TC4426/TC4427/TC4428 1.5A Dual High-Speed Power MOSFET Drivers Features General Description • High Peak Output Current – 1.5A The TC4426/TC4427/TC4428 are improved versions (cid:127) Wide Input Supply Voltage Operating Range: of the earlier TC426/TC427/TC428 family of MOSFET drivers. The TC4426/TC4427/TC4428 devices have - 4.5V to 18V matched rise and fall times when charging and (cid:127) High Capacitive Load Drive Capability – 1000pF discharging the gate of a MOSFET. in 25ns (typ.) These devices are highly latch-up resistant under any (cid:127) Short Delay Times – 40ns (typ.) conditions within their power and voltage ratings. They (cid:127) Matched Rise and Fall Times are not subject to damage when up to 5V of noise spik- (cid:127) Low Supply Current: ing (of either polarity) occurs on the ground pin. They - With Logic ‘1’ Input – 4mA can accept, without damage or logic upset, up to - With Logic ‘0’ Input – 400µA 500mA of reverse current (of either polarity) being (cid:127) Low Output Impedance – 7 Ω forced back into their outputs. All terminals are fully protected against Electrostatic Discharge (ESD) up to (cid:127) Latch-Up Protected: Will Withstand 0.5A Reverse 4kV. Current (cid:127) Input Will Withstand Negative Inputs Up to 5V The TC4426/TC4427/TC4428 MOSFET drivers can easily charge/discharge 1000pF gate capacitances in (cid:127) ESD Protected – 4kV under 30ns. These device provide low enough (cid:127) Pin-compatible with the TC426/TC427/TC428 impedances in both the on and off states to ensure the (cid:127) Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN MOSFET's intended state will not be affected, even by Packages large transients. Other compatible drivers are the TC4426A/TC4427A/ Applications TC4428A family of devices. The TC4426A/TC4427A/ (cid:127) Switch Mode Power Supplies TC4428A devices have matched leading and falling edge input-to-output delay times, in addition to the (cid:127) Line Drivers matched rise and fall times of the TC4426/TC4427/ (cid:127) Pulse Transformer Drive TC4428 devices. Package Types 8-Pin MSOP/ PDIP/SOIC TC4426 TC4427 TC4428 8-Pin DFN(1) TC4426 TC4427 TC4428 NC 1 8 NC NC NC NC 1 8 NC NC NC IN A 2 TC4426 7 OUT A OUT A OUT A TC4426 GND 3 TC4427 6 VDD VDD VDD IN A 2 TC4427 7 OUT A OUT A OUT A IN B 4 TC4428 5 OUT B OUT B OUT B GND 3 TC4428 6 VDD VDD VDD IN B 4 5 OUT B OUT B OUT B Note1: Exposed pad of the DFN package is electrically isolated.  2004 Microchip Technology Inc. DS21422C-page 1

TC4426/TC4427/TC4428 Functional Block Diagram V DD Inverting 1.5mA 300mV Output Non-Inverting Input Effective 4.7V Input C = 12pF (Each Input) TC4426/TC4427/TC4428 GND Note1: TC4426 has two inverting drivers, while the TC4427 has two non-inverting drivers. The TC4428 has one inverting and one non-inverting driver. 2: Ground any unused driver input. DS21422C-page 2  2004 Microchip Technology Inc.

TC4426/TC4427/TC4428 1.0 ELECTRICAL PIN FUNCTION TABLE CHARACTERISTICS Name Function Absolute Maximum Ratings † NC No Connection IN A Input A Supply Voltage.....................................................+22V GND Ground Input Voltage, IN A or IN B .....................................(V + 0.3V) to (GND – 5V) IN B Input B DD Package Power Dissipation (T ≤ 70°C) OUT B Output B A DFN.............................................................. Note3 VDD Supply Input MSOP..........................................................340 mW OUT A Output A PDIP............................................................730mW NC No Connection SOIC............................................................470mW Storage Temperature Range..............-65°C to +150°C Maximum Junction Temperature......................+150°C † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, T = +25ºC with 4.5V ≤ V ≤ 18V. A DD Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage V 2.4 — — V Note2 IH Logic ‘0’, Low Input Voltage V — — 0.8 V IL Input Current I -1.0 — +1.0 µA 0V ≤ V ≤ V IN IN DD Output High Output Voltage V V – 0.025 — — V DC Test OH DD Low Output Voltage V — — 0.025 V DC Test OL Output Resistance R — 7 10 Ω I = 10mA, V = 18V O OUT DD Peak Output Current I — 1.5 — A V = 18V PK DD Latch-Up Protection I — > 0.5 — A Duty cycle ≤ 2%, t ≤ 300µs REV Withstand Reverse Current V = 18V DD Switching Time (Note1) Rise Time t — 19 30 ns Figure4-1 R Fall Time t — 19 30 ns Figure4-1 F Delay Time t — 20 30 ns Figure4-1 D1 Delay Time t — 40 50 ns Figure4-1 D2 Power Supply Power Supply Current I — — 4.5 mA V = 3V (Both inputs) S IN — — 0.4 V = 0V (Both inputs) IN Note 1: Switching times ensured by design. 2: For V temperature range devices, the V (Min) limit is 2.0V. IH 3: Package power dissipation is dependent on the copper pad area on the PCB.  2004 Microchip Technology Inc. DS21422C-page 3

TC4426/TC4427/TC4428 DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ V ≤ 18V. DD Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage V 2.4 — — V Note2 IH Logic ‘0’, Low Input Voltage V — — 0.8 V IL Input Current I -10 — +10 µA 0V ≤ V ≤ V IN IN DD Output High Output Voltage V V – 0.025 — — V DC Test OH DD Low Output Voltage V — — 0.025 V DC Test OL Output Resistance R — 9 12 Ω I = 10mA, V = 18V O OUT DD Peak Output Current I — 1.5 — A V = 18V PK DD Latch-Up Protection I — >0.5 — A Duty cycle ≤ 2%, t ≤ 300µs REV Withstand Reverse Current V = 18V DD Switching Time (Note1) Rise Time t — — 40 ns Figure4-1 R Fall Time t — — 40 ns Figure4-1 F Delay Time t — — 40 ns Figure4-1 D1 Delay Time t — — 60 ns Figure4-1 D2 Power Supply Power Supply Current I — — 8.0 mA V = 3V (Both inputs) S IN — — 0.6 V = 0V (Both inputs) IN Note 1: Switching times ensured by design. 2: For V temperature range devices, the V (Min) limit is 2.0V. IH TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ V ≤ 18V. DD Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (C) T 0 — +70 °C A Specified Temperature Range (E) T -40 — +85 °C A Specified Temperature Range (V) T -40 — +125 °C A Maximum Junction Temperature T — — +150 °C J Storage Temperature Range T -65 — +150 °C A Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN θ — 33.2 — °C/W JA Thermal Resistance, 8L-MSOP θ — 206 — °C/W JA Thermal Resistance, 8L-PDIP θ — 125 — °C/W JA Thermal Resistance, 8L-SOIC θ — 155 — °C/W JA DS21422C-page 4  2004 Microchip Technology Inc.

TC4426/TC4427/TC4428 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, T = +25ºC with 4.5V ≤ V ≤ 18V. A DD 100 100 2200 pF 2200 pF 80 80 1500 pF 1500 pF (nsec)SE 60 1000 pF (nsec)ALL 60 1000 pF tRI 40 470 pF tF 40 470 pF 20 20 100 pF 100 pF 0 0 4 6 8 10 12 14 16 18 4 6 8 10 12 14 16 18 VDD(V) VDD(V) FIGURE 2-1: Rise Time vs. Supply FIGURE 2-4: Fall Time vs. Supply Voltage. Voltage. 100 100 5V 5V 80 80 (nsec)RISE 6400 101V5V (nsec)FALL 6400 1105VV t t 20 20 0 0 100 1000 10,000 100 1000 10,000 C L O A D (pF) C L O A D (pF) FIGURE 2-2: Rise Time vs. Capacitive FIGURE 2-5: Fall Time vs. Capacitive Load. Load. 60 80 50 CV D L OD A = D 1 7=. 51V000 pF sec) 7705 CVLINO A=D 5=V 1000 pF ay (n 6605 c) 40 el 55 Time (nse 30 gation D 445050 tD2 tFALL pa 35 tD1 o 30 20 tRISE Pr 25 20 4 6 8 10 12 14 16 18 10 –55 –35 –15 5 25 45 65 85 105 125 V (V) DD Temperature (˚C) FIGURE 2-3: Rise and Fall Times vs. FIGURE 2-6: Propagation Delay Time vs. Temperature. Supply Voltage.  2004 Microchip Technology Inc. DS21422C-page 5

TC4426/TC4427/TC4428 Note: Unless otherwise indicated, T = +25ºC with 4.5V ≤ V ≤ 18V. A DD 60 45 pagation Delay (nsec) 2233445505050505 tD1 tD2 CVLDODA =D =1 21V000 pF Delay Time (nsec) 2233405050 CVVIDLNOD = A=D 5 1=V8 1V000 tptDDF21 o 15 Pr 15 10 10 0 1 2 3 4 5 6 7 8 9 10 11 12 -55 -35 -15 5 25 45 65 85 105 125 Input Amplitude (V) Temperature (ºC) FIGURE 2-7: Propagation Delay Time vs. FIGURE 2-10: Propagation Delay Time vs. Input Amplitude. Temperature. 4.0 V = 18V DD 3.5 A) m Both Inputs = 1 A) I (QUIESCENT 1 I (mQUIESCENT32..05 Both Inputs = 1 Both Inputs = 0 0.1 2.0 4 6 8 10 12 14 16 18 –55 –35 –15 5 25 45 65 85 105 125 VD D TA (˚C) FIGURE 2-8: Supply Current vs. Supply FIGURE 2-11: Supply Current vs. Voltage. Temperature. 25 25 20 20 Worst Case @ T = +150˚C Worst Case @ T = +150˚C J J Ω) Ω) (N)15 (N) 15 O O DS( DS( R R Typical @ TA = +25˚C Typical @ TA = +25˚C 10 10 5 5 4 6 8 10 12 14 16 18 4 6 8 10 12 14 16 18 V V DD DD FIGURE 2-9: Output Resistance (R ) vs. FIGURE 2-12: Output Resistance (R ) vs. OH OL Supply Voltage. Supply Voltage. DS21422C-page 6  2004 Microchip Technology Inc.

TC4426/TC4427/TC4428 Note: Unless otherwise indicated, T = +25ºC with 4.5V ≤ V ≤ 18V. A DD 60 60 2 MHz 1000 pF VD D = 18V VD D = 18V 50 50 2200 pF 900 kHz A) 40 A) 40 m m 100 pF I (SUPPLY3200 600 kHz I (SUPPLY3200 10 200 kHz 10 20 kHz 0 0 100 1000 10,000 10 100 1000 C L O A D (pF) FREQUENCY (kHz) FIGURE 2-13: Supply Current vs. FIGURE 2-16: Supply Current vs. Capacitive Load. Frequency. 60 60 2200 pF VD D = 12V 2 MHz VD D = 12V 50 50 A) 40 A) 40 1000 pF m m (LY30 (LY30 PP 900 kHz PP U U IS20 600 kHz IS20 100 pF 10 10 200 kHz 20 kHz 0 0 100 1000 10,000 10 100 1000 C L O A D (pF) FREQUENCY (kHz) FIGURE 2-14: Supply Current vs. FIGURE 2-17: Supply Current vs. Capacitive Load. Frequency. 60 60 VD D = 6V VD D = 6V 50 50 A) 40 A) 40 m m I (SUPPLY3200 2 MHz I (SUPPLY3200 1000 pF 2200 pF 900 kHz 10 600 kHz 10 100 pF 200 kHz 20 kHz 0 0 100 1000 10,000 10 100 1000 C L O A D (pF) FREQUENCY (kHz) FIGURE 2-15: Supply Current vs. FIGURE 2-18: Supply Current vs. Capacitive Load. Frequency.  2004 Microchip Technology Inc. DS21422C-page 7

TC4426/TC4427/TC4428 Note: Unless otherwise indicated, T = +25ºC with 4.5V ≤ V ≤ 18V. A DD –8 10 9 8 7 6 5 ec 4 s A • 3 2 –9 10 4 6 8 10 12 14 16 18 VD D Note: The values on this graph represent the loss seen by both drivers in a package during one complete cycle. For a single driver, divide the stated values by 2. For a single transition of a single driver, divide the stated value by 4. FIGURE 2-19: Crossover Energy vs. Supply Voltage. DS21422C-page 8  2004 Microchip Technology Inc.

TC4426/TC4427/TC4428 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table3-1. TABLE 3-1: PIN FUNCTION TABLE (1) 8-Pin PDIP/ 8-Pin Symbol Description MSOP/SOIC DFN 1 1 NC No connection 2 2 IN A Input A 3 3 GND Ground 4 4 IN B Input B 5 5 OUT B Output B 6 6 V Supply input DD 7 7 OUT A Output A 8 8 NC No connection — PAD NC Exposed Metal Pad Note 1: Duplicate pins must be connected for proper operation. 3.1 Inputs A and B 3.4 Supply Input (V ) DD MOSFET driver inputs A and B are high-impedance, The V input is the bias supply for the MOSFET driver DD TTL/CMOS compatible inputs. These inputs also have and is rated for 4.5V to 18V with respect to the ground 300mV of hysteresis between the high and low pin. The V input should be bypassed with local DD thresholds that prevents output glitching even when the ceramic capacitors. The value of these capacitors rise and fall time of the input signal is very slow. should be chosen based on the capacitive load that is being driven. A value of 1.0µF is suggested. 3.2 Ground (GND) 3.5 Exposed Metal Pad Ground is the device return pin. The ground pin(s) should have a low-impedance connection to the bias The exposed metal pad of the 6x5 DFN package is not supply source return. High peak currents will flow out internally connected to any potential. Therefore, this the ground pin(s) when the capacitive load is being pad can be connected to a ground plane or other cop- discharged. per plane on a printed circuit board, to aid in heat removal from the package. 3.3 Output A and B MOSFET driver outputs A and B are low-impedance, CMOS push-pull style outputs. The pull-down and pull- up devices are of equal strength, making the rise and fall times equivalent.  2004 Microchip Technology Inc. DS21422C-page 9

TC4426/TC4427/TC4428 4.0 APPLICATIONS INFORMATION +5V 90% Input VDD = 18V 0V 10% tD1 tD2 V tF tR 4.7µF 0.1µF DD 90% 90% Output 6 10% 10% 2 7 0V Input Output Inverting Driver C = 1000pF L 4 5 +5V 90% Input 10% 0V 3 V DD 90% 90% Input: 100kHz, Output tD1 tR tD2 tF square wave, tRISE = tFALL ≤ 10ns 0V 10% 10% Non-Inverting Driver FIGURE 4-1: Switching Time Test Circuit. DS21422C-page 10  2004 Microchip Technology Inc.

TC4426/TC4427/TC4428 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead DFN Example: XXXXXXX TC4426 XXXXXXX EMF XXYYWW 0420 NNN 256 8-Lead MSOP Example: XXXXX 4426C YWWNNN 420256 8-Lead PDIP (300 mil) Example: XXXXXXXX TC4427 XXXXXNNN CPA256 YYWW 0420 8-Lead SOIC (150 mil) Example: XXXXXXXX TC4428 XXXXYYWW COA0420 NNN 256 Legend: XX...X Customer specific information* Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard device marking consists of Microchip part number, year code, week code, and traceability code.  2004 Microchip Technology Inc. DS21422C-page 11

TC4426/TC4427/TC4428 8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated DS21422C-page 12  2004 Microchip Technology Inc.

TC4426/TC4427/TC4428 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 α A A2 c φ A1 (F) L β Units INCHES MILLIMETERS* Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .026 BSC 0.65 BSC Overall Height A - - .043 - - 1.10 Molded Package Thickness A2 .030 .033 .037 0.75 0.85 0.95 Standoff A1 .000 - .006 0.00 - 0.15 Overall Width E .193 TYP. 4.90 BSC Molded Package Width E1 .118 BSC 3.00 BSC Overall Length D .118 BSC 3.00 BSC Foot Length L .016 .024 .031 0.40 0.60 0.80 Footprint (Reference) F .037 REF 0.95 REF Foot Angle φ 0° - 8° 0° - 8° Lead Thickness c .003 .006 .009 0.08 - 0.23 Lead Width B .009 .012 .016 0.22 - 0.40 Mold Draft Angle Top α 5° - 15° 5° - 15° Mold Draft Angle Bottom β 5° - 15° 5° - 15° *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-187 Drawing No. C04-111  2004 Microchip Technology Inc. DS21422C-page 13

TC4426/TC4427/TC4428 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 L c A1 β B1 p eB B Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α 5 10 15 5 10 15 Mold Draft Angle Bottom β 5 10 15 5 10 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21422C-page 14  2004 Microchip Technology Inc.

TC4426/TC4427/TC4428 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h α 45° c A A2 φ β L A1 Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .050 1.27 Overall Height A .053 .061 .069 1.35 1.55 1.75 Molded Package Thickness A2 .052 .056 .061 1.32 1.42 1.55 Standoff § A1 .004 .007 .010 0.10 0.18 0.25 Overall Width E .228 .237 .244 5.79 6.02 6.20 Molded Package Width E1 .146 .154 .157 3.71 3.91 3.99 Overall Length D .189 .193 .197 4.80 4.90 5.00 Chamfer Distance h .010 .015 .020 0.25 0.38 0.51 Foot Length L .019 .025 .030 0.48 0.62 0.76 Foot Angle φ 0 4 8 0 4 8 Lead Thickness c .008 .009 .010 0.20 0.23 0.25 Lead Width B .013 .017 .020 0.33 0.42 0.51 Mold Draft Angle Top α 0 12 15 0 12 15 Mold Draft Angle Bottom β 0 12 15 0 12 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057  2004 Microchip Technology Inc. DS21422C-page 15

TC4426/TC4427/TC4428 NOTES: DS21422C-page 16  2004 Microchip Technology Inc.

TC4426/TC4427/TC4428 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X XX XXX X Examples: a) TC4426COA: 1.5A Dual Inverting Device Temperature Package Tape & Reel PB Free MOSFET driver, Range 0°C to +70°C SOIC package. Device: TC4426: 1.5A Dual MOSFET Driver, Inverting b) TC4426EUA: 1.5A Dual Inverting TC4427: 1.5A Dual MOSFET Driver, Non-Inverting MOSFET driver, TC4428: 1.5A Dual MOSFET Driver, Complementary -40°C to +85°C. MSOP package. Temperature Range: C = 0°C to +70°C (PDIP and SOIC only) c) TC4426EMF: 1.5A Dual Inverting E = -40°C to +85°C MOSFET driver, V = -40°C to +125°C -40°C to +85°C, DFN package. Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead a) TC4427CPA: 1.5A Dual Non-Inverting MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead MOSFET driver, (Tape and Reel) OA = Plastic SOIC, (150 mil Body), 8-lead 0°C to +70°C OA713 = Plastic SOIC, (150 mil Body), 8-lead PDIP package. (Tape and Reel) b) TC4427EPA: 1.5A Dual Non-Inverting PA = Plastic DIP (300 mil Body), 8-lead MOSFET driver, UA = Plastic Micro Small Outline (MSOP), 8-lead UA713 = Plastic Micro Small Outline (MSOP), 8-lead -40°C to +85°C (Tape and Reel) PDIP package. a) TC4428COA713:1.5A Dual Complementary MOSFET driver, PB Free: G = Lead-Free device * 0°C to +70°C, = Blank SOIC package, Tape and Reel. * Available on selected packages. Contact your local sales b) TC4428EMF: 1.5A Dual Complementary, representative for availability. MOSFET driver, -40°C to +85°C DFN package. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2004 Microchip Technology Inc. DS21422C-page 17

TC4426/TC4427/TC4428 NOTES: DS21422C-page 18  2004 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: (cid:127) Microchip products meet the specification contained in their particular Microchip Data Sheet. (cid:127) Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. (cid:127) There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. (cid:127) Microchip is willing to work with the customer who is concerned about the integrity of their code. (cid:127) Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is intended through suggestion only The Microchip name and logo, the Microchip logo, Accuron, and may be superseded by updates. It is your responsibility to dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PROMATE, PowerSmart, rfPIC, and No representation or warranty is given and no liability is SmartShunt are registered trademarks of Microchip assumed by Microchip Technology Incorporated with respect Technology Incorporated in the U.S.A. and other countries. to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, use or otherwise. Use of Microchip’s products as critical SmartSensor and The Embedded Control Solutions Company components in life support systems is not authorized except are registered trademarks of Microchip Technology with express written approval by Microchip. No licenses are Incorporated in the U.S.A. conveyed, implicitly or otherwise, under any intellectual Analog-for-the-Digital Age, Application Maestro, dsPICDEM, property rights. dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2004 Microchip Technology Inc. DS21422C-page 19

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