TC1264 800 mA Fixed-Output CMOS LDO with Shutdown Features Description • Very Low Dropout Voltage The TC1264 is a fixed output, high accuracy (typically • 800mA Output Current ±0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1264’s • High Output Voltage Accuracy CMOS construction eliminates wasted ground current, • Standard or Custom Output Voltages significantly extending battery life. Total supply current • Overcurrent and Overtemperature Protection is typically 80µA at full load (20 to 60 times lower than in bipolar regulators). Applications TC1264 key features include ultra low noise operation, • Battery Operated Systems very low dropout voltage (typically 450mV at full load), and fast response to step changes in load. • Portable Computers • Medical Instruments The TC1264 incorporates both over temperature and over current protection. The TC1264 is stable with an • Instrumentation output capacitor of only 1μF and has a maximum • Cellular/GSM/PHS Phones output current of 800mA. It is available in 3-Pin • Linear Post-Regulators for SMPS SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages. • Pagers Package Type Typical Application 3-Pin TO-220 3-Pin DDPAK FRONT VIEW VIN VIN VOUT + VOUT TAB IS GND C 1 TC1264 1µF TC1264 TC1264 GND 1 2 3 1 2 3 3-Pin SOT-223 N D T VIN GND VOUT FRONT VIEW VI GN VOU D 3 V N OUT G S B I 2 GND A T 1 V TC1264 IN © 2006 Microchip Technology Inc. DS21375C-page 1

TC1264 1.0 ELECTRICAL † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is CHARACTERISTICS a stress rating only and functional operation of the device at those or any other conditions above those indicated in the Absolute Maximum Ratings † operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect Input Voltage.........................................................6.5V device reliability. Output Voltage..................(V – 0.3V) to (V + 0.3V) SS IN Power Dissipation................Internally Limited (Note8) Maximum Voltage on Any Pin ........V +0.3V to -0.3V IN Operating Temperature Range......-40°C < T < 125°C J Storage Temperature..........................-65°C to +150°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, V = V + 1.5V, (Note1), I = 100µA, C = 3.3µF, SHDN > V , IN R L L IH T = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. A Parameters Sym Min Typ Max Units Conditions Input Operating Voltage V 2.7 — 6.0 V Note2 IN Maximum Output Current I 800 — — mA OUTMAX Output Voltage V V – 2.5% V ± 0.5% V + 2.5% V V ≥ 2.5V OUT R R R R V – 2% V ± 0.5% V + 3% V = 1.8V R R R R V – 7% — V + 3% I = 0.1mA to 800mA R R L (Note3) V Temperature Coefficient ΔV /ΔT — 40 — ppm/°C Note4 OUT OUT Line Regulation ΔV /ΔV — 0.007 0.35 % (V + 1V) ≤ V ≤ 6V OUT IN R IN Load Regulation (Note5) ΔV /V -0.01 0.002 0 %/mA I = 0.1mA to I OUT OUT L OUTMAX Dropout Voltage (Note6) V –V — 20 30 mV V ≥ 2.5V, I = 100µA IN OUT R L — 50 160 VR ≥ 2.5V, IL = 100mA — 150 480 VR ≥ 2.5V, IL = 300mA — 260 800 VR ≥ 2.5V, IL = 500mA — 450 1300 VR ≥ 2.5V, IL = 800mA — 1000 1200 V = 1.8V, I = 500mA R L — 1200 1400 I = 800mA L Supply Current I — 80 130 µA SHDN = V , I = 0 DD IH L Power Supply Rejection Ratio PSRR — 64 — db F ≤ 1kHz Output Short Circuit Current I — 1200 — mA V = 0V OUTSC OUT Note 1: V is the regulator output voltage setting. R 2: The minimum V has to justify the conditions: V ≥ V + V and V ≥ 2.7V for I = 0.1mA to I . IN IN R DROPOUT IN L OUTMAX 3: This accuracy represents the worst-case over the entire output current and temperature range. 4: 6 (V –V )–10 TCV = -------O----U---T---M-----A---X------------O----U----T---M----I--N------------------- OUT V ×ΔT OUT 5: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 6: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. 7: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to I at V = 6V for T = 10ms. LMAX IN 8: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem- perature and the thermal resistance from junction-to-air (i.e., T , T , θ ). Exceeding the maximum allowable power dis- A J JA sipation causes the device to initiate thermal shutdown. Please see Section5.0 “Thermal Considerations” for more details.. DS21375C-page 2 © 2006 Microchip Technology Inc.

TC1264 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, V = V + 1.5V, (Note1), I = 100µA, C = 3.3µF, SHDN > V , IN R L L IH T = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. A Parameters Sym Min Typ Max Units Conditions Thermal Regulation ΔV /ΔP — 0.04 — V/W Note7 OUT D Output Noise eN — 260 — nV/√Hz IL = IOUTMAX, F = 10kHZ Note 1: V is the regulator output voltage setting. R 2: The minimum V has to justify the conditions: V ≥ V + V and V ≥ 2.7V for I = 0.1mA to I . IN IN R DROPOUT IN L OUTMAX 3: This accuracy represents the worst-case over the entire output current and temperature range. 4: 6 (V –V )–10 TCV = -------O----U---T---M-----A---X------------O----U----T---M----I--N------------------- OUT V ×ΔT OUT 5: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 6: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. 7: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to I at V = 6V for T = 10ms. LMAX IN 8: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem- perature and the thermal resistance from junction-to-air (i.e., T , T , θ ). Exceeding the maximum allowable power dis- A J JA sipation causes the device to initiate thermal shutdown. Please see Section5.0 “Thermal Considerations” for more details.. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, V = V + 1.5V, I = 100µA, C = 3.3µF, SHDN > V , T = +25°C. IN R L L IH A Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range T -40 — +125 °C (Note1) A Operating Temperature Range T -40 — +125 °C J Storage Temperature Range T -65 — +150 °C A Thermal Package Resistances Thermal Resistance, 3L-SOT-223 θ — 59 — °C/W JA Thermal Resistance, 3L-DDPAK θ — 71 — °C/W JA Thermal Resistance, 3L-TO-220 θ — 71 — °C/W JA Note 1: Operation in this range must not cause T to exceed Maximum Junction Temperature (+125°C). J © 2006 Microchip Technology Inc. DS21375C-page 3

TC1264 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.020 150 0.018 135 0.016 120 %) N ( 0.014 105 ATIO 0.012 mA) 90 VOUT = 3V UL 0.010 (D 75 EG 0.008 ID 60 R E 0.006 45 N LI 0.004 30 0.002 15 0.000 0 -40°C 0°C 25°C 70°C 85°C 125°C -40°C 0°C 25°C 70°C 85°C 125°C TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 2-1: Line Regulation vs. FIGURE 2-4: I vs. Temperature. DD Temperature. 10.0 RLOAD = 50(cid:58) 00..650500 85°C 125°C COUT = 1 μF 0.500 70°C μ NOISE (V/Hz)(cid:165) 10..01 ROPOUT VOLTAGE (V) 0000000.......443221350550500000000 25°C -40°C 0°C D 0.100 0.050 0.0 0.000 0.01 0.01 1 10 100 1000 0 100 200 300 400 500 600 700800 FREQUENCY (kHz) ILOAD (mA) FIGURE 2-2: Output Noise vs. Frequency. FIGURE 2-5: 3.0V Dropout Voltage vs. I . LOAD 0.0100 3.030 0.0090 3.020 ILOAD = 0.1 mA A)0.0080 3.010 GULATION (%/m0000....0000000074650000 VOUT = 3V 1 mA to 800 mA V (V)OUT 32222.....099990987600000 IILLOOAADD == 350000 mmAA E R0.0030 OAD 0.0020 22..994500 ILOAD = 800 mA L 0.0010 2.930 0.0100 2.920 -40°C 0°C 25°C 70°C 85°C 125°C -40°C 0°C 25°C 70°C 85°C 125°C TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 2-3: Load Regulation vs. FIGURE 2-6: 3.0V V vs.Temperature. OUT Temperature. DS21375C-page 4 © 2006 Microchip Technology Inc.

TC1264 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. 3-Pin SOT-223 Symbol Description 3-Pin TO-220 3-Pin DDPAK 1 V Unregulated supply input IN 2 GND Ground terminal 3 V Regulated voltage output. OUT 3.1 Unregulated Supply (V ) 3.3 Regulated Output Voltage (V ) IN OUT Unregulated supply input. Regulated voltage output. 3.2 Ground (GND) Ground terminal. © 2006 Microchip Technology Inc. DS21375C-page 5

TC1264 4.0 DETAILED DESCRIPTION 4.1 Output Capacitor The TC1264 is a precision, fixed output LDO. Unlike A 1µF (min) capacitor from VOUT to ground is required. bipolar regulators, the TC1264’s supply current does The output capacitor should have an effective series not increase with load current. In addition, V resistance greater than 0.1Ω and less than 5Ω. A 1µF OUT remains stable and within regulation over the entire capacitor should be connected from VIN to GND if there 0mA to I load current range (an important is more than 10 inches of wire between the regulator LOADMAX consideration in RTC and CMOS RAM battery back-up and the AC filter capacitor, or if a battery is used as the applications). power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum Figure4-1 shows a typical application circuit. electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications FIGURE 4-1: TYPICAL APPLICATION operating below -25°C.) When operating from sources CIRCUIT other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing VIN VIN VOUT + VOUT passive filtering techniques. C 1 TC1264 1µF GND SHDN DS21375C-page 6 © 2006 Microchip Technology Inc.

TC1264 5.0 THERMAL CONSIDERATIONS TABLE 5-2: THERMAL RESISTANCE GUIDELINES FOR TC1264 IN 5.1 Thermal Shutdown 3-PIN DDPAK/TO-220 PACKAGE Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. Copper Copper Thermal The regulator remains off until the die temperature Board Area Area Resistance drops to approximately 150°C. Area (Topside)* (Backside) (θ ) JA 5.2 Power Dissipation 2500sqmm 2500sqmm 2500sqmm 25°C/W 1000sqmm 2500sqmm 2500sqmm 27°C/W The amount of power the regulator dissipates is 125sqmm 2500sqmm 2500sqmm 35°C/W primarily a function of input and output voltage, and output current. The following equation is used to * Tab of device attached to topside copper calculate worst-case actual power dissipation: Equation5-1 can be used in conjunction with Equation5-2 to ensure regulator thermal operation is EQUATION 5-1: within limits. For example: P = (V –V )I D INMAX OUTMIN LOADMAX Given: Where: V = 3.3V ± 10% INMAX PD = Worst-case actual power dissipation VOUTMIN = 2.7V ± 0.5% V = Maximum voltage on V INMAX IN I = 275mA LOADMAX V = Minimum regulator output voltage OUTMIN T = 125°C I = Maximum output (load) current JMAX LOADMAX T = 95°C AMAX The maximum allowable power dissipation θJA = 59°C/W (SOT-223) (Equation5-2) is a function of the maximum ambient Find: temperature (T ), the maximum allowable die tem- AMAX 1. Actual power dissipation. perature (T ) and the thermal resistance from junc- JMAX 2. Maximum allowable dissipation tion-to-air (θ ). JA Actual power dissipation: EQUATION 5-2: P ≈(V –V )I D INMAX OUTMIN LOADMAX –3 P = (T – T ) P = (3.3×1.1)–(2.7×.995)275×10 DMAX JMAX AMAX D θ JA P = 260 mW D Where all terms are previously defined. Maximum allowable power dissipation: Table5-1 and Table5-2 show various values of θ for JA T –T the TC1264 packages. P = ----J--M-----A---X------------A----M----A---X-- DMAX θ JA TABLE 5-1: THERMAL RESISTANCE P = (---1---2---5----–-----9---5---)- DMAX 59 GUIDELINES FOR TC1264 IN P = 508 mW SOT-223 PACKAGE DMAX Copper Copper Thermal In this example, the TC1264 dissipates a maximum of Board Area Area Resistance 260mW; below the allowable limit of 508mW. In a Area (Topside)* (Backside) (θ ) similar manner, Equation5-1 and Equation5-2 can be JA used to calculate maximum current and/or input 2500sqmm 2500sqmm 2500sqmm 45°C/W voltage limits. For example, the maximum allowable 1000sqmm 2500sqmm 2500sqmm 45°C/W V , is found by substituting the maximum allowable IN 225sqmm 2500sqmm 2500sqmm 53°C/W power dissipation of 508mW into Equation5-1, from 100sqmm 2500sqmm 2500sqmm 59°C/W which VINMAX = 4.6V. 1000sqmm 1000sqmm 1000sqmm 52°C/W 1000sqmm 0sqmm 1000sqmm 55°C/W * Tab of device attached to topside copper © 2006 Microchip Technology Inc. DS21375C-page 7

TC1264 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 3-Lead DDPAK Example XXXXXXXXX TC1264 XXXXXXXXX 1.8VEB^e^3 YYWWNNN 0643256 3-Lead SOT-223 Example XXXXXXX 1264-25 XXXYYWW VDB0643 NNN 256 3-Lead TO-220 Example XXXXXXXXX TC1264 XXXXXXXXX 3.0VAB^e^3 YYWWNNN 0643256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS21375C-page 8 © 2006 Microchip Technology Inc.

TC1264 3-Lead Plastic (EB) (DDPAK) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E L3 E1 D2 D D1 1 b e BOTTOM VIEW TOP VIEW α b1 (5X) A c2 φ A1 c L Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins 3 3 Pitch e 1.00 BSC 2.54 BSC Overall Height A .170 .177 .183 4.32 4.50 4.65 Standoff § A1 .000 .005 .010 0.00 0.13 0.25 Overall Width E .385 .398 .410 9.78 10.11 10.41 Exposed Pad Width E1 .256 REF 6.50 REF Molded Package Length D .330 .350 .370 8.38 8.89 9.40 Overall Length D1 .549 .577 .605 13.94 14.66 15.37 Exposed Pad Length D2 .303 REF 7.70 REF Lead Thickness c .014 .020 .026 0.36 0.51 0.66 Pad Thickness c2 .045 -- .055 1.14 -- 1.40 Lower Lead Width b .026 .032 .037 0.66 0.81 0.94 Upper Lead Width b1 .049 .050 .051 1.24 1.27 1.30 Foot Length L .068 -- .110 1.73 -- 2.79 Pad Length L3 .045 -- .067 1.14 -- 1.70 Foot Angle φ -- -- 8° -- -- 8° Mold Draft Angle α 3° -- 7° 3° -- 7° * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. BSC: Basic Dimension. Theoretically, exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M JEDEC equivalent: TO-252 Revised 07-19-05 Drawing No. C04-011 © 2006 Microchip Technology Inc. DS21375C-page 9

TC1264 3-Lead Plastic Small Outline Transistor (DB) (SOT-223) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D b2 E1 E 1 e e1 α A2 A c φ β b A1 L Units INCHES MILLIMETERS* Dimension Limits MIN NOM MAX MIN NOM MAX Pitch e .091 BSC 2.30 BSC Outside lead pitch (basic) e1 .181 BSC 4.60 BSC Overall Height A – – .071 – – 1.80 Standoff A1 .001 – .004 0.02 – 0.10 Molded Package Height A2 .061 .063 .065 1.55 1.60 1.65 Overall Width E .264 .276 .287 6.70 7.00 7.30 Molded Package Width E1 .130 .138 .146 3.30 3.50 3.70 Overall Length D .248 .256 .264 6.30 6.50 6.70 Lead Thickness c .009 .012 .014 0.23 0.30 0.35 Lead Width b .026 .030 .033 0.65 0.76 0.85 Tab Lead Width b2 .114 .118 .124 2.90 3.00 3.15 Foot Length L .035 – – 0.90 – – Lead Angle φ 0° – 10° – 0.37 10° Mold Draft Angle, Top α 10° – 16° 10° – 16° Mold Draft Angle, Bottom β 10° – 16° 10° – 16° *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M JEDEC Equivalent TO-261 AA Revised 09-13-05 Drawing No. C04-032 DS21375C-page 10 © 2006 Microchip Technology Inc.

TC1264 3-Lead Plastic Transistor Outline (AB) (TO-220) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E A E/2 φP A1 E1 E3 Q H1 D3 D4 α D2 D 5X D1 L1 BOTTOM: VARIANT A BOTTOM: VARIANT B L b2 PIN 1 PIN n b e c A2 e1 Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 3 3 Pitch e .100 BSC 2.54 BSC Overall Pin Pitch e1 .200 BSC 5.08 BSC Overall Height A .140 - .190 3.56 - 4.83 Tab Thickness A1 .020 - .055 0.51 - 1.40 Base to Lead A2 .080 - .120 2.03 - 3.05 Overall Width E .380 - .420 9.65 - 10.67 Exposed Tab Width E1 .270 - .350 6.86 - 8.89 – (SEE BOTTOM VARIANT B) E3 .251 .256 .261 6.38 6.50 6.63 Hole Center to Tab Edge Q .100 - .120 2.54 - 3.05 Overall Length D .560 - .650 14.22 - 16.51 Molded Package Length D1 .330 - .361 8.38 - 9.17 Exposed Tab Length D2 .480 - .507 12.19 - 12.88 – (SEE BOTTOM VARIANT B) D3 .243 .248 .253 6.17 6.30 6.43 – (SEE BOTTOM VARIANT B) D4 .303 .308 .313 7.70 7.82 7.95 Tab Length H1 .230 - .270 5.84 - 6.86 Mounting Hole Diameter φP .139 - .156 3.53 - 3.96 Lead Length L .500 - .580 12.70 - 14.73 Lead Shoulder L1 - - .250 2.10 - 6.35 Foot Angle α 0 - 8° 0 - 8° Lead Thickness c .012 - .024 0.30 - 0.61 Lead Width b .015 .027 .040 0.38 0.69 1.02 Shoulder Width b2 .045 .057 .070 1.14 1.45 1.78 *Controlling Parameter Notes: Dimensions D1 and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M Drawing No. C04-158 © 2006 Microchip Technology Inc. DS21375C-page 11

TC1264 NOTES: DS21375C-page 12 © 2006 Microchip Technology Inc.

TC1264 APPENDIX A: REVISION HISTORY Revision C (October 2006) • Section1.0 “Electrical Characteristics”: Changed dropout voltage voltage typical value for I = 500mA from 700 to 1000 and maximum L value from 1000 to 1200 for. Changed typical value for I = 800mA from 890 to 1200 L • Section6.0 “PackAging Information”: Added package marking information and package outline drawings • Added disclaimer to package outline drawings. Revision B (May 2002) • Not Documented Revision A (March 2002) • Original Release of this Document. © 2006 Microchip Technology Inc. DS21375C-page 13

TC1264 NOTES: DS21375C-page 14 © 2006 Microchip Technology Inc.

TC1264 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X.XX XX XX Examples: a) TC1264-1.8VAB 1.8V LDO, TO-220-3 pkg. Device Voltage Package Tape and b) TC1264-2.5VAB 2.5V LDO, TO-220-3 pkg. Option Reel c) TC1264-3.0VAB 3.0V LDO, TO-220-3 pkg. d) TC1264-3.3VAB 3.3V LDO, TO-220-3 pkg. Device TC1264 Fixed Output CMOS LDO a) TC1264-1.8VEBTR1.8V LDO, DDPAK-3 pkg., Tape and Reel b) TC1264-2.5VEBTR2.5V LDO, DDPAK-3 pkg., Voltage Option:* 1.8V = 1.8V Tape and Reel 2.5V = 2.5V c) TC1264-3.0VEBTR3.0V LDO, DDPAK-3 pkg., 3.0V = 3.0V Tape and Reel 3.3V = 3.3V d) TC1264-3.3VEBTR3.3V LDO, DDPAK-3 pkg., Tape and Reel * Other output voltages are available. Please contact your local Microchip sales office for details. a) TC1264-1.8VDB 1.8V LDO, SOT-223 pkg. b) TC1264-1.8VDBTR1.8V LDO, SOT-223 pkg., Tape and Reel Package AB = Plastic (TO-220), 3-Lead c) TC1264-2.5VDB 2.5V LDO, SOT-223 pkg. DB = Plastic (SOT-223), 3-lead DBTR = Plastic (SOT-223), 3-lead, d) TC1264-2.5VDBTR2.5V LDO, SOT-223 pkg., Tape and Reel Tape and Reel EB = Plastic Transistor Outline (DDPAK), 3-Lead e) TC1264-3.0VDB 3.0V LDO, SOT-223 pkg. EBTR = Plastic Transistor Outline (DDPAK), 3-Lead, f) TC1264-3.0VDBTR3.0V LDO, SOT-223 pkg., Tape and Reel Tape and Reel g) TC1264-3.3VDB 3.3V LDO, SOT-223 pkg. h) TC1264-3.3VDBTR3.3V LDO, SOT-223 pkg., Tape and Reel © 2006 Microchip Technology Inc. DS21375C-page 15

TC1264 NOTES: DS21375C-page 16 © 2006 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, Accuron, and may be superseded by updates. It is your responsibility to dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, ensure that your application meets with your specifications. PROMATE, PowerSmart, rfPIC, and SmartShunt are MICROCHIP MAKES NO REPRESENTATIONS OR registered trademarks of Microchip Technology Incorporated WARRANTIES OF ANY KIND WHETHER EXPRESS OR in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, INCLUDING BUT NOT LIMITED TO ITS CONDITION, SEEVAL, SmartSensor and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Analog-for-the-Digital Age, Application Maestro, CodeGuard, devices in life support and/or safety applications is entirely at dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, the buyer’s risk, and the buyer agrees to defend, indemnify and ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, hold harmless Microchip from any and all damages, claims, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active suits, or expenses resulting from such use. No licenses are Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, conveyed, implicitly or otherwise, under any Microchip PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, intellectual property rights. PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. DS21375C-page 17

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