ICGOO在线商城 > 分立半导体产品 > 晶体管 - FET,MOSFET - 单 > SUD09P10-195-GE3
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SUD09P10-195-GE3产品简介:
ICGOO电子元器件商城为您提供SUD09P10-195-GE3由Vishay设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 SUD09P10-195-GE3价格参考¥3.61-¥9.42。VishaySUD09P10-195-GE3封装/规格:晶体管 - FET,MOSFET - 单, 表面贴装 P 沟道 100V 8.8A(Tc) 2.5W(Ta),32.1W(Tc) TO-252,(D-Pak)。您可以下载SUD09P10-195-GE3参考资料、Datasheet数据手册功能说明书,资料中有SUD09P10-195-GE3 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | MOSFET P-CH 100V 8.8A DPAK |
产品分类 | FET - 单 |
FET功能 | 标准 |
FET类型 | MOSFET P 通道,金属氧化物 |
品牌 | Vishay Siliconix |
数据手册 | |
产品图片 | |
产品型号 | SUD09P10-195-GE3 |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | TrenchFET® |
不同Id时的Vgs(th)(最大值) | 2.5V @ 250µA |
不同Vds时的输入电容(Ciss) | 1055pF @ 50V |
不同Vgs时的栅极电荷(Qg) | 34.8nC @ 10V |
不同 Id、Vgs时的 RdsOn(最大值) | 195 毫欧 @ 3.6A,10V |
供应商器件封装 | TO-252,(D-Pak) |
其它名称 | SUD09P10-195-GE3TR |
功率-最大值 | 2.5W |
包装 | 带卷 (TR) |
安装类型 | 表面贴装 |
封装/外壳 | TO-252-3,DPak(2 引线+接片),SC-63 |
标准包装 | 2,000 |
漏源极电压(Vdss) | 100V |
电流-连续漏极(Id)(25°C时) | 8.8A (Tc) |
SUD09P10-195 Vishay Siliconix P-Channel 100 V (D-S) MOSFET FEATURES PRODUCT SUMMARY • Halogen-free According to IEC 61249-2-21 V (V) R (Ω) I (A) Q (Typ.) DS DS(on) D g Definition - 100 0.195 at VGS = - 10 V - 8.8 11.7 (cid:129) TrenchFET® Power MOSFET 0.210 at VGS = - 4.5 V - 8.5 (cid:129) 100 % R and UIS Tested g (cid:129) Compliant to RoHS Directive 2002/95/EC APPLICATIONS (cid:129) Power Switch (cid:129) DC/DC Converters TO-252 S G Drain Connected to Tab G D S D Top View Ordering Information: SUD09P10-195-GE3 (Lead (Pb)-free and Halogen-free) P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted C Parameter Symbol Limit Unit Drain-Source Voltage VDS - 100 V Gate-Source Voltage VGS ± 20 TC = 25 °C - 8.8 Continuous Drain Current (T = 150 °C) I J D TC = 70 °C - 7.1 A Pulsed Drain Current IDM - 15 Avalanche Current IAS - 18 Single Avalanche Energya L = 0.1 mH EAS 16.2 mJ TC = 25 °C 32.1b Maximum Power Dissipationa T = 25 °Cc PD 2.5 W A Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C THERMAL RESISTANCE RATINGS Parameter Symbol Limit Unit Junction-to-Ambient (PCB Mount)c RthJA 50 °C/W Junction-to-Case (Drain) RthJC 3.9 Notes: a. Duty cycle ≤ 1 %. b. See SOA curve for voltage derating. c. When Mounted on 1" square PCB (FR-4 material). Document Number: 65903 www.vishay.com S10-0634-Rev. A, 22-Mar-10 1
SUD09P10-195 Vishay Siliconix SPECIFICATIONS T = 25 °C, unless otherwise noted J Parameter Symbol Test Conditions Min. Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS VDS = 0 V, ID = - 250 µA - 100 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = - 250 µA - 1 - 2.5 Gate-Body Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 250 nA VDS = - 100 V, VGS = 0 V - 1 Zero Gate Voltage Drain Current IDSS VDS = - 100 V, VGS = 0 V, TJ = 125 °C - 50 µA VDS = - 100 V, VGS = 0 V, TJ = 150 °C - 250 On-State Drain Currenta ID(on) VDS ≤ - 10 V, VGS = - 10 V - 15 A VGS = - 10 V, ID = - 3.6 A 0.162 0.195 Drain-Source On-State Resistancea RDS(on) Ω VGS = - 4.5 V, ID = - 3.4 A 0.175 0.210 Forward Transconductancea gfs VDS = - 15 V, ID = - 3.6 A 12 S Dynamicb Input Capacitance Ciss 1055 Output Capacitance Coss VGS = 0 V, VDS = - 50 V, f = 1 MHz 65 pF Reverse Transfer Capacitance Crss 41 Total Gate Chargec Qg VDS = - 50 V, VGS = - 10 V, ID = - 3.6 A 23.2 34.8 11.7 17.6 nC Gate-Source Chargec Qgs VDS = - 50 V, VGS = - 4.5 V, ID = - 3.6 A 3.5 Gate-Drain Chargec Qgd 4.8 Gate Resistance Rg f = 1 MHz 1.2 5.7 11.5 Ω Turn-On Delay Timec td(on) 7 14 Rise Timec tr VDD = - 50 V, RL = 17.2 Ω 12 18 ns Turn-Off Delay Timec td(off) ID ≅ - 2.9 A, VGEN = - 10 V, Rg = 1 Ω 33 50 Fall Timec tf 9 18 Drain-Source Body Diode Ratings and Characteristics T = 25°Cb C Continuous Current IS - 8.8 A Pulsed Current ISM - 15 Forward Voltagea VSD IF = - 2.9 A, VGS = 0 V - 0.8 - 1.5 V Reverse Recovery Time trr 50 75 ns Peak Reverse Recovery Current IRM(REC) IF = - 2.9 A, dI/dt = 100 A/µs - 4 - 6 A Reverse Recovery Charge Qrr 98 147 nC Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com Document Number: 65903 2 S10-0634-Rev. A, 22-Mar-10
SUD09P10-195 Vishay Siliconix TYPICAL CHARACTERISTICS 25°C, unless otherwise noted 15 0.30 VGS=10Vthru5V VGS=4V 12 Ω() 0.25 nt(A) ance Curre 9 Resist 0.20 Drain 6 - On- VGS=4.5V - ID S(on) VGS=10V VGS=3V RD 0.15 3 0 0.10 0 1 2 3 4 0 3 6 9 12 15 VDS-Drain-to-SourceVoltage(V) ID-DrainCurrent(A) Output Characteristics On-Resistance vs. Drain Current 2.0 0.60 1.6 Ω) 0.45 ( Current(A) 1.2 Resistance 0.30 TJ=150 °C ain On- Dr 0.8 - - ID TC=25 °C S(on) TJ=25 °C D 0.15 R 0.4 TC=125 °C TC=- 55 °C 0.0 0.00 0 1 2 3 4 0 2 4 6 8 10 VGS-Gate-to-SourceVoltage(V) VGS-Gate-to-SourceVoltage(V) Transfer Characteristics On-Resistance vs. Gate-to-Source Voltage 25 10 ID=3.6A 20 V) 8 (S) TC=- 55 °C ge( nce olta VDS=50V a V ct 15 TC=25 °C e 6 u c -Transcond 10 TC=125 °C Gate-to-Sour 4 VDS=25V VDS=80V fs - g 5 GS 2 V 0 0 0 3 6 9 12 15 0 5 10 15 20 25 ID-DrainCurrent(A) Qg-TotalGateCharge(nC) Transconductance Gate Charge Document Number: 65903 www.vishay.com S10-0634-Rev. A, 22-Mar-10 3
SUD09P10-195 Vishay Siliconix TYPICAL CHARACTERISTICS 25°C, unless otherwise noted 100 - 1.1 - 1.4 nt(A) 10 TJ=150 °C ID=250 μA e ceCurr (V)S(th) - 1.7 Sour TJ=25 °C VG - 1 S I - 2.0 0.1 - 2.3 0.0 0.3 0.6 0.9 1.2 - 50 - 25 0 25 50 75 100 125 150 VSD-Source-to-DrainVoltage(V) TJ-Temperature(°C) Source-Drain Diode Forward Voltage Threshold Voltage 1600 - 100 V) - 106 1200 Ciss ge ( (pF) Volta ID=250 μA ce e - 112 C - Capacitan 800 Drain-to-Sourc - 118 400 - DS - 124 V Coss 0 Crss - 130 0 20 40 60 80 100 - 50 - 25 0 25 50 75 100 125 150 VDS-Drain-to-SourceVoltage(V) TJ - Junction Temperature (°C) Capacitance Drain Source Breakdown vs. Junction Temperature 2.1 10 ID=3.6A VGS=10V 8 1.7 e c n-Resistan malized) 1.3 VGS=4.5V Current(A) 6 - On)(Nor Drain 4 o S( - D D R 0.9 I 2 0.5 0 - 50 - 25 0 25 50 75 100 125 150 0 25 50 75 100 125 150 TJ-JunctionTemperature(°C) TC-CaseTemperature(°C) On-Resistance vs. Junction Temperature Current Derating www.vishay.com Document Number: 65903 4 S10-0634-Rev. A, 22-Mar-10
SUD09P10-195 Vishay Siliconix TYPICAL CHARACTERISTICS 25°C, unless otherwise noted 100 100 LimitedbyRDS(on)* 10 A) ( 100μs I (A)DAV 10 TJ = 150 °C TJ = 25 °C DrainCurrent 1 11100m0msmss - 1s,10s,DC D I 0.1 TA=25 °C SinglePulse BVDSSLimited 1 0.01 10-6 10-5 10-4 10-3 10-2 10-1 0.1 1 10 100 Time (s) VDS-Drain-to-SourceVoltage(V) Single Pulse Avalanche Current Capability vs. Time *VGS>minimumVGSatwhichRDS(on)isspecified Safe Operating Area 1 nt DutyCycle=0.5 e Transiance ctivemped EffemalI 0.2 eder zh aliT m Nor 0.1 0.05 0.02 SinglePulse 0.1 10-4 10-3 10-2 10-1 1 10 SquareWavePulseDuration(s) Normalized Thermal Transient Impedance, Junction-to-Case Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?65903. Document Number: 65903 www.vishay.com S10-0634-Rev. A, 22-Mar-10 5
Package Information www.vishay.com Vishay Siliconix TO-252AA Case Outline E A MILLIMETERS INCHES C2 b3 DIM. MIN. MAX. MIN. MAX. 3 A 2.18 2.38 0.086 0.094 L A1 - 0.127 - 0.005 b 0.64 0.88 0.025 0.035 b2 0.76 1.14 0.030 0.045 D b3 4.95 5.46 0.195 0.215 H C 0.46 0.61 0.018 0.024 C2 0.46 0.89 0.018 0.035 L4 5 D 5.97 6.22 0.235 0.245 L L m) D1 4.10 - 0.161 - m 5 E 6.35 6.73 0.250 0.265 0. b b2 ght ( C E1 4.32 - 0.170 - e ei H 9.40 10.41 0.370 0.410 h A1 e1 ne e 2.28 BSC 0.090 BSC a pl e1 4.56 BSC 0.180 BSC e g a L 1.40 1.78 0.055 0.070 g L3 0.89 1.27 0.035 0.050 1 D L4 - 1.02 - 0.040 L5 1.01 1.52 0.040 0.060 ECN: T16-0236-Rev. P, 16-May-16 DWG: 5347 E1 Notes • Dimension L3 is for reference only. Revision: 16-May-16 1 Document Number: 71197 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Application Note 826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR DPAK (TO-252) 0.224 (5.690) 3 0) 4 8 2 1 0. 6. ( 0.420 10.668) ( 7 2) 8 0 0 2 0. 2. ( 0 6) 9 8 0 2 0. 2. ( 0.180 0.055 (4.572) (1.397) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index Return to Index A P P L I C A T I O N N O T E Document Number: 72594 www.vishay.com Revision: 21-Jan-08 3
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