TC1108 300mA CMOS LDO Features General Description • ExtremelyLowSupplyCurrent(50µA,Typ.) TheTC1108isafixedoutput, highaccuracy(typically (cid:127) VeryLowDropoutVoltage ±0.5%) CMOS low dropout regulator. Total supply current is typically 50µA at full load (20 to 60 times (cid:127) 300mAOutputCurrent lowerthaninbipolarregulators). (cid:127) HighOutputVoltageAccuracy TC1108keyfeaturesincludeultralownoiseoperation, (cid:127) StandardorCustomOutputVoltages verylowdropoutvoltage(typically240mVatfullload), (cid:127) OverCurrentandOverTemperatureProtection andfastresponsetostepchangesinload. Applications The TC1108 incorporates both over temperature and over current protection. The TC1108 is stable with an (cid:127) BatteryOperatedSystems output capacitor of only 1µF and has a maximum (cid:127) PortableComputers output current of 300mA. It is available in a SOT-223 (cid:127) MedicalInstruments package. (cid:127) Instrumentation TypicalApplication (cid:127) Cellular/GSM/PHSPhones (cid:127) LinearPost-RegulatorsforSMPS 1 3 • Pagers VIN VIN VOUT VOUT + C1 Device Selection Table TC1108 1µF Junction PartNumber Package 2 Temp.Range GND TC1108-xxVDB 3-PinSOT-223 -40°Cto+125°C NOTE:xxindicatesoutputvoltages AvailableOutputVoltages:2.5,2.8,3.0,3.3,5.0. Otheroutputvoltagesareavailable.PleasecontactMicrochip TechnologyInc.fordetails. Package Type SOT-223 TC1108VDB 1 2 3 VIN GND VOUT  2002MicrochipTechnologyInc. DS21357B-page 1

TC1108 1.0 ELECTRICAL Stresses above those listed under "Absolute Maximum Ratings"maycausepermanentdamagetothedevice.These CHARACTERISTICS arestressratingsonlyandfunctionaloperationofthedevice Absolute Maximum Ratings* attheseoranyotherconditionsabovethoseindicatedinthe operation sections of the specifications is not implied. InputVoltage.........................................................6.5V Exposure to Absolute Maximum Rating conditions for extendedperiodsmayaffectdevicereliability. OutputVoltage..................(V –0.3V)to(V +0.3V) SS IN PowerDissipation................InternallyLimited(Note6) MaximumVoltageonAnyPin ........V +0.3Vto-0.3V IN OperatingTemperatureRange......-40°C<T <125°C J StorageTemperature..........................-65°Cto+150°C TC1108ELECTRICALSPECIFICATIONS ElectricalCharacteristics:V =V +1V,I =100µA,C =3.3µF,T =25°C,unlessotherwisenoted.Boldfacetype IN OUT L L A specificationsapplyforjunctiontemperaturesof-40°Cto+125°C. Symbol Parameter Min Typ Max Units TestConditions V InputOperatingVoltage 2.7 — 6.0 V Note7 IN I MaximumOutputCurrent 300 — — mA OUTMAX V OutputVoltage — V ±0.5% — V Note1 OUT R V –2.5% — V +2.5% R R ∆V /∆T V TemperatureCoefficient — 40 — ppm/°C Note2 OUT OUT ∆V /∆V LineRegulation — 0.05 0.35 % (V +1V)≤ V ≤ 6V OUT IN R IN ∆V /V LoadRegulation — 0.5 2.0 % I =0.1mAtoI (Note3) OUT OUT L OUTMAX V -V DropoutVoltage — 20 30 mV I =0.1mA IN OUT L — 80 160 I =100mA L — 240 480 I =300mA(Note4) L I SupplyCurrent — 50 90 µA DD PSRR PowerSupplyRejectionRatio — 60 — dB F ≤ 1kHz RE I OutputShortCircuitCurrent — 550 650 mA V =0V OUTSC OUT ∆V /∆P ThermalRegulation — 0.04 — V/W Note5 OUT D eN OutputNoise — 260 — nV/√Hz F=10kHz,C =1µF, OUT R =50Ω LOAD Note 1: VRistheregulatoroutputvoltagesetting. 2: TCVOUT=(VOUTMAX–VOUTMIN)x106 VOUTx∆T 3: Regulationismeasuredataconstantjunctiontemperatureusinglowdutycyclepulsetesting.Loadregulationistestedoveraloadrange from0.1mAtothemaximumspecifiedoutputcurrent.Changesinoutputvoltageduetoheatingeffectsarecoveredbythethermal regulationspecification. 4: Dropoutvoltageisdefinedastheinputtooutputdifferentialatwhichtheoutputvoltagedrops2%belowitsnominalvaluemeasuredata 1Vdifferential. 5: ThermalRegulationisdefinedasthechangeinoutputvoltageatatimeTafterachangeinpowerdissipationisapplied,excludingloador lineregulationeffects.SpecificationsareforacurrentpulseequaltoILMAXatVIN=6VforT=10msec. 6: Themaximumallowablepowerdissipationisafunctionofambienttemperature,themaximumallowablejunctiontemperatureandthe thermalresistancefromjunction-to-air(i.e.,T,T,θ ).Exceedingthemaximumallowablepowerdissipationcausesthedevicetoinitiate A J JA thermalshutdown.PleaseseeSection4.0ThermalConsiderationsformoredetails. 7: TheminimumVINhastojustifytheconditions:VIN≥VR+VDROPOUTandVIN≥2.7VforIL=0.1mAtoIOUTMAX.  DS21357B-page 2 2002MicrochipTechnologyInc.

TC1108 2.0 PIN DESCRIPTIONS ThedescriptionsofthepinsarelistedinTable2-1. TABLE2-1: PINFUNCTIONTABLE PinNo. Symbol Description (3-PinSOT-223) 1 V Unregulatedsupplyinput. IN 2 GND Groundterminal. 3 V Regulatedvoltageoutput. OUT 3.0 DETAILED DESCRIPTION 3.1 Output Capacitor The TC1108 is a precision, fixed output LDO. Unlike A1µF(min)capacitorfromVOUTtogroundisrequired. bipolar regulators, the TC1108’s supply current does The output capacitor should have an effective series not increase with load current. In addition, V resistancegreaterthan0.1Ωandlessthan5.0Ω.A1µF OUT remains stable and within regulation over the entire capacitorshouldbeconnectedfromVINtoGNDifthere 0mA to I operating load current range, (an is more than 10 inches of wire between the regulator OUTMAX important consideration in RTC and CMOS RAM andtheACfiltercapacitor,orifabatteryisusedasthe batteryback-upapplications). power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum Figure3-1showsatypicalapplicationcircuit. electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications FIGURE 3-1: TYPICALAPPLICATION operatingbelow-25°C.)Whenoperatingfromsources CIRCUIT other than batteries, supply-noise rejection and transientresponsecanbeimprovedbyincreasingthe 1 3 + VIN VOUT + VOUT valueoftheinputandoutputcapacitorsandemploying C1 C2 passivefilteringtechniques. + 1µF TC1108 1µF Battery 2 GND –  2002MicrochipTechnologyInc. DS21357B-page 3

TC1108 4.0 THERMAL CONSIDERATIONS Equation4-1canbeusedinconjunctionwithEquation 4-2 to ensure regulator thermal operation is within 4.1 ThermalShutdown limits.Forexample: Given: Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. VINMAX =3.3V+10% The regulator remains off until the die temperature V =2.7V–0.5% OUTMIN dropstoapproximately140°C. I =275mA LOADMAX 4.2 PowerDissipation TJMAX =125°C T =95°C The amount of power the regulator dissipates is AMAX θ =59°C/W primarily a function of input and output voltage, and JA output current. The following equation is used to Find: 1.Actualpowerdissipation calculateworstcaseactualpowerdissipation: 2.Maximumallowabledissipation Actualpowerdissipation: EQUATION4-1: P ≈(V –V )I P ≈(V –V )I D INMAX OUTMIN LOADMAX D INMAX OUTMIN LOADMAX =[(3.3x1.1)–(2.7x.995)]275x10–3 Where: =260mW P =Worstcaseactualpowerdissipation D Maximumallowablepowerdissipation: V =MaximumvoltageonV INMAX IN V =Minimumregulatoroutputvoltage P =(T –T ) OUTMIN DMAX JMAX AMAX I =Maximumoutput(load)current θ LOADMAX JA =(125–95) The maximum allowable power dissipation (Equation 59 4-2)isafunctionofthemaximumambienttemperature =508mW (T ), the maximum allowable die temperature AMAX Inthisexample, theTC1108dissipatesamaximumof (T ) andthe thermal resistancefromjunction-to-air (θJM)A.X 260mW; below the allowable limit of 508mW. In a JA similarmanner,Equation4-1andEquation4-2canbe used to calculate maximum current and/or input EQUATION4-2: voltage limits. For example, the maximum allowable P =(T –T ) V , is found by sustituting the maximum allowable DMAX JMAX AMAX IN θ power dissipation of 508mW into Equation4-1, from JA whichV =4.6V. Wherealltermsarepreviouslydefined. INMAX Table4-1 shows variousvaluesof θ for the TC1108 JA versusboardcopperarea. TABLE 4-1: THERMALRESISTANCE GUIDELINESFORTC1108 Copper Copper Thermal Board Area Area Resistance Area (Topside)* (Backside) (θ ) JA 2500sqmm 2500sqmm 2500sqmm 45°C/W 1000sqmm 2500sqmm 2500sqmm 45°C/W 225sqmm 2500sqmm 2500sqmm 53°C/W 100sqmm 2500sqmm 2500sqmm 59°C/W 1000sqmm 1000sqmm 1000sqmm 52°C/W 1000sqmm 0sqmm 1000sqmm 55°C/W NOTE:*Tabofdeviceattachedtotopsidecopper  DS21357B-page 4 2002MicrochipTechnologyInc.

TC1108 5.0 TYPICAL CHARACTERISTICS Note: Thegraphsandtablesprovidedfollowingthisnoteareastatisticalsummarybasedonalimitednumberof samplesandareprovidedforinformationalpurposesonly.Theperformancecharacteristicslistedhereinare nottestedorguaranteed.Insomegraphsortables,thedatapresentedmaybeoutsidethespecified operatingrange(e.g.,outsidespecifiedpowersupplyrange)andthereforeoutsidethewarrantedrange. Line Regulation Output Noise Load Regulation 0.012 10.0 2.00 0.010 RCLOOUAT D= =1 µ5F0Ω 1.80 LINE REGULATION (%) 00000.....000000000004682 µ√NOISE (V/HZ) 10..01 LOAD REGULATION (%) 1100011.......60864240000000 11 ttoo 310000mmAA1 to 50mA -0.002 0.20 -0.004 0.0 0.00 -40°-20° 0° 20° 40° 60° 80°100°120° 0.01 0.01 1 10 100 1000 -40°-20° 0° 20° 40° 60° 80°100°120° TEMPERATURE (°C) FREQUENCY (kHz) TEMPERATURE (°C) Supply Current Dropout Voltage vs. Load Current VOUT vs. Temperature 100.0 0.40 125°C 3.075 VIN = 4V A) 90.0 V) 0.35 885°CC ICLLOOAADD = = 1 30.03µµAF µPLY CURRENT ( 678000...000 POUT VOLTAGE ( 0000....32210505 0°2CC5°7C0°C V (V)OUT32..092755 P O SU DR 0.10 -40°C 50.0 0.05 40.0 0.00 2.925 -40°-20° 0° 20° 40° 60° 80°100°120° 0 50 100 150 200 250 300 -40°-20° 0° 20° 40° 60° 80°100°120° TEMPERATURE (°C) LOAD CURRENT (mA) TEMPERATURE (°C)  2002MicrochipTechnologyInc. DS21357B-page 5

TC1108 6.0 PACKAGING INFORMATION 6.1 Package Marking Information “1”=partnumbercode “2”=representstemperature+datecode+lotidentity +subcontractoridentity TC1108(V) Code TC1108-2.5VDB 110825 TC1108-2.8VDB 110828 TC1108-3.0VDB 110830 TC1108-3.3VDB 110833 TC1108-5.0VDB 110850 6.2 Taping Form Component Taping Orientation for 3-Pin SOT-223 Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 3-Pin SOT-223 12 mm 8 mm 4000 13 in  DS21357B-page 6 2002MicrochipTechnologyInc.

TC1108 6.3 Package Dimensions 3-Pin SOT-223 .264 (6.70) .248 (6.30) .122 (3.10) .114 (2.90) .287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30) .041 (1.04) PIN 1 .033 (0.84) .091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) 10° MAX. .013 (0.33) MAX. .009 (0.24) .004 (0.10) .181 (4.60) TYP. .036 (0.91) MIN. .001 (0.02) Dimensions: inches (mm)  2002MicrochipTechnologyInc. DS21357B-page 7

TC1108 NOTES:  DS21357B-page 8 2002MicrochipTechnologyInc.

TC1108 SALES AND SUPPORT DataSheets ProductssupportedbyapreliminaryDataSheetmayhaveanerratasheetdescribingminoroperationaldifferencesandrecom- mendedworkarounds.Todetermineifanerratasheetexistsforaparticulardevice,pleasecontactoneofthefollowing: 1. YourlocalMicrochipsalesoffice 2. TheMicrochipCorporateLiteratureCenterU.S.FAX:(480)792-7277 3. TheMicrochipWorldwideSite(www.microchip.com) Pleasespecifywhichdevice,revisionofsiliconandDataSheet(includeLiterature#)youareusing. NewCustomerNotificationSystem Registeronourwebsite(www.microchip.com/cn)toreceivethemostcurrentinformationonourproducts.  2002 Microchip Technology Inc. DS21357B-page 9

TC1108 NOTES: DS21357B-page 10  2002 Microchip Technology Inc.

TC1108 Information contained in this publication regarding device Trademarks applicationsandthelikeisintendedthroughsuggestiononly andmaybesupersededbyupdates.Itisyourresponsibilityto The Microchip name and logo, the Microchip logo, FilterLab, ensure that your application meets with your specifications. KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, No representation or warranty is given and no liability is PICSTART,PROMATE, SEEVAL and TheEmbedded Control assumedbyMicrochipTechnologyIncorporatedwithrespect SolutionsCompanyareregisteredtrademarksofMicrochipTech- totheaccuracyoruseofsuchinformation,orinfringementof nologyIncorporatedintheU.S.A.andothercountries. patentsorotherintellectualpropertyrightsarisingfromsuch dsPIC,ECONOMONITOR,FanSense,FlexROM,fuzzyLAB, useorotherwise.UseofMicrochip’sproductsascriticalcom- In-Circuit Serial Programming, ICSP, ICEPIC, microPort, ponentsinlifesupportsystemsisnotauthorizedexceptwith Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, expresswritten approvalbyMicrochip.Nolicensesarecon- MXDEV,MXLAB,PICC,PICDEM,PICDEM.net,rfPIC,Select veyed,implicitlyorotherwise,underanyintellectualproperty Mode and Total Endurance are trademarks of Microchip rights. TechnologyIncorporatedintheU.S.A. SerializedQuickTurnProgramming(SQTP)isaservicemark ofMicrochipTechnologyIncorporatedintheU.S.A. All other trademarks mentioned herein are property of their respectivecompanies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A.,AllRightsReserved. Printedonrecycledpaper. MicrochipreceivedQS-9000qualitysystem certificationforitsworldwideheadquarters, designandwaferfabricationfacilitiesin ChandlerandTempe,ArizonainJuly1999 andMountainView,CaliforniainMarch2002. TheCompany’squalitysystemprocessesand proceduresareQS-9000compliantforits PICmicro®8-bitMCUs,KEELOQ®codehopping devices,SerialEEPROMs,microperipherals, non-volatilememoryandanalogproducts.In addition,Microchip’squalitysystemforthe designandmanufactureofdevelopment systemsisISO9001certified.  2002MicrochipTechnologyInc. DS21357B-page11

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrochip: TC1108-3.0VDBTR TC1108-5.0VDBTR TC1108-3.3VDBTR TC1108-2.8VDBTR TC1108-2.5VDBTR