BTA08, BTB08, T810 T835, T850 Datasheet Snubberless™, logic level and standard 8 A Triacs A2 Features • On-state rms current, I 8 A T(RMS) G • Repetitive peak off-state voltage, VDRM / VRRM 600 V to 800 V A2 A1 • Triggering gate current, IGT 5 to 50 mA Description G G Available either in through-hole and surface-mount packages, these devices are A2 A2 A1 A1 suitable for general purpose AC switching. They can be used as an ON/OFF function TO-220AB TO-220AB Ins. in applications such as static relays, heating regulation, induction motor starting A2 circuits or for phase control operation in light dimmers and motor speed controllers, etc. The Snubberless versions (BTA, BTB08_xxxxW and T8 series) are specially A2G recommended for use on inductive loads, thanks to their high commutation A1 D²PAK performance. A2 A2 Logic level versions are designed to interface directly with low power drivers such as Microcontrollers. A2 G A1 By using an internal ceramic pad, the BTA series provide voltage insulated tab (rated G IPAK A1A2 DPAK at 2500 VRMS) in compliance with UL standards (file ref.: E81734). Product status link BTA08 BTB08 T810 T835 T850 DS2114 - Rev 15 - August 2018 www.st.com For further information contact your local STMicroelectronics sales office.

BTA08, BTB08, T810, T835, T850 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (T = 25 °C unless otherwise stated) j Symbol Parameter Value Unit IPAK, DPAK,TO-220AB, D²PAK Tc = 110 °C IT(RMS) RMS on-state current (full sine wave) 8 A TO-220AB Ins. Tc = 100 °C f = 50 Hz t = 20 ms 80 Non repetitive surge peak on-state current (full ITSM cycle, Tj initial = 25 °C) f = 60 Hz tp = 16.7 ms 84 A I2t I2t value for fusing tp = 10 ms 36 A2s dl/dt CIGrTit,i ctra l≤ r 1a0te0 onfs rise of on-state current IG = 2 x f = 120 Hz Tj = 125 °C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125 °C 4 A PG(AV) Average gate power dissipation Tj = 125 °C 1 W Tstg Storage junction temperature range -40 to +150 °C Tj Operating junction temperature range -40 to +125 °C Table 2. Electrical characteristics (T = 25 °C, unless otherwise specified) Snubberless and logic level (3 j quadrants) T8 BTA08/BTB08 Symbol Parameter Quadrant Unit 10 35 50 TW SW CW BW IGT (1) I - II - III Max. 10 35 50 5 10 35 50 mA VD = 12 V, RL = 30 Ω VGT I - II - III Max. 1.2 V VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C I - II - III Min. 0.2 V IH (2) IT = 100 mA I - II - III Max. 15 35 75 10 15 35 50 mA I - III Max. 25 50 70 10 25 50 70 IL IG = 1.2 x IGT mA II Max. 30 60 110 15 30 60 80 dV/dt (2) VD = 67% VDRM, gate open, Tj = 125 °C Max. 40 400 1000 20 40 400 1000 V/µs (dV/dt)c = 0.1 V/µs, Tj = 125 °C Min. 5.4 3.5 5.4 (dl/dt)c (2) (dV/dt)c = 10 V/µs, Tj = 125 °C Min. 2.8 1.5 2.98 A/ms Without snubber, Tj = 125 °C Min. 4.5 7 4.5 7 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 DS2114 - Rev 15 page 2/21

BTA08, BTB08, T810, T835, T850 Characteristics Table 3. Standard (4 quadrants) BTA08/BTB08 Symbol Parameter Quadrant Unit C B I - II - III 25 50 IGT (1) Max. mA VD = 12 V, RL = 33 Ω IV 50 100 VGT All Max. 1.3 V VGD VD = VDRM, RL = 33 kΩ, Tj = 125 °C All Min. 0.2 V IH (2) IT = 500 mA I - II - III Max. 25 50 mA I - III - IV 40 50 IL IG = 1.2 IGT Max. mA II 80 100 dV/dt (2) VD = 67 % VDRM gate open, Tj = 125 °C Min. 200 400 V/µs (dV/dt)c (2) (dI/dt)c = 3.5 A/ms, Tj = 125 °C Min. 5 10 V/µs 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 Table 4. Static electrical characteristics Symbol Test conditions Value Unit VTM (1) ITM = 11 A, tp = 380 µs Tj = 25 °C Max. 1.55 V VTO (1) threshold on-state voltage Tj = 125 °C Max. 0.85 V RD (1) Dynamic resistance Tj = 125 °C Max. 50 mΩ Tj = 25 °C Max. 5 µA IDRM IRRM VDRM = VRRM Tj = 125 °C Max. 1 mA 1. For both polarities of A2 referenced to A1 Table 5. Thermal resistance Symbol Parameter Value Unit IPAK / D2PAK / DPAK / TO-220AB 1.6 Rth(j-c) Max. junction to case thermal resistance (AC) °C/W TO-220AB Insulated 2.5 S = 2 cm² (1) D²PAK 45 Junction to ambient (typ.) S = 1 cm²(1) DPAK 70 Rth(j-a) °C/W TO-220AB / TO-220AB Insulated 60 Junction to ambient (typ.) IPAK 100 1. S = Copper surface under tab. DS2114 - Rev 15 page 3/21

BTA08, BTB08, T810, T835, T850 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum power dissipation versus on-state Figure 2. RMS on-state current versus temperature (full RMS current (full cycle) cycle) P(W) IT(RMS)(A) 10 10 9 9 BTB/T8 8 8 7 7 BTA 6 6 5 5 4 4 3 3 2 2 10 IT(RMS)(A) 01 Tc(°C) 0 1 2 3 4 5 6 7 8 0 25 50 75 100 125 Figure 3. RMS on-state current versus ambient Figure 4. Relative variation of thermal impedance versus temperature (full cycle) pulse duration IT(RMS)(A) K = [Zth/Rth] 3.5 1E+0 D²PAK Printed circuit board FR4, copper thickness: 35 µm Zth(j-c) 3.0 (S = 1 cm²) DPAK/IPAK Zth(j-a) 2.5 1E-1 2.0 TO-220AB/D²PAK Zth(j-a) 1.5 DPAK (S = 0.5 cm²) 1E-2 1.0 0.5 Tc(°C) tp(s) 0.0 1E-3 0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 DS2114 - Rev 15 page 4/21

BTA08, BTB08, T810, T835, T850 Characteristics (curves) Figure 6. Surge peak on-state current versus number of Figure 5. On-state characteristics (maximum values) cycles ITM(A) I (A) 100 90 TSM Tj max. Tj = Tj max. Vto = 0.85 V 80 Rd = 50 mΩ 70 t = 16.66 ms Non repetitive 60 Tjinitial = 25 °C One cycle 10 50 Tj = 2 5 °C 40 30 Repetitive TC = 110 °C 20 VTM(V) 10 1 Number of cycles 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 1 10 100 1000 Figure 7. Non repetitive surge peak on-state current for a Figure 8. Relative variation of gate trigger current sinusoidal pulse (t < 10 ms) p ITSM(A) IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25 °C] 2.5 1000 Tjinitial=25°C Holding current and latching current versus junction temperature (typical values) 2.0 IGT dI/d5t 0limA/itµastion: ITSM 1.5 360° 100 1.0 IH and IL α 0.5 Tj (°C) tp(ms) 0.0 10 -40 -20 0 20 40 60 80 100 120 140 0.01 0.10 1.00 10.00 Figure 9. Relative variation of critical rate of decrease of Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) main current versus (dV/dt)c (typical values) (dl/dt)c [(dV/dt)c / specified (dl/dt)c (dl/dt)c [(dV/dt)c] / specified (dl/dt)c 2.2 2.0 2.0 TW Snubberless and logic level types 1.8 Standard types 1.8 1.6 C 1.6 1.4 1.4 1.2 T835/T850/CW/SW/BW 1.0 1.2 B 0.8 1.0 T810/SW 0.6 0.8 0.4 0.2 0.6 (dV/dt)c (V/µs) (dV/dt)c (V/µs) 0.0 0.4 0.1 1.0 10.0 100.0 0.1 1.0 10.0 100.0 DS2114 - Rev 15 page 5/21

BTA08, BTB08, T810, T835, T850 Characteristics (curves) Figure 11. Relative variation of critical rate of decrease of Figure 12. DPAK and D2PAK thermal resistance junction main current versus junction temperature to ambient versus copper surface under tab (dl/dt)c [Tj] / [Tj specified] Rth(j-a)(°C/W) 6 100 Printed circuit board FR4, copper thickness: 35 µm 90 5 80 70 4 60 DPAK 3 50 40 2 30 D²PAK 20 1 10 Tj(°C) S(cm²) 0 0 0 25 50 75 100 125 0 4 8 12 16 20 24 28 32 36 40 DS2114 - Rev 15 page 6/21

BTA08, BTB08, T810, T835, T850 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DS2114 - Rev 15 page 7/21

BTA08, BTB08, T810, T835, T850 DPAK package information 2.1 DPAK package information • Epoxy meets UL94, V0 • Lead-free package • Recommended torque: 0.4 to 0.6 N·m Figure 13. DPAK package outline A E b4 c2 2 L 1 D D H E1 A1 4 L e b c e1 L 2 V 2 A DS2114 - Rev 15 page 8/21

BTA08, BTB08, T810, T835, T850 DPAK package information Table 6. DPAK package mechanical data Dimensions Ref. Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max. A 2.18 2.40 0.0858 0.0945 A1 0.90 1.10 0.0354 0.0433 A2 0.03 0.23 0.0012 0.0091 b 0.64 0.90 0.0252 0.354 b4 4.95 5.46 0.1949 0.2150 c 0.46 0.61 0.0181 0.0240 c2 0.46 0.60 0.0181 0.0236 D 5.97 6.22 0.2350 0.2449 D1 5.10 0.2008 E 6.35 6.73 0.2500 0.2650 E1 4.32 0.1701 e 2.29 0.0900 e1 4.57 0.1800 H 9.35 10.40 0.3681 0.4094 L 1.00 1.78 0.0394 0.0701 L2 1.27 0.0500 L4 0.60 1.02 0.0236 0.0402 V2 0° +8° 0° +8° 1. Dimensions in inches are given for reference only Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. Figure 14. DPAK recommended footprint (dimensions are in mm) 12.7 6.7 3.0 3.0 A 4.572 6.7 B 1.6 The device must be positioned within 0.05 AB DS2114 - Rev 15 page 9/21

BTA08, BTB08, T810, T835, T850 IPAK package information 2.2 IPAK package information Figure 15. IPAK package outline E A b4 c2 L2 V1 D L1 H A1 b2 L e B5 b c e1 Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DS2114 - Rev 15 page 10/21

BTA08, BTB08, T810, T835, T850 IPAK package information Table 7. IPAK package mechanical data Dimensions Ref. Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max. A 2.20 2.40 0.0866 0.0945 A1 0.90 1.10 0.0354 0.0433 b 0.64 0.90 0.0252 0.0354 b2 0.95 0.0374 b4 5.20 5.43 0.2047 0.2138 B5 0.30 0.0118 c 0.45 0.60 0.0177 0.0236 c2 0.46 0.60 0.0181 0.0236 D 6.00 6.20 0.2362 0.2441 E 6.40 6.65 0.2520 0.2618 e 2.28 0.0898 e1 4.40 4.60 0.1732 0.1811 H 16.10 0.6339 L 9.00 9.60 0.3545 0.3780 L1 0.80 1.20 0.0315 0.0472 L2 0.80 1.25 0.0315 0.0492 V1 10° 10° 1. Inch dimensions are for reference only. DS2114 - Rev 15 page 11/21

BTA08, BTB08, T810, T835, T850 TO-220AB insulated package information 2.3 TO-220AB insulated package information Figure 16. TO-220AB insulated package outline B C b2 I Resin gate 0.5 mm max. protusion(1) L F A I4 l3 c2 a1 l2 a2 M c1 b1 Resin gate 0.5 mm max. protusion(1) e (1)Resin gate position accepted in one of the two positions or in the symmetrical opposites. DS2114 - Rev 15 page 12/21

BTA08, BTB08, T810, T835, T850 TO-220AB insulated package information Table 8. TO-220AB insulated package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 15.20 15.90 0.5984 0.6260 a1 3.75 0.1476 a2 13.00 14.00 0.5118 0.5512 B 10.00 10.40 0.3937 0.4094 b1 0.61 0.88 0.0240 0.0346 b2 1.23 1.32 0.0484 0.0520 C 4.40 4.60 0.1732 0.1811 c1 0.49 0.70 0.0193 0.0276 c2 2.40 2.72 0.0945 0.1071 e 2.40 2.70 0.0945 0.1063 F 6.20 6.60 0.2441 0.2598 I 3.73 3.88 0.1469 0.1528 L 2.65 2.95 0.1043 0.1161 I2 1.14 1.70 0.0449 0.0669 I3 1.14 1.70 0.0449 0.0669 I4 15.80 16.40 16.80 0.6220 0.6457 0.6614 M 2.6 0.1024 1. Inch dimensions are for reference only. DS2114 - Rev 15 page 13/21

BTA08, BTB08, T810, T835, T850 D²PAK package information 2.4 D²PAK package information Figure 17. D²PAK package outline A E1 E c2 E2 2 L 1 D D H 2 D 3 L b2 Resin gate e b 0.5 mm max. protrusion(1) G A1 A2 A3 L R Gauge Plane c V2 (1) Resin gate position accepted in one of the two positions or in the symmetrical opposites DS2114 - Rev 15 page 14/21

BTA08, BTB08, T810, T835, T850 D²PAK package information Table 9. D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 0.0091 A3 0.25 0.0098 b 0.70 0.93 0.0276 0.0366 b2 1.25 1.7 0.0492 0.0669 c 0.45 0.60 0.0177 0.0236 c2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 e 2.54 0.1 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 H 15 15.85 0.5906 0.6240 L 1.78 2.28 0.0701 0.0898 L2 1.27 1.40 0.0500 0.0551 L3 1.40 1.75 0.0551 0.0689 R 0.40 0.0157 V2 0° 8° 0° 8° 1. Dimensions in inches are given for reference only DS2114 - Rev 15 page 15/21

BTA08, BTB08, T810, T835, T850 D²PAK package information Figure 18. D²PAK recommended footprint (dimensions are in mm) 16.90 10.30 5.08 1.30 3.70 8.90 DS2114 - Rev 15 page 16/21

BTA08, BTB08, T810, T835, T850 Ordering information 3 Ordering information Figure 19. Ordering information scheme (BTA08 and BTB08 series) BT A 08 - 600 BW (RG) Triac Insulation A = Insulated B = Non-insulated Current 08 = 8A Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 mA BW = 50 mA Snubberless™ C = 25 mA standard CW = 35 mA Snubberless™ SW = 10 mA logic level TW = 5 mA logic level Packing mode RG = Tube Figure 20. Ordering information scheme (T8 series) T 8 10 - 600 B (-TR) Triac series Current 08 = 8A Sensitivity 10 = 10 mA 35 = 35 mA 50 = 50 mA Voltage 600 = 600 V 800 = 800 V Package B = DPAK H = IPAK G = D²PAK Packing mode Blank = Tube TR = Tape and reel DS2114 - Rev 15 page 17/21

BTA08, BTB08, T810, T835, T850 Ordering information Table 10. Product selector Voltage (xxx) Part Number Sensitivity Type Package 600 800 T810-xxxB X X 10 mA Logic Level DPAK T835-xxxH X 35 mA Snubberless™ IPAK T810-xxxG X 10 mA Logic Level D2PAK T835-xxxG X X 35 mA Snubberless™ D2PAK T850-xxxG X X 50 mA Snubberless™ D2PAK BTA08-xxxS X 10 mA Logic Level TO-220AB Ins. BTA08-xxxC X X 35 mA Standard TO-220AB Ins. BTA08-xxxB X 50 mA Standard TO-220AB Ins. BTA08-xxxTW X 5 mA Logic Level TO-220AB Ins. BTA08-xxxSW X 10 mA Logic Level TO-220AB Ins. BTA08-xxxCW X 35 mA Snubberless™ TO-220AB Ins. BTA08-xxxBW X X 50 mA Snubberless™ TO-220AB Ins. BTB08-xxxS X 10 mA Logic Level TO-220AB BTB08-xxxC X 35 mA Standard TO-220AB BTB08-xxxB X 50 mA Standard TO-220AB BTB08-xxxTW X X 5 mA Logic Level TO-220AB BTB08-xxxSW X 10 mA Logic Level TO-220AB BTB08-xxxCW X X 35 mA Snubberless™ TO-220AB BTB08-xxxBW X 50 mA Snubberless™ TO-220AB DS2114 - Rev 15 page 18/21

BTA08, BTB08, T810, T835, T850 Ordering information Table 11. Ordering information Order code Marking Package Weight Base qty. Delivery mode T810-600B T8 1060 T835-600B T8 3560 75 Tube T835-800B T8 3580 T810-600B-TR T8 1060 DPAK 0.30 T810-800B-TR T8 1080 2500 Tape&Reel 13" T835-600B-TR T8 3560 T835-800B-TR T8 3580 T835-600H T8 3560 IPAK 0.40 75 Tube T835-600G T835-600G T835-8G T835-8G 50 Tube T850-6G T850-6G T850-8G T850-8G T810-600G-TR T810-600G D2PAK 1.50 T835-600G-TR T835-600G T835-8G-TR T835-8G 1000 Tape&Reel 13" T850-6G-TR T850-6G T850-8G-TR T850-8G BTA08-600SRG BTA08-600S BTA08-600BRG BTA08-600B BTA08-600CRG BTA08-600C BTA08-800CRG BTA08-800C BTA08-600BWRG BTA08-600BW TO-220AB Ins. BTA08-600CWRG BTA08-600CW BTA08-600SWRG BTA08-600SW BTA08-600TWRG BTA08-600TW BTA08-800BWRG BTA08-800BW 2.30 50 Tube BTB08-600BRG BTB08-600B BTB08-600CRG BTB08-600C BTB08-600SRG BTB08-600S BTB08-600BWRG BTB08-600BW BTB08-600CWRG BTB08-600CW TO-220AB BTB08-600SWRG BTB08-600SW BTB08-600TWRG BTB08-600TW BTB08-800CWRG BTB08-800CW BTB08-800TWRG BTB08-800TW DS2114 - Rev 15 page 19/21

BTA08, BTB08, T810, T835, T850 Table 12. Document revision history Date Revision Changes Apr-2002 5A Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement 13-Feb-2006 6 added. 10-Mar-2010 7 Updated ECOPACK statement and Figure 26 Updated DPAK and IPAK package information and reformatted to current 02-Jun-2014 8 standard. 07-Nov-2016 9 Updated Table 1 and reformatted to current standard. Updated Figure 20: "Ordering information scheme (T8 series)", Table 10: 06-Jan-2017 10 "Product selector" and Table 11: "Ordering information". 09-Feb-2017 11 Added T850 package information. Updated Figure 6.. 24-Apr-2017 12 Minor text changes to improve readability. Updated Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Snubberless and logic level (3 quadrants), cover image, Figure 14-Mar-2018 13 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) and Figure 20. Ordering information scheme (T8 series). 14-May-2018 14 Updated product status links. 09-Aug-2018 15 Updated Table 3. Standard (4 quadrants). DS2114 - Rev 15 page 20/21

BTA08, BTB08, T810, T835, T850 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS2114 - Rev 15 page 21/21

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: S TMicroelectronics: T835-600B T835-600G BTA08-700BRG BTB08-800TWRG T810-600G-TR T810-800G-TR BTB08-600TWRG BTB08-600BWRG BTB08-600CWRG BTB08-600SWRG BTA08-600SWRG BTA08-600CWRG BTA08-600TWRG BTA08-600BWRG T835-600G-TR BTB08-700BWRG BTA08-700CWRG BTA08-800CRG BTA08-800BWRG T835- 600B-TR BTA08-400BRG BTA08-400CRG BTB08-400CRG BTA08-600BRG BTA08-600CRG BTA08-600SRG BTB08-600SRG BTB08-600CRG BTB08-600BRG T835-600H T810-600B T810-600B-TR T835-800B-TR T810- 800B-TR T810-600G T810-600H T835-800B T850-6G-TR T850-6G