TC4426A/TC4427A/TC4428A 1.5A Dual High-Speed Power MOSFET Drivers Features: General Description: • High Peak Output Current – 1.5A The TC4426A/TC4427A/TC4428A are improved (cid:129) Wide Input Supply Voltage Operating Range: versions of the earlier TC4426/TC4427/TC4428 family of MOSFET drivers. In addition to matched rise and fall - 4.5V to 18V times, the TC4426A/TC4427A/TC4428A devices have (cid:129) High Capacitive Load Drive Capability – 1000pF matched leading and falling edge propagation delay in 25ns (typ.) times. (cid:129) Short Delay Times – 30ns (typ.) These devices are highly latch-up resistant under any (cid:129) Matched Rise, Fall and Delay Times conditions within their power and voltage ratings. They (cid:129) Low Supply Current: are not subject to damage when up to 5V of noise - With Logic ‘1’ Input – 1mA (typ.) spiking (of either polarity) occurs on the ground pin. - With Logic ‘0’ Input – 100μA (typ.) They can accept, without damage or logic upset, up to (cid:129) Low Output Impedance – 7 Ω (typ.) 500mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully (cid:129) Latch-Up Protected: Will Withstand 0.5A Reverse protected against Electrostatic Discharge (ESD) up to Current 4kV. (cid:129) Input Will Withstand Negative Inputs Up to 5V The TC4426A/TC4427A/TC4428A MOSFET drivers (cid:129) ESD Protected – 4kV can easily charge/discharge 1000pF gate (cid:129) Pin-compatible with TC426/TC427/TC428 and capacitances in under 30ns. These devices provide TC4426/TC4427/TC4428 low enough impedances in both the on and off states to (cid:129) Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN ensure the MOSFET’s intended state will not be Packages affected, even by large transients. Applications: (cid:129) Switch Mode Power Supplies (cid:129) Line Drivers (cid:129) Pulse Transformer Drive Package Types 8-Pin MSOP/ PDIP/SOIC TC4426A TC4427A TC4428A 8-Pin DFN(1) TC4426A TC4427A TC4428A NC 1 8 NC NC NC NC 1 8 NC NC NC IN A 2TC4426A 7 OUT A OUT A OUT A TC4426A GND 3TC4427A 6 VDD VDD VDD IN A 2 TC4427A 7 OUT A OUT A OUT A IN B 4TC4428A 5 OUT B OUT B OUT B GND 3 TC4428A 6 VDD VDD VDD IN B 4 5 OUT B OUT B OUT B Note1: Exposed pad of the DFN package is electrically isolated. © 2006 Microchip Technology Inc. DS21423F-page 1

TC4426A/TC4427A/TC4428A Functional Block Diagram V DD Inverting 500μA 300mV Output Non-Inverting Input Effective 4.7V Input C = 12pF (Each Input) TC4426A/TC4427A/TC4428A GND Note 1: TC4426A has two inverting drivers, while the TC4427A has two non-inverting drivers. The TC4428A has one inverting and one non-inverting driver. 2: Ground any unused driver input. DS21423F-page 2 © 2006 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A 1.0 ELECTRICAL † Notice: Stresses above those listed under “Absolute Maxi- mum Ratings” may cause permanent damage to the device. CHARACTERISTICS These are stress ratings only and functional operation of the device at these or any other conditions above those indicated Absolute Maximum Ratings† in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for Supply Voltage.....................................................+22V extended periods may affect device reliability. Input Voltage, IN A or IN B .....................................(V + 0.3V) to (GND – 5V) DD Package Power Dissipation (T ≤ 70°C) A DFN.............................................................. Note2 MSOP..........................................................340mW PDIP............................................................730mW SOIC............................................................470mW DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ V ≤ 18V. DD Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage V 2.4 — — V IH Logic ‘0’, Low Input Voltage V — — 0.8 V IL Input Current I –1.0 — +1.0 μA 0V ≤ V ≤ V IN IN DD –10 — +10 Output High Output Voltage V V – 0.025 — — V DC Test OH DD Low Output Voltage V — — 0.025 V DC Test OL Output Resistance R — 7 9 Ω I = 10mA, V = 18V, T = +25°C O OUT DD A — 7 10 0°C ≤ T ≤ +70°C A — 8 11 -40°C ≤ T ≤ +85°C A — 8 12 -40°C ≤ T ≤ +125°C A Peak Output Current I — 1.5 — A V = 18V PK DD Latch-Up Protection I — > 0.5 — A Duty cycle ≤ 2%, t ≤ 300μsec REV Withstand Reverse Current V = 18V DD Switching Time (Note1) Rise Time t — 25 35 ns T = +25°C R A — 27 40 0°C ≤ T ≤ +70°C A — 29 40 -40°C ≤ T ≤ +85°C A — 30 40 -40°C ≤ T ≤ +125°C, Figure4-1 A Fall Time t — 25 35 ns T = +25°C F A — 27 40 0°C ≤ T ≤ +70°C A — 29 40 -40°C ≤ T ≤ +85°C A — 30 40 -40°C ≤ T ≤ +125°C, Figure4-1 A Delay Time t — 30 35 ns T = +25°C D1 A — 33 40 0°C ≤ T ≤ +70°C A — 35 45 -40°C ≤ T ≤ +85°C A — 38 50 -40°C ≤ T ≤ +125°C, Figure4-1 A Delay Time t — 30 35 ns T = +25°C D2 A — 33 40 0°C ≤ T ≤ +70°C A — 35 45 -40°C ≤ T ≤ +85°C A — 38 50 -40°C ≤ T ≤ +125°C, Figure4-1 A Power Supply Power Supply Current I — 1.0 2.0 mA V = 3V (Both inputs) S IN — 0.1 0.2 V = 0V (Both inputs), V = 18V IN DD Note 1: Switching times ensured by design. 2: Package power dissipation is dependent on the copper pad area on the PCB. © 2006 Microchip Technology Inc. DS21423F-page 3

TC4426A/TC4427A/TC4428A TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ V ≤ 18V. DD Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (C) T 0 — +70 °C A Specified Temperature Range (E) T -40 — +85 °C A Specified Temperature Range (V) T -40 — +125 °C A Maximum Junction Temperature T — — +150 °C J Storage Temperature Range T -65 — +150 °C A Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN θ — 33.2 — °C/W JA Thermal Resistance, 8L-MSOP θ — 206 — °C/W JA Thermal Resistance, 8L-PDIP θ — 125 — °C/W JA Thermal Resistance, 8L-SOIC θ — 155 — °C/W JA DS21423F-page 4 © 2006 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ V ≤ 18V. DD 100 100 80 CL = 2200 pF TA = +25°C 80 CCLL == 22220000 ppFF TA = +25°C t (nsec)RISE 4600 CL = 150C0 Lp F= 1000 pCFL = 470 pF (nsec)tFALL4600 CL = 150C0 Lp F= 1000 pCFL = 470 pF 20 20 0 CL = 100 pF 0 CCLL= 1=0 01p0F0 pF 5.0 7.5 10.0 12.5 15.0 17.5 5.0 7.5 10.0 12.5 15.0 17.5 VDD (V) VDD (V) FIGURE 2-1: Rise Time vs. Supply FIGURE 2-4: Fall Time vs. Supply Voltage. Voltage. 110 60 100 tD1 CL = 1000 pF 55 CL = 1000 pF me (nsec) 789000 VDD = 10V me (nsec) 544050 tD2 tD1 Delay Ti 654000 tD2 Delay Ti 3305 30 25 20 20 1 2 3 4 5 6 7 8 9 0 5 10 15 20 Input Amplitude (V) VDD (V) FIGURE 2-2: Delay Time vs. Input FIGURE 2-5: Propagation Delay Time vs. Amplitude. Supply Voltage. 28 40 26 CVDL D= =1 01080V pF c) 35 CVDL D= =1 01080V pF Time (nsec) 22212408 elay Time (nse 2350 tD2 tRISE D 20 16 tD1 14 tFALL 15 -100 -50 0 50 100 150 -100 -50 0 50 100 150 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 2-3: Rise and Fall Times vs. FIGURE 2-6: Propagation Delay Time vs. Temperature. Temperature. © 2006 Microchip Technology Inc. DS21423F-page 5

TC4426A/TC4427A/TC4428A Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ V ≤ 18V. DD 30 30 TA = +125°C 25 25 TA = +125°C Ω ()ON) 2105 TA = +25°C Ω ()ON) 2105 RDS( 10 RDS( 10 TA = +25°C 5 5 0 0 0 5 10 15 20 0 5 10 15 20 VDD (V) VDD (V) FIGURE 2-7: High-State Output FIGURE 2-10: Low-State Output Resistance. Resistance. 60 60 CL = 2200 pF CL = 1500 pF VDD = 18V 2 MHz VDD = 18V 900 kHz 50 50 mA) 40 CL = 1000 pF CL = 100 pF mA) 40 600 kHz (Y30 (Y30 L L P P P P U20 U 20 IS IS 200 kHz 10 10 20 kHz 0 0 0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500 FREQUENCY (kHz) CLOAD (pF) FIGURE 2-8: Supply Current vs. FIGURE 2-11: Supply Current vs. Frequency. Capacitive Load. 80 80 70 VDD = 12V CL = 2200 pF 70 VDD = 12V 2 MHz 60 CL = 1500 pF 60 (mA)Y 5400 CL = 1000 pF (mA)Y 5400 L L 900 kHz PP 30 PP 30 ISU 20 CL = 100 pF ISU 20 600 kHz 200 kHz 10 10 20 kHz 0 0 0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500 FREQUENCY (kHz) CLOAD (pF) FIGURE 2-9: Supply Current vs. FIGURE 2-12: Supply Current vs. Frequency. Capacitive Load. DS21423F-page 6 © 2006 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ V ≤ 18V. DD 40 40 35 VDD = 6V CL = 2200 pF 35 VDD = 6V 2 MHz 30 30 mA) 25 CL = 1500 pF mA) 25 (PLY 20 CL = 1000 pF (PLY 20 900 kHz ISUP 1150 CL = 100 pF ISUP 1150 600 kHz 5 5 200 kHz 20 kHz 0 0 0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500 FREQUENCY (kHz) CLOAD (pF) FIGURE 2-13: Supply Current vs. FIGURE 2-15: Supply Current vs. Frequency. Capacitive Load. 900 1100 800 BOTH INPUTS = 1 1000 900 BOTH INPUTS = 1 (µA)NT 765000000 TA = 25°C (µA)NT 876000000 VDD = 18V E E SC 400 SC 500 UIE 300 UIE 400 Q Q 300 I 200 BOTH INPUTS = 0 I 200 BOTH INPUTS = 0 100 100 0 0 0 5 10 15 20 -100 -50 0 50 100 150 VDD (V) TEMPERATURE (°C) FIGURE 2-14: Quiescent Supply Current FIGURE 2-16: Quiescent Supply Current vs. Voltage. vs. Temperature. © 2006 Microchip Technology Inc. DS21423F-page 7

TC4426A/TC4427A/TC4428A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table3-1. TABLE 3-1: PIN FUNCTION TABLE 8-Pin PDIP/ 8-Pin Symbol Description MSOP/SOIC DFN 1 1 NC No connection 2 2 IN A Input A 3 3 GND Ground 4 4 IN B Input B 5 5 OUT B Output B 6 6 V Supply input DD 7 7 OUT A Output A 8 8 NC No connection — PAD NC Exposed Metal Pad Note 1: Duplicate pins must be connected for proper operation. 3.1 Inputs A and B 3.4 Supply Input (V ) DD MOSFET driver inputs A and B are high-impedance, The V input is the bias supply for the MOSFET driver DD TTL/CMOS compatible inputs. These inputs also have and is rated for 4.5V to 18V, with respect to the ground 300mV of hysteresis between the high and low pin. The V input should be bypassed with local DD thresholds that prevents output glitching, even when ceramic capacitors. The value of these capacitors the rise and fall time of the input signal is very slow. should be chosen based on the capacitive load that is being driven. 3.2 Ground (GND) 3.5 Exposed Metal Pad The ground pin is the return path for both the bias current and the high peak current that discharges the The exposed metal pad of the 6x5 DFN package is not external load capacitance. The ground pin should be internally connected to any potential. Therefore, this tied into a ground plane or have a very short trace to the pad can be connected to a ground plane or other bias supply source return. copper plane on a printed circuit board, to aid in heat removal from the package. 3.3 Output A and B MOSFET driver outputs A and B are low-impedance, CMOS push-pull style outputs. The pull-down and pull- up devices are of equal strength, making the rise and fall times equivalent. DS21423F-page 8 © 2006 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A 4.0 APPLICATIONS INFORMATION +5V 90% Input VDD = 18V 0V 10% tD1 tD2 t t F R V 4.7μF 0.1μF DD 90% 90% Output 6 10% 10% 2 7 0V Input Output Inverting Driver CL = 1000pF (TC4426A, 1/2 TC4428A) 4 5 +5V 90% Input 10% 0V 3 V DD 90% 90% Input: 100kHz, Output tD1 tR tD2 tF square wave, tRISE = tFALL ≤ 10ns 0V 10% 10% Non-Inverting Driver (TC4427A, 1/2 TC4428A) FIGURE 4-1: Switching Time Test Circuit. © 2006 Microchip Technology Inc. DS21423F-page 9

TC4426A/TC4427A/TC4428A 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead DFN Example: XXXXXXX TC4426A XXXXXXX EMF XXYYWW 0420 NNN 256 8-Lead MSOP Example: XXXXX 4426AE YWWNNN 420256 8-Lead PDIP (300 mil) Example: XXXXXXXX TC4427A XXXXXNNN EPA256 YYWW 0420 8-Lead SOIC (150 mil) Example: XXXXXXXX TC4428A XXXXYYWW COA0420 NNN 256 Legend: XX...X Customer specific information* YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). DS21423F-page 10 © 2006 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A 8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated © 2006 Microchip Technology Inc. DS21423F-page 11

TC4426A/TC4427A/TC4428A 8-Lead Plastic Micro Small Outline Package (UA) (MSOP) E E1 p D 2 B n 1 α A A2 c φ A1 (F) L β Units INCHES MILLIMETERS* Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .026 BSC 0.65 BSC Overall Height A - - .043 - - 1.10 Molded Package Thickness A2 .030 .033 .037 0.75 0.85 0.95 Standoff A1 .000 - .006 0.00 - 0.15 Overall Width E .193 TYP. 4.90 BSC Molded Package Width E1 .118 BSC 3.00 BSC Overall Length D .118 BSC 3.00 BSC Foot Length L .016 .024 .031 0.40 0.60 0.80 Footprint (Reference) F .037 REF 0.95 REF Foot Angle φ 0° - 8° 0° - 8° Lead Thickness c .003 .006 .009 0.08 - 0.23 Lead Width B .009 .012 .016 0.22 - 0.40 Mold Draft Angle Top α 5° - 15° 5° - 15° Mold Draft Angle Bottom β 5° - 15° 5° - 15° *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-187 Drawing No. C04-111 DS21423F-page 12 © 2006 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 L c A1 β B1 p eB B Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α 5 10 15 5 10 15 Mold Draft Angle Bottom β 5 10 15 5 10 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 © 2006 Microchip Technology Inc. DS21423F-page 13

TC4426A/TC4427A/TC4428A 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h α 45° c A A2 φ β L A1 Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .050 1.27 Overall Height A .053 .061 .069 1.35 1.55 1.75 Molded Package Thickness A2 .052 .056 .061 1.32 1.42 1.55 Standoff § A1 .004 .007 .010 0.10 0.18 0.25 Overall Width E .228 .237 .244 5.79 6.02 6.20 Molded Package Width E1 .146 .154 .157 3.71 3.91 3.99 Overall Length D .189 .193 .197 4.80 4.90 5.00 Chamfer Distance h .010 .015 .020 0.25 0.38 0.51 Foot Length L .019 .025 .030 0.48 0.62 0.76 Foot Angle φ 0 4 8 0 4 8 Lead Thickness c .008 .009 .010 0.20 0.23 0.25 Lead Width B .013 .017 .020 0.33 0.42 0.51 Mold Draft Angle Top α 0 12 15 0 12 15 Mold Draft Angle Bottom β 0 12 15 0 12 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS21423F-page 14 © 2006 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X XX XXX X Examples: a)TC4426ACOA: 1.5A Dual Inverting Device Temperature Package Tape & Reel PB Free MOSFET driver, Range 0°C to +70°C, 8LD SOIC package. b)TC4426AEOA: 1.5A Dual Inverting Device: TC4426A: 1.5A Dual MOSFET Driver, Inverting MOSFET driver, TC4427A: 1.5A Dual MOSFET Driver, Non-Inverting TC4428A: 1.5A Dual MOSFET Driver, Complementary -40°C to +85°C, 8LD SOIC package. c)TC4426AEMF: 1.5A Dual Inverting Temperature Range: C = 0°C to +70°C (PDIP & SOIC Only) MOSFET driver, E = -40°C to +85°C -40°C to +85°C, V = -40ºC to +125°C 8LD DFN package. a)TC4427ACPA: 1.5A Dual Non-Inverting Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead MOSFET driver, MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead 0°C to +70°C, (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead 8LD PDIP package. OA = Plastic SOIC, (150 mil Body), 8-lead b)TC4427AEPA: 1.5A Dual Non-Inverting OA713 = Plastic SOIC, (150 mil Body), 8-lead MOSFET driver, (Tape and Reel) -40°C to +85°C, UA = Plastic Micro Small Outline (MSOP), 8-lead 8LD PDIP package. UA713 = Plastic Micro Small Outline (MSOP), 8-lead (Tape and Reel) c)TC4427AVMF713: 1.5A Dual Non-Inverting MOSFET driver, -40°C to +125°C, 8LD DFN package, Tape and Reel. a)TC4428AEPA: 1.5A Dual Complementary MOSFET driver, -40°C to +85°C, 8LD PDIP package. b)TC4428ACOA713: 1.5A Dual Complementary MOSFET driver, 0°C to +70°C 8LD SOIC package, Tape and Reel. c)TC4428AVMF: 1.5A Dual Complementary MOSFET driver, -40°C to +125°C, 8LD DFN package. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2006 Microchip Technology Inc. DS21423F-page 15

TC4426A/TC4427A/TC4428A NOTES: DS21423F-page 16 © 2006 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: (cid:129) Microchip products meet the specification contained in their particular Microchip Data Sheet. (cid:129) Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. (cid:129) There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. (cid:129) Microchip is willing to work with the customer who is concerned about the integrity of their code. (cid:129) Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, Accuron, and may be superseded by updates. It is your responsibility to dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, ensure that your application meets with your specifications. PROMATE, PowerSmart, rfPIC, and SmartShunt are MICROCHIP MAKES NO REPRESENTATIONS OR WAR- registered trademarks of Microchip Technology Incorporated RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, in the U.S.A. and other countries. WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, PICMASTER, SEEVAL, SmartSensor and The Embedded MERCHANTABILITY OR FITNESS FOR PURPOSE. Control Solutions Company are registered trademarks of Microchip disclaims all liability arising from this information and Microchip Technology Incorporated in the U.S.A. its use. Use of Microchip’s products as critical components in Analog-for-the-Digital Age, Application Maestro, dsPICDEM, life support systems is not authorized except with express dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, written approval by Microchip. No licenses are conveyed, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial implicitly or otherwise, under any Microchip intellectual property Programming, ICSP, ICEPIC, Linear Active Thermistor, rights. MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. DS21423F-page 17

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