TC1411/TC1411N 1A High-Speed MOSFET Drivers Features General Description • Latch-Up Protected: Withstands 500mA Reverse The TC1411/TC1411N are 1A CMOS buffers/drivers. Current They do not latch up under any conditions within their • Input Withstands Negative Inputs Up to 5V power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either • Electrostatic Discharge (ESD) Protected: 2.0kV polarity occurs on the ground pin. They can accept, (HBM) and 400V (MM) without damage or logic upset, up to 500mA of current • High Peak Output Current: 1A of either polarity being forced back into their output. All • Wide Input Supply Voltage Operating Range: terminals are fully protected against Electrostatic - 4.5V to 16V Discharge (ESD) up to 2.0kV (HBM) and 400V (MM). • High Capacitive Load Drive Capability: As MOSFET drivers, the TC1411/TC1411N can easily - 1000pF in 25ns charge a 1000pF gate capacitance in 25ns with • Short Delay Time: 30ns typical matched rise and fall times. To ensure that the MOSFET’s intended state is not affected even by large • Matched Delay Times transients, low enough impedance in both the ‘ON’ and • Low Supply Current ‘OFF’ states are provided. The leading and trailing - With Logic ‘1’ Input: 500µA edge propagation delay times are also matched to - With Logic ‘0’ Input: 100µA allow driving short-duration inputs with greater • Low Output Impedance: 8Ω accuracy. • Available in Space-Saving 8-pin MSOP Package Package Types • Pinout – same as TC1410/TC1412/TC1413 8-Pin MSOP/PDIP/SOIC Applications • Switch Mode Power Supplies VDD 1 8 VDD VDD 1 8 VDD • Pulse Transformer Drive IN 2 TC1411 7 OUT IN 2 TC1411N 7 OUT • Line Drivers NC 3 6 OUT NC 3 6 OUT • Relay Driver GND 4 5 GND GND 4 5 GND 2 6,7 2 6,7 Inverting Non-Inverting NC = No Internal Connection Note: For proper operation, duplicate pins must be connected together.  2001-2013 Microchip Technology Inc. DS20001390E-page 1

TC1411/TC1411N Functional Block Diagram V DD TC1411 Inverting Outputs 300mV Output Non-Inverting Input Outputs TC1411N Effective 4.7V Input C = 10pF GND DS20001390E-page 2  2001-2013 Microchip Technology Inc.

TC1411/TC1411N 1.0 ELECTRICAL † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to CHARACTERISTICS the device. These are stress ratings only and functional operation of the device at these or any other conditions Absolute Maximum Ratings † above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Supply Voltage.....................................................+20V Maximum Rating conditions for extended periods may Input Voltage......................V +0.3V to GND–5.0V affect device reliability. DD Power Dissipation (T ≤70°C) A MSOP..........................................................340mW PDIP............................................................730mW SOIC............................................................470mW Storage Temperature Range..............-65°C to +150°C Maximum Junction Temperature......................+150°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V≤V ≤16V. DD Typical values are measured at T =+25°C, V =16V. A DD Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage V 2.0 — — V IH Logic ‘0’, Low Input Voltage V — — 0.8 V IL Input Current I -1.0 — 1.0 µA 0V≤V ≤V T =+25°C IN IN DD, A -10 — 10 -40°C≤T ≤+85°C A Output High Output Voltage V V –0.025 — — V DC Test OH DD Low Output Voltage V — — 0.025 V DC Test OL Output Resistance R — 8 11 Ω V =16V, I =10mA, O DD O T =+25°C A — 10 14 0°C≤T ≤+70°C A — 10 14 -40°C≤T ≤+85°C A Peak Output Current I — 1.0 — A V =16V PK DD Latch-Up Protection I — 0.5 — A Duty cycle≤2%, t≤300µs, REV Withstand Reverse Current V =16V DD Switching Time (Note1) Rise Time t — 25 35 ns T =+25°C R A — 27 40 0°C≤T ≤+70°C A — 29 40 -40°C≤T ≤+85°C, Figure4-1 A Fall Time t — 25 35 ns T =+25°C F A — 27 40 0°C≤T ≤+70°C A — 29 40 -40°C≤T ≤+85°C, Figure4-1 A Delay Time t — 30 40 ns T =+25°C D1 A — 33 45 0°C≤T ≤+70°C A — 35 45 -40°C≤T ≤+85°C, Figure4-1 A Delay Time t — 30 40 ns T =+25°C D2 A — 33 45 0°C≤T ≤+70°C A — 35 45 -40°C≤T ≤+85°C, Figure4-1 A Note 1: Switching times ensured by design.  2001-2013 Microchip Technology Inc. DS20001390E-page 3

TC1411/TC1411N DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V≤V ≤16V. DD Typical values are measured at T =+25°C, V =16V. A DD Parameters Sym Min Typ Max Units Conditions Power Supply Power Supply Current I — 0.5 1.0 mA V =3V, V =16V S IN DD — 0.1 0.15 V =0V IN Note 1: Switching times ensured by design. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V≤V ≤16V. DD Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (C) T 0 — +70 ºC A Specified Temperature Range (E) T -40 — +85 ºC A Specified Temperature Range (V) T -40 — +125 ºC A Maximum Junction Temperature T — — +150 ºC J Storage Temperature Range T -65 — +150 ºC A Package Thermal Resistances Thermal Resistance, 8L-MSOP θ — 211 — ºC/W JA Thermal Resistance, 8L-PDIP θ — 89.3 — ºC/W JA Thermal Resistance, 8L-SOIC θ — 149.5 — ºC/W JA DS20001390E-page 4  2001-2013 Microchip Technology Inc.

TC1411/TC1411N 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V≤V ≤16V. DD 500 500 TA = +25°C VSUPPLY = 16V VIN = 3V 400 400 μI (A)SUPPLY 230000 VIN = 3V μI (A)SUPPLY 230000 100 VIN = 0V 100 VIN = 0V 0 0 4 6 8 10 12 14 16 -40 -20 0 20 40 60 80 VDD (V) TEMPERATURE (°C) FIGURE 2-1: Quiescent Supply Current FIGURE 2-4: Quiescent Supply Current vs. Supply Voltage. vs. Temperature. 1.6 TA = +25°C 1.6 VSUPPLY = 16V 1.5 1.5 V) VIH V) VIH (D 1.4 (D 1.4 L L O O H H S S RE 1.3 RE 1.3 H H T T V V 1.2 VIL 1.2 VIL 1.1 1.1 4 6 8 10 12 14 16 -40 -20 0 20 40 60 80 VDD (V) TEMPERATURE (°C) FIGURE 2-2: Input Threshold vs. Supply FIGURE 2-5: Input Threshold vs. Voltage. Temperature. 25 25 20 TA = +85°C 20 Ohms) 15 TA = +25°C Ohms) 15 TA = +85°C R (DS-ON 10 TA = -40°C R (DS-ON 10 TA = +25°C 5 5 TA = -40°C 04 6 8 10 12 14 16 0 4 6 8 10 12 14 16 VDD (V) VDD (V) FIGURE 2-3: High-State Output FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage. Resistance vs. Supply Voltage.  2001-2013 Microchip Technology Inc. DS20001390E-page 5

TC1411/TC1411N Note: Unless otherwise indicated, over operating temperature range with 4.5V≤V ≤16V. DD 100 100 CLOAD = 1000 pF CLOAD = 1000 pF 80 80 t(nsec)RISE 4600 TA = +85°C TA = +25°C t(nsec)FALL 4600 TA = +85°C TA = +25°C 20 20 TA = -40°C TA = -40°C 0 0 4 6 8 10 12 14 16 4 6 8 10 12 14 16 VDD (V) VDD (V) FIGURE 2-7: Rise Time vs. Supply FIGURE 2-10: Fall Time vs. Supply Voltage. Voltage. 100 100 CLOAD = 1000 pF CLOAD = 1000 pF 80 80 nsec) 60 TA = +85°C TA = +25°C nsec) 60 TA = +85°C TA = +25°C (D1 40 (D2 40 t t TA = -40°C TA = -40°C 20 20 0 0 4 6 8 10 12 14 16 4 6 8 10 12 14 16 VDD (V) VDD (V) FIGURE 2-8: Propagation Delay vs. FIGURE 2-11: Propagation Delay vs. Supply Voltage. Supply Voltage. 100 36 TVAD D= =+ 2156°VC TVAD D= =+ 2156°VC 80 tRISE c) 34 tD2 e (nsec)ALL 60 Delays (ns 32 , tSEF 40 tFALL ation 30 tD1 tRI pag 20 Pro 28 0 26 0 500 1000 1500 2000 2500 3000 3500 0 500 1000 1500 2000 2500 3000 3500 CLOAD (pF) CLOAD (pF) FIGURE 2-9: Rise and Fall Times vs. FIGURE 2-12: Propagation Delays vs. Capacitive Load. Capacitive Load. DS20001390E-page 6  2001-2013 Microchip Technology Inc.

TC1411/TC1411N 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table3-1. TABLE 3-1: PIN FUNCTION TABLE Pin TC1411 TC1411N Description No. MSOP, PDIP, SOIC MSOP, PDIP, SOIC 1 V V Supply input, 4.5V to 16V DD DD 2 IN IN Control input 3 NC NC No connection 4 GND GND Ground 5 GND GND Ground 6 OUT OUT CMOS push-pull output, common to pin 7 7 OUT OUT CMOS push-pull output, common to pin 6 8 V V Supply input, 4.5V to 16V DD DD 3.1 Supply Input (V ) 3.3 CMOS Push-pull Output DD (OUT, OUT) The V input is the bias supply for the MOSFET driver DD and is rated for 4.5V to 16V with respect to the ground The MOSFET driver output is a low impedance, CMOS pin. The VDD input should be bypassed to ground with push-pull style output, capable of driving a capacitive a local ceramic capacitor. The value of the capacitor is load with 1A peak currents. chosen based on the capacitive load that is being driven. A value of 1.0µF is suggested. 3.4 Ground (GND) 3.2 Control Input (IN) The ground pins are the return path for the bias current and for the high peak currents which discharge the load The MOSFET driver input is a high-impedance, capacitor. The ground pins should be tied into a ground TTL/CMOS-compatible input. The input has 300mV of plane or have very short traces to the bias supply hysteresis between the high and low thresholds that source return. prevents output glitching even when the rise and fall time of the input signal is very slow. 3.5 No Connect (NC) No internal connection.  2001-2013 Microchip Technology Inc. DS20001390E-page 7

TC1411/TC1411N 4.0 APPLICATION INFORMATION +5V 90% Input V = 16V DD 10% 0V tD1 tD2 t t 4.7µF 0.1µF V F R DD 90% 90% 1, 8 Output 2 6, 7 10% 10% Input Output 0V C = 1000pF L Inverting Driver TC1411 TC1411 TC1411N +5V 90% Input 4, 5 10% 0V Input: 100kHz, VDD 90% 90% square wave, tD1 tD2 tRISE = tFALL ≤ 10ns Output tR tF 0V 10% 10% Non-Inverting Driver TC1411N FIGURE 4-1: Switching Time Test Circuit. DS20001390E-page 8  2001-2013 Microchip Technology Inc.

TC1411/TC1411N 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) Example XXXXXXXX TC1411 XXXXXNNN CPA^e^3256 1317 YYWW OR TC1411 CPA256 1317 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e 3 RoHS Compliant JEDEC designator for Matte Tin (Sn) * This package is RoHS Compliant. The RoHS Compliant JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2001-2013 Microchip Technology Inc. DS20001390E-page 9

TC1411/TC1411N 8-Lead SOIC (3.90 mm) Example TC1411C OA^e^31317 NNN 256 OR TC1411 COA1317 256 8-Lead MSOP (3x3 mm) Example 1411E 317256 DS20001390E-page 10  2001-2013 Microchip Technology Inc.

TC1411/TC1411N (cid:56)(cid:36) (cid:49)(cid:82)(cid:87)(cid:72)(cid:29) For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS20001390E-page 11

TC1411/TC1411N UA Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001390E-page 12  2001-2013 Microchip Technology Inc.

TC1411/TC1411N 8-Lead Plastic Micro Small Outline Package (UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS20001390E-page 13

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TC1411/TC1411N Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS20001390E-page 15

TC1411/TC1411N Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001390E-page 16  2001-2013 Microchip Technology Inc.

TC1411/TC1411N (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)!(cid:25)(cid:6)(cid:10)(cid:10)(cid:8)"(cid:16)(cid:12)(cid:10)(cid:13)(cid:18)(cid:5)(cid:8)(cid:19)"(cid:20)(cid:21)(cid:8)(cid:22)(cid:8)(cid:31)(cid:6)##(cid:27)$%(cid:8)(cid:23)&’(cid:24)(cid:8)(cid:25)(cid:25)(cid:8)(cid:26)(cid:27)(cid:7)(cid:28)(cid:8)(cid:29)!"(cid:17)((cid:30) (cid:31)(cid:27)(cid:12)(cid:5) 4(cid:22)(cid:21)(cid:14)&(cid:23)(cid:13)(cid:14)’(cid:22)!&(cid:14)(cid:20)"(cid:21)(cid:21)(cid:13)(cid:25)&(cid:14)(cid:10)(cid:11)(cid:20)5(cid:11)(cid:12)(cid:13)(cid:14)#(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)!((cid:14)(cid:10)(cid:26)(cid:13)(cid:11)!(cid:13)(cid:14)!(cid:13)(cid:13)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)(cid:31)(cid:11)(cid:20)5(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)(cid:11)&(cid:14) (cid:23)&&(cid:10)366***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)’6(cid:10)(cid:11)(cid:20)5(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)  2001-2013 Microchip Technology Inc. DS20001390E-page 17

TC1411/TC1411N NOTES: DS20001390E-page 18  2001-2013 Microchip Technology Inc.

TC1411/TC1411N APPENDIX A: REVISION HISTORY Revision E (June 2013) The following is the list of modifications: • Updated the values for Electrostatic Discharge (ESD) in the Features and General Description columns. • Updated the Pin Description table in Section3.0, Pin Descriptions. • Updated package marking information and draw- ings in Section5.0, Packaging Information. • Minor grammatical and spelling corrections. Revision D (September 2006) • Added -40°C to +125°C temperature range to Temperature Characteristics table and Product Information System page. • Added disclaimer to package outline drawings. Revision C (March 2003) • Added 8-Lead MSOP Package. Revision B (May 2002) • Converted TELCOM data sheet for Embedded Control Handbook Revision A (March 2001) • Original Release of this Document.  2001-2013 Microchip Technology Inc. DS20001390E-page 19

TC1411/TC1411N NOTES: DS20001390E-page 20  2001-2013 Microchip Technology Inc.

TC1411/TC1411N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Examples: a) TC1411COA: 1A Single MOSFET Device Temperature Package driver, 8LD SOIC Range package, 0°C to +70°C. b) TC1411CPA: 1A Single MOSFET Device: TC1411: 1A Single MOSFET Driver, Inverting driver, 8LD PDIP TC1411N: 1A Single MOSFET Driver, Non-Inverting package, 0°C to +70°C. c) TC1411EUA713: Tape and Reel, 1A Single MOSFET driver, Temperature Range: C = 0°C to +70°C E = -40°C to +85°C 8LD MSOP package, V = -40°C to +125°C -40°C to +85°C. d) TC1411VOA713: Tape and Reel, Package: OA = Plastic SOIC, (150 mil Body), 8-lead 1A Single MOSFET OA713 = Plastic SOIC, (150 mil Body), 8-lead driver, 8LD SOIC (Tape and Reel) package, UA = Plastic Micro Small Outline (MSOP), 8-lead * -40°C to +125°C. UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead a) TC1411NCPA: 1A Single MOSFET * MSOP package is only available in E-Temp. driver, 8LD PDIP package, 0°C to +70°C. b) TC1411NEPA: 1A Single MOSFET driver, 8LD PDIP package, -40°C to +85°C. c) TC1411NEUA: 1A Single MOSFET driver, 8LD MSOP package, -40°C to +85°C. d) TC1411NVPA: 1A Single MOSFET driver, 8LD PDIP package, -40°C to +125°C.  2001-2013 Microchip Technology Inc. DS20001390E-page 21

TC1411/TC1411N NOTES: DS20001390E-page 22  2001-2013 Microchip Technology Inc.

TC1411/TC1411N THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at Users of Microchip products can receive assistance www.microchip.com. This web site is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the web site contains the following information: • Field Application Engineer (FAE) • Technical Support • Product Support – Data sheets and errata, application notes and sample programs, design Customers should contact their distributor, resources, user’s guides and hardware support representative or Field Application Engineer (FAE) for documents, latest software releases and archived support. Local sales offices are also available to help software customers. A listing of sales offices and locations is • General Technical Support – Frequently Asked included in the back of this document. Questions (FAQ), technical support requests, Technical support is available through the web site online discussion groups, Microchip consultant at: http://microchip.com/support program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2001-2013 Microchip Technology Inc. DS20001390E-page 23

TC1411/TC1411N NOTES: DS20001390E-page 24  2001-2013 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-244-7 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2001-2013 Microchip Technology Inc. DS20001390E-page 25

Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office Asia Pacific Office India - Bangalore Austria - Wels 2355 West Chandler Blvd. Suites 3707-14, 37th Floor Tel: 91-80-3090-4444 Tel: 43-7242-2244-39 Chandler, AZ 85224-6199 Tower 6, The Gateway Fax: 91-80-3090-4123 Fax: 43-7242-2244-393 Tel: 480-792-7200 Harbour City, Kowloon India - New Delhi Denmark - Copenhagen Fax: 480-792-7277 Hong Kong Tel: 91-11-4160-8631 Tel: 45-4450-2828 Technical Support: Tel: 852-2401-1200 Fax: 91-11-4160-8632 Fax: 45-4485-2829 http://www.microchip.com/ support Fax: 852-2401-3431 India - Pune France - Paris Web Address: Australia - Sydney Tel: 91-20-2566-1512 Tel: 33-1-69-53-63-20 Tel: 61-2-9868-6733 Fax: 33-1-69-30-90-79 www.microchip.com Fax: 91-20-2566-1513 Fax: 61-2-9868-6755 Germany - Munich Atlanta Japan - Osaka China - Beijing Tel: 49-89-627-144-0 Duluth, GA Tel: 81-6-6152-7160 Tel: 86-10-8569-7000 Fax: 49-89-627-144-44 Tel: 678-957-9614 Fax: 81-6-6152-9310 Fax: 678-957-1455 Fax: 86-10-8528-2104 Japan - Tokyo Italy - Milan China - Chengdu Tel: 39-0331-742611 Boston Tel: 81-3-6880- 3770 Tel: 86-28-8665-5511 Fax: 39-0331-466781 Westborough, MA Fax: 81-3-6880-3771 Tel: 774-760-0087 Fax: 86-28-8665-7889 Netherlands - Drunen Korea - Daegu Fax: 774-760-0088 China - Chongqing Tel: 82-53-744-4301 Tel: 31-416-690399 Tel: 86-23-8980-9588 Fax: 31-416-690340 Chicago Fax: 82-53-744-4302 Itasca, IL Fax: 86-23-8980-9500 Spain - Madrid Korea - Seoul Tel: 630-285-0071 China - Hangzhou Tel: 82-2-554-7200 Tel: 34-91-708-08-90 Fax: 630-285-0075 Tel: 86-571-2819-3187 Fax: 82-2-558-5932 or Fax: 34-91-708-08-91 Cleveland Fax: 86-571-2819-3189 82-2-558-5934 UK - Wokingham Independence, OH China - Hong Kong SAR Malaysia - Kuala Lumpur Tel: 44-118-921-5869 Tel: 216-447-0464 Tel: 852-2943-5100 Tel: 60-3-6201-9857 Fax: 44-118-921-5820 Fax: 216-447-0643 Fax: 852-2401-3431 Fax: 60-3-6201-9859 Dallas China - Nanjing Malaysia - Penang Addison, TX Tel: 86-25-8473-2460 Tel: 60-4-227-8870 Tel: 972-818-7423 Fax: 86-25-8473-2470 Fax: 60-4-227-4068 Fax: 972-818-2924 China - Qingdao Philippines - Manila Detroit Tel: 86-532-8502-7355 Tel: 63-2-634-9065 Farmington Hills, MI Fax: 86-532-8502-7205 Fax: 63-2-634-9069 Tel: 248-538-2250 Fax: 248-538-2260 China - Shanghai Singapore Tel: 86-21-5407-5533 Tel: 65-6334-8870 Indianapolis Fax: 86-21-5407-5066 Fax: 65-6334-8850 Noblesville, IN Tel: 317-773-8323 China - Shenyang Taiwan - Hsin Chu Fax: 317-773-5453 Tel: 86-24-2334-2829 Tel: 886-3-5778-366 Fax: 86-24-2334-2393 Fax: 886-3-5770-955 Los Angeles Mission Viejo, CA China - Shenzhen Taiwan - Kaohsiung Tel: 949-462-9523 Tel: 86-755-8864-2200 Tel: 886-7-213-7828 Fax: 949-462-9608 Fax: 86-755-8203-1760 Fax: 886-7-330-9305 Santa Clara China - Wuhan Taiwan - Taipei Santa Clara, CA Tel: 86-27-5980-5300 Tel: 886-2-2508-8600 Tel: 408-961-6444 Fax: 86-27-5980-5118 Fax: 886-2-2508-0102 Fax: 408-961-6445 China - Xian Thailand - Bangkok Toronto Tel: 86-29-8833-7252 Tel: 66-2-694-1351 Mississauga, Ontario, Fax: 86-29-8833-7256 Fax: 66-2-694-1350 Canada China - Xiamen Tel: 905-673-0699 Tel: 86-592-2388138 Fax: 905-673-6509 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 11/29/12 Fax: 86-756-3210049 DS20001390E-page 26  2001-2013 Microchip Technology Inc.

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrochip: TC1411CPA TC1411COA TC1411NCOA713 TC1411NEUA TC1411NEUA713 TC1411NEOA TC1411NEPA TC1411EPA TC1411NEOA713 TC1411EUA713 TC1411NCPA TC1411NCOA TC1411COA713 TC1411EOA TC1411EUA TC1411NVOA TC1411NVOA713 TC1411NVPA TC1411NVUA TC1411NVUA713 TC1411VOA TC1411VOA713 TC1411VPA TC1411VUA TC1411VUA713 TC1411EOA713