Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Overview The KEMET T428 was developed to provide the volumetric leadframe product. In addition, the facedown construction efficiency of a conformally coated capacitor in a pick- offers higher power ratings per cc. The robust design and-place friendly molded package. The planerity of the features and testing protocol make this part suitable for molded package eliminates the "drops" associated with the application in the telecommunications, industrial, defense, conformally coated tantalum surface mount devices. This and aerospace markets. new package design offers the highest CV/cc of any molded Benefits • High CV/cc • Taped and reeled per EIA 481 • SnPb termination finish • Laser-marked case • 100% surge current test available • Halogen-free epoxy • Extended range values • Pick-and-place friendly • RoHS Compliant and lead-free terminations available Applications Typical applications include decoupling and filtering in telecommunications, computer, industrial, defense, and aerospace applications. Environmental Compliance RoHS Compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder. K-SIM For a detailed analysis of specific part numbers, please visit ksim.kemet.com to access KEMET’s K-SIM software. KEMET K-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels. One world. One KEMET © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 1 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Ordering Information T 428 P 337 K 010 A H 61 10 Rated Capacitor Case Capacitance Capacitance Failure Rate/ Termination Series Voltage Surge ESR Class Size Code (pF) Tolerance Design Finish (VDC) T = High P First two J = ±5% 004 = 4 A = N/A H = Standard 61 = None 10 = Standard Tantalum volumetric digits K = ±10% 006 = 6.3 B = 0.1%/ solder-coated 62 = 10 cycles, 20 = Low efficiency represent M = ±20% 010 = 10 1,000 hours (SnPb 5% Pb) 25°C 30 = Ultra-low facedown significant 016 = 16 63 = 10 cycles, Hi-Rel MnO figures. 020 = 20 −55°C and 85°C 2 COTS Third digit 025 = 25 specifies 035 = 35 number of 050 = 50 zeros. Performance Characteristics Item Performance Characteristics Operating Temperature −55°C to 125°C Rated Capacitance Range 15 – 470 μF at 120 Hz/25°C Capacitance Tolerance J Tolerance (5%), K Tolerance (10%), M Tolerance (20%) Rated Voltage Range 4 – 50 V DF (120 Hz) Refer to Part Number Electrical Specification Table ESR (100 kHz) Refer to Part Number Electrical Specification Table Leakage Current ≤ 0.01 CV (µA) at rated voltage after 5 minutes © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 22 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Qualification Test Condition Characteristics Δ C/C Within ±10% of initial value 85°C at rated voltage, 2,000 hours DF Within initial limits Endurance 125°C at 2/3 rated voltage, 2,000 hours DCL Within 1.25 x initial limit ESR Within initial limits Δ C/C Within ±10% of initial value DF Within initial limits Storage Life 125°C at 0 volts, 2,000 hours DCL Within 1.25 x initial limit ESR Within initial limits Δ C/C Within ±5% of initial value MIL–STD–202, Method 107, Condition B, mounted, DF Within initial limits Thermal Shock −55°C to 125°C, 1,000 cycles DCL Within 1.25 x initial limit ESR Within initial limits +25°C −55°C +85°C +125°C Extreme temperature exposure at a Δ C/C IL* ±10% ±10% ±20% Temperature Stability succession of continuous steps at +25°C, −55°C, +25°C, +85°C, +125°C, +25°C DF IL IL 1.5 x IL 1.5 x IL DCL IL n/a 10 x IL 12 x IL Δ C/C Within ±5% of initial value 85°C, 1.32 x rated voltage 1,000 cycles DF Within initial limits Surge Voltage (125°C, 1.2 x rated voltage) DCL Within initial limits ESR Within initial limits Δ C/C Within ±10 of initial value MIL–STD–202, Method 213, Condition I, 100 G peak Mechanical Shock/ MIL–STD–202, Method 204, Condition D, 10 Hz to DF Within initial limits Vibration 2,000 Hz, 20 G peak DCL Within initial limits Additional Qualification Tests per MIL–PRF– Please contact KEMET for more information. 55365/8 *IL = Initial limit Certification MIL–PRF–55365/8 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 33 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Electrical Characteristics Impedance & ESR vs. Frequency 10 T428P390uF6V Z T428P390uF6V ESR vs. f T428P330uF10V Z T428P330uF10V ESR vs. f T428P180uF16V Z T428P180uF16V ESR vs. f 1 R T428P68uF25V Z S E T428P68uF25V ESR vs. f & e T428P15uF50V Z nc T428P15uF50V ESR vs. f a d e p m I 0 0 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000 f (Hz) Capacitance vs. Frequency 10,000 T428P390uF6V T428P330uF10V T428P180uF16V T428P68uF25V 1,000 T428P15uF50V ) F µ ( e c n a 100 t ci a p a C 10 1 100 1,000 10,000 100,000 1,000,000 10,000,000 f (Hz) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 44 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Dimensions – Millimeters END VIEW SIDE VIEW BOTTOM VIEW H A F W L S S Case Typical Component Size Weight EIA L Max W ±0.3 H ±0.3 F ±0.20 S ±0.20 A (Nom) (mg) 7360-38 7.2 6.0 3.5 4.95 1.6 3.8 0.86 These weights are provided as reference. If exact weights are needed, please contact your KEMET Sales Representative Table 1 – Ratings & Part Number Reference Case Maximum Rated Rated KEMET Part DC Standard Low Ultra- Code/ DF Operating MSL Voltage Cap Number Leakage ESR ESR Low ESR Case Size Temp μA at +20°C % at +20°C mΩ at +20°C mΩ at +20°C Ω at +20°C (See below for Reflow Temp. VDC at 85°C µF KEMET/EIA Maximum/ 120 Hz 100 kHz 100 kHz 100 kHz °C part options) ≤ 260°C 5 Minutes Maximum Maximum Maximum Maximum 4 470 P/7360-38 T428P477(1)004(2)(3)(4)(5) 18.8 10.0 130 45 NA 125 1 6.3 390 P/7360-38 T428P397(1)006(2)(3)(4)(5) 24.6 8.0 130 45 NA 125 1 6.3 470 P/7360-38 T428P477(1)006(2)(3)(4)(5) 29.6 10.0 120 50 NA 125 1 10 330 P/7360-38 T428P337(1)010(2)(3)(4)(5) 33.0 8.0 130 45 NA 125 1 16 180 P/7360-38 T428P187(1)016(2)(3)(4)(5) 28.8 8.0 130 55 NA 125 1 16 220 P/7360-38 T428P227(1)016(2)(3)(4)(5) 35.2 8.0 120 55 NA 125 1 20 150 P/7360-38 T428P157(1)020(2)(3)(4)(5) 30.0 8.0 140 100 NA 125 1 25 68 P/7360-38 T428P686(1)025(2)(3)(4)(5) 17.0 6.0 200 95 NA 125 1 35 22 P/7360-38 T428P226(1)035(2)(3)(4)(5) 7.7 6.0 280 220 NA 125 1 50 15 P/7360-38 T428P156(1)050(2)(3)(4)(5) 7.5 6.0 400 350 NA 125 1 (1) To complete KEMET part number, insert M for ±20%, K for ±10% or J for ±5%. Designates capacitance tolerance. (2) To complete KEMET part number, insert B (0.1%/1,000 hours) or A = N/A. (3) To complete KEMET part number, insert H = Solder-plated. Designates termination finish. (4) To complete KEMET part number, insert 61 = none, 62 = 10 cycles +25°C, 63 = 10 cycles −55°C +85°C after Weibull or 64 = 10 cycles −55°C +85°C before Weibull. Designates surge current option. (5) To complete KEMET part number, insert 10 = standard, 20 = lLow or 30 = ultra-low. Designates ESR option. Please refer to Ordering Information for additional details. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 55 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Recommended Voltage Derating Guidelines 120% −55°C to 85°C 85°C to 125°C % Change in Working DC 100% V 67% of V Voltage with Temperature R R ge a Recommended Maximum 50% of V 33% of V olt 80% % Change in Working DC Voltage Application Voltage R R V ng with Temperature 67% ki 60% or W % 40% Recommended Maximum Application Voltage 33% (As % of Rated Voltage) 20% 0% −55 25 85 125 Temperature (ºC ) Ripple Current/Ripple Voltage Permissible AC ripple voltage and current are related to Maximum Power equivalent series resistance (ESR) and the power dissipation EIA Dissipation (Pmax) Case Code capabilities of the device. Permissible AC ripple voltage Case Code mWatts at 25°C which may be applied is limited by two criteria: with +20°C Rise 1. The positive peak AC voltage plus the DC bias voltage, P 7360–38 325 if any, must not exceed the DC voltage rating of the Using the Pmax of the device, the maximum allowable rms capacitor. ripple current or voltage may be determined. 2. The negative peak AC voltage in combination with bias voltage, if any, must not exceed the allowable limits I(max) = √Pmax/R specified for reverse voltage. See the Reverse Voltage E(max) = Z √Pmax/R section for allowable limits. I = rms ripple current (amperes) The maximum power dissipation by case size can be E = rms ripple voltage (volts) determined using the table at right. The maximum power Pmax = maximum power dissipation (watts) dissipation rating stated in the table must be reduced with R = ESR at specified frequency (ohms) increasing environmental operating temperatures. Refer to Z = Impedance at specified frequency (ohms) the table below for temperature compensation requirements. Temperature Compensation Multipliers for Maximum Ripple Current T ≤ 25°C T ≤ 85°C T ≤ 125°C 1.00 0.90 0.40 T= Environmental Temperature The maximum power dissipation rating must be reduced with increasing environmental operating temperatures. Refer to the Temperature Compensation Multiplier table for details © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 66 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Reverse Voltage Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The positive terminal is identified on the capacitor body by a stripe, plus in some cases a beveled edge. A small degree of transient reverse voltage is permissible for short periods per the below table. The capacitors should not be operated continuously in reverse mode, even within these limits. Temperature Permissible Transient Reverse Voltage 25°C 15% of Rated Voltage 85°C 5% of Rated Voltage 125°C 1% of Rated Voltage Table 2 – Land Dimensions/Courtyard Metric Density Level A: Density Level B: Density Level C: KEMET Size Maximum (Most) Median (Nominal) Minimum (Least) Code Land Protrusion (mm) Land Protrusion (mm) Land Protrusion (mm) Case EIA X Y C V1 V2 X Y C V1 V2 X Y C V1 V2 P 7360-38 5.25 1.80 2.35 8.50 7.30 5.15 1.70 2.35 8.00 6.80 5.05 1.60 2.35 7.70 6.50 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). V1 Y Y X X V2 C C Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 77 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Soldering Process KEMET’s families of surface mount capacitors are Profile Feature SnPb Assembly Pb-Free Assembly compatible with wave (single or dual), convection, IR, Preheat/Soak or vapor phase reflow techniques. Preheating of these Temperature Minimum (T ) 100°C 150°C components is recommended to avoid extreme thermal Smin Temperature Maximum (T ) 150°C 200°C stress. KEMET's recommended profile conditions for Smax Time (t) from T to T ) 60 – 120 seconds 60 – 120 seconds convection and IR reflow reflect the profile conditions of the s smin smax Ramp-up Rate (T to T) 3°C/seconds maximum 3°C/seconds maximum IPC/J–STD–020D standard for moisture sensitivity testing. L P Liquidous Temperature (T) 183°C 217°C The devices can safely withstand a maximum of three reflow L Time Above Liquidous (t) 60 – 150 seconds 60 – 150 seconds passes at these conditions. L 220°C* 250°C* Peak Temperature (T) P 235°C** 260°C** Time within 5°C of Maximum Please note that although the X/7343–43 case size can Peak Temperature (t) 20 seconds maximum 30 seconds maximum P withstand wave soldering, the tall profile (4.3 mm maximum) Ramp-down Rate (T to T) 6°C/seconds maximum 6°C/seconds maximum P L dictates care in wave process development. Time 25°C to Peak 6 minutes maximum 8 minutes maximum Temperature Note: All temperatures refer to the center of the package, measured on the Hand soldering should be performed with care due to the package body surface that is facing up during assembly reflow. difficulty in process control. If performed, care should be * For Case Size height > 2.5 mm taken to avoid contact of the soldering iron to the molded ** For Case Size height ≤ 2.5 mm case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until T P t reflow occurs. Once reflow occurs, the iron should be Maximum Ramp-up Rate = 3°C/second P Maximum Ramp-down Rate = 6°C/second removed immediately. “Wiping” the edges of a chip and T heating the top surface is not recommended. re L tL u rat Tsmax e During typical reflow operations, a slight darkening of the mp T e smin t gold-colored epoxy may be observed. This slight darkening is T s normal and not harmful to the product. Marking permanency is not affected by this change. 25 25°C to Peak Time Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 88 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Construction Polarity Stripe (+) Detailed Cross Section Molded Epoxy Carbon Silver Paint Case (Third Layer) (Fourth Layer) Washer Washer MnO 2 Tantalum Wire (Second Layer) TaO Dielectric Tantalum 2 5 Leadframe (First Layer) Tantalum Wire Leadframe Weld (+ Anode) (- Cathode) Spacer (to attach wire) Capacitor Marking KEMET Polarity Date Code * Facedown Indicator (+) MnO 2 1st digit = Last number of Year 2 = 2012 3 = 2013 Picofarad 4 = 2014 Code 5 = 2015 Rated KEMET 6 = 2016 Voltage ID 7 = 2017 Date 2nd and 3rd digit = Week of the 01 = 1st week of the Year to Code* Year 52 = 52nd week of the Year * 635 = 35th week of 2016 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 99 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Tape & Reel Packaging Information KEMET’s molded chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in accordance with EIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system is compatible with all tape-fed automatic pick-and-place systems. Right hand orientation only Embossed carrier (+) (−) Embossment Top tape thickness 0.10 mm (0.004”) 8 mm (0.315”) or 180 mm (7.0”) or maximum thickness 12 mm (0.472”) 330 mm (13.”) Table 3 – Packaging Quantity Tape Width Case Code 7" Reel* 13" Reel* (mm) KEMET EIA S 3216-12 8 2,500 10,000 T 3528-12 8 3,000 10,000 M 3528-15 8 2,500 8,000 U 6032-15 12 1,000 5,000 L 6032-19 12 1,000 3,000 W 7343-15 12 1,000 3,000 Z 7343-17 12 1,000 3,000 V 7343-20 12 1,000 3,000 A 3216-18 8 2,000 9,000 B 3528-21 8 2,000 8,000 C 6032-28 12 500 3,000 D 7343-31 12 500 2,500 Q 7343-12 12 1,000 3,000 Y 7343-40 12 500 2,000 X 7343-43 12 500 2,000 E/T428P 7360-38 12 500 2,000 H 7360-20 12 1,000 2,500 O 7360-43 12 250 1,000 * No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 1100 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Figure 1 – Embossed (Plastic) Carrier Tape Dimensions T P 2 T2 ØD0 P0 t(o1l0e rpaintcchee osn c tuampuel a±0ti.v2e mm) E1 A 0 F K 0 W B1 B0 E2 S P 1 1 T1 Center Lines of Cavity ØD Embossment 1 For cavity size, Cover Tape see Note 1, Table 4 B is for tape feeder reference only, 1 including draft concentric about B0. User Direction of Unreeling Table 4 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) D Minimum R Reference S Minimum T Tape Size D 1 E P P 1 T Maximum 1 0 Note 1 1 0 2 Note 2 Note 3 Maximum 1.0 25.0 8 mm (0.039) (0.984) 1.5 +0.10/−0.0 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.600 0.100 (0.059 +0.004/−0.0) (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.024) (0.004) 1.5 30 12 mm (0.059) (1.181) Variable Dimensions — Millimeters (Inches) B Maximum Tape Size Pitch 1 E Minimum F P T Maximum W Maximum A, B & K Note 4 2 1 2 0 0 0 4.35 6.25 3.5 ±0.05 2.0 ±0.05 or 4.0 ±0.10 2.5 8.3 8 mm Single (4 mm) (0.171) (0.246) (0.138 ±0.002) (0.079 ±0.002 or 0.157 ±0.004) (0.098) (0.327) Single (4 mm) 2.0 ±0.05 (0.079 ±0.002) or Note 5 8.2 10.25 5.5 ±0.05 4.6 12.3 12 mm and Double 4.0 ±0.10 (0.157 ±0.004) or (0.323) (0.404) (0.217 ±0.002) (0.181) (0.484) (8 mm) 8.0 ±0.10 (0.315 ±0.004) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape, with or without components, shall pass around R without damage (see Figure 4). 3. If S < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b). 1 4. B dimension is a reference dimension for tape feeder clearance only. 1 5. The cavity defi ned by A, B and K shall surround the component with suffi cient clearance that: 0 0 0 (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3). (e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 1111 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Packaging Information Performance Notes 1. Cover tape break force: 1.0 kg minimum. 2. Cover tape peel strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Maximum Component Rotation Top View Side View Typical Pocket Centerline Tape Maximum ° Width (mm) Rotation ( °) s T 8, 12 20 Bo Tape Maximum Width (mm) Rotation ( °) S 8, 12 20 Typical Component Centerline Ao Figure 3 – Maximum Lateral Movement Figure 4 – Bending Radius 8 mm & 12 mm Tape Embossed Punched Carrier Carrier 0.5 mm maximum 0.5 mm maximum Bending R R Radius © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 1122 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Figure 5 – Reel Dimensions W Full Radius, (Includes Access Hole at 3 See Note Slot Location flange distortion (Ø 40 mm minimum) at outer edge) W (Measured at hub) 2 A D (See Note) N C (Arbor hole W (Measured at hub) diameter) 1 If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 5 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 178 ±0.20 8 mm (7.008 ±0.008) 1.5 13.0 +0.5/−0.2 20.2 or (0.059) (0.521 +0.02/−0.008) (0.795) 12 mm 330 ±0.20 (13.000 ±0.008) Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W W Maximum W 1 2 3 8.4 +1.5/−0.0 14.4 8 mm 50 (0.331 +0.059/−0.0) (0.567) Shall accommodate tape (1.969) 12.4 +2.0/−0.0 18.4 width without interference 12 mm (0.488 +0.078/−0.0) (0.724) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 1133 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier Carrier Tape 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) 100 mm minimum Leader Trailer Components 400 mm minimum 160 mm minimum Top Cover Tape Figure 7 – Maximum Camber Elongated Sprocket Holes Carrier Tape (32 mm & wider tapes) Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 1144 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Tantalum Surface Mount Capacitors – High Reliability T428 High Reliability Alternative High Volumetric Efficiency Facedown MnO 2 KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2058_T428 • 8/20/2019 1155 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com