STTH5L06 Turbo 2 ultrafast high voltage rectifier Datasheet - production data A K Description The device is developed using ST's Turbo 2 600 K V technology. It is well-suited as a boost diode, especially for use in continuous mode power factor corrections and hard switching conditions. This device is also intended for use as a free A wheeling diode in power supplies and other A K power switching applications. TO-220AC K TO-220FPAC Table 1: Device summary A Symbol Value IF(AV) 5 A VRRM 600 V DO-201AD IR (max) 125 µA / 150 µA K Tj (max) 175 °C VF (typ) 0.85 V K K trr (typ) 65 ns K K A A NC DPAK NC Features  Ultrafast switching  Low reverse recovery current  Reduces switching losses  Low thermal resistance  Insulated package: TO-220FPAC  Insulation voltage: 2000 V sine RMS  ECOPACK®2 compliant component for DPAK on demand May 2017 DocID8371 Rev 5 1/15 This is information on a product in full production. www.st.com

Characteristics STTH5L06 1 Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V TO-220AC TO-220FPAC 20 IF(RMS) Forward rms current DO-201AD A DPAK 10 TO-220AC, DPAK TC = 150 °C Average forward current IF(AV) δ = 0.5, square wave DO-201AD Tl = 50 °C 5 A TO-220FPAC TC = 135 °C Repetitive peak forward IFRM current tP = 5 μs, F = 5 kHz square 65 A TO-220AC 90 TO-220FPAC Surge non repetitive IFSM forward current tp = 10 ms sinusoidal DO-201AD 110 A DPAK 60 Tstg Storage temperature range -65 to +175 °C Tj Maximum operating junction temperature 175 °C Table 3: Thermal parameter Symbol Parameter Max. value Unit TO-220AC / DPAK 3.5 Rth(j-c) Junction to case °C/W TO-220FPAC 6 Rth(j-l) Junction to lead 20 L = 10 mm, DO-201AD °C/W Rth(j-a) Junction to ambient 75 2/15 DocID8371 Rev 5

STTH5L06 Characteristics Table 4: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C VR = 600 V - 5 Reverse TO-220AC IR(1) leakage TO-220FPAC - 10 125 µA current Tj = 150 °C VR = 600 V DPAK DO-201AD - 25 150 Forward Tj = 25 °C - 1.30 VF(2) voltage drop Tj = 150 °C IF = 5 A - 0.8 5 1.05 V Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.89 x I + 0.033 x I 2 F(AV) F (RMS) Table 5: Dynamic electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IF = 1 A trr Reverse recovery time Tj= 25 °C VR = 30 V - 65 95 ns dIF/dt = -50 A/µs IF = 5 A tfr Forward recovery time VVFFRm =a x1 .1 x - 150 ns Tj= 25 °C dIF/dt = 100 A/µs VFP Forward recovery voltage IdFI F=/d 5t =A 100 A/µs - 7 V DocID8371 Rev 5 3/15

Characteristics STTH5L06 1.1 Characteristics (curves) Figure 1: Conduction losses versus average Figure 2: Forward voltage drop versus forward current current P(W) 7 δ=0.1 δ=0.2 δ=0.5 δ=1.0 δ=0.05 6 5 4 3 2 T 1 δ=tp/T tp 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 IF(AV)(A) Figure 3: Relative variation of thermal impedance Figure 4: Relative variation of thermal impedance junction to case versus pulse duration junction to case versus pulse duration (TO-220AC, DPAK) (TO-220FPAC) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 δ=0.5 0.6 δ=0.5 0.5 0.5 0.4 δ=0.2 0.4 0.3 δ=0.1 0.3 δ=0.2 0.2 T 0.2 δ=0.1 T 0.1 Singlepulse 0.1 0.0 δ=tp/T tp 0.0 Singlepulse δ=tp/T tp 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-03 1.E-02 1.E-01 1.E+00 tp(s) tp(s) Figure 5: Relative variation of thermal impedance Figure 6: Peak reverse recovery current versus junction to ambient versus pulse duration (DO-201AD) dIF/dt (typical values) IRM(A) 1.0Zth(j-a)/Rth(j-a) 8 VR=400V 0.9 EpoxyFR4,Lleads=10mm 7 Tj=125°C IF=2xIF(AV) 0.8 6 IF=IF(AV) 0.7 5 0.6 IF=0.5xIF(AV) δ=0.5 4 0.5 IF=0.25xIF(AV) 0.4 3 0.3 2 0.2 δ=0.2 T δ=0.1 1 0.1 Singlepulse δ=tp/T tp 0 0.0 0 10 20 30 40 50 60 70 80 90 100 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 tp(s) dlF/dt(A/µs) 4/15 DocID8371 Rev 5

STTH5L06 Characteristics Figure 7: Reverse recovery time versus dIF/dt Figure 8: Reverse recovery charges versus dIF/dt (typical values) (typical values) trr(ns) Qrr(nC) 1000 500 900 VTjR==142050°CV 450 VTjR==142050°CV IF=2xIF(AV) 800 400 IF=IF(AV) 700 350 600 IF=2xIF(AV) 300 IF=0.5xIF(AV) 500 IF=IF(AV) 250 IF=0.5xIF(AV) 400 200 300 150 200 100 100 50 0 0 0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100 dlF/dt(A/µs) dlF/dt(A/µs) Figure 9: Softness factor versus dIF/dt Figure 10: Relative variations of dynamic (typical values) parameters versus junction temperature Sfactor 1.25 2.4 Sfactor 2.2 IVFR==IF4(A0V0)V 1.00 2.0 Tj=125°C 1.8 IRM 0.75 1.6 Qrr 1.4 1.2 0.50 1.0 0.8 0.25 0.6 IF=IF(AV) 0.4 RefereVnRc=e:4T0j0=V125°C 0.00 0.2 25 50 75 100 125 0 10 20 30 40 50 60 70 80 90 100 dIF/dt(A/µs) Tj(°C) Figure 11: Transient peak forward voltage versus Figure 12: Forward recovery time versus dIF/dt dIF/dt (typical values) (typical values) VFP(V) tfr(ns) 10 200 9 TIFj==1IF2(5AV°C) 180 VFR=I1F.1=xIFV(AFV)max. 8 160 Tj=125°C 7 140 6 120 5 100 4 80 3 60 2 40 1 20 0 0 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 dlF/dt(A/µs) dIF/dt(A/µs) DocID8371 Rev 5 5/15

Characteristics STTH5L06 Figure 13: Junction capacitance versus reverse Figure 14: Thermal resistance junction to ambient voltage applied (typical values) versus copper surface under tab C(pF) 100 F=1MHz VOSC=30mV Tj=25°C 10 1 1 10 100 1000 VR(V) Figure 15: Thermal resistance junction to ambient versus copper surface under each lead Rth(j-a)(°C/W) 80 EpoxyprintedboardFR4,copperthickness=35µm 70 60 DO-201AD 50 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Scu(cm²) 6/15 DocID8371 Rev 5

STTH5L06 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.  Cooling method: by conduction (C)  Epoxy meets UL 94,V0  Recommended torque value: 0.55 N·m (for TO-220FPAC / TO-220AC)  Maximum torque value: 0.7 N·m (for TO-220FPAC / TO-220AC) 2.1 TO-220AC package information Figure 16: TO-220AC package outline DocID8371 Rev 5 7/15

Package information STTH5L06 Table 6: TO-220AC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. ØI 3.75 3.85 0.147 0.151 8/15 DocID8371 Rev 5

STTH5L06 Package information 2.2 TO-220FPAC package information Figure 17: TO-220FPAC package outline A H B Dia L6 L2 L7 L3 D F1 L4 F E G1 G DocID8371 Rev 5 9/15

Package information STTH5L06 Table 7: TO-220FPAC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 B 2.50 2.70 0.098 0.106 D 2.50 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1.00 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.40 2.70 0.094 0.106 H 10.00 10.40 0.393 0.409 L2 16.00 typ. 0.630 typ. L3 28.60 30.60 0.126 1.205 L4 9.80 10.60 0.386 0.417 L6 15.90 16.40 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 10/15 DocID8371 Rev 5

STTH5L06 Package information 2.3 DO-201AD package information Figure 18: DO-201AD package outline Table 8: DO-201AD package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 9.50 0.374 B 25.40 1.000 ØC 5.30 0.209 ØD 1.30 0.051 E 1.25 0.049 DocID8371 Rev 5 11/15

Package information STTH5L06 2.4 DPAK package information Figure 19: DPAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 12/15 DocID8371 Rev 5

STTH5L06 Package information Table 9: DPAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° Figure 20: DPAK recommended footprint (dimensions in mm) DocID8371 Rev 5 13/15

Ordering information STTH5L06 3 Ordering information Table 10: Ordering information Order code Marking Package Weight Base qty Delivery mode STTH5L06 STTH5L06 600 Ammopack DO-201AD 1.12 g STTH5L06RL STTH5L06 1900 Tape and reel STTH5L06D STTH5L06D TO-220AC 1.9 g 50 Tube STTH5L06B-TR STTH5 L06B DPAK 0.32 g 2500 Tape and reel STTH5L06FP STTH5L06FP TO-220FPAC 1.9 g 50 Tube 4 Revision history Table 11: Document revision history Date Revision Changes 16-Nov-2001 1 First issue. 31-Mar-2007 2 Merged with TO-220AC, TO-220FPAC and DPAK version. 26-Nov-2014 3 Updated DPAK and reformatted to current standard. 05-Dec-2014 4 Updated Features. 17-May-2017 5 Updated DPAK package information and reformatted to current standard. 14/15 DocID8371 Rev 5

STTH5L06 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID8371 Rev 5 15/15

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