TC4426/TC4427/TC4428 1.5A Dual High-Speed Power MOSFET Drivers Features: General Description: • High Peak Output Current: 1.5A The TC4426/TC4427/TC4428 are improved versions • Wide Input Supply Voltage Operating Range: of the earlier TC426/TC427/TC428 family of MOSFET drivers. The TC4426/TC4427/TC4428 devices have - 4.5V to 18V matched rise and fall times when charging and • High Capacitive Load Drive Capability: 1000pF in discharging the gate of a MOSFET. 25ns (typical) These devices are highly latch-up resistant under any • Short Delay Times: 40ns (typical) conditions within their power and voltage ratings. They • Matched Rise and Fall Times are not subject to damage when up to 5V of noise • Low Supply Current: spiking (of either polarity) occurs on the ground pin. - With Logic ‘1’ Input – 4mA They can accept, without damage or logic upset, up to - With Logic ‘0’ Input – 400µA 500mA of reverse current (of either polarity) being • Low Output Impedance: 7 forced back into their outputs. All terminals are fully protected against Electrostatic Discharge (ESD) up to • Latch-Up Protected: Withstands 0.5A Reverse 2.0kV. Current • Input Withstands Negative Inputs Up to 5V The TC4426/TC4427/TC4428 MOSFET drivers can easily charge/discharge 1000pF gate capacitances in • Electrostatic Discharge (ESD) Protected: 2.0kV under 30ns. These devices provide low enough • Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN-S impedances in both the On and Off states to ensure the Packages MOSFET’s intended state is not affected, even by large transients. Applications: Other compatible drivers are the TC4426A/TC4427A/ • Switch Mode Power Supplies TC4428A family of devices. The TC4426A/TC4427A/ • Line Drivers TC4428A devices have matched leading and falling edge input-to-output delay times, in addition to the • Pulse Transformer Drive matched rise and fall times of the TC4426/TC4427/ TC4428 devices. Package Types 8-Pin MSOP/ PDIP/SOIC TC4426 TC4427 TC4428 8-PinDFN-S* TC4426 TC4427 TC4428 NC 1 8 NC NC NC NC 1 8 NC NC NC IN A 2 TC4426 7 OUT A OUT A OUT A GINN DB 34 TTCC44442278 56 OVDUDT B OVDUDT B OVDUDT B GINN DA 23 E9P 76 OVDUDT A OVDUDT A OVDUDT A IN B 4 5 OUT B OUT B OUT B * Includes Exposed Thermal Pad (EP); see Table3-1.  2006-2014 Microchip Technology Inc. DS20001422G-page 1

TC4426/TC4427/TC4428 Functional Block Diagram V DD Inverting 1.5mA 300mV Output Non-Inverting Input Effective 4.7V Input C = 12pF (Each Input) TC4426/TC4427/TC4428 GND Note1: TC4426 has two inverting drivers, while the TC4427 has two non-inverting drivers. The TC4428 has one inverting and one non-inverting driver. 2: Ground any unused driver input. DS20001422G-page 2  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 1.0 ELECTRICAL † Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These CHARACTERISTICS are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the Absolute Maximum Ratings † operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for Supply Voltage................................................................+22V extended periods may affect device reliability. Input Voltage, IN A or IN B..........(V + 0.3V) to (GND – 5V) DD Package Power Dissipation (T +70°C) A DFN-S..................................................................... Note3 MSOP.....................................................................340mW PDIP.......................................................................730mW SOIC.......................................................................470mW Storage Temperature Range.........................-65°C to +150°C Maximum Junction Temperature.................................+150°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, T = +25ºC with 4.5V  V  18V. A DD Parameters Sym. Min. Typ. Max. Units Conditions Input Logic ‘1’, High Input Voltage VIH 2.4 — — V Note2 Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current I -1.0 — +1.0 µA 0VV V IN IN DD Output High Output Voltage V V – 0.025 — — V DC Test OH DD Low Output Voltage V — — 0.025 V DC Test OL Output Resistance R — 7 10  I = 10mA, V = 18V O OUT DD Peak Output Current I — 1.5 — A V = 18V PK DD Latch-Up Protection I — > 0.5 — A Duty cycle2%, t 300µs REV Withstand Reverse Current V = 18V DD Switching Time (Note1) Rise Time t — 19 30 ns Figure4-1 R Fall Time t — 19 30 ns Figure4-1 F Delay Time t — 20 30 ns Figure4-1 D1 Delay Time t — 40 50 ns Figure4-1 D2 Power Supply Power Supply Current I — — 4.5 mA V = 3V (Both inputs) S IN — — 0.4 V = 0V (Both inputs) IN Note 1: Switching times ensured by design. 2: For V temperature range devices, the V (Min) limit is 2.0V. IH 3: Package power dissipation is dependent on the copper pad area on the PCB.  2006-2014 Microchip Technology Inc. DS20001422G-page 3

TC4426/TC4427/TC4428 DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V  V  18V. DD Parameters Sym. Min. Typ. Max. Units Conditions Input Logic ‘1’, High Input Voltage VIH 2.4 — — V Note2 Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current I -10 — +10 µA 0VV V IN IN DD Output High Output Voltage V V – 0.025 — — V DC Test OH DD Low Output Voltage V — — 0.025 V DC Test OL Output Resistance R — 9 12  I = 10mA, V = 18V O OUT DD Peak Output Current I — 1.5 — A V = 18V PK DD Latch-Up Protection I — >0.5 — A Duty cycle2%, t 300µs REV Withstand Reverse Current V = 18V DD Switching Time (Note1) Rise Time t — — 40 ns Figure4-1 R Fall Time t — — 40 ns Figure4-1 F Delay Time t — — 40 ns Figure4-1 D1 Delay Time t — — 60 ns Figure4-1 D2 Power Supply Power Supply Current I — — 8.0 mA V = 3V (Both inputs) S IN — — 0.6 V = 0V (Both inputs) IN Note 1: Switching times ensured by design. 2: For V temperature range devices, the V (Min) limit is 2.0V. IH TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  V  18V. DD Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range (C) T 0 — +70 °C A Specified Temperature Range (E) T -40 — +85 °C A Specified Temperature Range (V) T -40 — +125 °C A Maximum Junction Temperature T — — +150 °C J Storage Temperature Range T -65 — +150 °C A Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN-S  — 33.2 — °C/W JA Thermal Resistance, 8L-MSOP  — 206 — °C/W JA Thermal Resistance, 8L-PDIP  — 125 — °C/W JA Thermal Resistance, 8L-SOIC  — 155 — °C/W JA DS20001422G-page 4  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, T = +25ºC with 4.5V  V  18V. A DD 100 100 2200 pF 2200 pF 80 80 1500 pF 1500 pF (nsec)E 60 1000 pF (nsec)LL 60 1000 pF S A tRI 40 470 pF tF 40 470 pF 20 20 100 pF 100 pF 0 0 4 6 8 10 12 14 16 18 4 6 8 10 12 14 16 18 VDD(V) VDD(V) FIGURE 2-1: Rise Time vs. Supply FIGURE 2-4: Fall Time vs. Supply Voltage. Voltage. 100 100 5V 5V 80 80 (nsec)RISE 6400 101V5V (nsec)FALL 6400 1105VV t t 20 20 0 0 100 1000 10,000 100 1000 10,000 C L O A D (pF) C L O A D (pF) FIGURE 2-2: Rise Time vs. Capacitive FIGURE 2-5: Fall Time vs. Capacitive Load. Load. 60 80 50 CV D L OD A = D 1 7=. 51V000 pF sec) 7705 CVLINO A=D 5=V 1000 pF ay (n 6605 c) 40 el 55 Time (nse 30 gation D 445050 tD2 tFALL pa 35 tD1 o 30 20 tRISE Pr 25 20 4 6 8 10 12 14 16 18 10 –55 –35 –15 5 25 45 65 85 105 125 V (V) DD Temperature (˚C) FIGURE 2-3: Rise and Fall Times vs. FIGURE 2-6: Propagation Delay Time vs. Temperature. Supply Voltage.  2006-2014 Microchip Technology Inc. DS20001422G-page 5

TC4426/TC4427/TC4428 Note: Unless otherwise indicated, T = +25ºC with 4.5V  V  18V. A DD 60 45 pagation Delay (nsec) 2233445505050505 tD1 tD2 CVLDODA =D =1 21V000 pF Delay Time (nsec) 2233405050 CVVIDLNOD = A=D 5 1=V8 1V000 tptDDF21 o 15 Pr 15 10 10 0 1 2 3 4 5 6 7 8 9 10 11 12 -55 -35 -15 5 25 45 65 85 105 125 Input Amplitude (V) Temperature (ºC) FIGURE 2-7: Propagation Delay Time vs. FIGURE 2-10: Propagation Delay Time vs. Input Amplitude. Temperature. 4.0 V = 18V DD 3.5 A) I (mQUIESCENT 1 Both Inputs = 1 I (mA)QUIESCENT32..05 Both Inputs = 1 Both Inputs = 0 0.1 2.0 4 6 8 10 12 14 16 18 –55 –35 –15 5 25 45 65 85 105 125 VD D TA (˚C) FIGURE 2-8: Supply Current vs. Supply FIGURE 2-11: Supply Current vs. Voltage. Temperature. 25 25 20 20 Worst Case @ T = +150˚C Worst Case @ T = +150˚C J J Ω) Ω) (N)15 (N) 15 O O DS( DS( R R Typical @ TA = +25˚C Typical @ TA = +25˚C 10 10 5 5 4 6 8 10 12 14 16 18 4 6 8 10 12 14 16 18 V V DD DD FIGURE 2-9: Output Resistance (R ) vs. FIGURE 2-12: Output Resistance (R ) vs. OH OL Supply Voltage. Supply Voltage. DS20001422G-page 6  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 Note: Unless otherwise indicated, T = +25ºC with 4.5V  V  18V. A DD 60 60 2 MHz 1000 pF VD D = 18V VD D = 18V 50 50 2200 pF 900 kHz A) 40 A) 40 m m 100 pF I (SUPPLY3200 600 kHz I (SUPPLY3200 10 200 kHz 10 20 kHz 0 0 100 1000 10,000 10 100 1000 C L O A D (pF) FREQUENCY (kHz) FIGURE 2-13: Supply Current vs. FIGURE 2-16: Supply Current vs. Capacitive Load. Frequency. 60 60 2200 pF VD D = 12V 2 MHz VD D = 12V 50 50 A) 40 A) 40 1000 pF m m (PPLY30 900 kHz (PPLY30 U U IS20 600 kHz IS20 100 pF 10 10 200 kHz 20 kHz 0 0 100 1000 10,000 10 100 1000 C L O A D (pF) FREQUENCY (kHz) FIGURE 2-14: Supply Current vs. FIGURE 2-17: Supply Current vs. Capacitive Load. Frequency. 60 60 VD D = 6V VD D = 6V 50 50 A) 40 A) 40 m m I (SUPPLY3200 2 MHz I (SUPPLY3200 1000 pF 2200 pF 900 kHz 10 600 kHz 10 100 pF 200 kHz 20 kHz 0 0 100 1000 10,000 10 100 1000 C L O A D (pF) FREQUENCY (kHz) FIGURE 2-15: Supply Current vs. FIGURE 2-18: Supply Current vs. Capacitive Load. Frequency.  2006-2014 Microchip Technology Inc. DS20001422G-page 7

TC4426/TC4427/TC4428 Note: Unless otherwise indicated, T = +25ºC with 4.5V  V  18V. A DD –8 10 9 8 7 6 5 ec 4 s A • 3 2 –9 10 4 6 8 10 12 14 16 18 VD D Note: The values on this graph represent the loss seen by both drivers in a package during one complete cycle. For a single driver, divide the stated values by 2. For a single transition of a single driver, divide the stated value by 4. FIGURE 2-19: Crossover Energy vs. Supply Voltage. DS20001422G-page 8  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table3-1. TABLE 3-1: PIN FUNCTION TABLE (1) 8-Pin PDIP/ 8-Pin Symbol Description MSOP/SOIC DFN-S 1 1 NC No connection 2 2 IN A Input A 3 3 GND Ground 4 4 IN B Input B 5 5 OUT B Output B 6 6 V Supply input DD 7 7 OUT A Output A 8 8 NC No connection — PAD NC Exposed Metal Pad Note 1: Duplicate pins must be connected for proper operation. 3.1 Inputs A and B 3.4 Supply Input (V ) DD MOSFET driver inputs A and B are high-impedance, The V input is the bias supply for the MOSFET driver DD TTL/CMOS compatible inputs. These inputs also have and is rated for 4.5V to 18V with respect to the Ground 300mV of hysteresis between the high and low pin. The V input should be bypassed with local DD thresholds that prevents output glitching even when the ceramic capacitors. The value of these capacitors rise and fall time of the input signal is very slow. should be chosen based on the capacitive load that is being driven. A value of 1.0µF is suggested. 3.2 Ground (GND) 3.5 Exposed Metal Pad Ground is the device return pin. The Ground pin(s) should have a low-impedance connection to the bias The exposed metal pad of the 6x5 DFN-S package is supply source return. High peak current flows out the not internally connected to any potential. Therefore, Ground pin(s) when the capacitive load is being this pad can be connected to a ground plane or other discharged. copper plane on a Printed Circuit Board (PCB), to aid in heat removal from the package. 3.3 Output A and B MOSFET driver outputs A and B are low-impedance, CMOS push-pull style outputs. The pull-down and pull- up devices are of equal strength, making the rise and fall times equivalent.  2006-2014 Microchip Technology Inc. DS20001422G-page 9

TC4426/TC4427/TC4428 4.0 APPLICATIONS INFORMATION +5V 90% Input VDD = 18V 0V 10% tD1 tD2 V tF tR 4.7µF 0.1µF DD 90% 90% Output 6 10% 10% 2 7 0V Input Output Inverting Driver C = 1000pF L 4 5 +5V 90% Input 10% 0V 3 V DD 90% 90% Input: 100kHz, Output tD1 tR tD2 tF square wave, tRISE = tFALL  10ns 0V 10% 10% Non-Inverting Driver FIGURE 4-1: Switching Time Test Circuit. DS20001422G-page 10  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead DFN-S (6x5x0.9 mm) Example TC4426 EMF^^ 1315 NNN 256 PIN 1 PIN 1 8-Lead MSOP (3x3 mm) Example 4426C 315256 8-Lead PDIP (300 mil) Example XXXXXXXX TC4427 XXXXXNNN CPA^^NNN 1315 YYWW 8-Lead SOIC (150 mil) Example TC4428C OA^^YYWW NNN 256 Legend: XX...X Customer specific information* Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard device marking consists of Microchip part number, year code, week code and traceability code.  2006-2014 Microchip Technology Inc. DS20001422G-page 11

TC4426/TC4427/TC4428 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)(cid:15)(cid:16)(cid:6)(cid:10)(cid:8)(cid:17)(cid:10)(cid:6)(cid:12)(cid:18)(cid:8)(cid:19)(cid:20)(cid:8)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:6)(cid:14)(cid:21)(cid:6)(cid:22)(cid:5)(cid:8)(cid:23)(cid:24)(cid:17)(cid:25)(cid:8)(cid:26)(cid:8)(cid:27)(cid:28)(cid:29)(cid:8)(cid:30)(cid:30)(cid:8)(cid:31)(cid:20)(cid:7) (cid:8)!(cid:15)(cid:17)(cid:19)(cid:3)"# (cid:19)(cid:20)(cid:12)(cid:5)$ 3(cid:22)(cid:21)(cid:14)&(cid:23)(cid:13)(cid:14)’(cid:22)!&(cid:14)(cid:20)"(cid:21)(cid:21)(cid:13)(cid:25)&(cid:14)(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:13)(cid:14)#(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)!((cid:14)(cid:10)(cid:26)(cid:13)(cid:11)!(cid:13)(cid:14)!(cid:13)(cid:13)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)(cid:31)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)(cid:11)&(cid:14) (cid:23)&&(cid:10)244***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)’4(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) (cid:14) e D L b N N K E E2 EXPOSEDPAD NOTE1 NOTE1 1 2 2 1 D2 TOPVIEW BOTTOMVIEW A A3 A1 NOTE2 5(cid:25)(cid:19)&! (cid:18)(cid:28)66(cid:28)(cid:18)-(cid:24)-(cid:8)(cid:3) (cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)(cid:14)6(cid:19)’(cid:19)&! (cid:18)(cid:28)7 78(cid:18) (cid:18)(cid:7)9 7"’)(cid:13)(cid:21)(cid:14)(cid:22)%(cid:14)(cid:31)(cid:19)(cid:25)! 7 : (cid:31)(cid:19)&(cid:20)(cid:23) (cid:13) (cid:30)(cid:29)(cid:16)(cid:17)(cid:14)0(cid:3)1 8 (cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14);(cid:13)(cid:19)(cid:12)(cid:23)& (cid:7) (cid:4)(cid:29):(cid:4) (cid:4)(cid:29):/ (cid:30)(cid:29)(cid:4)(cid:4) (cid:3)&(cid:11)(cid:25)#(cid:22)%%(cid:14) (cid:7)(cid:30) (cid:4)(cid:29)(cid:4)(cid:4) (cid:4)(cid:29)(cid:4)(cid:30) (cid:4)(cid:29)(cid:4)/ 1(cid:22)(cid:25)&(cid:11)(cid:20)&(cid:14)(cid:24)(cid:23)(cid:19)(cid:20)+(cid:25)(cid:13)!! (cid:7), (cid:4)(cid:29)(cid:16)(cid:4)(cid:14)(cid:8)-3 8 (cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)6(cid:13)(cid:25)(cid:12)&(cid:23) (cid:2) /(cid:29)(cid:4)(cid:4)(cid:14)0(cid:3)1 8 (cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)<(cid:19)#&(cid:23) - (cid:15)(cid:29)(cid:4)(cid:4)(cid:14)0(cid:3)1 -$(cid:10)(cid:22)!(cid:13)#(cid:14)(cid:31)(cid:11)#(cid:14)6(cid:13)(cid:25)(cid:12)&(cid:23) (cid:2)(cid:16) ,(cid:29)(cid:6)(cid:4) (cid:5)(cid:29)(cid:4)(cid:4) (cid:5)(cid:29)(cid:30)(cid:4) -$(cid:10)(cid:22)!(cid:13)#(cid:14)(cid:31)(cid:11)#(cid:14)<(cid:19)#&(cid:23) -(cid:16) (cid:16)(cid:29)(cid:16)(cid:4) (cid:16)(cid:29),(cid:4) (cid:16)(cid:29)(cid:5)(cid:4) 1(cid:22)(cid:25)&(cid:11)(cid:20)&(cid:14)<(cid:19)#&(cid:23) ) (cid:4)(cid:29),/ (cid:4)(cid:29)(cid:5)(cid:4) (cid:4)(cid:29)(cid:5): 1(cid:22)(cid:25)&(cid:11)(cid:20)&(cid:14)6(cid:13)(cid:25)(cid:12)&(cid:23) 6 (cid:4)(cid:29)/(cid:4) (cid:4)(cid:29)(cid:15)(cid:4) (cid:4)(cid:29)(cid:17)/ 1(cid:22)(cid:25)&(cid:11)(cid:20)&(cid:9)&(cid:22)(cid:9)-$(cid:10)(cid:22)!(cid:13)#(cid:14)(cid:31)(cid:11)# = (cid:4)(cid:29)(cid:16)(cid:4) > > (cid:19)(cid:20)(cid:12)(cid:5)(cid:11)$ (cid:30)(cid:29) (cid:31)(cid:19)(cid:25)(cid:14)(cid:30)(cid:14) (cid:19)!"(cid:11)(cid:26)(cid:14)(cid:19)(cid:25)#(cid:13)$(cid:14)%(cid:13)(cid:11)&"(cid:21)(cid:13)(cid:14)’(cid:11)(cid:27)(cid:14) (cid:11)(cid:21)(cid:27)((cid:14))"&(cid:14)’"!&(cid:14))(cid:13)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)*(cid:19)&(cid:23)(cid:19)(cid:25)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:23)(cid:11)&(cid:20)(cid:23)(cid:13)#(cid:14)(cid:11)(cid:21)(cid:13)(cid:11)(cid:29) (cid:16)(cid:29) (cid:31)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:13)(cid:14)’(cid:11)(cid:27)(cid:14)(cid:23)(cid:11) (cid:13)(cid:14)(cid:22)(cid:25)(cid:13)(cid:14)(cid:22)(cid:21)(cid:14)’(cid:22)(cid:21)(cid:13)(cid:14)(cid:13)$(cid:10)(cid:22)!(cid:13)#(cid:14)&(cid:19)(cid:13)(cid:14))(cid:11)(cid:21)!(cid:14)(cid:11)&(cid:14)(cid:13)(cid:25)#!(cid:29) ,(cid:29) (cid:31)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:13)(cid:14)(cid:19)!(cid:14)!(cid:11)*(cid:14)!(cid:19)(cid:25)(cid:12)"(cid:26)(cid:11)&(cid:13)#(cid:29) (cid:5)(cid:29) (cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)(cid:19)(cid:25)(cid:12)(cid:14)(cid:11)(cid:25)#(cid:14)&(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:19)(cid:25)(cid:12)(cid:14)(cid:10)(cid:13)(cid:21)(cid:14)(cid:7)(cid:3)(cid:18)-(cid:14).(cid:30)(cid:5)(cid:29)/(cid:18)(cid:29) 0(cid:3)12 0(cid:11)!(cid:19)(cid:20)(cid:14)(cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)(cid:29)(cid:14)(cid:24)(cid:23)(cid:13)(cid:22)(cid:21)(cid:13)&(cid:19)(cid:20)(cid:11)(cid:26)(cid:26)(cid:27)(cid:14)(cid:13)$(cid:11)(cid:20)&(cid:14) (cid:11)(cid:26)"(cid:13)(cid:14)!(cid:23)(cid:22)*(cid:25)(cid:14)*(cid:19)&(cid:23)(cid:22)"&(cid:14)&(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:13)!(cid:29) (cid:8)-32 (cid:8)(cid:13)%(cid:13)(cid:21)(cid:13)(cid:25)(cid:20)(cid:13)(cid:14)(cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)((cid:14)"!"(cid:11)(cid:26)(cid:26)(cid:27)(cid:14)*(cid:19)&(cid:23)(cid:22)"&(cid:14)&(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:13)((cid:14)%(cid:22)(cid:21)(cid:14)(cid:19)(cid:25)%(cid:22)(cid:21)’(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:10)"(cid:21)(cid:10)(cid:22)!(cid:13)!(cid:14)(cid:22)(cid:25)(cid:26)(cid:27)(cid:29) (cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:24)(cid:13)(cid:20)(cid:23)(cid:25)(cid:22)(cid:26)(cid:22)(cid:12)(cid:27)(cid:2)(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)1(cid:4)(cid:5)(cid:9)(cid:30)(cid:16)(cid:16)0 DS20001422G-page 12  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 (cid:19)(cid:20)(cid:12)(cid:5)$ 3(cid:22)(cid:21)(cid:14)&(cid:23)(cid:13)(cid:14)’(cid:22)!&(cid:14)(cid:20)"(cid:21)(cid:21)(cid:13)(cid:25)&(cid:14)(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:13)(cid:14)#(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)!((cid:14)(cid:10)(cid:26)(cid:13)(cid:11)!(cid:13)(cid:14)!(cid:13)(cid:13)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)(cid:31)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)(cid:11)&(cid:14) (cid:23)&&(cid:10)244***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)’4(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)  2006-2014 Microchip Technology Inc. DS20001422G-page 13

TC4426/TC4427/TC4428 (cid:56)(cid:36) (cid:49)(cid:82)(cid:87)(cid:72)(cid:29) For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001422G-page 14  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 UA Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2006-2014 Microchip Technology Inc. DS20001422G-page 15

TC4426/TC4427/TC4428 8-Lead Plastic Micro Small Outline Package (UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001422G-page 16  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 (cid:27)(cid:16)(cid:47)(cid:72)(cid:68)(cid:71)(cid:3)(cid:51)(cid:79)(cid:68)(cid:86)(cid:87)(cid:76)(cid:70)(cid:3)(cid:39)(cid:88)(cid:68)(cid:79)(cid:3)(cid:44)(cid:81)(cid:16)(cid:47)(cid:76)(cid:81)(cid:72)(cid:3)(cid:11)(cid:51)(cid:36)(cid:12)(cid:3)(cid:16)(cid:3)(cid:22)(cid:19)(cid:19)(cid:3)(cid:80)(cid:76)(cid:79)(cid:3)(cid:37)(cid:82)(cid:71)(cid:92)(cid:3)(cid:62)(cid:51)(cid:39)(cid:44)(cid:51)(cid:64) (cid:49)(cid:82)(cid:87)(cid:72)(cid:29) For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A A2 (cid:51)(cid:47)(cid:36)(cid:49)(cid:40) L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2006-2014 Microchip Technology Inc. DS20001422G-page 17

TC4426/TC4427/TC4428 (cid:27)(cid:16)(cid:47)(cid:72)(cid:68)(cid:71)(cid:3)(cid:51)(cid:79)(cid:68)(cid:86)(cid:87)(cid:76)(cid:70)(cid:3)(cid:39)(cid:88)(cid:68)(cid:79)(cid:3)(cid:44)(cid:81)(cid:16)(cid:47)(cid:76)(cid:81)(cid:72)(cid:3)(cid:11)(cid:51)(cid:36)(cid:12)(cid:3)(cid:16)(cid:3)(cid:22)(cid:19)(cid:19)(cid:3)(cid:80)(cid:76)(cid:79)(cid:3)(cid:37)(cid:82)(cid:71)(cid:92)(cid:3)(cid:62)(cid:51)(cid:39)(cid:44)(cid:51)(cid:64) (cid:49)(cid:82)(cid:87)(cid:72)(cid:29) For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e e 2 2 e e Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e .100 BSC Top to Seating Plane A - - .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 - - Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB - - .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 DS20001422G-page 18  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2006-2014 Microchip Technology Inc. DS20001422G-page 19

TC4426/TC4427/TC4428 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001422G-page 20  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)"(cid:30)(cid:6)(cid:10)(cid:10)(cid:8)%(cid:16)(cid:12)(cid:10)(cid:13)&(cid:5)(cid:8)(cid:23)%’(cid:25)(cid:8)(cid:26)(cid:8)(cid:19)(cid:6)(((cid:20))(cid:18)(cid:8)*+,-(cid:8)(cid:30)(cid:30)(cid:8)(cid:31)(cid:20)(cid:7) (cid:8)!"%./# (cid:19)(cid:20)(cid:12)(cid:5)$ 3(cid:22)(cid:21)(cid:14)&(cid:23)(cid:13)(cid:14)’(cid:22)!&(cid:14)(cid:20)"(cid:21)(cid:21)(cid:13)(cid:25)&(cid:14)(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:13)(cid:14)#(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)!((cid:14)(cid:10)(cid:26)(cid:13)(cid:11)!(cid:13)(cid:14)!(cid:13)(cid:13)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)(cid:31)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)(cid:11)&(cid:14) (cid:23)&&(cid:10)244***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)’4(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)  2006-2014 Microchip Technology Inc. DS20001422G-page 21

TC4426/TC4427/TC4428 NOTES: DS20001422G-page 22  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 APPENDIX A: REVISION HISTORY Revision G (July 2014) The following is the list of modifications: 1. Updated the Functional Block Diagram. Revision F (September 2013) The following is the list of modifications: 2. Updated the Electrostatic Discharge (ESD) rating to 2kV in the Features section. 3. Updated the package drawings in Section5.0 “Packaging Information”. 4. Minor typographical and editorial corrections. Revisions E (December 2012) • Added a note to each package outline drawing.  2006-2014 Microchip Technology Inc. DS20001422G-page 23

TC4426/TC4427/TC4428 NOTES: DS20001422G-page 24  2006-2014 Microchip Technology Inc.

TC4426/TC4427/TC4428 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X XX XXX X Examples: a) TC4426COA: 1.5A Dual Inverting Device Temperature Package Tape & Reel PB Free MOSFET driver, Range 0°C to +70°C SOIC package. Device: TC4426: 1.5A Dual MOSFET Driver, Inverting b) TC4426EUA: 1.5A Dual Inverting TC4427: 1.5A Dual MOSFET Driver, Non-Inverting MOSFET driver, TC4428: 1.5A Dual MOSFET Driver, Complementary -40°C to +85°C. MSOP package. Temperature Range: C = 0°C to +70°C (PDIP and SOIC only) c) TC4426EMF: 1.5A Dual Inverting E = -40°C to +85°C MOSFET driver, V = -40°C to +125°C -40°C to +85°C, DFN-S package. Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead a) TC4427CPA: 1.5A Dual Non-Inverting MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead MOSFET driver, (Tape and Reel) OA = Plastic SOIC, (150 mil Body), 8-lead 0°C to +70°C OA713 = Plastic SOIC, (150 mil Body), 8-lead PDIP package. (Tape and Reel) b) TC4427EPA: 1.5A Dual Non-Inverting PA = Plastic DIP (300 mil Body), 8-lead MOSFET driver, UA = Plastic Micro Small Outline (MSOP), 8-lead UA713 = Plastic Micro Small Outline (MSOP), 8-lead -40°C to +85°C (Tape and Reel) PDIP package. a) TC4428COA713:1.5A Dual Complementary MOSFET driver, 0°C to +70°C, SOIC package, Tape and Reel. b) TC4428EMF: 1.5A Dual Complementary, MOSFET driver, -40°C to +85°C DFN-S package.  2006-2014 Microchip Technology Inc. DS20001422G-page 25

TC4426/TC4427/TC4428 NOTES: DS20001422G-page 26  2006-2014 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, ensure that your application meets with your specifications. LANCheck, MediaLB, MOST, MOST logo, MPLAB, MICROCHIP MAKES NO REPRESENTATIONS OR OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, WARRANTIES OF ANY KIND WHETHER EXPRESS OR SST, SST Logo, SuperFlash and UNI/O are registered IMPLIED, WRITTEN OR ORAL, STATUTORY OR trademarks of Microchip Technology Incorporated in the OTHERWISE, RELATED TO THE INFORMATION, U.S.A. and other countries. INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR The Embedded Control Solutions Company and mTouch are FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated arising from this information and its use. Use of Microchip in the U.S.A. devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, the buyer’s risk, and the buyer agrees to defend, indemnify and CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit hold harmless Microchip from any and all damages, claims, Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, suits, or expenses resulting from such use. No licenses are KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, conveyed, implicitly or otherwise, under any Microchip MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code intellectual property rights. Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2006-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN:978-1-63276-371-6 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2006-2014 Microchip Technology Inc. DS20001422G-page 27

Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office Asia Pacific Office India - Bangalore Austria - Wels 2355 West Chandler Blvd. Suites 3707-14, 37th Floor Tel: 91-80-3090-4444 Tel: 43-7242-2244-39 Chandler, AZ 85224-6199 Tower 6, The Gateway Fax: 91-80-3090-4123 Fax: 43-7242-2244-393 Tel: 480-792-7200 Harbour City, Kowloon India - New Delhi Denmark - Copenhagen Fax: 480-792-7277 Hong Kong Tel: 91-11-4160-8631 Tel: 45-4450-2828 Technical Support: Tel: 852-2943-5100 Fax: 91-11-4160-8632 Fax: 45-4485-2829 http://www.microchip.com/ support Fax: 852-2401-3431 India - Pune France - Paris Web Address: Australia - Sydney Tel: 91-20-3019-1500 Tel: 33-1-69-53-63-20 Tel: 61-2-9868-6733 Fax: 33-1-69-30-90-79 www.microchip.com Japan - Osaka Atlanta Fax: 61-2-9868-6755 Tel: 81-6-6152-7160 Germany - Dusseldorf Duluth, GA China - Beijing Fax: 81-6-6152-9310 Tel: 49-2129-3766400 TFealx: :6 67788-9-95577-9-1641545 TFealx: :8 866-1-100-8-8556298-7-2010004 JTealp: a8n1 --3 T-6o8k8y0o- 3770 GTeel:r m49a-n8y9 --6 M27u-n1i4c4h-0 China - Chengdu Fax: 49-89-627-144-44 Austin, TX Fax: 81-3-6880-3771 Tel: 512-257-3370 Tel: 86-28-8665-5511 Korea - Daegu Germany - Pforzheim Fax: 86-28-8665-7889 Tel: 49-7231-424750 Boston Tel: 82-53-744-4301 Westborough, MA China - Chongqing Fax: 82-53-744-4302 Italy - Milan Tel: 774-760-0087 Tel: 86-23-8980-9588 Korea - Seoul Tel: 39-0331-742611 Fax: 774-760-0088 Fax: 86-23-8980-9500 Tel: 82-2-554-7200 Fax: 39-0331-466781 Chicago China - Hangzhou Fax: 82-2-558-5932 or Italy - Venice Itasca, IL Tel: 86-571-8792-8115 82-2-558-5934 Tel: 39-049-7625286 Tel: 630-285-0071 Fax: 86-571-8792-8116 Malaysia - Kuala Lumpur Netherlands - Drunen Fax: 630-285-0075 China - Hong Kong SAR Tel: 60-3-6201-9857 Tel: 31-416-690399 Cleveland Tel: 852-2943-5100 Fax: 60-3-6201-9859 Fax: 31-416-690340 Independence, OH Fax: 852-2401-3431 Malaysia - Penang Poland - Warsaw Tel: 216-447-0464 China - Nanjing Tel: 60-4-227-8870 Tel: 48-22-3325737 Fax: 216-447-0643 Tel: 86-25-8473-2460 Fax: 60-4-227-4068 Spain - Madrid Dallas Fax: 86-25-8473-2470 Philippines - Manila Tel: 34-91-708-08-90 Addison, TX China - Qingdao Tel: 63-2-634-9065 Fax: 34-91-708-08-91 Tel: 972-818-7423 Tel: 86-532-8502-7355 Fax: 63-2-634-9069 Sweden - Stockholm Fax: 972-818-2924 Fax: 86-532-8502-7205 Singapore Tel: 46-8-5090-4654 Detroit Novi, MI China - Shanghai Tel: 65-6334-8870 UK - Wokingham Tel: 248-848-4000 Tel: 86-21-5407-5533 Fax: 65-6334-8850 Tel: 44-118-921-5800 Fax: 86-21-5407-5066 Taiwan - Hsin Chu Fax: 44-118-921-5820 Houston, TX China - Shenyang Tel: 886-3-5778-366 Tel: 281-894-5983 Tel: 86-24-2334-2829 Fax: 886-3-5770-955 Indianapolis Fax: 86-24-2334-2393 Noblesville, IN Taiwan - Kaohsiung China - Shenzhen Tel: 886-7-213-7830 Tel: 317-773-8323 Tel: 86-755-8864-2200 Fax: 317-773-5453 Taiwan - Taipei Fax: 86-755-8203-1760 Tel: 886-2-2508-8600 Los Angeles China - Wuhan Fax: 886-2-2508-0102 Mission Viejo, CA Tel: 86-27-5980-5300 Tel: 949-462-9523 Thailand - Bangkok Fax: 86-27-5980-5118 Fax: 949-462-9608 Tel: 66-2-694-1351 China - Xian Fax: 66-2-694-1350 New York, NY Tel: 86-29-8833-7252 Tel: 631-435-6000 Fax: 86-29-8833-7256 San Jose, CA Tel: 408-735-9110 China - Xiamen Tel: 86-592-2388138 Canada - Toronto Fax: 86-592-2388130 Tel: 905-673-0699 Fax: 905-673-6509 China - Zhuhai Tel: 86-756-3210040 03/25/14 Fax: 86-756-3210049 DS20001422G-page 28  2006-2014 Microchip Technology Inc.