TC4426A/TC4427A/TC4428A 1.5A Dual High-Speed Power MOSFET Drivers Features: General Description: • High Peak Output Current: 1.5A The TC4426A/TC4427A/TC4428A are improved • Wide Input Supply Voltage Operating Range: versions of the earlier TC4426/TC4427/TC4428 family of MOSFET drivers. In addition to matched rise and fall - 4.5V to 18V times, the TC4426A/TC4427A/TC4428A devices have • High Capacitive Load Drive Capability: 1000pF in matched leading and falling edge propagation delay 25ns (typical) times. • Short Delay Times: 30ns (typical) These devices are highly latch-up resistant under any • Matched Rise, Fall and Delay Times conditions within their power and voltage ratings. They • Low Supply Current: are not subject to damage when up to 5V of noise - With Logic ‘1’ Input – 1mA (typical) spiking (of either polarity) occurs on the Ground pin. - With Logic ‘0’ Input – 100µA (typical) They can accept, without damage or logic upset, up to • Low Output Impedance: 7(typical) 500mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully • Latch-Up Protected: Will Withstand 0.5A Reverse protected against Electrostatic Discharge (ESD) up Current to2kV. • Input Withstands Negative Inputs Up to 5V The TC4426A/TC4427A/TC4428A MOSFET drivers • Electrostatic Discharge (ESD) Protected: 2kV can easily charge/discharge 1000pF gate • Pin-compatible with TC426/TC427/TC428 and capacitances in under 30ns. These devices provide TC4426/TC4427/TC4428 low enough impedances in both the On and Off states • Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN-S to ensure the MOSFET’s intended state will not be Packages affected, even by large transients. Applications: • Switch Mode Power Supplies • Line Drivers • Pulse Transformer Drive Package Types 8-Pin MSOP/ 8-Pin 6x5 DFN-S* PDIP/SOIC TC4426A TC4427A TC4428A TC4426A TC4427A TC4428A NC 1 8 NC NC NC NC 1 8 NC NC NC IN A 2 7 OUT A OUT A OUT A GND 3 6 V V V IN A 2 EP 7 OUT A OUT A OUT A DD DD DD IN B 4 5 OUT B OUT B OUT B GND 3 9 6 VDD VDD VDD IN B 4 5 OUT B OUT B OUT B * Includes Exposed Thermal Pad (EP); see Table3-1.  2002-2014 Microchip Technology Inc. DS20001423J-page 1

TC4426A/TC4427A/TC4428A Functional Block Diagram V DD Inverting 500A 300mV Output Non-Inverting Input Effective 4.7V Input C = 12pF (Each Input) TC4426A/TC4427A/TC4428A GND Note1: TC4426A has two inverting drivers, while the TC4427A has two non-inverting drivers. The TC4428A has one inverting and one non-inverting driver. 2: Ground any unused driver input. DS20001423J-page 2  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A 1.0 ELECTRICAL † Notice: Stresses above those listed under “Absolute Maxi- mum Ratings” may cause permanent damage to the device. CHARACTERISTICS These are stress ratings only and functional operation of the device at these or any other conditions above those indicated Absolute Maximum Ratings† in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for Supply Voltage................................................................+22V extended periods may affect device reliability. Input Voltage, IN A or IN B..........(V + 0.3V) to (GND – 5V) DD Package Power Dissipation (T +70°C) A DFN-S..................................................................... Note2 MSOP.....................................................................340mW PDIP.......................................................................730mW SOIC.......................................................................470mW DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5VV 18V. DD Parameters Sym. Min. Typ. Max. Units Conditions Input Logic ‘1’, High Input VIH 2.4 — — V Voltage Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current I –1.0 — +1.0 µA 0VV V IN IN DD –10 — +10 Output High Output Voltage V V – 0.025 — — V DC Test OH DD Low Output Voltage V — — 0.025 V DC Test OL Output Resistance R — 7 9  I = 10mA, V = 18V, T = +25°C O OUT DD A — 7 10 0°CT +70°C A — 8 11 -40°CT +85°C A — 8 12 -40°CT +125°C A Peak Output Current I — 1.5 — A V = 18V PK DD Latch-Up Protection I — > 0.5 — A Duty cycle2%, t300µs REV Withstand Reverse Current V = 18V DD Switching Time (Note1) Rise Time t — 25 35 ns T = +25°C R A — 27 40 0°CT +70°C A — 29 40 -40°CT +85°C A — 30 40 -40°CT +125°C, Figure4-1 A Fall Time t — 25 35 ns T =+25°C F A — 27 40 0°CT +70°C A — 29 40 -40°CT +85°C A — 30 40 -40°CT +125°C, Figure4-1 A Delay Time t — 30 35 ns T =+25°C D1 A — 33 40 0°CT +70°C A — 35 45 -40°CT +85°C A — 38 50 -40°CT +125°C, Figure4-1 A Note 1: Switching times ensured by design. 2: Package power dissipation is dependent on the copper pad area on the PCB.  2002-2014 Microchip Technology Inc. DS20001423J-page 3

TC4426A/TC4427A/TC4428A DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5VV 18V. DD Parameters Sym. Min. Typ. Max. Units Conditions Delay Time t — 30 35 ns T = +25°C D2 A — 33 40 0°CT +70°C A — 35 45 -40°CT +85°C A — 38 50 -40°CT +125°C, Figure4-1 A Power Supply Power Supply Current I — 1.0 2.0 mA V = 3V (Both inputs) S IN — 0.1 0.2 V = 0V (Both inputs), V = 18V IN DD Note 1: Switching times ensured by design. 2: Package power dissipation is dependent on the copper pad area on the PCB. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  V  18V. DD Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range (C) T 0 — +70 °C A Specified Temperature Range (E) T -40 — +85 °C A Specified Temperature Range (V) T -40 — +125 °C A Maximum Junction Temperature T — — +150 °C J Storage Temperature Range T -65 — +150 °C A Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN-S  — 35.7 — °C/W JA Thermal Resistance, 8L-MSOP  — 211 — °C/W JA Thermal Resistance, 8L-PDIP  — 89.3 — °C/W JA Thermal Resistance, 8L-SOIC  — 149.5 — °C/W JA DS20001423J-page 4  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5VV 18V. DD 100 100 80 CL = 2200 pF TA = +25°C 80 CCLL == 22220000 ppFF TA = +25°C t (nsec)RISE 4600 CL = 150C0 Lp F= 1000 pCFL = 470 pF (nsec)tFALL4600 CL = 150C0 Lp F= 1000 pCFL = 470 pF 20 20 0 CL = 100 pF 0 CCLL= 1=0 01p0F0 pF 5.0 7.5 10.0 12.5 15.0 17.5 5.0 7.5 10.0 12.5 15.0 17.5 VDD (V) VDD (V) FIGURE 2-1: Rise Time vs. Supply FIGURE 2-4: Fall Time vs. Supply Voltage. Voltage. 110 60 100 tD1 CL = 1000 pF 55 CL = 1000 pF me (nsec) 789000 VDD = 10V me (nsec) 544050 tD2 tD1 Delay Ti 654000 tD2 Delay Ti 3305 30 25 20 20 1 2 3 4 5 6 7 8 9 0 5 10 15 20 Input Amplitude (V) VDD (V) FIGURE 2-2: Delay Time vs. Input FIGURE 2-5: Propagation Delay Time vs. Amplitude. Supply Voltage. 28 40 26 CL = 1000 pF CL = 1000 pF VDD = 18V c) 35 VDD = 18V Time (nsec) 22212408 elay Time (nse 2350 tD2 tRISE D 20 16 tD1 14 tFALL 15 -100 -50 0 50 100 150 -100 -50 0 50 100 150 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 2-3: Rise and Fall Times vs. FIGURE 2-6: Propagation Delay Time vs. Temperature. Temperature.  2002-2014 Microchip Technology Inc. DS20001423J-page 5

TC4426A/TC4427A/TC4428A Note: Unless otherwise indicated, over operating temperature range with 4.5VV 18V. DD 30 30 TA = +125°C 25 25 TA = +125°C Ω ()ON) 2105 TA = +25°C Ω ()ON) 2105 RDS( 10 RDS( 10 TA = +25°C 5 5 0 0 0 5 10 15 20 0 5 10 15 20 VDD (V) VDD (V) FIGURE 2-7: High-State Output FIGURE 2-10: Low-State Output Resistance. Resistance. 60 60 CL = 2200 pF CL = 1500 pF VDD = 18V 2 MHz VDD = 18V 900 kHz 50 50 mA) 40 CL = 1000 pF CL = 100 pF mA) 40 600 kHz (PLY30 (PLY30 P P ISU20 ISU 20 200 kHz 10 10 20 kHz 0 0 0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500 FREQUENCY (kHz) CLOAD (pF) FIGURE 2-8: Supply Current vs. FIGURE 2-11: Supply Current vs. Frequency. Capacitive Load. 80 80 70 VDD = 12V CL = 2200 pF 70 VDD = 12V 2 MHz 60 CL = 1500 pF 60 (mA)Y 5400 CL = 1000 pF (mA)Y 5400 L L 900 kHz PP 30 PP 30 ISU 20 CL = 100 pF ISU 20 600 kHz 200 kHz 10 10 20 kHz 0 0 0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500 FREQUENCY (kHz) CLOAD (pF) FIGURE 2-9: Supply Current vs. FIGURE 2-12: Supply Current vs. Frequency. Capacitive Load. DS20001423J-page 6  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A Note: Unless otherwise indicated, over operating temperature range with 4.5VV 18V. DD 40 40 35 VDD = 6V CL = 2200 pF 35 VDD = 6V 2 MHz 30 30 mA) 25 CL = 1500 pF mA) 25 (PLY 20 CL = 1000 pF (PLY 20 900 kHz ISUP 1150 CL = 100 pF ISUP 1150 600 kHz 5 5 200 kHz 20 kHz 0 0 0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500 FREQUENCY (kHz) CLOAD (pF) FIGURE 2-13: Supply Current vs. FIGURE 2-15: Supply Current vs. Frequency. Capacitive Load. 900 1100 800 BOTH INPUTS = 1 1000 900 BOTH INPUTS = 1 (µA)T 760000 TA = 25°C (µA)T 870000 VDD = 18V N 500 N 600 E E SC 400 SC 500 UIE 300 UIE 400 Q Q 300 I 200 BOTH INPUTS = 0 I 200 BOTH INPUTS = 0 100 100 0 0 0 5 10 15 20 -100 -50 0 50 100 150 VDD (V) TEMPERATURE (°C) FIGURE 2-14: Quiescent Supply Current FIGURE 2-16: Quiescent Supply Current vs. Voltage. vs. Temperature.  2002-2014 Microchip Technology Inc. DS20001423J-page 7

TC4426A/TC4427A/TC4428A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table3-1. TABLE 3-1: PIN FUNCTION TABLE (Note1) PDIP, MSOP, SOIC 6x5 DFN-S Symbol Description 1 1 NC No connection 2 2 IN A Input A 3 3 GND Ground 4 4 IN B Input B 5 5 OUT B Output B 6 6 V Supply input DD 7 7 OUT A Output A 8 8 NC No connection — 9 EP Exposed Metal Pad Note 1: Duplicate pins must be connected for proper operation. 3.1 Inputs A and B (IN A, IN B) 3.4 Supply Input (V ) DD MOSFET driver inputs A and B are high-impedance, The V input is the bias supply for the MOSFET driver DD TTL/CMOS compatible inputs. These inputs also have and is rated for 4.5V to 18V, with respect to the ground 300mV of hysteresis between the high and low pin. The V input should be bypassed with local DD thresholds that prevents output glitching, even when ceramic capacitors. The value of these capacitors the rise and fall time of the input signal is very slow. should be chosen based on the capacitive load that is being driven. 3.2 Ground (GND) 3.5 Exposed Metal Pad (EP) The Ground pin is the return path for both the bias current and the high-peak current that discharges the The exposed metal pad of the 6x5 DFN-S package is external load capacitance. The Ground pin should be not internally connected to any potential. Therefore, tied into a ground plane or have a very short trace to the this pad can be connected to a ground plane or other bias supply source return. copper plane on a printed circuit board, to aid in heat removal from the package. 3.3 Output A and B (OUT A, OUT B) MOSFET driver outputs A and B are low-impedance, CMOS push-pull style outputs. The pull-down and pull-up devices are of equal strength, making the rise and fall times equivalent. DS20001423J-page 8  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A 4.0 APPLICATIONS INFORMATION +5V 90% Input VDD = 18V 0V 10% tD1 tD2 t t F R V 4.7µF 0.1µF DD 90% 90% Output 6 10% 10% 2 7 0V Input Output Inverting Driver C = 1000pF (TC4426A, ½ TC4428A) L 4 5 +5V 90% Input 10% 0V 3 V DD 90% 90% Input: 100kHz, Output tD1 tR tD2 tF square wave, tRISE = tFALL10ns 0V 10% 10% Non-Inverting Driver (TC4427A, ½ TC4428A) FIGURE 4-1: Switching Time Test Circuit.  2002-2014 Microchip Technology Inc. DS20001423J-page 9

TC4426A/TC4427A/TC4428A 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead DFN-S (6x5x0.9 mm) Example TC4426A EMFe^^3 1330 256 NNN PIN 1 PIN 1 8-Lead MSOP (3x3 mm) Example 4426AE 330256 8-Lead PDIP (300 mil) Example XXXXXXXX TC4427A XXXXXNNN EPAe^3^256 YYWW 1330 8-Lead SOIC (3.90 mm) Example TC2248AC OAe^^3330 NNN 256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS20001423J-page 10  2002-2014 Microchip Technology Inc.

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(cid:7), (cid:4)(cid:29)(cid:16)(cid:4)(cid:14)(cid:8)-3 8 (cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)6(cid:13)(cid:25)(cid:12)&(cid:23) (cid:2) /(cid:29)(cid:4)(cid:4)(cid:14)0(cid:3)1 8 (cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)<(cid:19)#&(cid:23) - (cid:15)(cid:29)(cid:4)(cid:4)(cid:14)0(cid:3)1 -$(cid:10)(cid:22)!(cid:13)#(cid:14)(cid:31)(cid:11)#(cid:14)6(cid:13)(cid:25)(cid:12)&(cid:23) (cid:2)(cid:16) ,(cid:29)(cid:6)(cid:4) (cid:5)(cid:29)(cid:4)(cid:4) (cid:5)(cid:29)(cid:30)(cid:4) -$(cid:10)(cid:22)!(cid:13)#(cid:14)(cid:31)(cid:11)#(cid:14)<(cid:19)#&(cid:23) -(cid:16) (cid:16)(cid:29)(cid:16)(cid:4) (cid:16)(cid:29),(cid:4) (cid:16)(cid:29)(cid:5)(cid:4) 1(cid:22)(cid:25)&(cid:11)(cid:20)&(cid:14)<(cid:19)#&(cid:23) ) (cid:4)(cid:29),/ (cid:4)(cid:29)(cid:5)(cid:4) (cid:4)(cid:29)(cid:5): 1(cid:22)(cid:25)&(cid:11)(cid:20)&(cid:14)6(cid:13)(cid:25)(cid:12)&(cid:23) 6 (cid:4)(cid:29)/(cid:4) (cid:4)(cid:29)(cid:15)(cid:4) (cid:4)(cid:29)(cid:17)/ 1(cid:22)(cid:25)&(cid:11)(cid:20)&(cid:9)&(cid:22)(cid:9)-$(cid:10)(cid:22)!(cid:13)#(cid:14)(cid:31)(cid:11)# = (cid:4)(cid:29)(cid:16)(cid:4) > > (cid:19)(cid:20)(cid:12)(cid:5)(cid:11)$ (cid:30)(cid:29) (cid:31)(cid:19)(cid:25)(cid:14)(cid:30)(cid:14) (cid:19)!"(cid:11)(cid:26)(cid:14)(cid:19)(cid:25)#(cid:13)$(cid:14)%(cid:13)(cid:11)&"(cid:21)(cid:13)(cid:14)’(cid:11)(cid:27)(cid:14) (cid:11)(cid:21)(cid:27)((cid:14))"&(cid:14)’"!&(cid:14))(cid:13)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)*(cid:19)&(cid:23)(cid:19)(cid:25)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:23)(cid:11)&(cid:20)(cid:23)(cid:13)#(cid:14)(cid:11)(cid:21)(cid:13)(cid:11)(cid:29) (cid:16)(cid:29) (cid:31)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:13)(cid:14)’(cid:11)(cid:27)(cid:14)(cid:23)(cid:11) (cid:13)(cid:14)(cid:22)(cid:25)(cid:13)(cid:14)(cid:22)(cid:21)(cid:14)’(cid:22)(cid:21)(cid:13)(cid:14)(cid:13)$(cid:10)(cid:22)!(cid:13)#(cid:14)&(cid:19)(cid:13)(cid:14))(cid:11)(cid:21)!(cid:14)(cid:11)&(cid:14)(cid:13)(cid:25)#!(cid:29) ,(cid:29) (cid:31)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:13)(cid:14)(cid:19)!(cid:14)!(cid:11)*(cid:14)!(cid:19)(cid:25)(cid:12)"(cid:26)(cid:11)&(cid:13)#(cid:29) (cid:5)(cid:29) (cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)(cid:19)(cid:25)(cid:12)(cid:14)(cid:11)(cid:25)#(cid:14)&(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:19)(cid:25)(cid:12)(cid:14)(cid:10)(cid:13)(cid:21)(cid:14)(cid:7)(cid:3)(cid:18)-(cid:14).(cid:30)(cid:5)(cid:29)/(cid:18)(cid:29) 0(cid:3)12 0(cid:11)!(cid:19)(cid:20)(cid:14)(cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)(cid:29)(cid:14)(cid:24)(cid:23)(cid:13)(cid:22)(cid:21)(cid:13)&(cid:19)(cid:20)(cid:11)(cid:26)(cid:26)(cid:27)(cid:14)(cid:13)$(cid:11)(cid:20)&(cid:14) (cid:11)(cid:26)"(cid:13)(cid:14)!(cid:23)(cid:22)*(cid:25)(cid:14)*(cid:19)&(cid:23)(cid:22)"&(cid:14)&(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:13)!(cid:29) (cid:8)-32 (cid:8)(cid:13)%(cid:13)(cid:21)(cid:13)(cid:25)(cid:20)(cid:13)(cid:14)(cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)((cid:14)"!"(cid:11)(cid:26)(cid:26)(cid:27)(cid:14)*(cid:19)&(cid:23)(cid:22)"&(cid:14)&(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:13)((cid:14)%(cid:22)(cid:21)(cid:14)(cid:19)(cid:25)%(cid:22)(cid:21)’(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:10)"(cid:21)(cid:10)(cid:22)!(cid:13)!(cid:14)(cid:22)(cid:25)(cid:26)(cid:27)(cid:29) (cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:24)(cid:13)(cid:20)(cid:23)(cid:25)(cid:22)(cid:26)(cid:22)(cid:12)(cid:27)(cid:2)(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)1(cid:4)(cid:5)(cid:9)(cid:30)(cid:16)(cid:16)0  2002-2014 Microchip Technology Inc. DS20001423J-page 11

TC4426A/TC4427A/TC4428A (cid:19)(cid:20)(cid:12)(cid:5)$ 3(cid:22)(cid:21)(cid:14)&(cid:23)(cid:13)(cid:14)’(cid:22)!&(cid:14)(cid:20)"(cid:21)(cid:21)(cid:13)(cid:25)&(cid:14)(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:13)(cid:14)#(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)!((cid:14)(cid:10)(cid:26)(cid:13)(cid:11)!(cid:13)(cid:14)!(cid:13)(cid:13)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)(cid:31)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)(cid:11)&(cid:14) (cid:23)&&(cid:10)244***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)’4(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) DS20001423J-page 12  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A (cid:56)(cid:36) (cid:49)(cid:82)(cid:87)(cid:72)(cid:29) For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2014 Microchip Technology Inc. DS20001423J-page 13

TC4426A/TC4427A/TC4428A UA Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001423J-page 14  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A 8-Lead Plastic Micro Small Outline Package (UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2014 Microchip Technology Inc. DS20001423J-page 15

TC4426A/TC4427A/TC4428A (cid:27)(cid:16)(cid:47)(cid:72)(cid:68)(cid:71)(cid:3)(cid:51)(cid:79)(cid:68)(cid:86)(cid:87)(cid:76)(cid:70)(cid:3)(cid:39)(cid:88)(cid:68)(cid:79)(cid:3)(cid:44)(cid:81)(cid:16)(cid:47)(cid:76)(cid:81)(cid:72)(cid:3)(cid:11)(cid:51)(cid:36)(cid:12)(cid:3)(cid:16)(cid:3)(cid:22)(cid:19)(cid:19)(cid:3)(cid:80)(cid:76)(cid:79)(cid:3)(cid:37)(cid:82)(cid:71)(cid:92)(cid:3)(cid:62)(cid:51)(cid:39)(cid:44)(cid:51)(cid:64) (cid:49)(cid:82)(cid:87)(cid:72)(cid:29) For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A A2 (cid:51)(cid:47)(cid:36)(cid:49)(cid:40) L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 DS20001423J-page 16  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A (cid:27)(cid:16)(cid:47)(cid:72)(cid:68)(cid:71)(cid:3)(cid:51)(cid:79)(cid:68)(cid:86)(cid:87)(cid:76)(cid:70)(cid:3)(cid:39)(cid:88)(cid:68)(cid:79)(cid:3)(cid:44)(cid:81)(cid:16)(cid:47)(cid:76)(cid:81)(cid:72)(cid:3)(cid:11)(cid:51)(cid:36)(cid:12)(cid:3)(cid:16)(cid:3)(cid:22)(cid:19)(cid:19)(cid:3)(cid:80)(cid:76)(cid:79)(cid:3)(cid:37)(cid:82)(cid:71)(cid:92)(cid:3)(cid:62)(cid:51)(cid:39)(cid:44)(cid:51)(cid:64) (cid:49)(cid:82)(cid:87)(cid:72)(cid:29) For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e e 2 2 e e Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e .100 BSC Top to Seating Plane A - - .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 - - Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB - - .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2  2002-2014 Microchip Technology Inc. DS20001423J-page 17

TC4426A/TC4427A/TC4428A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001423J-page 18  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2014 Microchip Technology Inc. DS20001423J-page 19

TC4426A/TC4427A/TC4428A (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)"(cid:30)(cid:6)(cid:10)(cid:10)(cid:8)%(cid:16)(cid:12)(cid:10)(cid:13)&(cid:5)(cid:8)(cid:23)%’(cid:25)(cid:8)(cid:26)(cid:8)(cid:19)(cid:6)(((cid:20))(cid:18)(cid:8)*+,-(cid:8)(cid:30)(cid:30)(cid:8)(cid:31)(cid:20)(cid:7) (cid:8)!"%./# (cid:19)(cid:20)(cid:12)(cid:5)$ 3(cid:22)(cid:21)(cid:14)&(cid:23)(cid:13)(cid:14)’(cid:22)!&(cid:14)(cid:20)"(cid:21)(cid:21)(cid:13)(cid:25)&(cid:14)(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:13)(cid:14)#(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)!((cid:14)(cid:10)(cid:26)(cid:13)(cid:11)!(cid:13)(cid:14)!(cid:13)(cid:13)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)(cid:31)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)(cid:11)&(cid:14) (cid:23)&&(cid:10)244***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)’4(cid:10)(cid:11)(cid:20)+(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) DS20001423J-page 20  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A APPENDIX A: REVISION HISTORY Revision J (July 2014) The following is the list of modifications: 1. Updated Figure4-1. Revision H (September 2013) The following is the list of modifications: 1. Changed ESD protection value to 2kV on the Features page. 2. Updated the package specification drawings in Section5.0 “Packaging Information”, to show all views available. 3. Minor typographical corrections.  2002-2014 Microchip Technology Inc. DS20001423J-page 21

TC4426A/TC4427A/TC4428A NOTES: DS20001423J-page 22  2002-2014 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X XX XXX X Examples: a)TC4426ACOA: 1.5A Dual Inverting Device Temperature Package Tape & Reel PB Free MOSFET driver, Range 0°C to +70°C, 8LD SOIC package. b)TC4426AEOA: 1.5A Dual Inverting MOSFET driver, Device: TC4426A: 1.5A Dual MOSFET Driver, Inverting -40°C to +85°C, TC4427A: 1.5A Dual MOSFET Driver, Non-Inverting 8LD SOIC package. TC4428A: 1.5A Dual MOSFET Driver, Complementary c) TC4426AEMF: 1.5A Dual Inverting MOSFET driver, -40°C to +85°C, Temperature Range: C = 0°C to +70°C (PDIP & SOIC Only) 8LD DFN-S package. E = -40°C to +85°C a)TC4427ACPA: 1.5A Dual Non-Inverting V = -40ºC to +125°C MOSFET driver, 0°C to +70°C, 8LD PDIP package. Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead b)TC4427AEPA: 1.5A Dual Non-Inverting MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead MOSFET driver, (Tape and Reel) -40°C to +85°C, OA = Plastic SOIC, (150 mil Body), 8-lead 8LD PDIP package. OA713 = Plastic SOIC, (150 mil Body), 8-lead c) TC4427AVMF713: 1.5A Dual Non-Inverting (Tape and Reel) MOSFET driver, PA = Plastic DIP (300 mil Body), 8-lead -40°C to +125°C, UA = Plastic Micro Small Outline (MSOP), 8-lead 8LD DFN-S package, UA713 = Plastic Micro Small Outline (MSOP), 8-lead Tape and Reel. (Tape and Reel) a)TC4428AEPA: 1.5A Dual Complementary MOSFET driver, -40°C to +85°C, 8LD PDIP package. b)TC4428ACOA713: 1.5A Dual Complementary MOSFET driver, 0°C to +70°C 8LD SOIC package, Tape and Reel. c) TC4428AVMF: 1.5A Dual Complementary MOSFET driver, -40°C to +125°C, 8LD DFN-S package.  2002-2014 Microchip Technology Inc. DS20001423J-page 23

TC4426A/TC4427A/TC4428A NOTES: DS20001423J-page 24  2002-2014 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, ensure that your application meets with your specifications. LANCheck, MediaLB, MOST, MOST logo, MPLAB, MICROCHIP MAKES NO REPRESENTATIONS OR OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, WARRANTIES OF ANY KIND WHETHER EXPRESS OR SST, SST Logo, SuperFlash and UNI/O are registered IMPLIED, WRITTEN OR ORAL, STATUTORY OR trademarks of Microchip Technology Incorporated in the OTHERWISE, RELATED TO THE INFORMATION, U.S.A. and other countries. INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR The Embedded Control Solutions Company and mTouch are FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated arising from this information and its use. Use of Microchip in the U.S.A. devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, the buyer’s risk, and the buyer agrees to defend, indemnify and CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit hold harmless Microchip from any and all damages, claims, Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, suits, or expenses resulting from such use. No licenses are KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, conveyed, implicitly or otherwise, under any Microchip MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code intellectual property rights. Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-361-7 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2002-2014 Microchip Technology Inc. DS20001423J-page 25

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