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  • 型号: STTH8L06G-TR
  • 制造商: STMicroelectronics
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STTH8L06G-TR产品简介:

ICGOO电子元器件商城为您提供STTH8L06G-TR由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 STTH8L06G-TR价格参考。STMicroelectronicsSTTH8L06G-TR封装/规格:二极管 - 整流器 - 单, Diode Standard 600V 8A Surface Mount D2PAK。您可以下载STTH8L06G-TR参考资料、Datasheet数据手册功能说明书,资料中有STTH8L06G-TR 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

DIODE ULTRA FAST 600V 8A D2PAK整流器 RECTIFIER

产品分类

单二极管/整流器分离式半导体

品牌

STMicroelectronics

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

二极管与整流器,整流器,STMicroelectronics STTH8L06G-TR-

数据手册

点击此处下载产品Datasheet

产品型号

STTH8L06G-TR

不同If时的电压-正向(Vf)

1.3V @ 8A

不同 Vr、F时的电容

-

不同 Vr时的电流-反向漏电流

8µA @ 600V

二极管类型

标准

产品

Ultra Fast Recovery Rectifiers

产品目录页面

点击此处下载产品Datasheet

产品种类

整流器

供应商器件封装

D2PAK

其它名称

497-3763-1

其它有关文件

http://www.st.com/web/catalog/sense_power/FM64/CL830/SC12/SS1652/PF64993?referrer=70071840

包装

剪切带 (CT)

反向恢复时间(trr)

105ns

反向电压

600 V

反向电流IR

8 uA

商标

STMicroelectronics

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

TO-263-3,D²Pak(2 引线+接片),TO-263AB

封装/箱体

D2-PAK

工作温度-结

175°C (最大)

工厂包装数量

1000

恢复时间

105 ns

最大工作温度

+ 175 C

最大浪涌电流

120 A

最小工作温度

- 40 C

标准包装

1

正向电压下降

1.3 V

正向连续电流

8 A

热阻

2.5°C/W Jc

电压-DC反向(Vr)(最大值)

600V

电流-平均整流(Io)

8A

系列

STTH8L06

速度

快速恢复 =< 500 ns,> 200mA(Io)

配置

Single

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PDF Datasheet 数据手册内容提取

STTH8L06 Turbo 2 ultrafast high voltage rectifier Features K ■ Ultrafast switching ■ Low reverse recovery current A ■ Low thermal resistance A K K ■ Reduces switching and conduction losses TO-220AC TO-220FPAC ■ Package insulation voltage: STTH8L06D STTH8L06FP – TO-220AC Ins: 2500 V rms – TO-220FPAC: 2000 V DC K Description A NC K A The STTH8L06, which is using ST Turbo2 600 V technology, is specially suited as boost diode in D2PAK TO-220AC Insulated STTH8L06G STTH8L06DIRG discontinuous or critical mode power factor corrections. T able 1. Device summary The device is also intended for use as a free wheeling diode in power supplies and other power Symbol Value switching applications. I 8 A F(AV) V 600 V RRM I (max) 200 µA R T 175 °C j V (typ) 0.85 V F t (typ) 75 ns rr February 2012 Doc ID 8373 Rev 6 1/11 www.st.com 11

Characteristics STTH8L06 1 Characteristics Table 2. A bsolute ratings (limiting values) Symbol Parameter Value Unit V Repetitive peak reverse voltage 600 V RRM TO-220AC / TO-220FPAC / D2PAK 30 I Forward rms current A F(RMS) TO-220AC Ins. 24 TO-220AC / D2PAK T = 150 °C c Average forward current I TO-220FPAC T = 125 °C 8 A F(AV) δ = 0.5 c TO-220AC Ins. T = 135 °C c I Surge non repetitive forward current t = 10 ms sinusoidal 120 A FSM p T Storage temperature range -65 to 175 °C stg T Operating junction temperature range -40 to 175 °C j Table 3. T hermal resistance Symbol Parameter Value (max) Unit TO-220AC / D2PAK 2.5 R Junction to case TO-220FPAC 5 °C/W th(j-c) TO-220AC Ins. 4 Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit T = 25 °C 8 j I Reverse leakage current V = V µA R R RRM T = 150 °C 16 200 j T = 25 °C 1.3 j V Forward voltage drop I = 8 A V F F T = 150 °C 0.85 1.05 j To evaluate the conduction losses use the following equation: P = 0.89 x I + 0.022 I 2 F(AV) F (RMS) Table 5. D ynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Reverse t T = 25 °C I = 1 A, dI /dt = -50 A/µs V = 30 V 75 105 ns rr recovery time j F F R Reverse I = 8 A, dI /dt = 100 A/µs, I T = 125 °C F F 7.2 10 A RM recovery current j V = 400 V R Forward I = 8 A, dI /dt = 100 A/µs t F F 150 ns fr recovery time V = 1.1 x V FR Fmax T = 25°C j Forward I = 8 A, dI /dt = 100 A/µs V F F 6 V FP recovery voltage 2/11 Doc ID 8373 Rev 6

STTH8L06 Characteristics Figure 1. C onduction losses versus Figure 2. Forward voltage drop versus average current forward current P(W) IFM(A) 11 100.0 10 δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5 (maxTimj=u1m50 v°aClues) 9 δ= 1 Tj=25°C 8 Tj=150°C (maximum values) 10.0 (typical values) 7 6 5 4 1.0 3 T 2 1 IF(AV)(A) δ=tp/T tp VFM(V) 0 0.1 0 2 4 6 8 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Figure 3. R elative variation of thermal Figure 4. Relative variation of thermal impedance junction to case versus impedance junction to case versus pulse duration (TO-220FPAC) pulse duration Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.9 (TO-220AC,TO-220AC Ins,D2 PAK) 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 Single pulse 0.2 Single pulse T 0.2 T 0.1 tp(s) δ=tp/T tp 0.1 tp(s) δ=tp/T tp 0.0 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-03 1.E-02 1.E-01 1.E+00 Figure 5. P eak reverse recovery current Figure 6. Reverse recovery time versus versus dI /dt (typical values) dI /dt (typical values) F F IRM(A) trr(ns) 14 1000 1123 VTjR==142050°CV IF=2 x IF(AV) 900 VTjR==142050°CV 11 800 IF=IF(AV) 10 700 9 IF=0.5 x IF(AV) 600 8 7 IF=0.25 x IF(AV) 500 IF=2 x IF(AV) 6 400 IF=IF(AV) 5 4 300 IF=0.5 x IF(AV) 3 200 2 1 dIF/dt(A/µs) 100 dIF/dt(A/µs) 0 0 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 Doc ID 8373 Rev 6 3/11

Characteristics STTH8L06 Figure 7. R everse recovery charges Figure 8. Softness factor versus versus dI /dt (typical values) dI /dt (typical values) F F Qrr(nC) S factor 1000 2.0 900 VTjR==142050°CV IF=2 x IF(AV) 1.8 IVFR≤=24 x0 I0FV(AV) Tj=125°C 800 1.6 700 IF=IF(AV) 1.4 600 1.2 500 IF=0.5 x IF(AV) 1.0 400 0.8 300 0.6 200 0.4 100 dIF/dt(A/µs) 0.2 dIF/dt(A/µs) 0 0.0 0 20 40 60 80 100 120 140 160 180 200 0 25 50 75 100 125 150 175 200 Figure 9. R elative variations of dynamic Figure 10. Transient peak forward voltage parameters versus junction versus dI /dt (typical values) F temperature VFP(V) 1.25 7 Sfactor IF=IF(AV) Tj=125°C 6 1.00 5 IRM 0.75 QRR 4 0.50 3 IF≤2 x IF(AV) 2 0.25 VR=400V Reference:Tj=125°C Tj(°C) 1 0.00 dIF/dt(A/µs) 25 50 75 100 125 0 0 20 40 60 80 100 120 140 160 180 200 Figure 11. F orward recovery time versus Figure 12. Junction capacitance versus dI /dt (typical values) reverse voltage applied (typical F values) tfr(ns) C(pF) 300 1000 250 VFR=T1IFj.=1=1 Ix2F(5VA°VFC)max. VOSFCT==j=132M05m°HCVzRMS 200 100 150 100 10 50 dIF/dt(A/µs) VR(V) 0 1 0 20 40 60 80 100 120 140 160 180 200 1 10 100 1000 4/11 Doc ID 8373 Rev 6

STTH8L06 Characteristics Figure 13. Thermal resistance junction to ambient versus copper surface under tab (D2PAK) Rth(j-a)(°C/W) 70 epoxy FR4,Cu= 35 µm 60 50 40 30 20 10 S(Cu)(cm²) 0 0 5 10 15 20 25 30 35 40 Doc ID 8373 Rev 6 5/11

Package information STTH8L06 2 Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.4 N·m to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. TO-220AC dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 H2 A C 1.23 1.32 0.048 0.051 Ø I C D 2.40 2.72 0.094 0.107 L5 L7 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 L6 F1 1.14 1.70 0.044 0.066 L2 G 4.95 5.15 0.194 0.202 F1 L9 D H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 F L4 13.00 14.00 0.511 0.551 M L5 2.65 2.95 0.104 0.116 E L6 15.25 15.75 0.600 0.620 G L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. Diam. I 3.75 3.85 0.147 0.151 6/11 Doc ID 8373 Rev 6

STTH8L06 Package information T able 7. TO-220FPAC dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 A B 2.5 2.7 0.098 0.106 H B D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 Dia F 0.75 1 0.030 0.039 L6 F1 1.15 1.70 0.045 0.067 L2 L7 G 4.95 5.20 0.195 0.205 L3 G1 2.4 2.7 0.094 0.106 L5 D H 10 10.4 0.393 0.409 F1 L4 L2 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 F E L4 9.8 10.6 0.386 0.417 G1 L5 2.9 3.6 0.114 0.142 G L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 Doc ID 8373 Rev 6 7/11

Package information STTH8L06 T able 8. TO-220AC (Nins. & Ins. 20-up) dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 15.20 15.90 0.598 0.625 a1 3.75 0.147 B C a2 13.00 14.00 0.511 0.551 Ø I b2 B 10.00 10.40 0.393 0.409 L F b1 0.61 0.88 0.024 0.034 A b2 1.23 1.32 0.048 0.051 I4 C 4.40 4.60 0.173 0.181 a1 c2 c1 0.49 0.70 0.019 0.027 l2 a2 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 M b1 c1 F 6.20 6.60 0.244 0.259 e ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 M 2.60 0.102 8/11 Doc ID 8373 Rev 6

STTH8L06 Package information T able 9. D2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A A1 2.49 2.69 0.098 0.106 E L2 C2 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 D B2 1.14 1.70 0.045 0.067 L C 0.45 0.60 0.017 0.024 L3 A1 C2 1.23 1.36 0.048 0.054 B2 C R D 8.95 9.35 0.352 0.368 B E 10.00 10.40 0.393 0.409 G G 4.88 5.28 0.192 0.208 A2 L 15.00 15.85 0.590 0.624 M * L2 1.27 1.40 0.050 0.055 V2 L3 1.40 1.75 0.055 0.069 * FLAT ZONE NO LESS THAN 2mm M 2.40 3.20 0.094 0.126 R 0.40 typ. 0.016 typ. V2 0° 8° 0° 8° Figure 14. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 3.70 8.90 Doc ID 8373 Rev 6 9/11

Ordering information STTH8L06 3 Ordering information T able 10. Ordering information Order code Marking Package Weight Base qty Delivery mode STTH8L06D STTH8L06D TO-220AC 1.90 g 50 Tube STTH8L06G STTH8L06G D2PAK 1.48 g 50 Tube STTH8L066G-TR STTH8L06G D2PAK 1.48 g 1000 Tape and reel STTH8L06FP STTH8L06FP TO-220FPAC 1.70 g 50 Tube STTH8L06DIRG STTH8L06DI TO-220AC Ins. 1.86 g 50 Tube 4 Revision history T able 11. Document revision history Date Revision Changes Nov-2002 2A Last issue 18-Oct-2004 3 TO-220AC Insulated and D2PAK packages added 13-Jun-2005 4 T changed from value 175 to range -40 to 175 °C - Page1 j Reformatted to current standard. Added package insulation voltage 10-Aug-2006 5 data on page 1. Changed order code STTH8L06DI to STTH8L06DIRG. 07-Feb-2012 6 Added I to Table4. RM 10/11 Doc ID 8373 Rev 6

STTH8L06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 8373 Rev 6 11/11