TC1426/TC1427/TC1428 1.2A Dual High-Speed MOSFET Drivers Features: Package Type • Low Cost 8-Pin PDIP/SOIC • Latch-Up Protected: Will Withstand 500 mA NC 1 8 NC NC 1 8 NC NC 1 8 NC Reverse Output Current IN A 2 7 OUT A IN A 2 7 OUT A IN A 2 7 OUT A TC1426CPA TC1427CPA TC1428CPA GND 3 6 VDD GND 3 6 VDD GND 3 6 VDD • ESD Protected ±2kV IN B 4 5 OUT B IN B 4 5 OUT B IN B 4 5 OUT B • High Peak Output Current: 1.2A 2, 4 7, 5 2, 4 7, 5 2 7 • Wide Operating Range: Inverting Noninverting 4 5 - 4.5V to 16V • High Capacitive Load Drive Capability: 1000 pF in NC 1 8 NC NC 1 8 NC NC 1 8 NC 38 nsec IN A 2 7 OUT A IN A 2 7 OUT A IN A 2 7 OUT A TC1426COA TC1427COA TC1428COA GND 3 6 VDD GND 3 6 VDD GND 3 6 VDD • Low Delay Time: 75 nsec Max IN B 4 5 OUT B IN B 4 5 OUT B IN B 4 5 OUT B • Logic Input Threshold Independent of Supply 2, 4 7, 5 2, 4 7, 5 2 7 Voltage Inverting Noninverting 4 5 • Output Voltage Swing to Within 25 mV of Ground NC = No connection or V DD • Low Output Impedance: 8 General Description: Applications: The TC1426/TC1427/TC1428 are a family of 1.2A dual high-speed drivers. CMOS fabrication is used for low- • Power MOSFET Drivers power consumption and high efficiency. • Switched Mode Power Supplies These devices are fabricated using an epitaxial layer to • Pulse Transformer Drive effectively short out the intrinsic parasitic transistor • Small Motor Controls responsible for CMOS latch-up. They incorporate a number of other design and process refinements to • Print Head Drive increase their long-term reliability. Device Selection Table The TC1426 is compatible with the bipolar DS0026, but only draws 1/5 of the quiescent current. The TC1426/ Part Number Package Temp. Range TC1427/TC1428 are also compatible with the TC426/ TC1426COA 8-Pin SOIC 0°C to +70°C TC427/TC428, but with 1.2A peak output current rather than the 1.5A of the TC426/TC427/TC428 devices. TC1426CPA 8-Pin PDIP 0°C to +70°C TC1427COA 8-Pin SOIC 0°C to +70°C Other compatible drivers are the TC4426/TC4427/ TC4428 and the TC4426A/TC4427A/TC4428A. The TC1427CPA 8-Pin PDIP 0°C to +70°C TC4426/TC4427/TC4428 have the added feature that TC1428COA 8-Pin SOIC 0°C to +70°C the inputs can withstand negative voltage up to 5V with TC1428CPA 8-Pin PDIP 0°C to +70°C diode protection circuits. The TC4426A/TC4427A/ TC4428A have matched input to output leading edge and falling edge delays, t and t , for processing D1 D2 short duration pulses in the 25 nanoseconds range. All of the above drivers are pin compatible. The high-input impedance TC1426/TC1427/TC1428 drivers are CMOS/TTL input-compatible, do not require the speed-up needed by the bipolar devices, and can be directly driven by most PWM ICs. This family of devices is available in inverting and non- inverting versions. Specifications have been optimized to achieve low-cost and high-performance devices, well-suited for the high-volume manufacturer.  2001-2012 Microchip Technology Inc. DS21393D-page 1

TC1426/TC1427/TC1428 Functional Block Diagram V+ ≈500 μA TC1426 Inverting TC1427 Noninverting ≈2.5 μA TC1428 Inverting/Noninverting Noninverting Inverting Output Output (TC1427) (TC1426) Input GND NOTE: TC1428 has one inverting and one noninverting driver. Ground any unused driver input. DS21393D-page 2  2001-2012 Microchip Technology Inc.

TC1426/TC1427/TC1428 1.0 ELECTRICAL *Stresses above those listed under "Absolute CHARACTERISTICS Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions Absolute Maximum Ratings* above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Supply Voltage.....................................................+18V Maximum Rating conditions for extended periods may Input Voltage, Any Terminal affect device reliability. ...................................V + 0.3V to GND – 0.3V DD Power Dissipation (T 70°C) A PDIP........................................................730 mW SOIC.......................................................470 mW Derating Factor PDIP.......................................................8 mW/C SOIC......................................................4 mW/C Operating Temperature Range C Version........................................0°C to +70°C Storage Temperature Range..............-65°C to +150°C TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS Electrical Characteristics: T = +25°C, with 4.5V V 16V, unless otherwise noted. A DD Symbol Parameter Min Typ Max Units Test Conditions Input V Logic 1, High Input Voltage 3 — — V IH V Logic 0, Low Input Voltage — — 0.8 V IL I Input Current -1 — 1 A 0VV V IN IN DD Output V High Output Voltage V – 0.025 — — V Figure3-1, Figure3-2 OH DD V Low Output Voltage — — 0.025 V Figure3-1, Figure3-2 OL R Output Resistance — 12 18  I = 10 mA, V = 16V O OUT DD — 8 12 I Peak Output Current — 1.2 — A PK I Latch-Up Current — >500 — mA REV Withstand Reverse Current Switching Time (Note 1) t Rise Time — — 35 nsec Figure3-1, Figure3-2 R t Fall Time — — 25 nsec Figure3-1, Figure3-2 F t Delay Time — — 75 nsec Figure3-1, Figure3-2 D1 t Delay Time — — 75 nsec Figure3-1, Figure3-2 D2 Power Supply I Power Supply Current — — 9 mA V = 3V (Both Inputs) S IN — — 0.5 V = 0V (Both Inputs) IN Note 1: Switching times ensured by design.  2001-2012 Microchip Technology Inc. DS21393D-page 3

TC1426/TC1427/TC1428 TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V V 16V, unless otherwise noted. DD Symbol Parameter Min Typ Max Units Test Conditions Input V Logic 1, High Input Voltage 3 — — V IH V Logic 0, Low Input Voltage — — 0.8 V IL I Input Current -10 — 10 A 0VV V IN IN DD Output V High Output Voltage V – 0.025 — — V Figure3-1, Figure3-2 OH DD V Low Output Voltage — — 0.025 V Figure3-1, Figure3-2 OL R Output Resistance — 15 23  I = 10 mA, V = 16V O OUT DD — 10 18 I Latch-Up Current — >500 — mA REV Withstand Reverse Current Switching Time (Note 1) t Rise Time — — 60 nsec Figure3-1, Figure3-2 R t Fall Time — — 40 nsec Figure3-1, Figure3-2 F t Delay Time — — 125 nsec Figure3-1, Figure3-2 D1 t Delay Time — — 125 nsec Figure3-1, Figure3-2 D2 Power Supply I Power Supply Current — — 13 mA V = 3V (Both Inputs) S IN — — 0.7 V = 0V (Both Inputs) IN Note 1: Switching times ensured by design. DS21393D-page 4  2001-2012 Microchip Technology Inc.

TC1426/TC1427/TC1428 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, Symbol Description SOIC) 1 NC No connection. 2 IN A Control input A, TTL/CMOS compatible logic input. 3 GND Ground. 4 IN B Control input B, TTL/CMOS compatible logic input. 5 OUT B Output B, CMOS totem-pole output. 6 V Supply input, 4.5V to 16V. DD 7 OUT A Output A, CMOS totem-pole output. 8 NC No connection.  2001-2012 Microchip Technology Inc. DS21393D-page 5

TC1426/TC1427/TC1428 3.0 APPLICATIONS INFORMATION 3.3 INPUT STAGE The input voltage level changes the no-load or 3.1 SUPPLY BYPASSING quiescent supply current. The N-channel MOSFET input stage transistor drives a 2.5 mA current source Large currents are required to charge and discharge load. With a logic ‘1’ input, the maximum quiescent capacitive loads quickly. For example, charging a 1000 supply current is 9 mA. Logic ‘0’ input level signals pF load to 16V in 25 nsec requires a 0.8A current from reduce quiescent current to 500 A maximum. Unused the device's power supply. driver inputs must be connected to V or GND. DD To ensure low supply impedance over a wide frequency Minimum power dissipation occurs for logic ‘0’ inputs range, a parallel capacitor combination is recom- for the TC1426/TC1427/TC1428. mended for supply bypassing. Low-inductance ceramic The drivers are designed with 100 mV of hysteresis. MLC capacitors with short lead lengths (<0.5-in.) This provides clean transitions and minimizes output should be used. A 1.0 F film capacitor in parallel with stage current spiking when changing states. Input one or two 0.1 F ceramic MLC capacitors normally voltage thresholds are approximately 1.5V, making a provides adequate bypassing. logic ‘1’ input any voltage greater than 1.5V up to V . DD Input current is less than 1 A over this range. 3.2 GROUNDING The TC1426/TC1427/TC1428 may be directly driven The TC1426 and TC1428 contain inverting drivers. by the TL494, SG1526/27, TC38C42, TC170 and Individual ground returns for the input and output similar switch-mode power supply integrated circuits. circuits or a ground plane should be used. This will reduce negative feedback that causes degradation in switching speed characteristics. VDD = 16V VDD = 16V Test Circuit Test Circuit 1 μF 0.1 μF MLC 1W μIMFA 0.1 μF MLC WIMA MKS-2 MKS-2 Input 1 Output Input 1 Output CL = 1000 pF CL = 1000 pF 2 2 TC1427 (1/2 TC1428) TC1426 (1/2 TC1428) +5V +5V 90% 90% Input Input 10% 10% 0V 0V tD1 tD2 VDD 90% 90% tF tR tD1 tD2 VDD 90% 90% Output tR tF Output 0V 10% 10% 10% 10% 0V FIGURE 3-2: Noninverting Driver FIGURE 3-1: Inverting Driver Switching Switching Time Time DS21393D-page 6  2001-2012 Microchip Technology Inc.

TC1426/TC1427/TC1428 4.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Rise Time vs. Supply Voltage Fall Time vs. Supply Voltage Delay Time vs. Supply Voltage 550 TA = +25°C 330 TA = +25°C 80 CL = 1000 pF 440 264 70 TA = +25°C sec)330 10,000 pF sec)198 10,000 pF sec)60 n n n E ( E ( E ( TIM220 4700 pF TIM132 4700 pF TIM50 tD1 110 2200 pF 66 2200 p F 40 tD2 0 0 30 5 7 9 11 13 15 5 7 9 11 13 15 5 7 9 11 13 15 VDD (V) VDD (V) VDD (V) Rise and Fall Times vs. Temperature Delay Time vs. Temperature Supply Current vs. Capacitive Load 40 60 30 CL = 1000 pF CL = 1000 pF CL = 1000 pF 32 VDD = +15V tRISE 54 VDD = +15V mA)24 VTAD D= =+ 2+51°5CV 500 kHz sec)24 tFALL sec)48 tD2 RENT (18 TIME (n16 TIME (n42 tD1 LY CUR12 20200 kkHHzz P P 8 36 SU 6 0 0 0 25 45 65 85 105 125 25 45 65 85 105 125 100 520 940 1360 1780 2200 TEMPERATURE (°C) TEMPERATURE (°C) CAPACITIVE LOAD (pF) Rise Time vs. Capacitive Load Fall Time vs. Capacitive Load Supply Current vs. Frequency 1000 1000 100 TA = +25°C TA = +25°C CTAL == +102050°C pF VDD = 15V mA)80 VDD = 10V TIME (nsec) 100 10 VDD 5 VDD TIME (nsec)100 10 VDD 5 VDD LY CURRENT (4600 P P 15 VDD 15VDD SU20 VD D = 5V 10 10 0 100 1000 10,000 100 1000 10,000 10 100 1000 10,000 CAPACITIVE LOAD (pF) CAPACITIVE LOAD (pF) FREQUENCY (kHz)  2001-2012 Microchip Technology Inc. DS21393D-page 7

TC1426/TC1427/TC1428 TYPICAL CHARACTERISTICS (CONTINUED) Low-State Output Resistance High-State Output Resistance Crossover Energy Loss 15 100 mA TA = +25°C 50 TA = +25°C 10-8 13 42 100 mA 50 mA Ω) 11 Ω) 34 ( ( c) UT UT se 10-9 RO 9 RO26 50 mA A ( 10 mA 7 18 10 mA 5 10 10-10 5 7 9 11 13 15 5 7 9 11 13 15 4 6 8 10 12 14 16 18 VDD (V) VDD (V) VDD (V) Quiescent Power Supply Quiescent Power Supply Current vs. Supply Voltage Current vs. Supply Voltage 20 20 BOTH INPUTS LOGIC ‘0’ BOTH INPUTS LOGIC ‘1’ V) 15 V) E ( E (15 G G A A OLT 10 OLT V V10 Y Y L L P P UP 5 UP S S 5 0 0 0 50 100 150 200 300 400 1 2 3 4 5 6 SUPPLY CURRENT (μA) SUPPLY CURRENT (mA) Thermal Derating Curves 1600 1400 8 Pin DIP W) 1200 m R ( 1000 E W O 800 P 8 Pin SOIC X. 600 A M 400 200 0 0 10 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) DS21393D-page 8  2001-2012 Microchip Technology Inc.

TC1426/TC1427/TC1428 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form  2001-2012 Microchip Technology Inc. DS21393D-page 9

TC1426/TC1427/TC1428 5.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .070 (1.78) .030 (0.76) .040 (1.02) .310 (7.87) .400 (10.16) .290 (7.37) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .015 (0.38) 3° Min. .150 (3.81) .008 (0.20) .115 (2.92) .400 (10.16) .310 (7.87) .110 (2.79) .022 (0.56) .090 (2.29) .015 (0.38) Dimensions: inches (mm) DS21393D-page 10  2001-2012 Microchip Technology Inc.

TC1426/TC1427/TC1428 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC Pin 1 .157 (3.99) .244 (6.20) .150 (3.81) .228 (5.79) .050 (1.27) Typ. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) 8° Max. .010 (0.25) .007 (0.18) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .050 (1.27) .016 (0.40) Dimensions: inches (mm)  2001-2012 Microchip Technology Inc. DS21393D-page 11

TC1426/TC1427/TC1428 6.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing. DS21393D-page 12  2001-2012 Microchip Technology Inc.

TC1426/TC1427/TC1428 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at Users of Microchip products can receive assistance www.microchip.com. This web site is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the web site contains the following • Field Application Engineer (FAE) information: • Technical Support • Product Support – Data sheets and errata, application notes and sample programs, design Customers should contact their distributor, resources, user’s guides and hardware support representative or field application engineer (FAE) for documents, latest software releases and archived support. Local sales offices are also available to help software customers. A listing of sales offices and locations is included in the back of this document. • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, Technical support is available through the web site online discussion groups, Microchip consultant at: http://microchip.com/support program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2001-2012 Microchip Technology Inc. DS21393D-page 13

TC1426/TC1427/TC1428 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480)792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager Total Pages Sent ________ RE: Reader Response From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: TC1426/TC1427/TC1428 Literature Number: DS21393D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21393D-page 14  2001-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767887 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2001-2012 Microchip Technology Inc. DS21393D-page 15

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