STTH810 Ultrafast recovery - high voltage diode Main product characteristics A K I 8 A F(AV) V 1000 V RRM T 175° C j V (typ) 1.30 V F t (typ) 47 ns rr A A Features and benefits K K TO-220AC TO-220FPAC ■ Ultrafast, soft recovery STTH810D STTH810FP ■ Very low conduction and switching losses ■ High frequency and/or high pulsed current operation K ■ High reverse voltage capability ■ High junction temperature A A ■ Insulated packages: NC – TO-220Ins K – Electrical insulation = 2500 V RMS D2PAK TO-220Ins Capacitance = 7 pF STTH810G STTH810DI – TO-220FPAC Electrical insulation = 2500 V RMS Capacitance = 12 pF Order codes Description Part Number Marking The high quality design of this diode has produced a device with low leakage current, STTH810D STTH810D regularly reproducible characteristics and intrinsic STTH810G STTH810G ruggedness. These characteristics make it ideal for heavy duty applications that demand long term STTH810G-TR STTH810G reliability. STTH810FP STTH810FP Such demanding applications include industrial power supplies, motor control, and similar STTH810DI STTH810DI mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. March 2006 Rev 1 1/11 www.st.com 11

Characteristics STTH810 1 Characteristics Table 1. A bsolute ratings (limiting values at 25° C, unless otherwise specified) Symbol Parameter Value Unit V Repetitive peak reverse voltage 1000 V RRM TO-220AC / D2PAK / TO-220FPAC 30 I RMS forward current A F(RMS) TO-220AC Ins 20 TO-220AC / D2PAK T = 130° C c I Average forward current, δ = 0.5 TO-220FPAC T = 75° C 8 A F(AV) c TO-220AC Ins T = 105° C c I Repetitive peak forward current t = 5 µs, F = 5 kHz square 100 A FRM p I Surge non repetitive forward current t = 10 ms Sinusoidal 60 A FSM p T Storage temperature range -65 to + 175 °C stg T Maximum operating junction temperature 175 °C j Table 2. T hermal parameters Symbol Parameter Value Unit TO-220AC / D2PAK 2.5 R Junction to case TO-220FPAC 5.8 °C/W th(j-c) TO-220AC Ins 4.1 Table 3. S tatic electrical characteristics Symbol Parameter Test conditions Min. Typ Max. Unit T = 25° C 5 I (1) Reverse leakage current j V = V µA R R RRM T = 125° C 2 20 j T = 25° C 2 j V (2) Forward voltage drop T = 100° C I = 8 A 1.4 1.8 V F j F T = 150° C 1.3 1.7 j 1. Pulse test: t = 5 ms, δ < 2 % p 2. Pulse test: t = 380 µs, δ < 2 % p To evaluate the conduction losses use the following equation: P = 1.3 x I + 0.05 I 2 F(AV) F (RMS) 2/11

STTH810 Characteristics Table 4. D ynamic characteristics Symbol Parameter Test conditions Min. Typ Max. Unit I = 1 A, dI /dt = -50 A/µs, F F 64 85 V = 30 V, T = 25° C R j t Reverse recovery time ns rr I = 1 A, dI /dt = -100 A/µs, F F 47 65 V = 30 V, T = 25° C R j I = 8 A, dI /dt = -200 A/µs, I Reverse recovery current F F 12 16 A RM V = 600 V, T = 125° C R j I = 8 A, dI /dt = -200 A/µs, S Softness factor F F 2 V = 600 V, T = 125° C R j I = 8 A dI /dt = 50 A/µs t Forward recovery time F F 300 ns fr V = 1.5 x V , T = 25° C FR Fmax j I = 8 A, dI /dt = 50 A/µs, F F V Forward recovery voltage 5.5 V FP T = 25° C j Figure 1. C onduction losses versus Figure 2. Forward voltage drop versus average current forward current P(W) IFM(A) 18 80 =0.05 =0.1 =0.2 =0.5 =1 16 70 Tj=150°C 14 (Maximum values) 60 12 10 50 (TypTijc=a1l5v0a°lCues) 40 Tj=25°C 8 (Maximum values) 30 6 4 T 20 2 IF(AV)(A) 10 VFM(V) 0 0 0 1 2 3 4 5 6 7 8 9 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 3. R elative variation of thermal Figure 4. Relative variation of thermal impedance junction to case impedance junction to case versus versus pulse duration pulse duration Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 SDinOg-l2e2 p0uAlsBe 0.9 TSOin-2g2le0 pFuPlAseB 0.8 D²PAK 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 tp(s) 0.1 tp(s) 0.0 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 3/11

Characteristics STTH810 Figure 5. P eak reverse recovery current Figure 6. Reverse recovery time versus dI /dt F versus dI /dt (typical values) (typical values) F IRM(A) trr(ns) 25 500 TVjR==162050°CV IF= 2 x IF(AV) 450 TVjR==162050°CV 20 400 IF= 2 xIF(AV) IF= IF(AV) 350 15 IF=0.5 x IF(AV) 235000 IF=IF(AV) 10 200 150 5 100 IF=0.5 xIF(AV) dIF/dt(A/µs) 50 dIF/dt(A/µs) 0 0 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 Figure 7. R everse recovery charges Figure 8. Softness factor versus dI /dt F versus dI /dt (typical values) (typical values) F Qrr(µC) S factor 2.5 3.0 2.0 TVjR==162050°CV IF= 2 x IF(AV) IFTV=jR=2=1 62x0 5I0F°(CVAV) 2.5 1.5 IF= IF(AV) 2.0 1.0 IF=0.5 x IF(AV) 1.5 0.5 dIF/dt(A/µs) dIF/dt(A/µs) 0.0 1.0 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 Figure 9. R elative variations of dynamic Figure 10. Transient peak forward voltage parameters versus junction versus dI /dt (typical values) F temperature VFP(V) 45 2.0 11..68 Sfactor RefereVInFRc==e 6I:F0T(A0jV=V)125°C 3450 TIFj==1 2IF5(A°VC) 1.4 30 1.2 25 1.0 20 0.8 0.6 IRM 15 0.4 10 tRR 0.2 QRR Tj(°C) 5 dIF/dt(A/µs) 0.0 0 25 50 75 100 125 0 100 200 300 400 500 4/11

STTH810 Characteristics Figure 11. F orward recovery time versus dI /dt Figure 12. Junction capacitance versus F (typical values) reverse voltage applied (typical values) tfr(ns) C(pF) 600 100 IF= IF(AV) F=1MHz 550 VFR=T 1j=.51 2x5V°CFmax. VoscT=j=3205m°VCRMS 500 450 400 10 350 300 250 dIF/dt(A/µs) VR(V) 200 1 0 100 200 300 400 500 1 10 100 1000 F igure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, e = 35 µm) cu Rth(j-a)(°C/W) 80 D²PAK 70 60 50 40 30 20 10 SCU(cm²) 0 0 5 10 15 20 25 30 35 40 5/11

Package information STTH810 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC, TC-220Ins, TO-220FPAC) Maximum torque value: 0.7 Nm (TO-220AC, TO-220Ins, TO-220FPAC) T able 5. T0-220AC dimensions DIMENSIONS REF. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 H2 A C 1.23 1.32 0.048 0.051 Ø I C D 2.40 2.72 0.094 0.107 L5 L7 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 L6 F1 1.14 1.70 0.044 0.066 L2 G 4.95 5.15 0.194 0.202 F1 L9 D H2 10.00 10.40 0.393 0.409 L4 L2 16.40 typ. 0.645 typ. F L4 13.00 14.00 0.511 0.551 M E L5 2.65 2.95 0.104 0.116 G L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. Diam. I 3.75 3.85 0.147 0.151 6/11

STTH810 Package information T able 6. T0-220Ins dimensions DIMENSIONS REF Millimeters Inches Min. Max. Min. Max. A 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 M 2.60 0.102 7/11

Package information STTH810 T able 7. T0-220FPAC dimensions DIMENSIONS REF Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 A B 2.5 2.7 0.098 0.106 H B D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 Dia F 0.75 1 0.030 0.039 L6 F1 1.15 1.70 0.045 0.067 L2 L7 G 4.95 5.20 0.195 0.205 L3 L5 G1 2.4 2.7 0.094 0.106 D F1 H 10 10.4 0.393 0.409 L4 L2 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 F E G1 L4 9.8 10.6 0.386 0.417 G L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 8/11

STTH810 Package information T able 8. D2PAK dimensions DIMENSIONS REF. Millimeters Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A A1 2.49 2.69 0.098 0.106 E C2 A2 0.03 0.23 0.001 0.009 L2 B 0.70 0.93 0.027 0.037 D B2 1.14 1.70 0.045 0.067 L C 0.45 0.60 0.017 0.024 L3 A1 C2 1.23 1.36 0.048 0.054 B2 C R D 8.95 9.35 0.352 0.368 B E 10.00 10.40 0.393 0.409 G G 4.88 5.28 0.192 0.208 A2 2mm min. FLAT ZONE L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 V2 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R 0.40 typ. 0.016 typ. V2 0° 8° 0° 8° Figure 14. D2PAK footprint (all dimensions in mm) 16.90 10.30 5.08 1.30 3.70 8.90 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11

Ordering information STTH810 3 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH810D STTH810D TO-220AC 1.86 g 50 Tube STTH810DI STTH810DI TO-220Ins 1.86 g 50 Tube STTH810FP STTH810FP TO-220FPAC 2.2 g 50 Tube STTH810G STTH810G D2PAK 1.48 g 50 Tube STTH810G-TR STTH810G D2PAK 1.48 g 1000 Tape & reel 4 Revision history Date Revision Description of Changes 02-Mar-2006 1 First issue. 10/11

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