ICGOO在线商城 > 集成电路(IC) > PMIC - 监控器 > TC1232CPA
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TC1232CPA产品简介:
ICGOO电子元器件商城为您提供TC1232CPA由Microchip设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 TC1232CPA价格参考¥3.48-¥4.35。MicrochipTC1232CPA封装/规格:PMIC - 监控器, 开路漏极或开路集电极 监控器 1 通道 8-PDIP。您可以下载TC1232CPA参考资料、Datasheet数据手册功能说明书,资料中有TC1232CPA 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC MPU MONITOR 4.5V 8-DIP监控电路 Microprocessor Montr |
产品分类 | |
品牌 | Microchip Technology |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 电源管理 IC,监控电路,Microchip Technology TC1232CPA- |
NumberofInputsMonitored | 1 Input |
数据手册 | http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en011667 |
产品型号 | TC1232CPA |
PCN组件/产地 | http://www.microchip.com/mymicrochip/NotificationDetails.aspx?id=5776&print=view |
PCN设计/规格 | http://www.microchip.com/mymicrochip/NotificationDetails.aspx?id=5805&print=view |
产品目录页面 | |
产品种类 | 监控电路 |
人工复位 | Manual Reset |
供应商器件封装 | 8-PDIP |
其它名称 | 158-1042 |
功率失效检测 | Yes |
包装 | 管件 |
受监控电压数 | 1 |
商标 | Microchip Technology |
复位 | 高有效/低有效 |
复位超时 | 最小为 250 ms |
安装类型 | 通孔 |
安装风格 | Through Hole |
封装 | Tube |
封装/外壳 | 8-DIP(0.300",7.62mm) |
封装/箱体 | PDIP-8 |
工作温度 | 0°C ~ 70°C |
工作电源电流 | 200 uA |
工厂包装数量 | 60 |
最大工作温度 | + 70 C |
最小工作温度 | 0 C |
标准包装 | 60 |
欠电压阈值 | 4.5 V, 4.25 V |
电压-阈值 | 4.37V,4.62V |
电池备用开关 | No Backup |
电源电压-最大 | 5.5 V |
电源电压-最小 | 4 V |
监视器 | Watchdog |
类型 | 简单复位/加电复位 |
芯片启用信号 | No Chip Enable |
被监测输入数 | 1 Input |
输出 | 开路漏极或开路集电极 |
输出类型 | Active High, Active Low, Open Drain, Push-Pull |
过电压阈值 | 4.74 V, 4.49 V |
重置延迟时间 | 1000 ms |
阈值电压 | 4.5 V to 4.75 V |
TC1232 Microprocessor Monitor Features: General Description: • Precision Voltage Monitor: The TC1232 is a fully-integrated processor supervisor - Adjustable +4.5V or +4.75V that provides three important functions to safeguard processor sanity: precision power on/off Reset control, • Reset Pulse Width – 250ms minimum Watchdog Timer and external Reset override. • No External Components On power-up, the TC1232 holds the processor in the • Adjustable Watchdog Timer: Reset state for a minimum of 250ms after V is within - 150ms, 600ms or 1.2s CC tolerance to ensure a stable system start-up. • Operating Voltage 4.0V to 5.5V Microprocessor sanity is monitored by the on-board • Debounced Manual Reset Input for External watchdog circuit. The microprocessor must provide a Override periodic low-going signal on the ST input. Should the processor fail to supply this signal within the selected Block Diagram time-out period (150ms, 600ms or 1200ms), an out- of-control processor is indicated and the TC1232 VCC issues a processor Reset as a result. Tolerance RST Select The outputs of the TC1232 are immediately driven TOL (5% or 10%) + RST active when the PB input is brought low by an external + – push button switch or other electronic signal. When VR+EF connected to a push button switch, the TC1232 – provides contact debounce. The TC1232 is packaged in a space-saving 8-Pin PDIP Reset PB RST Debounce Generator or SOIC package, a 16-Pin SOIC (wide) package and requires no external components. Watchdog TD Timebase Watchdog Select Timer ST Package Types 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC (Wide) PB RST 1 8 VCC PB RST 11 88 VCC NC 1 16 NC PB RST 2 15 VCC TD 2 7 ST TD 2 7 ST TC1232 TOL 33 TTCC11223322 66 RST NC 3 14 NC TOL 3 6 RST TD 4 13 ST GND 4 5 RST GND 44 55 RST NC 5 TC1232 12 NC TOL 6 11 RST NC 7 10 NC GND 8 9 RST Device Features RST pin RST pin Minimum WDI Input Trip Points Reset MR Device Typical Pull-up Active Active (Max) Active Time Input Type Type Timeouts (ms) Resistor Level Level (ms) TC1232 Open-drain External Low Push-pull High 4.75V 250 150, 600 or Yes or 4.5V 1200 2002-2014 Microchip Technology Inc. DS20001370E-page 1
TC1232 1.0 ELECTRICAL † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These CHARACTERISTICS are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the Absolute Maximum Ratings† operation sections of the specifications is not implied. Voltage on Any Pin (With Respect to GND) Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. ......................................................-0.3V to +5.8V Operating Temperature Range: C-Version........................................0°C to +70°C E-Version......................................-40°C to +85°C Storage Temperature Range: ............-65°C to +150°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, T = T to T ; V = +4.0V to 5.5V. A MIN MAX CC Parameters Sym. Min. Typ. Max. Units Conditions Supply Voltage V 4.0 5.0 5.5 V CC ST and PB RST Input High Level V 2.0 — V +0.3 V Note1 IH CC ST and PB RST Input Low Level V -0.3 — +0.8 V IL Input Leakage ST, TOL I -1.0 — +1.0 µA L Output Current RST I -1.0 -12 — mA V = 2.4V OH OH Current RST, RST I 2.0 10 — mA V = 0.4V OL OL Operating Current I — 50 200 µA Note2 CC V 5% Trip Point V 4.50 4.62 4.74 V TOL = GND (Note3) CC CCTP V 10% Trip Point V 4.25 4.37 4.49 V TOL = V (Note3) CC CCTP CC Capacitance Electrical Characteristics: Unless otherwise noted, T = +25°C. (Note4) A Input Capacitance ST, TOL C — — 5 pF IN Output Capacitance RST, RST C — — 7 pF OUT Note 1: PB RST is internally pulled up to V with an internal impedance of typically 40k. CC 2: Measured with outputs open. 3: All voltages referenced to GND. 4: Ensured by design. DS20001370E-page 2 2002-2014 Microchip Technology Inc.
TC1232 V tF tR CC +4.75V +4.75V +4.25V +4.25V V CC V = 5V CC 4.6V (5% Trip Point) +4.5V (5% Trip Point) +4.25V (10% Trip Point) 4.5V(10% Trip Point) V CC tRPD tRPU RST RST Determined by VOH VOH Determined by external Pull-up external Pull-up RST resistor VOL RST VOL resistor FIGURE 1-1: Rise Time, Fall Time and Reset Detected to Reset Active Timing Waveforms. AC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, T = T to T ; V = +4.0V to 5.5V. A MIN MAX CC Parameters Sym. Min. Typ. Max. Units Conditions V Fall Time t 10 — — µs Note1 CC F V Rise Time t 0 — — µs Note1 CC R V Trip Point Detected t — — 100 ns V falling CC RPD CC to RST High and RST Low V Trip Point Detected t 250 610 1000 ms V rising (Note2) CC RPU CC to RST High and RST Open Note 1: Ensured by design. 2: t = 5µs. R 2002-2014 Microchip Technology Inc. DS20001370E-page 3
TC1232 t tPB ST TD t ST PB RST tPBD V IH RST (when t t (min)) “H” TD TD V IL t RST RST RST (when tTD(min) tTD tTD(max)) RST RST (when t t (max)) TD TD The debounced PB RST input ignores input pulses less than 1ms and is designed to recognize pulses of RST (when t t (min)) “L” TD TD 20ms or greater. RST (when t (min) t t (max)) TD TD TD RST (when t t (max)) TD TD FIGURE 1-2: Push Button Reset and Watchdog Timer Reset Timing Waveforms. AC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, T = T to T ; V = +4.0V to 5.5V. A MIN MAX CC Parameters Sym. Min. Typ. Max. Units Conditions PB RST Pulse Width t 20 — — ms Note1 PB PB RST Falling Edge Low to t 1 4 20 ms PBD Reset Active PB RST Rising Edge High to t 250 610 1000 ms RST Reset Inactive ST Pulse Width t 20 — — ns ST ST Time-out Period t 62.5 150 250 ms TD Pin = 0V TD 250 600 1000 ms TD Pin = Open 500 1200 2000 ms TD Pin = V CC Note 1: PB RST must be held low for a minimum of 20 ms to ensure a Reset. DS20001370E-page 4 2002-2014 Microchip Technology Inc.
TC1232 2.0 TYPICAL PERFORMANCE CURVES Performance Graphs are not available. 2002-2014 Microchip Technology Inc. DS20001370E-page 5
TC1232 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table3-1. TABLE 3-1: PIN FUNCTION TABLES Pin No. Buffer/ Pin 8-pin Symbol Driver Function 16-pin Type PDIP, Type SOIC SOIC 1 2 PB RST I ST Push Button Reset Input. Input for a Manual Reset Switch. This input debounces (ignores) pulses less than 1ms in duration and is ensured to recognize inputs of 20ms or greater. L = Manual Reset Switch is Active, Force RST/RST pins Active H = Manual Reset Switch is Inactive. State of RST/RST pins determined by other system conditions. 2 4 TD I ST Time Delay Input. The voltage level on this input determines the Watchdog Timer Time-out period. TD = 0V t = 150ms TD TD = Open t = 600ms TD TD = V t = 1.2s CC TD 3 6 TOL I ST Tolerance Input. TOL = GND, Max Voltage Trip Point (V ) = 4.75V (5% tolerance) CCTP TOL = V , Max Voltage Trip Point (V ) = 4.5V (10% tolerance) CC CCTP 4 8 GND — P The ground reference for the device. 5 9 RST O Push Reset Output (Active-High) Pull Goes active (High) if one of these conditions occurs: 1. If V falls below the selected Reset voltage threshold. CC 2. If PB RST pin is forced low. 3. If ST pin is not strobed within the minimum selected time-out period. (see TD pin) 4. During power-up. 6 11 RST O Open Reset Output (Active-Low) Drain Goes active (Low) if one of these conditions occurs: 1. If V falls below the selected Reset voltage threshold. CC 2. If PB RST pin is forced low. 3. If ST pin is not strobed within the minimum selected time-out period. (see TD pin) 4. During power-up. 7 13 ST I ST Strobe Input Input for Watchdog Timer. WDT period determined by state of TD pin Falling Edge Resets Watchdog Timer counter (no time-out) 8 15 V — P The positive supply (+5V) for the device. CC — 1,3,5, NC — — No internal connection. 7,10,1 2,16 DS20001370E-page 6 2002-2014 Microchip Technology Inc.
TC1232 4.0 OPERATIONAL DESCRIPTION V = 5V CC 4.1 Power Monitor +4.5V (5% Trip Point) The TC1232 provides the function of warning the processor of a power failure. When VCC is detected as +4.25V (10% Trip Point) being below the voltage levels defined by the TOL pin, the TC1232’s comparator outputs the RST and RST signals to a logic level that warns the system of an out- of-tolerance power supply. The RST and RST signals switch at a threshold value of 4.5V if TOL is tied to V , CC t and at a value of 4.75V if TOL is grounded. The RST RPD and RST signals are held active for a minimum of RST 250ms to ensure that the power supply voltage has V OH been stabilized. Figure4-1 shows the V fall time. RST VOL CC Figure4-2 shows the VCC rise time. VCC SLEW RATE = 1.66mV/µs (0.5V/300µs) Figure4-3 shows the time from when the voltage trip FIGURE 4-3: V Detect Reset Output point is detected to the Reset output pin going active. CC Delay (Power-Down). Figure4-4 shows the time from when the voltage trip point is exited to the Reset output pin going inactive. 4.6V (5% Trip Point) t VCC F 4.5V(10% Trip Point) +4.75V V CC +4.25V t RPU RST V OH FIGURE 4-1: Power-Down Slew Rate. RST VOL FIGURE 4-4: V Detect Reset Output CC t R Delay (Power-Up). +4.75V +4.25V V CC FIGURE 4-2: Power-up Slew Rate. 2002-2014 Microchip Technology Inc. DS20001370E-page 7
TC1232 4.2 Push Button Reset Input +5V The debounced manual Reset input (PB RST) manu- ally forces the Reset outputs into their active states. Figure4-5 shows a block diagram for using the TC1232 with a push button switch. VCC TD Once PB RST has been low for a time t (the push PBD PB RST ST I/O button delay time), the Reset outputs go active. The Reset outputs remain in their active states for a TC1232 Microprocessor minimum of 250ms after PB RST rises above V . IH RST Reset Figure4-6 shows a waveform for the push button switch input and the Reset pins output. A mechanical push button or active logic signal can drive the PB RST input. The debounced input ignores GND TOL input pulses less than 1ms and recognizes pulses of 20ms or greater. No external pull-up resistor is required because the PB RST input has an internal pull-up toV ofapproximately 100µA. CC FIGURE 4-5: Push Button Reset and Watchdog Timer. t PB PB RST tPBD V IH V IL t RST RST RST The debounced PB RST input ignores input pulses less than 1ms and is designed to recognize pulses of 20ms or greater. FIGURE 4-6: Push Button Reset – PB RST Input. DS20001370E-page 8 2002-2014 Microchip Technology Inc.
TC1232 4.3 Watchdog Timer Figure4-8 shows the expected Reset output pin wave- forms depending on the period of the ST pin falling When the ST input is not stimulated for a preset time edge and the state of the TD input pin. period, the Watchdog Timer function forces RST and RST signals to the active state. The preset time period is determined by the TD inputs to be 150ms with TD t TD connected to ground, 600ms with TD floating or ST t ST 1200ms with TD connected to V (typ.). The CC Watchdog Timer starts timing-out from the set time period as soon as RST and RST are inactive. If a high- to-low transition occurs on the ST input pin prior to RST (when t t (min)) “H” time-out, the Watchdog Timer is reset and begins to TD TD time-out again. If the Watchdog Timer is allowed to time-out, the RST and RST signals are driven to the RST (when t (min) t t (max)) active state for 250ms, minimum (Figure4-7). TD TD TD The software routine that strobes ST is critical. The RST code must be in a section of software that is executed (when t t (max)) TD TD frequently enough so the time between toggles is less than the Watchdog Time-out period. One common RST (when t t (min)) “L” technique controls the microprocessor I/O line from two TD TD sections of the program. The software might set the I/O RST line high while operating in the Foreground mode and (when t (min) t t (max)) set it low while in the Background or Interrupt modes. If TD TD TD both modes do not execute correctly, the Watchdog RST Timer issues Reset pulses. (when t t (max)) TD TD t is the maximum elapsed time between ST high-to- TD FIGURE 4-8: Strobe Input. low transitions (ST is activated by falling edges only), which will keep the Watchdog Timer from forcing the 4.4 Supply Monitor Noise Sensitivity Reset outputs active for a time of t . t is a function RST TD of the voltage at the TD pin, as tabulated below: The TC1232 is optimized for fast response to negative- going changes in V . Systems with an inordinate DD TABLE 4-1: WATCHDOG TIMER amount of electrical noise on V (such as systems DD PERIODS using relays) may require a 0.01µF or 0.1µF bypass capacitor to reduce detection sensitivity. This capacitor t TD should be installed as close to the TC1232 as possible Condition Min. Typ. Max. to keep the capacitor lead length short. TD pin = 0V 62.5ms 150ms 250ms TD pin = Open 250ms 600ms 1000ms TD pin = V 500ms 1200ms 2000ms CC Figure4-7 shows a block diagram for using the TC1232 with a PIC® MCU and the Watchdog input. +5V 10k 3-Terminal +5V Regulator VCC RST RESET (example: 0.1 MCP1700) µF TC1232 PIC® MCU ST I/O TD TOL GND FIGURE 4-7: Watchdog Timer. 2002-2014 Microchip Technology Inc. DS20001370E-page 9
TC1232 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) Examples: XXXXXXXX TC1232 TC1232 XXXXXNNN I/P256 OR CPA^e^3256 YYWW 0518 0518 8-Lead SOIC (150 mil) Examples: XXXXXXXX TC1232 TC1232E XXXXYYWW COA0518 OA^e^30518 OR NNN 256 256 16-Lead SOIC (150 mil) Examples: XXXXXXXXXXXXX TC1232COE TC1232COE^e^3 XXXXXXXXXXXXX XXXXXXXXXX XXXXXXXXXX OR YYWWNNN 0518256 0518256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS20001370E-page 10 2002-2014 Microchip Technology Inc.
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(cid:20) (cid:29)(cid:4)(cid:4)= (cid:29)(cid:4)(cid:30)(cid:4) (cid:29)(cid:4)(cid:30)1 7(cid:10)(cid:10)(cid:13)(cid:21)(cid:14):(cid:13)(cid:11)#(cid:14)?(cid:19)#&(cid:23) )(cid:30) (cid:29)(cid:4)(cid:5)(cid:4) (cid:29)(cid:4)(cid:15)(cid:4) (cid:29)(cid:4)(cid:17)(cid:4) :(cid:22)*(cid:13)(cid:21)(cid:14):(cid:13)(cid:11)#(cid:14)?(cid:19)#&(cid:23) ) (cid:29)(cid:4)(cid:30)(cid:5) (cid:29)(cid:4)(cid:30)= (cid:29)(cid:4)(cid:16)(cid:16) ; (cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)(cid:8)(cid:22)*(cid:14)(cid:3)(cid:10)(cid:11)(cid:20)(cid:19)(cid:25)(cid:12)(cid:14)(cid:14)+ (cid:13)2 > > (cid:29)(cid:5)-(cid:4) (cid:31)(cid:27)(cid:12)(cid:5)(cid:11) (cid:30)(cid:29) (cid:31)(cid:19)(cid:25)(cid:14)(cid:30)(cid:14) (cid:19)!"(cid:11)(cid:26)(cid:14)(cid:19)(cid:25)#(cid:13)$(cid:14)%(cid:13)(cid:11)&"(cid:21)(cid:13)(cid:14)’(cid:11)(cid:27)(cid:14) (cid:11)(cid:21)(cid:27)((cid:14))"&(cid:14)’"!&(cid:14))(cid:13)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)*(cid:19)&(cid:23)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:23)(cid:11)&(cid:20)(cid:23)(cid:13)#(cid:14)(cid:11)(cid:21)(cid:13)(cid:11)(cid:29) (cid:16)(cid:29) +(cid:14)(cid:3)(cid:19)(cid:12)(cid:25)(cid:19)%(cid:19)(cid:20)(cid:11)(cid:25)&(cid:14),(cid:23)(cid:11)(cid:21)(cid:11)(cid:20)&(cid:13)(cid:21)(cid:19)!&(cid:19)(cid:20)(cid:29) -(cid:29) (cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)!(cid:14)(cid:2)(cid:14)(cid:11)(cid:25)#(cid:14).(cid:30)(cid:14)#(cid:22)(cid:14)(cid:25)(cid:22)&(cid:14)(cid:19)(cid:25)(cid:20)(cid:26)"#(cid:13)(cid:14)’(cid:22)(cid:26)#(cid:14)%(cid:26)(cid:11)!(cid:23)(cid:14)(cid:22)(cid:21)(cid:14)(cid:10)(cid:21)(cid:22)&(cid:21)"!(cid:19)(cid:22)(cid:25)!(cid:29)(cid:14)(cid:18)(cid:22)(cid:26)#(cid:14)%(cid:26)(cid:11)!(cid:23)(cid:14)(cid:22)(cid:21)(cid:14)(cid:10)(cid:21)(cid:22)&(cid:21)"!(cid:19)(cid:22)(cid:25)!(cid:14)!(cid:23)(cid:11)(cid:26)(cid:26)(cid:14)(cid:25)(cid:22)&(cid:14)(cid:13)$(cid:20)(cid:13)(cid:13)#(cid:14)(cid:29)(cid:4)(cid:30)(cid:4)/(cid:14)(cid:10)(cid:13)(cid:21)(cid:14)!(cid:19)#(cid:13)(cid:29) (cid:5)(cid:29) (cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)(cid:19)(cid:25)(cid:12)(cid:14)(cid:11)(cid:25)#(cid:14)&(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:19)(cid:25)(cid:12)(cid:14)(cid:10)(cid:13)(cid:21)(cid:14)(cid:7)(cid:3)(cid:18).(cid:14)0(cid:30)(cid:5)(cid:29)1(cid:18)(cid:29) 2(cid:3),3(cid:14)2(cid:11)!(cid:19)(cid:20)(cid:14)(cid:2)(cid:19)’(cid:13)(cid:25)!(cid:19)(cid:22)(cid:25)(cid:29)(cid:14)(cid:24)(cid:23)(cid:13)(cid:22)(cid:21)(cid:13)&(cid:19)(cid:20)(cid:11)(cid:26)(cid:26)(cid:27)(cid:14)(cid:13)$(cid:11)(cid:20)&(cid:14) (cid:11)(cid:26)"(cid:13)(cid:14)!(cid:23)(cid:22)*(cid:25)(cid:14)*(cid:19)&(cid:23)(cid:22)"&(cid:14)&(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:13)!(cid:29) (cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:24)(cid:13)(cid:20)(cid:23)(cid:25)(cid:22)(cid:26)(cid:22)(cid:12)(cid:27)(cid:2)(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12),(cid:4)(cid:5)(cid:9)(cid:4)(cid:30)=2 2002-2014 Microchip Technology Inc. DS20001370E-page 11
TC1232 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001370E-page 12 2002-2014 Microchip Technology Inc.
TC1232 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2002-2014 Microchip Technology Inc. DS20001370E-page 13
TC1232 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)!(cid:25)(cid:6)(cid:10)(cid:10)(cid:8)"(cid:16)(cid:12)(cid:10)(cid:13)(cid:18)(cid:5)(cid:8)(cid:19)"(cid:20)(cid:21)(cid:8)(cid:22)(cid:8)(cid:31)(cid:6)##(cid:27)$%(cid:8)(cid:23)&’(cid:24)(cid:8)(cid:25)(cid:25)(cid:8)(cid:26)(cid:27)(cid:7)(cid:28)(cid:8)(cid:29)!"(cid:17)((cid:30) (cid:31)(cid:27)(cid:12)(cid:5) 4(cid:22)(cid:21)(cid:14)&(cid:23)(cid:13)(cid:14)’(cid:22)!&(cid:14)(cid:20)"(cid:21)(cid:21)(cid:13)(cid:25)&(cid:14)(cid:10)(cid:11)(cid:20)5(cid:11)(cid:12)(cid:13)(cid:14)#(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)!((cid:14)(cid:10)(cid:26)(cid:13)(cid:11)!(cid:13)(cid:14)!(cid:13)(cid:13)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)(cid:31)(cid:11)(cid:20)5(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)(cid:11)&(cid:14) (cid:23)&&(cid:10)366***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)’6(cid:10)(cid:11)(cid:20)5(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) DS20001370E-page 14 2002-2014 Microchip Technology Inc.
TC1232 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2002-2014 Microchip Technology Inc. DS20001370E-page 15
TC1232 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001370E-page 16 2002-2014 Microchip Technology Inc.
TC1232 )*(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)!(cid:25)(cid:6)(cid:10)(cid:10)(cid:8)"(cid:16)(cid:12)(cid:10)(cid:13)(cid:18)(cid:5)(cid:8)(cid:19)"+(cid:21)(cid:8)(cid:22)(cid:8),(cid:13)(cid:7)(cid:5)%(cid:8)-&.(cid:24)(cid:8)(cid:25)(cid:25)(cid:8)(cid:26)(cid:27)(cid:7)(cid:28)(cid:8)(cid:29)!"(cid:17)((cid:30)(cid:8)(cid:4)(cid:6)(cid:18)(cid:7)(cid:8)(cid:9)(cid:6)(cid:12)(cid:12)(cid:5)#(cid:18)(cid:8)(cid:8) (cid:31)(cid:27)(cid:12)(cid:5) 4(cid:22)(cid:21)(cid:14)&(cid:23)(cid:13)(cid:14)’(cid:22)!&(cid:14)(cid:20)"(cid:21)(cid:21)(cid:13)(cid:25)&(cid:14)(cid:10)(cid:11)(cid:20)5(cid:11)(cid:12)(cid:13)(cid:14)#(cid:21)(cid:11)*(cid:19)(cid:25)(cid:12)!((cid:14)(cid:10)(cid:26)(cid:13)(cid:11)!(cid:13)(cid:14)!(cid:13)(cid:13)(cid:14)&(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)(cid:31)(cid:11)(cid:20)5(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)&(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)&(cid:13)#(cid:14)(cid:11)&(cid:14) (cid:23)&&(cid:10)366***(cid:29)’(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)’6(cid:10)(cid:11)(cid:20)5(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) 2002-2014 Microchip Technology Inc. DS20001370E-page 17
TC1232 NOTES: DS20001370E-page 18 2002-2014 Microchip Technology Inc.
TC1232 APPENDIX A: REVISION HISTORY Revision E (February 2014) • Removed the “Preliminary” watermark. Revision D (November 2012) • Added a note to the package outline drawing. Revision C (June 2005) The following is the list of modifications: 1. Since no data is given in Section2.0 “Typical Performance Curves”, “Preliminary” was added to the bottom of this document. 2. Corrected Operating Voltage in the Electrical Specifications. 3. General Data Sheet Enhancements. 4. Added Revision History Appendix Section. Revision B (March 2003) • Not logged Revision A (March 2002) • Original Release of this Document. 2002-2014 Microchip Technology Inc. DS20001370E-page 19
TC1232 NOTES: l DS20001370E-page 20 2002-2014 Microchip Technology Inc.
TC1232 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Examples: a)TC1232COA: 0°C to +70°C, 8L-SOIC Device Temperature Package b)TC1232COA713: 0°C to +70°C, 8L-SOIC, Range Tape and Reel c)TC1232COE: 0°C to +70°C, 16L-SOIC Device: TC1232: Microprocessor Monitor d)TC1232COE713: 0°C to +70°C, 16L-SOIC Tape and Reel e)TC1232CPA: 0°C to +70°C, 8L-PDIP Temperature Range: C = 0°C to +70°C f) TC1232EOA: -40°C to +85°C, E = -40°C to +85°C 8L-SOIC g)TC1232EOA713: -40°C to +85°C, Package: PA = Plastic DIP (300 mil Body), 8-lead 8L-SOIC, OA = Plastic SOIC, (150 mil Body), 8-lead Tape and Reel OA713 = Plastic SOIC, (150 mil Body), 8-lead Tape and Reel h)TC1232EOE: -40°C to +85°C, OE = Plastic SOIC (300 mil Body), 16-lead 16L-SOIC OE713 = Plastic SOIC (300 mil Body), 16-lead i) TC1232EOE713: -40°C to +85°C, Tape and Reel 16L-SOIC, Tape and Reel j) TC1232EPA: -40°C to +85°C, 8L-PDIP 2002-2014 Microchip Technology Inc. DS20001370E-page 21
TC1232 NOTES: DS20001370E-page 22 2002-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-944-6 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2002-2014 Microchip Technology Inc. DS20001370E-page 23
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