TCM809/TCM810 3-Pin Microcontroller Reset Monitors Features General Description • Precision V Monitor for 2.5V, 3.0V, 3.3V, 5.0V The TCM809 and TCM810 are cost-effective system DD Nominal System Voltage Supplies supervisor circuits designed to monitor V in digital DD • 140msec Minimum RESET Time-Out Period systems; providing a reset signal to the host processor, when necessary. No external components are • RESET Output to V = 1.0V (TCM809) DD required. • Low Supply Current, 9µA (typ.) The RESET output is typically driven active within • V Transient Immunity DD 65µsec of V falling through the reset voltage thresh- • Small 3-Pin SC-70 and SOT-23B Packages DD old. RESET is maintained active for a minimum of • No External Components 140msec after V rises above the reset threshold. DD • Push-Pull RESET Output The TCM810 has an active-high RESET output, while • Temperature Ranges: the TCM809 has an active-low RESET output. The - Industrial: SC-70 (E): -40C to +85C output of the TCM809/TCM810 is valid down to V =1V. Both devices are available in 3-Pin SC-70 - Extended: SOT-23, SC-70 (V): -40C to +125C DD and SOT-23B packages. Applications The TCM809/TCM810 are optimized to reject fast transient glitches on the V line. A low supply current DD • Computers of 9µA (typ., V = 3.3V) make these devices suitable DD • Embedded Systems for battery-powered applications. • Battery-powered Equipment Pin Configurations • Critical Microcontroller Power Supply Monitoring • Automotive SOT-23B/SC-70 Typical Application Circuit GND 1 V DD 9/0 01 3 VDD M8M8 3 VDD VDD PIC® TCTC TCM809 Microcontroller TCM809 RESET 2 2 RESET TCM810 (RESET) RESET INPUT (Active-Low) GND Note: 3-Pin SOT-23B is equivalent to GND JEDEC TO-236. 1  2001-2012 Microchip Technology Inc. DS21661E-page 1

TCM809/TCM810 1.0 ELECTRICAL † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is CHARACTERISTICS a stress rating only and functional operation of the device at those or any other conditions above those indicated in the Absolute Maximum Ratings† operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods Supply Voltage (VDD to GND)........................................................6.0V may affect device reliability. RESET, RESET...................................................-0.3V to (VDD +0.3V) Input Current, VDD.......................................................................20mA Output Current, RESET, RESET.................................................20mA dV/dt (VDD)...........................................................................100V/µsec Operating Temperature Range...................................-40°C to +125°C Power Dissipation (TA = 70°C): 3-Pin SOT-23B (derate 4mW/°C above +70°C)....................320mW 3-Pin SC-70 (derate 2.17mW/°C above +70°C)....................174mW Storage Temperature Range.......................................-65°C to +150°C Maximum Junction Temperature, T............................................150°C J ELECTRICAL CHARACTERISTICS V = Full Range, T = Operating Temperature Range, unless otherwise noted. Typical values are at T = +25°C, DD A A V = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note1). DD Parameter Sym Min Typ Max Units Test Conditions V Range 1.0 — 5.5 V T = 0°C to +70°C DD A 1.2 — 5.5 T = – 40°C to +125°C A Supply Current I — 12 30 µA TCM8xxL/M/J: V < 5.5V CC DD — 9 25 TCM8xxR/S/T/Z: V < 3.6V DD Reset Threshold (Note2) V 4.56 4.63 4.70 V TCM8xxL: T = +25°C TH A 4.50 — 4.75 T = – 40°C to +125°C A 4.31 4.38 4.45 V TCM8xxM: T = +25°C A 4.25 — 4.50 V T = – 40°C to +125°C A 3.93 4.00 4.06 V TCM809J: T = +25°C A 3.89 — 4.10 V T = – 40°C to +125°C A 3.04 3.08 3.11 V TCM8xxT: T = +25°C A 3.00 — 3.15 V T = – 40°C to +125°C A 2.89 2.93 2.96 V TCM8xxS: T = +25°C A 2.85 — 3.00 V T = – 40°C to +125°C A 2.59 2.63 2.66 V TCM8xxR: T = +25°C A 2.55 — 2.70 V T = – 40°C to +125°C A 2.28 2.32 2.35 V TCM8xxZ: T = +25°C A 2.25 — 2.38 V T = – 40°C to +125°C A Reset Threshold Tempco — 30 — ppm/°C V to Reset Delay, — 65 — µsec V = V to (V – 100mV) (Note2) DD DD TH TH Reset Active Time Out 140 320 560 msec Period RESET Output Voltage V — — 0.3 V TCM809R/S/T/Z: V = V min, I = 1.2mA OL DD TH SINK Low (TCM809) — — 0.4 TCM809L/M/J: V = V min, I = 3.2mA DD TH SINK — — 0.3 V > 1.0V, I = 50µA DD SINK RESET Output Voltage V 0.8 V — — V TCM809R/S/T/Z: V > V max, I = 500µA OH DD DD TH SOURCE High (TCM809) V – 1.5 — — TCM809L/M/J: V > V max, I = 800µA DD DD TH SOURCE RESET Output Voltage V — — 0.3 V TCM810R/S/T/Z:V = V max, I = 1.2mA OL DD TH SINK Low (TCM810) — — 0.4 TCM810L/M: V = V max, I = 3.2mA DD TH SINK RESET Output Voltage V 0.8 V — — V 1.8 < V < V min, I = 150µA OH DD DD TH SOURCE High (TCM810) Note 1: Production testing done at T = +25°C, overtemperature limits ensured by QC screen. A 2: RESET output for TCM809, RESET output for TCM810. DS21661E-page 2  2001-2012 Microchip Technology Inc.

TCM809/TCM810 2.0 TYPICAL PERFORMANCE CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 18 TCM8xx/R/S/T/Z, No Load 450 16 VDD = 5V 400 14 Supply Current ( µA) 11022468 VVDDDD == 13VV Power-up Reset Timeout (µsec) 11223305050550000000 0 -40 -20 0 20 40 60 80 100 120 0 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Temperature (°C) FIGURE 2-1: Supply Current vs. FIGURE 2-3: Power-up Reset Time Out Temperature. vs. Temperature. 16 1.001 TCM8xx/L/M/J, No Load 14 VDD = 5V Supply Current ( µA) 1102468 VDVDD D= =3 V1V Normalized Reset Threshold 00..9999891 2 0 0.997 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 Temperature (°C) Temperature (°C) FIGURE 2-2: Supply Current vs. FIGURE 2-4: Normalized Reset Temperature. Threshold vs. Temperature.  2001-2012 Microchip Technology Inc. DS21661E-page 3

TCM809/TCM810 3.0 PIN DESCRIPTIONS The descriptions of the pins are given in Table3-1. TABLE 3-1: PIN FUNCTION TABLE NAME FUNCTION GND Ground RESET (TCM809) RESET push-pull output RESET (TCM810) RESET push-pull output V Supply voltage (+2.5V, +3.0V, DD +3.3V, +5.0V). 3.1 Ground (GND) Ground terminal. 3.2 RESET Output (TCM809) The RESET push-pull output remains low while V is DD below the reset voltage threshold, and for 240msec (140msec min.) after V rises above reset threshold. DD 3.3 RESET Output (TCM810) The RESET push-pull output remains high while V is DD below the reset voltage threshold, and for 240msec (140msec min.) after V rises above reset threshold. DD 3.4 Supply Voltage (V ) DD V : +2.5V, +3.0V, +3.3V and +5.0V DD DS21661E-page 4  2001-2012 Microchip Technology Inc.

TCM809/TCM810 4.0 APPLICATIONS INFORMATION Combinations above the curve are detected as a brown-out or power-down condition. Transient immunity can be improved by adding a capacitor in 4.1 V Transient Rejection DD close proximity to the V pin of the TCM809/TCM810. DD The TCM809/TCM810 provides accurate V monitor- DD ing and reset timing during power-up, power-down and 4.2 RESET Signal Integrity During brown-out/sag conditions. These devices also reject Power-Down negative-going transients (glitches) on the power supply line. Figure4-1 shows the maximum transient The TCM809 RESET output is valid to VDD = 1.0V. duration vs. maximum negative excursion (overdrive) Below this voltage the output becomes an "open cir- for glitch rejection. Any combination of duration and cuit" and does not sink current. This means CMOS overdrive that lies under the curve will not generate a logic inputs to the microcontroller will be floating at an reset signal. undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in situations where RESET must be main- V DD tained valid to V = 0V, a pull-down resistor must be DD V connected from RESET to ground to discharge stray TH capacitances and hold the output low (Figure4-2). This Overdrive resistor value, though not critical, should be chosen such that it does not appreciably load RESET under normal operation (100k will be suitable for most Duration applications). Similarly, a pull-up resistor to V is DD c) 400 required for the TCM810 to ensure a valid high RESET e T = +25°C µs A for VDD below 1.0V. on ( 320 rati V u DD D 240 nt e nsi 160 V a DD m Tr TCM8XXL/M/J (SOT-23) u 80 TCM809 m Maxi 0 T(SCOMT8-X23X)Z/R/S/T RESET 1 5 100 1000 Reset Comparator Overdrive R 1 [V – V ] (mv) GND 100k TH DD 130 c) 120 se 110 TCM8XXL/M/J (SC-70) FIGURE 4-2: The addition of R1 at the µ y ( 100 RESET output of the TCM809 ensures that the a Del 90 RESET output is valid to VDD = 0V. et 80 s 70 e R 60 o tD 50 TCM8XXZ/R/S/T (SC-70) D V 40 30 1 10 100 1000 Reset Comparator Overdrive (mV) [V – V ] (mv) TH DD FIGURE 4-1: Maximum Transient Duration vs. Overdrive for Glitch Rejection at +25°C.  2001-2012 Microchip Technology Inc. DS21661E-page 5

TCM809/TCM810 4.3 Controllers and Processors With Bidirectional I/O Pins Buffered RESET Buffer To Other System Some microcontrollers have bidirectional reset pins. Components Depending on the current drive capability of the control- V ler pin, an indeterminate logic level may result if there DD is a logic conflict. This can be avoided by adding a PIC® 4.7k resistor in series with the output of the TCM809/ TCM809 Micro- controller TCM810 (Figure4-3). If there are other components in 4.7k the system that require a reset signal, they should be RESET RESET buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the GND GND microcontroller, the buffer should be connected as shown with the solid line. FIGURE 4-3: Interfacing the TCM809 to a Bidirectional RESET I/O. DS21661E-page 6  2001-2012 Microchip Technology Inc.

TCM809/TCM810 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 3-Pin SOT-23B Example: Customer Specific Information Codes for: TCM8xx = XXNN Part Number TCM809 TCM810 TCM8xxL ENB J1 K1 VNB JZ KZ TCM8xxM ENB J2 K2 VNB JY KY TCM8xxT ENB J3 K3 VNB JX KX TCM8xxS ENB J4 K4 VNB JV KV TCM8xxR ENB J5 K5 VNB JU KU TCM8xxJ ENB J6 — VNB JT KS TCM8xxZ ENB J7 K6 3-Pin SC-70 Example: Customer Specific Information Codes for: TCM8xx = XXN YWW Part Number TCM809 TCM810 TCM8xxL ELB J1 — VLB JZ KZ Top Side Bottom Side TCM8xxM ELB J2 — VLB JY KY OR TCM8xxT ELB J3 — VLB JX KX TCM8xxS ELB J4 — VLB JV KV TCM8xxR ELB J5 — XXNN VLB JU KU TCM8xxJ ELB J6 — VLB JT KS TCM8xxZ ELB J7 — VLB JS KT Legend: XX...X Customer-specific information* Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2001-2012 Microchip Technology Inc. DS21661E-page 7

TCM809/TCM810 3-Lead Plastic Small Outline Transistor (NB) (SOT-23) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 2 B p1 D n p 1  c A A2  A1  L Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 3 3 Pitch p .038 0.96 Outside lead pitch (basic) p1 .076 1.92 Overall Height A .035 .040 .044 0.89 1.01 1.12 Molded Package Thickness A2 .035 .037 .040 0.88 0.95 1.02 Standoff § A1 .000 .002 .004 0.01 0.06 0.10 Overall Width E .083 .093 .104 2.10 2.37 2.64 Molded Package Width E1 .047 .051 .055 1.20 1.30 1.40 Overall Length D .110 .115 .120 2.80 2.92 3.04 Foot Length L .014 .018 .022 0.35 0.45 0.55 Foot Angle  0 5 10 0 5 10 Lead Thickness c .004 .006 .007 0.09 0.14 0.18 Lead Width B .015 .017 .020 0.37 0.44 0.51 Mold Draft Angle Top  0 5 10 0 5 10 Mold Draft Angle Bottom  0 5 10 0 5 10 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 DS21661E-page 8  2001-2012 Microchip Technology Inc.

TCM809/TCM810 3-Lead Plastic Small Outline Transistor (LB) (SC-70) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 B 2 p1 D 3 p 1 a c A A2 b L A1 Units INCHES MILLIMETERS* Dimension Limits MIN MAX MIN MAX Number of Pins 3 3 Pitch p .026 BSC. 0.65 BSC. Outside lead pitch (basic) p1 .051 BSC. 1.30 BSC. Overall Height A .031 .043 0.80 1.10 Molded Package Thickness A2 .031 .039 0.80 1.00 Standoff A1 .000 .0004 0.00 .010 Overall Width E .071 .094 1.80 2.40 Molded Package Width E1 .045 .053 1.15 1.35 Overall Length D .071 .089 1.80 2.25 Foot Length L .004 .016 0.10 0.41 Lead Thickness c .003 .010 0.08 0.25 Lead Width B .006 .016 0.15 0.40 Mold Draft Angle Top a 8° 12° 8° 12° Mold Draft Angle Bottom b 8° 12° 8° 12° *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104  2001-2012 Microchip Technology Inc. DS21661E-page 9

TCM809/TCM810 5.2 Product Tape and Reel Specifications FIGURE 5-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY) Top Cover Tape A 0 W K0 B0 P TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS Carrier Cavity Dimensions Dimensions Output Reel Case Package Quantity Diameter in Outline Type W P A0 B0 K0 Units mm mm mm mm mm mm NB SOT-23 3L 8 4 3.15 2.77 1.22 3000 180 LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180 FIGURE 5-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS gnikraM Device User Direction of Feed eciveD Marking W, Width Pin 1 of Carrier Tape Pin 1 P, Pitch Standard Reel Component Orientation Reverse Reel Component Orientation DS21661E-page 10  2001-2012 Microchip Technology Inc.

TCM809/TCM810 APPENDIX A: REVISION HISTORY Revision E (December 2012) • Added a note to each package outline drawing. Revision D (March 2005) • Updated 6.0 “Packaging Information” to include old and new packaging examples. • Applied new template and rearranged sections to be consistent with current documentation. Revision C (April 2004) Revision B (January 2002) Revision A (May 2001) Initial release of data sheet. Confidential  2001-2012 Microchip Technology Inc. DS21661E-page 11

TCM809/TCM810 NOTES: Confidential DS21661E-page 12  2001-2012 Microchip Technology Inc.

TCM809/TCM810 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X X XXXXX Examples: a) TCM809LENB713: SOT-23B-3-TR, Device VDD Temperature Package Microcontroller 4.63V Reset Range Reset Monitor, Threshold -40°C to +85°C, Tape and Reel. b) TCM809LVLB713: SC-70-3-TR, Device: TCM809: Supervisor circuit with active-low RESET output Microcontroller 4.63V TCM810: Supervisor circuit with active-high RESET output Reset Monitor, -40°C to +125°C, Tape and Reel. V Reset Threshold: L = 4.63V DD c) TCM809LVNB713: SOT-23B-3-TR, M = 4.38V Microcontroller 4.63V J = 4.00V Reset Monitor, T = 3.08V -40°C to +125°C, S = 2.93V Tape and Reel. R = 2.63V Z = 2.32V a) TCM810MENB713: SOT-23B-3-TR, Microcontroller 4.38V Temperature Range: E = -40°C to +85°C Reset Monitor, V = -40°C to +125°C -40°C to +85°C, Tape and Reel. b) TCM810RVLB713: SOT-23B-3-TR, Package: NB713 = SOT-23B, 3-pin (Tape and Reel) Microcontroller 2.63V LB713 = SC-70, 3-pin (Tape and Reel) Reset Monitor, -40°C to +125°C, Tape and Reel. c) TCM810TVLB713: SC-70-3-TR, Microcontroller 4.38V Reset Monitor, -40°C to +125°C, Tape and Reel. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com) to receive the most current information on our products.  2001-2012 Microchip Technology Inc. DS21661E-page 13

TCM809/TCM810 NOTES: DS21661E-page 14  2001-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768877 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2001-2012 Microchip Technology Inc. DS21661E-page 15

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