T3035H, T3050H 30 A high temperature Snubberless™ Triacs Datasheet - production data Applications Thanks to its high electrical noise immunity level and its strong current robustness, the T3035H, T3050H series is designed for the control of AC actuators in appliances and industrial systems. Description Specifically designed to operate at 150 °C, the 30 A T3035H, T3050H Triacs provide very high dynamic and enhanced performance in terms of power loss and thermal dissipation. This allows the heatsink size optimization, leading to space and cost effectiveness when compared to electro-mechanical solutions. Based on ST Snubberless™ technology, they offer a specified minimal commutation and high noise immunity levels valid up to the T max. j These devices safely optimize the control of universal motors and of inductive loads found in power tools and major appliances. By using an internal ceramic pad, they provide voltage insulation (rated at 2500 V ). RMS Features Table 1: Device summary  High current Triac Symbol Value Unit  High immunity level  Low thermal resistance with clip bonding IT(RMS) 30 A  Very high 3 quadrant commutation at 150 °C VDRM/VRRM 600 V capability IGT 35 or 50 mA  Packages are RoHS (2002/95/EC) compliant  UL certified (ref. file E81734) January 2017 DocID17029 Rev 6 1/12 This is information on a product in full production. www.st.com

Characteristics T3035H, T3050H 1 Characteristics Table 2: Absolute ratings (limiting values) Symbol Parameter Value Unit D²PAK, RMS on-state current TO-220AB TC = 121 °C IT(RMS) (full sine wave) 30 A TO-220AB Ins. TC = 92 °C Non repetitive surge peak on- f = 50 Hz tp = 20 ms 270 ITSM state current A (full cycle, Tj initial = 25 °C) f = 60 Hz tp = 16.7 ms 284 I²t I²t value for fusing tp = 10 ms 487 A²s Critical rate of rise of on-state dl/dt current f = 120 Hz Tj = 150 °C 50 A/µs IG = 2 x IGT , tr ≤ 100 ns VVDRSSMM / Nofof-ns traetpee vtiotilvtaeg seu rge peak tp = 10 ms Tj = 25 °C VDRM1/V00R RM + V IGM Peak forward gate current tp = 20 µs Tj = 150 °C 4 A PG(AV) Average gate power dissipation Tj = 150 °C 1 W Tstg Storage junction temperature range -40 to +150 °C Tj Operating junction temperature range -40 to +150 °C Table 3: Electrical characteristics (Tj = 25 °C unless otherwise specified) Value Symbol Test Conditions Quadrant Unit T3035H T3050H IGT(1) Max. 35 50 VD = 12 V, RL = 33 Ω I - II - III mA VGT Max. 1.0 VGD VTjD = = 1 V5D0R °MC, RL = 3.3 kΩ, I - II - III Min. 0.15 V IH IT = 500 mA Max. 60 75 mA I - III 75 90 IL IG = 1.2 x IGT Max. mA II 90 110 dV/dt(2) VD = 2/3 x VDRM, gate open Tj = 150 °C Min. 1000 1500 V/µs (dI/dt)c(2) Without snubber Tj = 150 °C Min. 33 44 A/ms Notes: (1)minimum IGT is guaranteed at 20% of IGT max. (2)for both polarities of A2 referenced to A1. 2/12 DocID17029 Rev 6

T3035H, T3050H Characteristics Table 4: Static characteristics Symbol Test conditions Value Unit VTM(1) ITM = 42 A, tp = 380 μs Tj = 25 °C Max. 1.55 V VTO(1) Threshold voltage Tj = 150 °C Max. 0.80 V Rd(1) Dynamic resistance Tj = 150 °C Max. 15 mΩ Tj = 25 °C Max. 10 µA VDRM = VRRM Tj = 150 °C Max. 8.5 IDRM / IRRM VD/VR = 400 V (at peak mains voltage) Tj = 150 °C Max. 7 mA VD/VR = 200 V (at peak mains voltage) Tj = 150 °C Max. 5.5 Notes: (1)for both polarities of A2 referenced to A1 Table 5: Thermal parameters Symbol Parameter Value Unit D²PAK, 0.8 Rth(j-c) Junction to case (AC) TO-220AB TO-220AB Ins. 1.6 °C/W Junction to ambient (Scu = 1 cm2) D²PAK 45 Rth(j-a) TO-220AB, Junction to ambient 60 TO-220AB Ins. DocID17029 Rev 6 3/12

Characteristics T3035H, T3050H 1.1 Characteristics (curves) Figure 1: Maximum power dissipation versus Figure 2: On-state RMS current versus case on-state RMS current temperature P(W) IT(RMS)(A) 40 35 35 TO-220AB,D²PAK 30 30 25 25 TO-220AB-ins 20 20 15 15 10 10 5 5 0 IT(RMS)(A) 0 Tc(°C) 0 5 10 15 20 25 30 0 25 50 75 100 125 150 Figure 3: On-state RMS current versus ambient Figure 4: Variation of thermal impedance versus temperature (free air convection) pulse duration K=[Zth/Rth] IT(RMS)(A) 1.0E+00 3.5 Zth(j-c) Zth(j-a) 3.0 2.5 1.0E-01 2.0 1.5 1.0E-02 1.0 0.5 Ta(°C) tP(s) 0.0 1.0E-03 -50 -25 0 25 50 75 100 125 150 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Figure 5: Relative variation of gate trigger current Figure 6: Relative variation of holding current and and gate trigger voltage versus junction latching current versus junction temperature temperature (typical value) IH,IL[Tj]/IH,IL[Tj=25°C] 2.0 1.5 1.0 IL IH 0.5 Tj(°C) 0.0 -50 -25 0 25 50 75 100 125 150 4/12 DocID17029 Rev 6

T3035H, T3050H Characteristics Figure 7: Surge peak on-state current versus Figure 8: Non repetitive surge peak on-state number of cycles current for a sinusoidal pulse with width tp < 10 ms ITSM(A) 250 t=20ms 200 Nonrepetitive Onecycle Tjinitial=25°C 150 100 Repetitive 50 TC=121°C Numberofcycles 0 1 01 100 1000 Figure 10: Relative variation of critical rate of Figure 9: On state characteristics decrease of main current versus junction (maximum values) temperature (dI/dt)c[T]/(dI/dt)c[T =150°C] 11 j j 10 9 8 7 6 5 4 3 2 1 T(°C) 0 j 25 50 75 100 125 150 Figure 12: Relative variation of leakage current Figure 11: Relative variation of static dV/dt versus junction temperature for different values of immunity versus junction temperature blocking voltage dV/dt[T]/dV/dt[T =150°C] 11 j j I /I [T;V /V ]/I /I V =V =400V 1.0E+00 DRM RRM j DRM RRM DRM RRM 10 D R [T =150°C;600V] j 9 8 1.0E-01 VDRM=VRRM=600V 7 6 V =V =400V DRM RRM 5 1.0E-02 4 VDRM=VRRM=200V 3 2 1.0E-03 1 T(°C) 0 j T(°C) 25 50 75 100 125 150 1.0E-04 j 25 50 75 100 125 150 DocID17029 Rev 6 5/12

Characteristics T3035H, T3050H Figure 14: Acceptable junction to ambient thermal Figure 13: Thermal resistance junction to ambient resistance versus repetitive peak off-state voltage versus copper surface under tab and ambient temperature 80 Rth(j-a)(°C/W) 70 60 50 40 30 20 EpoxyprintedboardFR4,eCU=35µm 10 SCu(cm²) 0 0 5 10 15 20 25 30 35 40 6/12 DocID17029 Rev 6

T3035H, T3050H Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.  Epoxy meets UL94, V0  Lead-free package leads  Cooling method: by conduction (C) 2.1 D²PAK package information Figure 15: D²PAK package outline DocID17029 Rev 6 7/12

Package information T3035H, T3050H Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.1693 0.1811 A1 2.49 2.69 0.0980 0.1059 A2 0.03 0.23 0.0012 0.0091 B 0.70 0.93 0.0276 0.0366 B2 1.25 1.40 0.0492 0.0551 C 0.45 0.60 0.0177 0.0236 C2 1.21 1.36 0.0476 0.0535 D 8.95 9.35 0.3524 0.3681 D1 7.50 8.00 0.2953 0.3150 D2 1.30 1.70 0.0512 0.0669 E 10.00 10.28 0.3937 0.4047 E1 8.30 8.70 0.3268 0.3425 E2 6.85 7.25 0.2697 0.2854 G 4.88 5.28 0.1921 0.2079 L 15 15.85 0.5906 0.6240 L2 1.27 1.40 0.0500 0.0551 L3 1.40 1.75 0.0551 0.0689 R 0.40 0.0157 V2 0° 8° 0° 8° Notes: (1)Dimensions in inches are given for reference only Figure 16: D²PAK recommended footprint (dimensions are in mm) 8/12 DocID17029 Rev 6

T3035H, T3050H Package information 2.2 TO-220AB (NIns. and Ins.) package information Figure 17: TO-220AB (NIns. and Ins.) package outline DocID17029 Rev 6 9/12

Package information T3035H, T3050H Table 7: TO-220AB (NIns. and Ins.) package mechanical data Dimensions Ref. Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max. A 15.20 15.90 0.5984 0.6260 a1 3.75 0.1476 a2 13.00 14.00 0.5118 0.5512 B 10.00 10.40 0.3937 0.4094 b1 0.61 0.88 0.0240 0.0346 b2 1.23 1.32 0.0484 0.0520 C 4.40 4.60 0.1732 0.1811 c1 0.49 0.70 0.0193 0.0276 c2 2.40 2.72 0.0945 0.1071 e 2.40 2.70 0.0945 0.1063 F 6.20 6.60 0.2441 0.2598 I 3.73 3.88 0.1469 0.1528 L 2.65 2.95 0.1043 0.1161 I2 1.14 1.70 0.0449 0.0669 I3 1.14 1.70 0.0449 0.0669 I4 15.80 16.40 16.80 0.6220 0.6457 0.6614 M 2.6 0.1024 Notes: (1)Inch dimensions are for reference only. 10/12 DocID17029 Rev 6

T3035H, T3050H Ordering information 3 Ordering information Figure 18: Ordering information scheme T 30 xx H - 6 y -TR Triacseries Current 30=30A Sensitivity 35=35mA 50=50mA Hightemperature Voltage 6=600V Package T=TO-220AB I=TO-220ABinsulated G=D²PAK Deliverymode Blank=tube(TO-220AB,TO-220ABins) -TR=Tapeandreel(D²PAK) Table 8: Ordering information Order code Marking Package Weight Base qty. Delivery mode T3035H-6G T3035H-6G 50 Tube D²PAK 1.5 g T3035H-6G-TR T3035H-6G 1000 Tape and reel 13" T3035H-6I T3035H-6I TO-220AB Ins. 2.3 g 50 Tube T3035H-6T T3035H-6T TO-220AB 2.3 g 50 Tube T3050H-6G T3050H-6G 50 Tube D²PAK 1.5 g T3050H-6G-TR T3050H-6G 1000 Tape and reel 13" T3050H-6T T3050H-6T TO-220AB 2.3 g 50 Tube 4 Revision history Table 9: Document revision history Date Revision Changes 28-Jan-2010 1 Initial release. 17-May-2010 2 Updated maximum Tj in Table 2. 14-Dec-2010 3 Updated IGT in Table 1. 20-Sep-2011 4 Updated: Features. 21-Jul-2015 5 Update Table 2 and reformatted to current standard. 20-Jan-2017 6 D²PAK package added. DocID17029 Rev 6 11/12

T3035H, T3050H IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 12/12 DocID17029 Rev 6

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