M TC1232 Microprocessor Monitor Features General Description • Precision Voltage Monitor The TC1232 is a fully-integrated processor supervisor - Adjustable +4.5V or +4.75V that provides three important functions to safeguard processor sanity: precision power on/off reset control, • Reset Pulse Width – 250msec minimum watchdog timer and external reset override. • No External Components On power-up, the TC1232 holds the processor in the • Adjustable Watchdog Timer reset state for a minimum of 250msec after V is - 150msec, 600msec or 1.2sec CC within tolerance to ensure a stable system start-up. • Debounced Manual Reset Input for External Microprocessor sanity is monitored by the on-board Override watchdog circuit. The microprocessor must provide a Applications periodic low-going signal on the ST input. Should the processor fail to supply this signal within the selected • Computers time-out period (150msec, 600msec or 1200msec), • Controllers an out-of-control processor is indicated and the TC1232 issues a processor reset as a result. • Intelligent Instruments • Automotive Systems The outputs of the TC1232 are immediately driven • Critical µP Power Monitoring active when the PB input is brought low by an external push-button switch or other electronic signal. When connected to a push-button switch, the TC1232 provides contact debounce. The TC1232 is packaged in a space-saving 8-Pin PDIP or SOIC package and a 16-Pin SOIC (Wide) package and requires no external components. Package Types 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC Wide PB RST 1 8 VCC PB RST 11 88 VCC NC 1 16NC TD 2 TC1232 7 ST TD 2 TTCC11223322 7 ST PB RNSCT 23 1154VNCCC TOL 33 66 RST TOL 3 6 RST TD 4 13ST GND 4 5 RST GND 44 55 RST NC 5 TC1232 12NC TOL 6 11RST NC 7 10NC GND 8 9 RST  2003 Microchip Technology Inc. DS21370B-page 1

TC1232 Functional Block Diagram RST VCC 5%/10% + Tolerance Reset Select – Generator TOL + + V R–E F RST TC1232 PB RST Debounce Watchdog Watchdog TD Timebase ST Timer Select GND DS21370B-page 2  2003 Microchip Technology Inc.

TC1232 1.0 ELECTRICAL † Stresses above those listed under "Absolute Maximum Rat- ings" may cause permanent damage to the device. These are CHARACTERISTICS stress ratings only and functional operation of the device at these or any other conditions above those indicated in the Absolute Maximum Ratings† operation sections of the specifications is not implied. Expo- Voltage on Any Pin (With Respect to GND) sure to Absolute Maximum Rating conditions for extended periods may affect device reliability. ......................................................-0.3V to +5.8V Operating Temperature Range C-Version........................................0°C to +70°C E-Version.....................................-40°C to +85°C Storage Temperature Range .............-65°C to +150°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, T = T to T ; V = +4.5V to 5.5V. A MIN MAX CC Parameters Sym Min Typ Max Units Conditions Supply Voltage V 4.5 5.0 5.5 V CC ST and PB RST Input High Level V 2.0 — V +0.3 V Note1 IH CC ST and PB RST Input Low Level V -0.3 — +0.8 V IL Input Leakage ST, TOL I -1.0 — +1.0 µA L Output Current RST I -1.0 -12 — mA V = 2.4V OH OH Current RST, RST I 2.0 10 — mA V = 0.4V OL OL Operating Current I — 50 200 µA Note2 CC V 5% Trip Point V 4.50 4.62 4.74 V TOL = GND (Note3) CC CCTP V 10% Trip Point V 4.25 4.37 4.49 V TOL = V (Note3) CC CCTP CC Capacitance Electrical Characteristics: Unless otherwise noted, TA = +25°C. (Note4) Input Capacitance ST, TOL C — — 5 pF IN Output Capacitance RST, RST C — — 7 pF OUT AC Electrical Characteristics: Unless otherwise noted, T = T to T ; V = +5V to ±10%. A MIN MAX CC PB RST t 20 — — msec Figure3-3 (Note5) PB PB RST Delay t 1 4 20 msec Figure3-3 PBD Reset Active Time t 250 610 1000 msec RST ST Pulse Width t 20 — — nsec Figure3-4 ST ST Time-out Period t 62.5 150 250 msec TD Pin = 0V, Figure3-4 TD 250 600 1000 msec TD Pin = Open, Figure3-4 500 1200 2000 msec TD Pin = V Figure3-4 CC, V Fall Time t 10 — — µsec Figure3-5, (Note4) CC F V Rise Time t 0 — — µsec Figure3-6, (Note4) CC R V Detect to RST High and t — — 100 nsec Figure3-7, V Falling CC RPD CC RST Low V Detect to RST High and t 250 610 1000 msec Figure3-8, V Rising, (Note6) CC RPU CC RST Open Note 1: PB RST is internally pulled up to Vcc with an internal impedance of typically 40kΩ. 2: Measured with outputs open. 3: All voltages referenced to GND. 4: Ensured by design. 5: PB RST must be held low for a minimum of 20msec to ensure a reset. 6: t = 5µsec. R  2003 Microchip Technology Inc. DS21370B-page 3

TC1232 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. Pin No. Symbol Function (8-pin PDIP, SOIC) (16-pin SOIC) 1 2 PB RST Push-button Reset Input. A debounced active-low input that ignores pulses less than 1msec in duration and is ensured to recognize inputs of 20msec or greater. 2 4 TD Time Delay Set. The watchdog time-out select input (t = 150msec for TD = TD 0V, t = 600msec for TD = open, t = 1.2sec for TD = V ). TD TD CC 3 6 TOL Tolerance Input. Connect to GND for 5% tolerance or to V for 10% tolerance. CC 4 8 GND Ground. 5 9 RST Reset Output (Active-High) – goes active: 1. If V falls below the selected reset voltage threshold. CC 2. If PB RST is forced low. 3. If ST is not strobed within the minimum time-out period. 4. During power-up 6 11 RST Reset output (active-low, open-drain) – see RST. 7 13 ST Strobe input. Input for watchdog timer. 8 15 V The +5V power-supply input. CC — 1,3,5,7,10,12,16 NC No internal connection. DS21370B-page 4  2003 Microchip Technology Inc.

TC1232 3.0 DETAILED DESCRIPTION 3.4 Supply Monitor Noise Sensitivity The TC1232 is optimized for fast response to negative- 3.1 Power Monitor going changes in V . Systems with an inordinate DD The TC1232 provides the function of warning the pro- amount of electrical noise on VDD (such as systems cessor of a power failure. When V is detected as using relays) may require a 0.01µF or 0.1µF bypass CC being below the voltage levels defined by the TOL pin, capacitor to reduce detection sensitivity. This capacitor the TC1232’s comparator outputs the RST and RST should be installed as close to the TC1232 as possible signals to a logic level that warns the system of an out- to keep the capacitor lead length short. of-tolerance power supply. The RST and RST signals switch at a threshold value of 4.5V if TOL is tied to V CC and at a value of 4.75 volts if TOL is grounded. The +5V RST and RST signals are held active for a minimum of 250msec to ensure that the power supply voltage has been stabilized. VCC TD 3.2 Push-Button Reset Input PB RST ST I/O The debounced manual reset input (PB RST) manually Micro- TC1232 forces the reset outputs into their active states. Once processor PB RST has been low for a time t (the push-button RST Reset PBD delay time) the reset outputs go active. The reset outputs remain in their active states for a minimum of 250msec after PB RST rises above V (Figure3-3). IH A mechanical push-button or active logic signal can GND TOL drive the PB RST input. The debounced input ignores input pulses less than 1msec and ecognizes pulses of 20msec or greater. No external pull-up resistor is required because the PB RST input has an internal FIGURE 3-1: Push-Button Reset. pull-up toV ofapproximately 100µA. CC 3.3 Watchdog Timer +5V When the ST input is not stimulated for a preset time 10kΩ period, the watchdog timer function forces RST and RST signals to the active state. The preset time period is determined by the TD inputs to be 150msec with TD 3R-eTegrumlaitnoarl +5V VCC RST RESET connected to ground, 600msec with TD floating, or 0.1 1200msec with TD connected to VCC (typical). The µF TC1232 Micro- watchdog timer starts timing-out from the set time processor period as soon as RST and RST are inactive. If a high- to-low transition occurs on the ST input pin prior to ST I/O time-out, the watchdog timer is reset and begins to TD TOL GND time-out again. If the watchdog timer is allowed to time- out, then the RST and RST signals are driven to the active state for 250msec minimum (Figure3-2). FIGURE 3-2: Watchdog Timer. The software routine that strobes ST is critical. The code must be in a section of software that is executed frequently enough so the time between toggles is less than the watchdog time-out period. One common technique controls the µP I/O line from two sections of the program. The software might set the I/O line high while operating in the foreground mode and set it low while in the background or interrupt mode. If both modes do not execute correctly, the watchdog timer issues reset pulses.  2003 Microchip Technology Inc. DS21370B-page 5

TC1232 t PB t F PB RST tPBD VIH VCC V IL t RST +4.75V RST +4.25V RST The debounced PB RST input ignores input pulses less than 1msec and is designed to recognize pulses of 20msec or greater. FIGURE 3-5: Power-Down Slew Rate. FIGURE 3-3: Push-Button Reset – PB RST Input. ST tST tR +4.75V t +4.25V TD Note: t is the maximum elapsed time between ST high- TD to-low transitions (ST is activated by falling edges V CC only) which will keep the watchdog timer from forcing the reset outputs active for a time of t . I is a RST TD function of the voltage at the TD pin, as tabulated FIGURE 3-6: Power-up Slew Rate. below: Condition Min ITD Typ Max TD pin = 0V 62.5ms 150ms 250ms TD pin = Open 250ms 600ms 1000ms TD pin = VCC 500ms 1200ms 2000ms FIGURE 3-4: Strobe Input. DS21370B-page 6  2003 Microchip Technology Inc.

TC1232 V = 5V CC +4.5V (5% Trip Point) 4.6V (5% Trip Point) +4.25V (10% Trip Point) 4.5V(10% Trip Point) V CC tRPD RST tRPU RST V OH V OH RST VOL RST VOL V SLEW RATE = 1.66mV/µsec (0.5V/300µsec) CC FIGURE 3-7: Vcc Detect Reset Output FIGURE 3-8: Vcc Detect Reset Output Delay (Power-Down). Delay (Power-Up).  2003 Microchip Technology Inc. DS21370B-page 7

TC1232 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead PDIP (300 mil) Example: XXXXXXXX TC1232 XXXXXNNN I/P256 YYWW 0351 8-Lead SOIC (150 mil) Example: XXXXXXXX TC1232 XXXXYYWW COA0351 NNN 256 16-Lead SOIC (150 mil) Example: XXXXXXXXXXXXX TC1232COE XXXXXXXXXXXXX XXXXXXXXXX YYWWNNN 0351256 Legend: XX...X Customer specific information* YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. DS21370B-page 8  2003 Microchip Technology Inc.

TC1232 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 L c A1 β B1 p eB B Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .100 2.54 Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top α 5 10 15 5 10 15 Mold Draft Angle Bottom β 5 10 15 5 10 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018  2003 Microchip Technology Inc. DS21370B-page 9

TC1232 8-Lead Plastic Small Outline (OA) –Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h α 45° c A A2 φ β L A1 Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch p .050 1.27 Overall Height A .053 .061 .069 1.35 1.55 1.75 Molded Package Thickness A2 .052 .056 .061 1.32 1.42 1.55 Standoff § A1 .004 .007 .010 0.10 0.18 0.25 Overall Width E .228 .237 .244 5.79 6.02 6.20 Molded Package Width E1 .146 .154 .157 3.71 3.91 3.99 Overall Length D .189 .193 .197 4.80 4.90 5.00 Chamfer Distance h .010 .015 .020 0.25 0.38 0.51 Foot Length L .019 .025 .030 0.48 0.62 0.76 Foot Angle φ 0 4 8 0 4 8 Lead Thickness c .008 .009 .010 0.20 0.23 0.25 Lead Width B .013 .017 .020 0.33 0.42 0.51 Mold Draft Angle Top α 0 12 15 0 12 15 Mold Draft Angle Bottom β 0 12 15 0 12 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS21370B-page 10  2003 Microchip Technology Inc.

TC1232 16-Lead Plastic Small Outline (OE) – Wide, 300 mil (SOIC) E p E1 D 2 n 1 B h α 45° c A A2 φ β L A1 Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 16 16 Pitch p .050 1.27 Overall Height A .093 .099 .104 2.36 2.50 2.64 Molded Package Thickness A2 .088 .091 .094 2.24 2.31 2.39 Standoff § A1 .004 .008 .012 0.10 0.20 0.30 Overall Width E .394 .407 .420 10.01 10.34 10.67 Molded Package Width E1 .291 .295 .299 7.39 7.49 7.59 Overall Length D .398 .406 .413 10.10 10.30 10.49 Chamfer Distance h .010 .020 .029 0.25 0.50 0.74 Foot Length L .016 .033 .050 0.41 0.84 1.27 Foot Angle φ 0 4 8 0 4 8 Lead Thickness c .009 .011 .013 0.23 0.28 0.33 Lead Width B .014 .017 .020 0.36 0.42 0.51 Mold Draft Angle Top α 0 12 15 0 12 15 Mold Draft Angle Bottom β 0 12 15 0 12 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-102  2003 Microchip Technology Inc. DS21370B-page 11

TC1232 NOTES: DS21370B-page 12  2003 Microchip Technology Inc.

TC1232 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Examples: Device Temperature Package a) TC1232COA: 0°C to +70°C, 8L-SOIC Range b) TC1232COA713: 0°C to +70°C, 8L-SOIC, Tape and Reel c) TC1232COE: 0°C to +70°C, 16L-SOIC Device: TC1232: Microprocessor Monitor d) TC1232COE713:0°C to +70°C, 16L-SOIC, Tape and Reel e) TC1232CPA: 0°C to +70°C, 8L-PDIP Temperature Range: C = 0°C to +70°C f) TC1232EOA: -40°C to +85°C, 8L-SOIC E = -40°C to +85°C g) TC1232EOA713: -40°C to +85°C, 8L-SOIC, Tape and Reel Package: PA = Plastic DIP (300 mil Body), 8-lead h) TC1232EOE: -40°C to +85°C, 16L-SOIC OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead i) TC1232EOE713: -40°C to +85°C, 16L-SOIC, Tape and Reel Tape and Reel OE = Plastic SOIC (300 mil Body), 16-lead j) TC1232EPA: -40°C to +85°C, 8L-PDIP OE713 = Plastic SOIC (300 mil Body), 16-lead Tape and Reel Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2003 Microchip Technology Inc. DS21370B-page13

TC1232 NOTES: DS21370B-page 14  2003 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to The Microchip name and logo, the Microchip logo, KEELOQ, ensure that your application meets with your specifications. No MPLAB, PIC, PICmicro, PICSTART, PRO MATE and representation or warranty is given and no liability is assumed PowerSmart are registered trademarks of Microchip Technology by Microchip Technology Incorporated with respect to the Incorporated in the U.S.A. and other countries. accuracy or use of such information, or infringement of patents FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL or other intellectual property rights arising from such use or and The Embedded Control Solutions Company are registered otherwise. Use of Microchip’s products as critical components in trademarks of Microchip Technology Incorporated in the U.S.A. life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, Accuron, Application Maestro, dsPIC, dsPICDEM, implicitly or otherwise, under any intellectual property rights. dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2003 Microchip Technology Inc. DS21370B - page 15

M WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Japan Corporate Office Australia Microchip Technology Japan K.K. Benex S-1 6F 2355 West Chandler Blvd. Microchip Technology Australia Pty Ltd 3-18-20, Shinyokohama Chandler, AZ 85224-6199 Marketing Support Division Kohoku-Ku, Yokohama-shi Tel: 480-792-7200 Fax: 480-792-7277 Suite 22, 41 Rawson Street Kanagawa, 222-0033, Japan Technical Support: 480-792-7627 Epping 2121, NSW Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Web Address: http://www.microchip.com Australia Korea Atlanta Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Microchip Technology Korea 3780 Mansell Road, Suite 130 168-1, Youngbo Bldg. 3 Floor Alpharetta, GA 30022 Microchip Technology Consulting (Shanghai) Samsung-Dong, Kangnam-Ku Tel: 770-640-0034 Fax: 770-640-0307 Co., Ltd., Beijing Liaison Office Seoul, Korea 135-882 Unit 915 Boston Tel: 82-2-554-7200 Fax: 82-2-558-5934 Bei Hai Wan Tai Bldg. 2 Lan Drive, Suite 120 No. 6 Chaoyangmen Beidajie Singapore Westford, MA 01886 Beijing, 100027, No. China Microchip Technology Singapore Pte Ltd. Tel: 978-692-3848 Fax: 978-692-3821 Tel: 86-10-85282100 Fax: 86-10-85282104 200 Middle Road Chicago China - Chengdu #07-02 Prime Centre Singapore, 188980 333 Pierce Road, Suite 180 Microchip Technology Consulting (Shanghai) Tel: 65-6334-8870 Fax: 65-6334-8850 Itasca, IL 60143 Co., Ltd., Chengdu Liaison Office Tel: 630-285-0071 Fax: 630-285-0075 Rm. 2401-2402, 24th Floor, Taiwan Microchip Technology (Barbados) Inc., Dallas Ming Xing Financial Tower No. 88 TIDU Street Taiwan Branch 4570 Westgrove Drive, Suite 160 Chengdu 610016, China 11F-3, No. 207 Addison, TX 75001 Tung Hua North Road Tel: 972-818-7423 Fax: 972-818-2924 Tel: 86-28-86766200 Fax: 86-28-86766599 Taipei, 105, Taiwan China - Fuzhou Detroit Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Microchip Technology Consulting (Shanghai) Tri-Atria Office Building Co., Ltd., Fuzhou Liaison Office EUROPE 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Unit 28F, World Trade Plaza Austria No. 71 Wusi Road Tel: 248-538-2250 Fax: 248-538-2260 Fuzhou 350001, China Microchip Technology Austria GmbH Kokomo Tel: 86-591-7503506 Fax: 86-591-7503521 Durisolstrasse 2 A-4600 Wels 2767 S. Albright Road China - Hong Kong SAR Kokomo, Indiana 46902 Austria Microchip Technology Hongkong Ltd. Tel: 43-7242-2244-399 Tel: 765-864-8360 Fax: 765-864-8387 Unit 901-6, Tower 2, Metroplaza Fax: 43-7242-2244-393 Los Angeles 223 Hing Fong Road Denmark 18201 Von Karman, Suite 1090 Kwai Fong, N.T., Hong Kong Microchip Technology Nordic ApS Irvine, CA 92612 Tel: 852-2401-1200 Fax: 852-2401-3431 Regus Business Centre Tel: 949-263-1888 Fax: 949-263-1338 China - Shanghai Lautrup hoj 1-3 Phoenix Microchip Technology Consulting (Shanghai) Ballerup DK-2750 Denmark 2355 West Chandler Blvd. Co., Ltd. Tel: 45 4420 9895 Fax: 45 4420 9910 Chandler, AZ 85224-6199 Room 701, Bldg. B France Far East International Plaza Tel: 480-792-7966 Fax: 480-792-4338 Microchip Technology SARL No. 317 Xian Xia Road Parc d’Activite du Moulin de Massy San Jose Shanghai, 200051 43 Rue du Saule Trapu Microchip Technology Inc. Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Batiment A - ler Etage 2107 North First Street, Suite 590 China - Shenzhen 91300 Massy, France San Jose, CA 95131 Microchip Technology Consulting (Shanghai) Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Tel: 408-436-7950 Fax: 408-436-7955 Co., Ltd., Shenzhen Liaison Office Germany Toronto Rm. 1812, 18/F, Building A, United Plaza Microchip Technology GmbH 6285 Northam Drive, Suite 108 No. 5022 Binhe Road, Futian District Steinheilstrasse 10 Mississauga, Ontario L4V 1X5, Canada Shenzhen 518033, China D-85737 Ismaning, Germany Tel: 905-673-0699 Fax: 905-673-6509 Tel: 86-755-82901380 Fax: 86-755-82966626 Tel: 49-89-627-144-0 China - Qingdao Fax: 49-89-627-144-44 Rm. B505A, Fullhope Plaza, Italy No. 12 Hong Kong Central Rd. Microchip Technology SRL Qingdao 266071, China Via Quasimodo, 12 Tel: 86-532-5027355 Fax: 86-532-5027205 20025 Legnano (MI) India Milan, Italy Microchip Technology Inc. Tel: 39-0331-742611 Fax: 39-0331-466781 India Liaison Office United Kingdom Marketing Support Division Microchip Ltd. Divyasree Chambers 505 Eskdale Road 1 Floor, Wing A (A3/A4) Winnersh Triangle No. 11, O’Shaugnessey Road Wokingham Bangalore, 560 025, India Berkshire, England RG41 5TU Tel: 91-80-2290061 Fax: 91-80-2290062 Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/25/03 DS21370B-page 16  2003 Microchip Technology Inc.

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrochip: TC1232COA713 TC1232EOA713 TC1232CPA TC1232COA TC1232COE TC1232EOE TC1232EOA TC1232EOE713 TC1232EPA TC1232COE713