TC1262 500mA Fixed Output CMOS LDO Features Package Type • VeryLowDropoutVoltage 3-Pin TO-220 3-Pin DDPAK (cid:127) 500mAOutputCurrent Front View (cid:127) HighOutputVoltageAccuracy Tab is GND Tab is GND (cid:127) StandardorCustomOutputVoltages (cid:127) OverCurrentandOverTemperatureProtection TC1262 TC1262 Applications 1 2 3 1 2 3 (cid:127) BatteryOperatedSystems (cid:127) PortableComputers 3-Pin SOT-223 N D T (cid:127) MedicalInstruments VIN GND VOUT Front View VI GN VOU (cid:127) Instrumentation (cid:127) Cellular/GSM/PHSPhones 3 VOUT (cid:127) LinearPost-RegulatorsforSMPS D N G • Pagers s 2 GND b i a T Device Selection Table TC1262 1 VIN Junction PartNumber Package Temp.Range General Description TC1262-xxVDB 3-PinSOT-223 -40°Cto+125°C TheTC1262isafixedoutput,highaccuracy(typically TC1262-xxVAB 3-PinTO-220 -40°Cto+125°C ±0.5%)CMOSlowdropoutregulator.Designedspecif- TC1262-xxVEB 3-PinDDPAK -40°Cto+125°C ically for battery-operated systems, the TC1262’s CMOSconstructioneliminateswastedgroundcurrent, NOTE:xxindicatesoutputvoltages. significantlyextendingbatterylife.Totalsupplycurrent AvailableOutputVoltages:2.5,2.8,3.0,3.3,5.0. istypically80µAatfullload(20to60timeslowerthan Otheroutputvoltagesareavailable.PleasecontactMicrochip inbipolarregulators). TechnologyInc.fordetails. TC1262keyfeaturesincludeultralownoiseoperation, verylowdropoutvoltage(typically350mVatfullload), andfastresponsetostepchangesinload. The TC1262 incorporates both over temperature and over current protection. The TC1262 is stable with an output capacitor of only 1µF and has a maximum output current of 500mA. It is available in 3-Pin SOT-223,3-PinTO-220and3-PinDDPAKpackages. TypicalApplication VIN VIN VOUT VOUT + TC1262 C1 1µF GND  2002MicrochipTechnologyInc. DS21373B-page 1

TC1262 1.0 ELECTRICAL *Stresses above those listed under "Absolute Maximum Ratings"maycausepermanentdamagetothedevice.These CHARACTERISTICS arestressratingsonlyandfunctionaloperationofthedevice Absolute Maximum Ratings* attheseoranyotherconditionsabovethoseindicatedinthe operation sections of the specifications is not implied. InputVoltage.........................................................6.5V Exposure to Absolute Maximum Rating conditions for extendedperiodsmayaffectdevicereliability. OutputVoltage..................(V –0.3V)to(V +0.3V) SS IN PowerDissipation................InternallyLimited(Note6) MaximumVoltageonAnyPin ........V +0.3Vto-0.3V IN OperatingTemperatureRange......-40°C<T <125°C J StorageTemperature..........................-65°Cto+150°C TC1262ELECTRICALSPECIFICATIONS ElectricalCharacteristics:V =V +1V,I =100µA,C =3.3µF,T =25°C,unlessotherwisenoted.Boldfacetype IN OUT L L A specificationsapplyforjunctiontemperaturesof-40°Cto+125°C. Symbol Parameter Min Typ Max Units TestConditions V InputOperatingVoltage 2.7 — 6.0 V Note7 IN I MaximumOutputCurrent 500 — — mA OUTMAX V OutputVoltage — V ±0.5% — V Note1 OUT R V –2.5% — V +2.5% R R ∆V /∆T V TemperatureCoefficient — 40 — ppm/°C Note2 OUT OUT ∆V /∆V LineRegulation — .003 0.35 %/V (V +1V)≤ V ≤ 6V OUT IN R IN ∆V /V LoadRegulation — 0.002 0.01 %/mA I =0.1mAtoI (Note3) OUT OUT L OUTMAX V -V DropoutVoltage — 20 30 mV I =100µA IN OUT L — 60 130 I =100mA L — 200 390 I =300mA L 350 650 I =500mA(Note4) L I SupplyCurrent — 80 130 µA I =0 DD L PSRR PowerSupplyRejectionRatio — 64 — dB F ≤ 1kHz RE I OutputShortCircuitCurrent — 1200 — mA V =0V OUTSC OUT ∆V /∆P ThermalRegulation — 0.04 — V/W Note5 OUT D eN OutputNoise — 260 — nV/√Hz I =I ,F =10kHz L OUTMAX RE Note 1: VRistheregulatoroutputvoltagesetting. 2: TCVOUT=(VOUTMAX–VOUTMIN)x106 V x∆T OUT 3: Regulationismeasuredataconstantjunctiontemperatureusinglowdutycyclepulsetesting.Loadregulationistestedoveraloadrange from0.1mAtothemaximumspecifiedoutputcurrent.Changesinoutputvoltageduetoheatingeffectsarecoveredbythethermal regulationspecification. 4: Dropoutvoltageisdefinedastheinputtooutputdifferentialatwhichtheoutputvoltagedrops2%belowitsnominalvaluemeasuredata 1Vdifferential. 5: ThermalRegulationisdefinedasthechangeinoutputvoltageatatimeTafterachangeinpowerdissipationisapplied,excludingloador lineregulationeffects.SpecificationsareforacurrentpulseequaltoI atV =6VforT=10msec. LMAX IN 6: Themaximumallowablepowerdissipationisafunctionofambienttemperature,themaximumallowablejunctiontemperatureandthe thermalresistancefromjunction-to-air(i.e.,TA,TJ,θJA).Exceedingthemaximumallowablepowerdissipationcausesthedevicetoinitiate thermalshutdown.PleaseseeSection4.0ThermalConsiderationsformoredetails. 7: TheminimumVINhastojustifytheconditions:VIN≥ VR+VDROPOUTandVIN≥ 2.7VforIL=0.1mAtoIOUTMAX.  DS21373B-page 2 2002MicrochipTechnologyInc.

TC1262 2.0 PIN DESCRIPTIONS ThedescriptionsofthepinsarelistedinTable2-1. TABLE2-1: PINFUNCTIONTABLE PinNo. (3-PinSOT-223) Symbol Description (3-PinTO-220) (3-PinDDPAK) 1 V Unregulatedsupplyinput. IN 2 GND Groundterminal. 3 V Regulatedvoltageoutput. OUT 3.0 DETAILED DESCRIPTION 3.1 Output Capacitor The TC1262 is a precision, fixed output LDO. Unlike A1µF(min)capacitorfromVOUTtogroundisrequired. bipolar regulators, the TC1262’s supply current does The output capacitor should have an effective series not increase with load current. In addition, V resistance greater than0.1Ω andlessthan5Ω, and a OUT remains stable and within regulation over the entire resonant frequency above 1MHz. A 1µF capacitor 0mA to ILOADMAX load current range (an important shouldbeconnectedfromVINtoGNDifthereismore considerationinRTCandCMOSRAMbatteryback-up than 10 inches of wire between the regulator and the applications). ACfiltercapacitor,orif abatteryisusedasthepower source. Aluminum electrolytic or tantalum capacitor Figure3-1showsatypicalapplicationcircuit. typescanbeused.(Sincemanyaluminumelectrolytic capacitors freeze at approximately -30°C, solid FIGURE 3-1: TYPICALAPPLICATION tantalumsarerecommendedforapplicationsoperating CIRCUIT below-25°C.) Whenoperatingfromsourcesotherthan batteries, supply-noise rejection and transient + VIN VOUT + VOUT response can be improved by increasing the value of + C1µ1F TC1262 C1µ2F tfhilteerininpgutteacnhdnioquutepsu.tcapacitorsandemployingpassive Battery GND –  2002MicrochipTechnologyInc. DS21373B-page 3

TC1262 4.0 THERMAL CONSIDERATIONS TABLE 4-2: THERMALRESISTANCE GUIDELINESFORTC1262IN 4.1 ThermalShutdown 3-PINDDPAK/TO-220 PACKAGE Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. Copper Copper Thermal The regulator remains off until the die temperature Board Area Area Resistance dropstoapproximately150°C. (Topside)* (Backside) Area (θ ) JA 4.2 PowerDissipation 2500sqmm 2500sqmm 2500sqmm 25°C/W 1000sqmm 2500sqmm 2500sqmm 27°C/W The amount of power the regulator dissipates is 125sqmm 2500sqmm 2500sqmm 35°C/W primarily a function of input and output voltage, and output current. The following equation is used to *Tabofdeviceattachedtotopsidecopper calculateworstcaseactualpowerdissipation: Equation4-1canbeusedinconjunctionwithEquation EQUATION4-1: 4-2 to ensure regulator thermal operation is within limits.Forexample: P ≈(V –V )I D INMAX OUTMIN LOADMAX Given: Where: V =3.3V±10% INMAX P =Worstcaseactualpowerdissipation D V =2.7V±0.5% VINMAX =MaximumvoltageonVIN OUTMIN VOUTMIN =Minimumregulatoroutputvoltage ILOADMAX =275mA ILOADMAX =Maximumoutput(load)current TJMAX =125°C T =95°C The maximum allowable power dissipation (Equation AMAX θ =59°C/W(SOT-223) 4-2)isafunctionofthemaximumambienttemperature JA (T ), the maximum allowable die temperature Find: 1.Actualpowerdissipation AMAX (TJ )andthe thermal resistancefromjunction-to-air 2.Maximumallowabledissipation MAX (θ ). JA Actualpowerdissipation: P ≈(V –V )I EQUATION4-2: D INMAX OUTMIN LOADMAX =[(3.3x1.1)–(2.7x.995)]275x10–3 P =(T –T ) DMAX JMAX AMAX =260mW θ JA Maximumallowablepowerdissipation: Wherealltermsarepreviouslydefined. P =(T –T ) DMAX JMAX AMAX Table4-1andTable4-2showvariousvaluesofθJAfor θJA theTC1262packages. =(125–95) 59 TABLE 4-1: THERMALRESISTANCE =508mW GUIDELINESFORTC1262IN Inthisexample,theTC1262dissipatesamaximumof SOT-223PACKAGE 260mW; below the allowable limit of 508mW. In a similarmanner,Equation4-1andEquation4-2canbe Copper Copper Thermal Board used to calculate maximum current and/or input Area Area Resistance Area voltage limits. For example, the maximum allowable (Topside)* (Backside) (θ ) JA V , is found by sustituting the maximum allowable IN 2500sqmm 2500sqmm 2500sqmm 45°C/W power dissipation of 508mW into Equation4-1, from 1000sqmm 2500sqmm 2500sqmm 45°C/W whichVINMAX=4.6V. 225sqmm 2500sqmm 2500sqmm 53°C/W 100sqmm 2500sqmm 2500sqmm 59°C/W 1000sqmm 1000sqmm 1000sqmm 52°C/W 1000sqmm 0sqmm 1000sqmm 55°C/W *Tabofdeviceattachedtotopsidecopper  DS21373B-page 4 2002MicrochipTechnologyInc.

TC1262 5.0 TYPICAL CHARACTERISTICS Note: Thegraphsandtablesprovidedfollowingthisnoteareastatisticalsummarybasedonalimitednumberof samplesandareprovidedforinformationalpurposesonly.Theperformancecharacteristicslistedhereinare nottestedorguaranteed.Insomegraphsortables,thedatapresentedmaybeoutsidethespecified operatingrange(e.g.,outsidespecifiedpowersupplyrange)andthereforeoutsidethewarrantedrange. Line Regulation vs. Temperature Output Noise vs. Frequency Load Regulation vs. Temperature 0.020 10.0 0.0100 0.018 RCLOOUAT D= =1 µ5F0µΩ 0.0090 %) 0.016 mA)0.0080 N ( 0.014 z) 1.0 %/0.0070 LINE REGULATIO 00000.....000001001008426 µ√NOISE (V/H 0.1 AD REGULATION (00000.....00000000004653200000 52V.5V 11mmAA ttoo 550000mmAA O 0.002 L0.0010 0.000 0.0 0.0100 -40°C 0°C 25°C 70°C 85°C 125°C 0.01 0.01 1 10 100 1000 -40°C 0°C 25°C 70°C 85°C 125°C TEMPERATURE (°C) FREQUENCY (kHz) TEMPERATURE (°C) IDD vs. Temperature 2.5V Dropout Voltage vs. ILOAD LOAD 150 0.50 0.50 135 125°C 1125°C 112005 GE (V)0.40 70°C85°C GE (V)0.40 85°C µI (A)DD 976050 2.5V 5V OUT VOLTA00..3200 25°C 0°C OUT VOLTA00..3200 25°7C0°C 45 OP -40°C OP 0°C 30 DR 0.10 DR 0.10 15 -40°C 0 0.00 0.00 -40°C 0°C 25°C 70°C 85°C 125°C 0 100 200 300 400 500 0 100 200 300 400 500 TEMPERATURE (°C) ILOAD (mA) ILOAD (mA) 2.5V VOUT vs. Temperature 5.0V VOUT vs. Temperature 2.70 5.20 5.10 2.50 IL= 0.1mA 5.00 IL= 0.1mA 4.90 2.30 4.80 V (V)OUT2.10 IL = 300mIIILAA= 500mAAA V (V)OUT 444...765000 IIIL IIIL 1.90 4.40 4.30 1.70 4.20 4.10 1.50 4.00 -40°C 0°C 25°C 70°C 85°C 125°C -40°C 0°C 25°C 70°C 85°C 125°C TEMPERATURE (°C) TEMPERATURE (°C)  2002MicrochipTechnologyInc. DS21373B-page 5

TC1262 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Packagemarkingdatanotavailableatthistime. 6.2 Taping Form Component Taping Orientation for 3-Pin SOT-223 Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 3-Pin SOT-223 12 mm 8 mm 4000 13 in Component Taping Orientation for 3-Pin DDPAK Devices PIN 1 User Direction of Feed gnikraM eciveD W P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 3-Pin DDPAK 24 mm 16 mm 750 13 in  DS21373B-page 6 2002MicrochipTechnologyInc.

TC1262 6.3 Package Dimensions 3-Pin SOT-223 .264 (6.70) .248 (6.30) .122 (3.10) .114 (2.90) .287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30) .041 (1.04) PIN 1 .033 (0.84) .091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) 10° MAX. .013 (0.33) MAX. .009 (0.24) .004 (0.10) .181 (4.60) TYP. .036 (0.91) MIN. .001 (0.02) Dimensions: inches (mm) 3-Pin TO-220 .185 (4.70) .165 (4.19) .410 (10.41) .113 (2.87) .357 (9.06) .055 (1.40) .103 (2.62) .156 (3.96) .045 (1.14) .146 (3.71) DIA. .258 (6.55) .230 (5.84) 3° - 7.5° .594 (15.09) 5 PLCS. .569 (14.45) .244 (6.20) .234 (5.94) .560 (14.22) .518 (13.16) .055 (1.40) .045 (1.14) .020 (0.51) .012 (0.30) .037 (0.94) .027 (0.69) .105 (2.67) PIN 1 .095 (2.41) .115 (2.92) .095 (2.41) .205 (5.21) .195 (4.95) Dimensions: inches (mm)  2002MicrochipTechnologyInc. DS21373B-page 7

TC1262 6.3 Package Dimensions (Continued) 3-Pin DDPAK .410 (10.41) .183 (4.65) .385 (9.78) .170 (4.32) .067 (1.70) .045 (1.14) .055 (1.40) .045 (1.14) 3° - 7° (5x) .370 (9.40) .330 (8.38) .010 (0.25) .000 (0.00) .605 (15.37) .026 (0.66) .549 (13.95) .051 (1.30) .014 (0.36) .049 (1.24) .110 (2.79) .068 (1.72) .037 (0.94) PIN 1 .026 (0.66) .100 (2.54) TYP. 8° MAX. Dimensions: inches (mm)  DS21373B-page 8 2002MicrochipTechnologyInc.

TC1262 SALES AND SUPPORT DataSheets ProductssupportedbyapreliminaryDataSheetmayhaveanerratasheetdescribingminoroperationaldifferencesandrecom- mendedworkarounds.Todetermineifanerratasheetexistsforaparticulardevice,pleasecontactoneofthefollowing: 1. YourlocalMicrochipsalesoffice 2. TheMicrochipCorporateLiteratureCenterU.S.FAX:(480)792-7277 3. TheMicrochipWorldwideSite(www.microchip.com) Pleasespecifywhichdevice,revisionofsiliconandDataSheet(includeLiterature#)youareusing. NewCustomerNotificationSystem Registeronourwebsite(www.microchip.com/cn)toreceivethemostcurrentinformationonourproducts.  2002 Microchip Technology Inc. DS21373B-page 9

TC1262 NOTES: DS21373B-page 10  2002 Microchip Technology Inc.

TC1262 Information contained in this publication regarding device Trademarks applicationsandthelikeisintendedthroughsuggestiononly andmaybesupersededbyupdates.Itisyourresponsibilityto The Microchip name and logo, the Microchip logo, FilterLab, ensure that your application meets with your specifications. KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, No representation or warranty is given and no liability is PICSTART,PROMATE, SEEVAL and TheEmbedded Control assumedbyMicrochipTechnologyIncorporatedwithrespect SolutionsCompanyareregisteredtrademarksofMicrochipTech- totheaccuracyoruseofsuchinformation,orinfringementof nologyIncorporatedintheU.S.A.andothercountries. patentsorotherintellectualpropertyrightsarisingfromsuch dsPIC,ECONOMONITOR,FanSense,FlexROM,fuzzyLAB, useorotherwise.UseofMicrochip’sproductsascriticalcom- In-Circuit Serial Programming, ICSP, ICEPIC, microPort, ponentsinlifesupportsystemsisnotauthorizedexceptwith Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, expresswritten approvalbyMicrochip.Nolicensesarecon- MXDEV,MXLAB,PICC,PICDEM,PICDEM.net,rfPIC,Select veyed,implicitlyorotherwise,underanyintellectualproperty Mode and Total Endurance are trademarks of Microchip rights. TechnologyIncorporatedintheU.S.A. SerializedQuickTurnProgramming(SQTP)isaservicemark ofMicrochipTechnologyIncorporatedintheU.S.A. All other trademarks mentioned herein are property of their respectivecompanies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A.,AllRightsReserved. Printedonrecycledpaper. MicrochipreceivedQS-9000qualitysystem certificationforitsworldwideheadquarters, designandwaferfabricationfacilitiesin ChandlerandTempe,ArizonainJuly1999 andMountainView,CaliforniainMarch2002. TheCompany’squalitysystemprocessesand proceduresareQS-9000compliantforits PICmicro®8-bitMCUs,KEELOQ®codehopping devices,SerialEEPROMs,microperipherals, non-volatilememoryandanalogproducts.In addition,Microchip’squalitysystemforthe designandmanufactureofdevelopment systemsisISO9001certified.  2002MicrochipTechnologyInc. DS21373B-page11

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrochip: TC1262-2.5VEBTR TC1262-2.5VAB TC1262-2.8VAB TC1262-2.8VDBTR TC1262-5.0VEBTR TC1262-3.0VEBTR TC1262-3.3VAB TC1262-2.8VEBTR TC1262-3.0VAB TC1262-3.3VEBTR TC1262-3.3VDBTR TC1262-5.0VAB TC1262-2.5VDBTR TC1262-2.5VDB TC1262-3.0VDBTR TC1262-5.0VDBTR TC1262-3.0VDB TC1262-3.3VDB TC1262-5.0VDB TC1262-2.8VDB