TC1262 500mA Fixed Output CMOS LDO Features Package Type • Very Low Dropout Voltage 3-Pin TO-220 3-Pin DDPAK • 500mA Output Current Front View • High Output Voltage Accuracy Tab is GND Tab is GND • Standard or Custom Output Voltages • Over Current and Over Temperature Protection TC1262 TC1262 Applications 1 2 3 1 2 3 • Battery Operated Systems • Portable Computers 3-Pin SOT-223 N D T • Medical Instruments VIN GND VOUT Front View VI GN VOU • Instrumentation • Cellular/GSM/PHS Phones 3 VOUT • Linear Post-Regulators for SMPS D N G • Pagers s 2 GND b i a T Device Selection Table TC1262 1 VIN Junction Part Number Package Temp. Range General Description TC1262-xxVDB 3-Pin SOT-223 -40°C to +125°C The TC1262 is a fixed output, high accuracy (typically TC1262-xxVAB 3-Pin TO-220 -40°C to +125°C ±0.5%) CMOS low dropout regulator. Designed specif- TC1262-xxVEB 3-Pin DDPAK -40°C to +125°C ically for battery-operated systems, the TC1262’s CMOS construction eliminates wasted ground current, NOTE: xx indicates output voltages. significantly extending battery life. Total supply current Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0. is typically 80A at full load (20 to 60 times lower than Other output voltages are available. Please contact Microchip in bipolar regulators). Technology Inc. for details. TC1262 key features include ultra low noise operation, very low dropout voltage (typically 350mV at full load), and fast response to step changes in load. The TC1262 incorporates both over temperature and over current protection. The TC1262 is stable with an output capacitor of only 1F and has a maximum output current of 500mA. It is available in 3-Pin SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages. Typical Application VIN VIN VOUT VOUT + TC1262 C1 1μF GND  2002-2012 Microchip Technology Inc. DS21373C-page 1

TC1262 1.0 ELECTRICAL *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These CHARACTERISTICS are stress ratings only and functional operation of the device Absolute Maximum Ratings* at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Input Voltage.........................................................6.5V Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Output Voltage..................(V – 0.3V) to (V + 0.3V) SS IN Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........V +0.3V to -0.3V IN Operating Temperature Range......-40°C < T < 125°C J Storage Temperature..........................-65°C to +150°C TC1262 ELECTRICAL SPECIFICATIONS Electrical Characteristics: V = V + 1V, I = 100A, C = 3.3F, T = 25°C, unless otherwise noted. Boldface type IN OUT L L A specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions V Input Operating Voltage 2.7 — 6.0 V Note 7 IN I Maximum Output Current 500 — — mA OUTMAX V Output Voltage — V ±0.5% — V Note 1 OUT R V – 2.5% — V + 2.5% R R V /T V Temperature Coefficient — 40 — ppm/°C Note 2 OUT OUT V /V Line Regulation — .003 0.35 %/V (V + 1V) V 6V OUT IN R IN V /V Load Regulation — 0.002 0.01 %/mA I = 0.1mA to I (Note 3) OUT OUT L OUTMAX V -V Dropout Voltage — 20 30 mV I = 100A IN OUT L — 60 130 I = 100mA L — 200 390 I = 300mA L 350 650 I = 500mA (Note 4) L I Supply Current — 80 130 A I = 0 DD L PSRR Power Supply Rejection Ratio — 64 — dB F 1kHz RE I Output Short Circuit Current — 1200 — mA V = 0V OUTSC OUT V /P Thermal Regulation — 0.04 — V/W Note 5 OUT D eN Output Noise — 260 — nV/Hz I = I , F = 10kHz L OUTMAX RE Note 1: VR is the regulator output voltage setting. 2: TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x T 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section4.0 Thermal Considerations for more details. 7: The minimum VIN has to justify the conditions: VIN  VR + VDROPOUT and VIN  2.7V for IL = 0.1mA to IOUTMAX. DS21373C-page 2  2002-2012 Microchip Technology Inc.

TC1262 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (3-Pin SOT-223) Symbol Description (3-Pin TO-220) (3-Pin DDPAK) 1 V Unregulated supply input. IN 2 GND Ground terminal. 3 V Regulated voltage output. OUT 3.0 DETAILED DESCRIPTION 3.1 Output Capacitor The TC1262 is a precision, fixed output LDO. Unlike A 1F (min) capacitor from VOUT to ground is required. bipolar regulators, the TC1262’s supply current does The output capacitor should have an effective series not increase with load current. In addition, V resistance greater than 0.1 and less than 5, and a OUT remains stable and within regulation over the entire resonant frequency above 1MHz. A 1F capacitor 0mA to ILOADMAX load current range (an important should be connected from VIN to GND if there is more consideration in RTC and CMOS RAM battery back-up than 10 inches of wire between the regulator and the applications). AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor Figure3-1 shows a typical application circuit. types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid FIGURE 3-1: TYPICAL APPLICATION tantalums are recommended for applications operating CIRCUIT below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient + VIN VOUT + VOUT response can be improved by increasing the value of + C1μ1F TC1262 C1μ2F tfhiltee rininpgu tte acnhdn ioquutepsu.t capacitors and employing passive Battery GND –  2002-2012 Microchip Technology Inc. DS21373C-page 3

TC1262 4.0 THERMAL CONSIDERATIONS TABLE 4-2: THERMAL RESISTANCE GUIDELINES FOR TC1262 IN 4.1 Thermal Shutdown 3-PIN DDPAK/TO-220 PACKAGE Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. Copper Copper Thermal The regulator remains off until the die temperature Board Area Area Resistance drops to approximately 150°C. Area (Topside)* (Backside)  ) JA 4.2 Power Dissipation 2500 sq mm 2500 sq mm 2500 sq mm 25°C/W 1000 sq mm 2500 sq mm 2500 sq mm 27°C/W The amount of power the regulator dissipates is 125 sq mm 2500 sq mm 2500 sq mm 35°C/W primarily a function of input and output voltage, and output current. The following equation is used to *Tab of device attached to topside copper calculate worst case actual power dissipation: Equation4-1 can be used in conjunction with Equation EQUATION 4-1: 4-2 to ensure regulator thermal operation is within limits. For example: P  (V – V )I D INMAX OUTMIN LOADMAX Given: Where: V = 3.3V ± 10% P = Worst case actual power dissipation INMAX D V = 2.7V ± 0.5% VINMAX= Maximum voltage on VIN OUTMIN VOUTMIN = Minimum regulator output voltage ILOADMAX = 275mA ILOADMAX= Maximum output (load) current TJMAX = 125°C T = 95°C The maximum allowable power dissipation (Equation AMAX  = 59°C/W (SOT-223) 4-2) is a function of the maximum ambient temperature JA (T ), the maximum allowable die temperature Find: 1. Actual power dissipation AMAX (TJ ) and the thermal resistance from junction-to-air 2. Maximum allowable dissipation MAX ( ). JA Actual power dissipation: P  (V – V )I EQUATION 4-2: D INMAX OUTMIN LOADMAX = [(3.3 x 1.1) – (2.7 x .995)]275 x 10–3 P = (T – T ) DMAX JMAX AMAX = 260mW  JA Maximum allowable power dissipation: Where all terms are previously defined. P = (T – T ) DMAX JMAX AMAX Table4-1 and Table4-2 show various values of JA for JA the TC1262 packages. = (125 – 95) 59 TABLE 4-1: THERMAL RESISTANCE = 508mW GUIDELINES FOR TC1262 IN In this example, the TC1262 dissipates a maximum of SOT-223 PACKAGE 260mW; below the allowable limit of 508mW. In a similar manner, Equation4-1 and Equation4-2 can be Copper Copper Thermal Board used to calculate maximum current and/or input Area Area Resistance Area voltage limits. For example, the maximum allowable (Topside)* (Backside)  ) JA V , is found by sustituting the maximum allowable IN 2500 sq mm 2500 sq mm 2500 sq mm 45°C/W power dissipation of 508mW into Equation4-1, from 1000 sq mm 2500 sq mm 2500 sq mm 45°C/W which VINMAX = 4.6V. 225 sq mm 2500 sq mm 2500 sq mm 53°C/W 100 sq mm 2500 sq mm 2500 sq mm 59°C/W 1000 sq mm 1000 sq mm 1000 sq mm 52°C/W 1000 sq mm 0 sq mm 1000 sq mm 55°C/W *Tab of device attached to topside copper DS21373C-page 4  2002-2012 Microchip Technology Inc.

TC1262 5.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Line Regulation vs. Temperature Output Noise vs. Frequency Load Regulation vs. Temperature 0.020 10.0 0.0100 0.018 RCLOOUAT D= =1 μ5F0μΩ 0.0090 %) 0.016 mA)0.0080 N ( 0.014 z) 1.0 %/0.0070 LINE REGULATIO 00000.....000000011084026 μ√NOISE (V/H 0.1 AD REGULATION (00000.....00000000004653200000 52V.5V 11mmAA ttoo 550000mmAA O 0.002 L0.0010 0.000 0.0 0.0100 -40°C 0°C 25°C 70°C 85°C 125°C 0.01 0.01 1 10 100 1000 -40°C 0°C 25°C 70°C 85°C 125°C TEMPERATURE (°C) FREQUENCY (kHz) TEMPERATURE (°C) IDD vs. Temperature 2.5V Dropout Voltage vs. ILOAD LOAD 150 0.50 0.50 135 125°C 1125°C 112005 GE (V)0.40 70°C85°C GE (V)0.40 85°C µI (A)DD 976050 2.5V 5V OUT VOLTA00..3200 25°C 0°C OUT VOLTA00..3200 25°7C0°C 45 OP -40°C OP 0°C 30 DR 0.10 DR 0.10 15 -40°C 0 0.00 0.00 -40°C 0°C 25°C 70°C 85°C 125°C 0 100 300 400 500 0 100 200 300 400 500 TEMPERATURE (°C) ILOAD (mA) ILOAD (mA) 2.5V VOUT vs. Temperature 5.0V VOUT vs. Temperature 2.70 5.20 5.10 2.50 IL= 0.1mA 5.00 IL= 0.1mA 4.90 2.30 4.80 V (V)OUT2.10 IL = 300mIIILAA= 500mAAA V (V)OUT 444...765000 IIIL IIIL 1.90 4.40 4.30 1.70 4.20 4.10 1.50 4.00 -40°C 0°C 25°C 70°C 85°C 125°C -40°C 0°C 25°C 70°C 85°C 125°C TEMPERATURE (°C) TEMPERATURE (°C)  2002-2012 Microchip Technology Inc. DS21373C-page 5

TC1262 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 3-Pin SOT-223 Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 3-Pin SOT-223 12 mm 8 mm 4000 13 in Component Taping Orientation for 3-Pin DDPAK Devices PIN 1 User Direction of Feed gnikraM eciveD W P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 3-Pin DDPAK 24 mm 16 mm 750 13 in DS21373C-page 6  2002-2012 Microchip Technology Inc.

TC1262 6.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 3-Pin SOT-223 .264 (6.70) .248 (6.30) .122 (3.10) .114 (2.90) .287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30) .041 (1.04) PIN 1 .033 (0.84) .091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) 10° MAX. .013 (0.33) MAX. .009 (0.24) .004 (0.10) .181 (4.60) TYP. .036 (0.91) MIN. .001 (0.02) Dimensions: inches (mm)  2002-2012 Microchip Technology Inc. DS21373C-page 7

TC1262 Package Dimensions (Continued) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 3-Pin TO-220 .185 (4.70) .165 (4.19) .410 (10.41) .113 (2.87) .357 (9.06) .055 (1.40) .103 (2.62) .156 (3.96) .045 (1.14) .146 (3.71) DIA. .258 (6.55) .230 (5.84) 3° - 7.5° .594 (15.09) 5 PLCS. .569 (14.45) .244 (6.20) .234 (5.94) .560 (14.22) .518 (13.16) .055 (1.40) .045 (1.14) .020 (0.51) .012 (0.30) .037 (0.94) .027 (0.69) .105 (2.67) PIN 1 .095 (2.41) .115 (2.92) .095 (2.41) .205 (5.21) .195 (4.95) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 3-Pin DDPAK .410 (10.41) .183 (4.65) .385 (9.78) .170 (4.32) .067 (1.70) .045 (1.14) .055 (1.40) .045 (1.14) 3° - 7° (5x) .370 (9.40) .330 (8.38) .010 (0.25) .000 (0.00) .605 (15.37) .026 (0.66) .549 (13.95) .051 (1.30) .014 (0.36) .049 (1.24) .110 (2.79) .068 (1.72) .037 (0.94) PIN 1 .026 (0.66) .100 (2.54) TYP. 8° MAX. Dimensions: inches (mm) DS21373C-page 8  2002-2012 Microchip Technology Inc.

TC1262 7.0 REVISION HISTORY Revision C (November 2012) Added a note to each package outline drawing.  2002-2012 Microchip Technology Inc. DS21373C-page 9

TC1262 NOTES: DS21373C-page 10  2002-2012 Microchip Technology Inc.

TC1262 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002-2012 Microchip Technology Inc. DS21373C-page11

TC1262 NOTES: DS21373C-page12  2002-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767788 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2002-2012 Microchip Technology Inc. DS21373C-page 13

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