Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR MnO 2 Overview The KEMET T513 Surface Mount Capacitors are suitable surge current and high ripple current capability. These for the High Reliability Series (HRA) requirements of benefits are achieved via a multiple anode construction industrial, telecom, defense, and aerospace markets. similar to KEMET's T510 Series. The T513 HRA Series also This surface mount series offers very low ESR and surge offers various options including Weibull Grading, termination robustness designed for applications that require high finish, and surge current. Benefits • Meets or exceeds EIA Standard 535BAAC • Taped & Reel standard packaging per EIA 481 • High surge current capability • Termination options B, C, H, K, and T • High ripple current capability • Surge testing options • 100% steady-state accelerated aging • ESR as low as 10 mΩ • RoHS compliant 100% Sn terminations available Applications The T513 Series is suitable for the industrial, telecom, defense, and aerospace markets. Typical applications include decoupling and filtering in radar, sonar, power supply, guidance systems, and other high reliability applications. Environmental Compliance RoHS Compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder or gold plated. One world. One KEMET © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 1 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 K-SIM For a detailed analysis of specific part numbers, please visit ksim.kemet.com to access KEMET’s K-SIM software. KEMET K-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels. Ordering Information T 513 X 108 K 004 B H 61 10 Rated Failure Capacitor Case Capacitance Capacitance Termination Packaging Series Voltage Rate/ Surge ESR Class Size Code (pF) Tolerance Finish (C-Spec) (VDC) Design T = Multiple D First two K = ±10% 004 = 4 A = N/A C = Hot solder 61 = None 10 = Standard ESR Blank = 7" Reel Tantalum anode E digits M = ±20% 006 = 6.3 B = 0.1%/ dipped 62 = 10 cycles, 25°C 20 = Low ESR 7280 = 13" Reel COTS X represent 010 = 10 1,000 H = Standard after Weibull 30 = Ultra-low ESR 7610 = Bulk bag significant 016 = 16 hours solder-coated 63 = 10 cycles, −55°C 7640 = Bulk figures. 020 = 20 C = 0.01%/ (SnPb 5% Pb and 85°C after Weibull plastic box Third digit 025 = 25 1,000 minimum) 64 = 10 cycles, −55°C WAFL = Waffle specifies 035 = 35 hours B = Gold-Plated and 85°C before pack number of K = Solder fused Weibull zeros. T = 100% Tin Performance Characteristics Item Performance Characteristics Operating Temperature −55°C to 125°C Rated Capacitance Range 15 – 1,000 μF at 120 Hz/25°C Capacitance Tolerance K Tolerance (10%), M Tolerance (20%) Rated Voltage Range 4 – 35 VDC DF (120 Hz) Refer to Part Number Electrical Specification Table ESR (100 kHz) Refer to Part Number Electrical Specification Table Leakage Current ≤ 0.01 CV (μA) at rated voltage after 5 minutes © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 22 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Qualification Test Condition Characteristics Δ C/C Within ±10% of initial value 85°C at rated voltage, 2,000 hours DF Within initial limits Endurance 125°C at 2/3 rated voltage, 2,000 hours DCL Within 1.25 x initial limit ESR Within initial limits Δ C/C Within ±10% of initial value DF Within initial limits Storage Life 125°C at 0 volts, 2,000 hours DCL Within 1.25 x initial limit ESR Within initial limits Δ C/C Within ±5% of initial value MIL–STD–202, Method 107, Condition B, mounted, DF Within initial limits Thermal Shock −55°C to 125°C, 1,000 cycles DCL Within 1.25 x initial limit ESR Within initial limits +25°C −55°C +85°C +125°C Extreme temperature exposure at a Δ C/C IL* ±10% ±10% ±20% Temperature Stability succession of continuous steps at +25°C, −55°C, +25°C, +85°C, +125°C, +25°C DF IL IL 1.5 x IL 1.5 x IL DCL IL n/a 10 x IL 12 x IL Δ C/C Within ±5% of initial value 25°C and 85°C, 1.32 x rated voltage 1,000 cycles DF Within initial limits Surge Voltage (125°C, 1.2 x rated voltage) DCL Within initial limits ESR Within initial limits Δ C/C Within ±10 of initial value MIL–STD–202, Method 213, Condition I, 100 G peak Mechanical Shock/ MIL–STD–202, Method 204, Condition D, 10 Hz to DF Within initial limits Vibration 2,000 Hz, 20 G peak DCL Within initial limits Additional Qualification Tests per MIL–PRF– Please contact KEMET for more information. 55365/8 *IL = Initial limit © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 33 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Dimensions – Millimeters (Inches) Metric will govern CATHODE (-) END VIEW SIDE VIEW ANODE (+) END VIEW BOTTOM VIEW A W B B H E F P Termination cutout X T S G S at KEeMitEhTer's e onpdtion, R L Typical Case Size Component Weight B ±0.15 F ±0.1 S ±0.3 X P R T A G E KEMET EIA L W H (Ref) (mg) ±(0.004) ±(0.012) (Ref) (Ref) (Ref) (Ref) (Min) (Ref) (Ref) ±0.006 7.3±0.3 4.3±0.3 2.8±0.3 2.4 1.3 0.5 0.10±0.10 0.9 1.0 0.13 3.8 3.5 3.5 D 7343-31 349.43 (0.287±0.012) (0.169±0.012) (0.110±0.012) (0.095) (0.051) (0.020) (0.004±0.004) (0.035) (0.039) (0.005) (0.150) (0.138) (0.138) 7.3±0.3 4.3±0.3 4.0±0.3 2.4 1.3 0.5 0.10±0.10 1.7 1.0 0.13 3.8 3.5 3.5 X 7343–43 430.15 (0.287±0.012) (0.169±0.012) (0.157±0.012) (0.094) (0.051) (0.020) (0.004±0.004) (0.067) (0.039) (0.005) (0.150) (0.138) (0.138) 7.3±0.3 6.0±0.3 3.6±0.2 4.1 1.3 0.5 0.10±0.10 0.9 1.0 0.13 3.8 3.5 3.5 E 7360–38 500.73 (0.287±0.012) (0.236±0.012) (0.142±0.008) (0.161) (0.051) (0.020) (0.004±0.004) (0.035) (0.039) (0.005) (0.150) (0.138) (0.138) Notes: (Ref) – Dimensions provided for reference only. These weights are provided as reference. If exact weights are needed, please contact your KEMET Sales Representative. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 44 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Table 1 – Ratings & Part Number Reference Maximum Rated Rated Case Code/ KEMET Part DC Standard Low Ultra- DF Operating Voltage Cap Case Size Number Leakage ESR ESR low ESR Temp. (See below for μA at +20°C % at +20°C mΩ at +20°C mΩ at +20°C mΩ at +20°C VDC at 85°C µF KEMET/EIA °C part options) Max./5 Min. 120 Hz Max. 100 kHz Max. 100 kHz Max. 100 kHz Max. 4 680 X/7343-43 T513X687(1)004(2)(3)(4)(5) 27.2 6.0 30 N/A N/A 125 4 1000 X/7343-43 T513X108(1)004(2)(3)(4)(5) 40.0 6.0 23 18 N/A 125 4 1000 E/7360-38 T513E108(1)004(6)(3)(4)(5) 40.0 6.0 18 10 N/A 125 6.3 470 X/7343-43 T513X477(1)006(2)(3)(4)(5) 29.6 6.0 30 N/A N/A 125 6.3 680 X/7343-43 T513X687(1)006(2)(3)(4)(5) 42.8 6.0 45 23 N/A 125 6.3 680 E/7360-38 T513E687(1)006(6)(3)(4)(5) 42.8 6.0 23 12 N/A 125 10 330 X/7343-43 T513X337(1)010(6)(3)(4)(5) 33.0 6.0 35 N/A N/A 125 16 100 D/7343-31 T513D107(1)016(2)(3)(4)(5) 16.0 6.0 75 N/A N/A 125 16 150 X/7343-43 T513X157(1)016(2)(3)(4)(5) 24.0 6.0 40 30 N/A 125 16 220 X/7343-43 T513X227(1)016(2)(3)(4)(5) 35.2 10.0 40 25 N/A 125 20 100 X/7343-43 T513X107(1)020(6)(3)(4)(5) 20.0 8.0 45 40 35 125 25 68 X/7343-43 T513X686(1)025(2)(3)(4)(5) 17.0 8.0 45 N/A N/A 125 25 100 E/7360-38 T513E107(1)025(2)(3)(4)(5) 25.0 8.0 50 N/A N/A 125 35 15 D/7343-31 T513D156(1)035(2)(3)(4)(5) 5.3 6.0 100 N/A N/A 125 35 33 X/7343-43 T513X336(1)035(2)(3)(4)(5) 11.6 6.0 65 55 N/A 125 35 47 X/7343-43 T513X476(1)035(2)(3)(4)(5) 16.5 8.0 65 55 N/A 125 (See below for μA at +20°C % at +20°C mΩ at +20°C mΩ at +20°C mΩ at +20°C VDC at 85°C µF KEMET/EIA °C part options) Max./5 Min. 120 Hz Max. 100 kHz Max. 100 kHz Max. 100 kHz Max. Maximum Rated Voltage Rated Case Code/ KEMET Part Number DC DF Standard Low ESR Ultra-low Operating Cap Case Size Leakage ESR ESR Temp. (1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates Capacitance tolerance. (2) To complete KEMET part number, insert B (0.1%/1,000 hours), or A = N/A. Designates Reliability Level. (3) To complete KEMET part number, insert B = Gold-plated, C = Hot solder dipped, H = Solder-plated, K = Solder Fused or T = 100% Tin (Sn). Designates Termination Finish. (4) To complete KEMET part number, insert 61 = None, 62 = 10 cycles +25°C, 63 = 10 cycles −55°C +85°C after Weibull or 64 = 10 cycles −55°C +85°C before Weibull. Designates Surge current option. (5) To complete KEMET part number, insert 10 = Standard ESR, 20 = Low ESR or 30 = Ultra Low ESR. Designates ESR option. (6) To complete KEMET part number, insert C (0.01%/1,000 hours), B (0.1%/1,000 hours), or A = N/A. Designates Reliability Level. Refer to Ordering Information for additional detail. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 55 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Recommended Voltage Derating Guidelines −55°C to 85°C 85°C to 125°C 120% % Change in Working DC V 67% of V 100% Voltage with Temperature R R e Recommended Maximum ag Application Voltage 50% of VR 33% of VR olt 80% % Change in Working DC Voltage V ng with Temperature 67% ki 60% or W % 40% Recommended Maximum Application Voltage 33% (As % of Rated Voltage) 20% 0% −55 25 85 125 Temperature (ºC ) Ripple Current/Ripple Voltage Permissible AC ripple voltage and current are related to Maximum Power equivalent series resistance (ESR) and the power dissipation KEMET EIA Dissipation (Pmax) capabilities of the device. Permissible AC ripple voltage Case Code Case Code mWatts at 25°C which may be applied is limited by two criteria: with +20°C Rise 1. The positive peak AC voltage plus the DC bias voltage, A 3216–18 75 if any, must not exceed the DC voltage rating of the B 3528–21 85 capacitor. C 6032–28 110 2. The negative peak AC voltage in combination with D 7343–31 150 X 7343–43 165 bias voltage, if any, must not exceed the allowable limits E 7360–38 200 specified for reverse voltage. See the Reverse Voltage S 3216–12 60 section for allowable limits. T 3528–12 70 The maximum power dissipation by case size can be U 6032–15 90 determined using the table at right. The maximum power V 7343–20 125 dissipation rating stated in the table must be reduced with T510X 7343–43 270 increasing environmental operating temperatures. Refer to T510E 7360–38 285 the table below for temperature compensation requirements. Using the Pmax of the device, the maximum allowable rms Temperature Compensation Multipliers ripple current or voltage may be determined. for Maximum Ripple Current I(max) = √Pmax/R T ≤ 25°C T ≤ 85°C T ≤ 125°C E(max) = Z √Pmax/R 1.00 0.90 0.40 T= Environmental Temperature I = rms ripple current (amperes) E = rms ripple voltage (volts) The maximum power dissipation rating must be reduced with increasing Pmax = maximum power dissipation (watts) environmental operating temperatures. Refer to the Temperature R = ESR at specified frequency (ohms) Compensation Multiplier table for details. Z = Impedance at specified frequency (ohms) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 66 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Reverse Voltage Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The positive terminal is identified on the capacitor body by a stripe, plus in some cases a beveled edge. A small degree of transient reverse voltage is permissible for short periods per the below table. The capacitors should not be operated continuously in reverse mode, even within these limits. Temperature Permissible Transient Reverse Voltage 25°C 15% of Rated Voltage 85°C 5% of Rated Voltage 125°C 1% of Rated Voltage Table 2 – Land Dimensions/Courtyard Metric Density Level A: Density Level B: Density Level C: KEMET Size Maximum (Most) Land Median (Nominal) Land Minimum (Least) Land Code Protrusion (mm) Protrusion (mm) Protrusion (mm) Case EIA W L S V1 V2 W L S V1 V2 W L S V1 V2 D 7343–31 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 E1 7360–38 4.25 2.77 3.67 10.22 7.30 4.13 2.37 3.87 9.12 6.80 4.03 1.99 4.03 8.26 6.54 X1 7343–43 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351). 1 Height of these chips may create problems in wave soldering. 2 Land pattern geometry is too small for silkscreen outline. V1 L L W W V2 S Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 77 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Soldering Process KEMET’s families of surface mount capacitors are Profile Feature SnPb Assembly Pb-Free Assembly compatible with wave (single or dual), convection, IR, Preheat/Soak or vapor phase reflow techniques. Preheating of these Temperature Minimum (T ) 100°C 150°C components is recommended to avoid extreme thermal Smin Temperature Maximum (T ) 150°C 200°C stress. KEMET's recommended profile conditions for Smax Time (t) from T to T ) 60 – 120 seconds 60 – 120 seconds convection and IR reflow reflect the profile conditions of the s smin smax Ramp-up Rate (T to T) 3°C/seconds maximum 3°C/seconds maximum IPC/J–STD–020D standard for moisture sensitivity testing. L P Liquidous Temperature (T) 183°C 217°C The devices can safely withstand a maximum of three reflow L Time Above Liquidous (t) 60 – 150 seconds 60 – 150 seconds passes at these conditions. L 220°C* 250°C* Peak Temperature (T) P 235°C** 260°C** Time within 5°C of Maximum Please note that although the X/7343–43 case size can Peak Temperature (t) 20 seconds maximum 30 seconds maximum P withstand wave soldering, the tall profile (4.3 mm maximum) Ramp-down Rate (T to T) 6°C/seconds maximum 6°C/seconds maximum P L dictates care in wave process development. Time 25°C to Peak 6 minutes maximum 8 minutes maximum Temperature Note: All temperatures refer to the center of the package, measured on the Hand soldering should be performed with care due to the package body surface that is facing up during assembly reflow. difficulty in process control. If performed, care should be * For Case Size height > 2.5 mm taken to avoid contact of the soldering iron to the molded ** For Case Size height ≤ 2.5 mm case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until T P t reflow occurs. Once reflow occurs, the iron should be Maximum Ramp-up Rate = 3°C/second P Maximum Ramp-down Rate = 6°C/second removed immediately. “Wiping” the edges of a chip and T heating the top surface is not recommended. re L tL u rat Tsmax e During typical reflow operations, a slight darkening of the mp T e smin t gold-colored epoxy may be observed. This slight darkening is T s normal and not harmful to the product. Marking permanency is not affected by this change. 25 25°C to Peak Time Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 88 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Construction Molded Epoxy Polarity Stripe (+) Detailed Cross Section Case Silver Paint Polarity (Fourth Layer) Bevel (+) Tantalum Wire Leadframe (− Cathode) Washer Tantalum Wire Weld (to attach wire) Carbon (Third Layer) Washer Silver Adhesive Molded Epoxy Leadframe MnO2 Ta2O5 Dielectric Tantalum Case (+ Anode) (Second Layer) (First Layer) Capacitor Marking Date Code * KEMET Polarity 1st digit = Last number of Year 2 = 2012 Multi-Anode Indicator (+) 3 = 2013 COTS 4 = 2014 5 = 2015 Picofarad 6 = 2016 Code 7 = 2017 2nd and 3rd digit = Week of the 01 = 1st week of the Year to Rated KEMET Voltage ID Year 52 = 52nd week of the Year Date Code* * 230 = 30th week of 2012 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 99 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Tape & Reel Packaging Information KEMET’s molded chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in accordance with EIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system is compatible with all tape-fed automatic pick-and-place systems. Right hand orientation only Embossed carrier (+) (−) Embossment Top tape thickness 0.10 mm (0.004”) 8 mm (0.315”) or 180 mm (7.0”) or maximum thickness 12 mm (0.472”) 330 mm (13.”) Table 3 – Packaging Quantity Tape Width Case Code 7" Reel* 13" Reel* (mm) KEMET EIA S 3216-12 8 2,500 10,000 T 3528-12 8 3,000 10,000 M 3528-15 8 2,500 8,000 U 6032-15 12 1,000 5,000 L 6032-19 12 1,000 3,000 W 7343-15 12 1,000 3,000 Z 7343-17 12 1,000 3,000 V 7343-20 12 1,000 3,000 A 3216-18 8 2,000 9,000 B 3528-21 8 2,000 8,000 C 6032-28 12 500 3,000 D 7343-31 12 500 2,500 Q 7343-12 12 1,000 3,000 Y 7343-40 12 500 2,000 X 7343-43 12 500 2,000 E/T428P 7360-38 12 500 2,000 H 7360-20 12 1,000 2,500 O 7360-43 12 250 1,000 * No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 1100 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P 2 T2 ØD0 P0 t(o1l0e rpaintcchee osn c tuampuel a±0ti.v2e mm) E1 A 0 F K 0 W B1 B0 E2 S P 1 1 T1 Center Lines of Cavity ØD Embossment 1 For cavity size, Cover Tape see Note 1, Table 4 B is for tape feeder reference only, 1 including draft concentric about B0. User Direction of Unreeling Table 4 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) D Minimum R Reference S Minimum T Tape Size D 1 E P P 1 T Maximum 1 0 Note 1 1 0 2 Note 2 Note 3 Maximum 1.0 25.0 8 mm (0.039) (0.984) 1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100 (0.059 +0.004/−0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.024) (0.004) 1.5 30 12 mm (0.059) (1.181) Variable Dimensions — Millimeters (Inches) B Maximum Tape Size Pitch 1 E Minimum F P T Maximum W Maximum A, B & K Note 4 2 1 2 0 0 0 4.35 6.25 3.5 ±0.05 2.0 ±0.05 or 4.0 ±0.10 2.5 8.3 8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.079 ±0.002 or 0.157 ±0.004) (0.098) (0.327) Single (4 mm) 2.0 ±0.05 (0.079 ±0.002) or Note 5 8.2 10.25 5.5 ±0.05 4.6 12.3 12 mm and Double 4.0 ±0.10 (0.157 ±0.004) or (0.323) (0.404) (0.217 ±0.002) (0.181) (0.484) (8 mm) 8.0 ±0.10 (0.315 ±0.004) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape, with or without components, shall pass around R without damage (see Figure 4). 3. If S < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b). 1 4. B dimension is a reference dimension for tape feeder clearance only. 1 5. The cavity defi ned by A, B and K shall surround the component with suffi cient clearance that: 0 0 0 (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3). (e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 1111 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Packaging Information Performance Notes 1. Cover tape break force: 1.0 kg minimum. 2. Cover tape peel strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( °) s T 8, 12 20 Bo Tape Maximum Width (mm) Rotation ( °) S 8, 12 20 Typical Component Centerline Ao Figure 3 – Maximum Lateral Movement Figure 4 – Bending Radius 8 mm & 12 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 0.5 mm maximum Bending R R Radius © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 1122 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Figure 5 – Reel Dimensions W Full Radius, (Includes Access Hole at 3 See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W (Measured at hub) 2 A D (See Note) N C (Arbor hole W (Measured at hub) diameter) 1 If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 5 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 178 ±0.20 8 mm (7.008 ±0.008) 1.5 13.0 +0.5/−0.2 20.2 or (0.059) (0.521 +0.02/−0.008) (0.795) 12 mm 330 ±0.20 (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W W Maximum W 1 2 3 8.4 +1.5/−0.0 14.4 8 mm 50 (0.331 +0.059/−0.0) (0.567) Shall accommodate tape (1.969) 12.4 +2.0/−0.0 18.4 width without interference 12 mm (0.488 +0.078/−0.0) (0.724) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 1133 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm minimum Leader Trailer Components 400 mm minimum 160 mm minimum Top Cover Tape Figure 7 – Maximum Camber Elongated Sprocket Holes Carrier Tape (32 mm & wider tapes) Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 1144 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T513 High Reliability Series (HRA), Multiple Anode Low ESR COTS MnO 2 KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2049_T513 • 9/26/2019 1155 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com