STTH512 Ultrafast recovery - 1200 V diode Datasheet - production data Description (cid:36) (cid:46) The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic (cid:46) ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial (cid:36) power supplies, motor control, and similar (cid:36) (cid:46) mission-critical systems that require rectification and freewheeling. These diodes also fit into (cid:55)(cid:50)(cid:16)(cid:21)(cid:21)(cid:19)(cid:36)(cid:38) (cid:46) (cid:55)(cid:50)(cid:16)(cid:21)(cid:21)(cid:19)(cid:41)(cid:51)(cid:36)(cid:38) auxiliary functions such as snubber, bootstrap, and demagnetization applications. (cid:46) (cid:46) The improved performance in low leakage current, and therefore thermal runaway guard (cid:49)(cid:38) band, is an immediate competitive advantage for this device. (cid:49)(cid:38) (cid:36) (cid:36) Table 1. Device summary (cid:39)(cid:51)(cid:36)(cid:46) Symbol Value I 5 A Features F(AV) V 1200 V RRM  Ultrafast, soft recovery T(max) 175 °C j  Very low conduction and switching losses V (typ) 1.25 V F  High frequency and/or high pulsed current t (typ) 48 ns operation rr  High reverse voltage capability  High junction temperature  ECOPACK®2 compliant component for DPAK on demand  Insulated package: TO-220FPAC – Insulated voltage: 2000 V sine RMS February 2016 DocID12154 Rev 3 1/13 This is information on a product in full production. www.st.com

Characteristics STTH512 1 Characteristics T a ble 2. Absolute ratings (limiting values at 25 °C, unless otherwise stated) Symbol Parameter Value Unit V Repetitive peak reverse voltage 1200 V RRM TO-220AC / TO-220FPAC 30 I RMS forward current A F(RMS) DPAK 10 Average forward current, δ = 0.5, square TO-220AC / DPAK Tc = 145° C I 5 A F(AV) wave TO-220FPAC T = 105° C c I Repetitive peak forward current t = 5 µs, F = 5 kHz square 60 A FRM p I Surge non repetitive forward current t = 10 ms Sinusoidal 55 A FSM p T Storage temperature range -65 to + 175 °C stg T Maximum operating junction temperature 175 °C j Table 3. Thermal resistance Symbol Parameter Value Unit TO-220AC / DPAK 2.5 R Junction to case °C/W th(j-c) TO-220FPAC 5.8 Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit T = 25° C 5 I (1) Reverse leakage current j V = V µA R R RRM T = 125° C 3 30 j T = 25° C 2.20 j V (2) Forward voltage drop T = 125° C I = 5 A 1.30 2.00 V F j F T = 150° C 1.25 1.90 j 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.5 x I + 0.08 I 2 F(AV) F (RMS) 2/13 DocID12154 Rev 3

STTH512 Characteristics Table 5. Dynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I = 1 A, dI /dt = -50 A/µs, F F 95 V = 30 V, T = 25 °C R j t Reverse recovery time ns rr I = 1 A, dI /dt = -100 A/µs, F F 48 70 V = 30 V, T = 25 °C R j I = 5 A, dI /dt = -200 A/µs, I Reverse recovery current F F 11 16 A RM V = 600 V, T = 125 °C R j I = 5 A, dI /dt = -200 A/µs, S Softness factor F F 2 V = 600 V, T = 125 °C R j I = 5 A dI /dt = 50 A/µs t Forward recovery time F F 400 ns fr V = 1.5 x V , T = 25 °C FR Fmax j I = 5 A, dI /dt = 50 A/µs, F F V Forward recovery voltage 9.5 V FP T = 25 °C j Figure 1. Conduction losses versus average Figure 2. Forward voltage drop versus forward current current P(W) IFM(A) 13 δ= 0.1 δ= 0.2 δ= 0.5 δ= 1 50 12 45 11 δ= 0.05 Tj=150°C 10 40 (typical values) 9 35 8 30 7 6 25 (maxiTmj=u2m5 °vCalues) 5 20 Tj=150°C 4 15 (maximum values) 3 T 10 2 1 IF(AV)(A) δ=tp/T tp 5 VFM(V) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 3. Relative variation of thermal Figure 4. Relative variation of thermal impedance junction to case versus pulse impedance junction to case versus pulse duration duration Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 Single pulse Single pulse 0.9 TO-220AC 0.9 TO-220FPAC DPAK 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 tp(s) 0.1 tp(s) 0.0 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 DocID12154 Rev 3 3/13 13

Characteristics STTH512 Figure 5. Peak reverse recovery current versus Figure 6. Reverse recovery time versus dI /dt F dI /dt (typical values) (typical values) F IRM(A) trr(ns) 28 600 2246 VTjR==162050°CV 550500 VTjR==162050°CV 22 IF=2 x IF(AV) 450 20 400 18 16 IF=0.5 x IF(AV) IF=IF(AV) 350 IF=2 x IF(AV) 14 300 IF=IF(AV) IF=0.5 x IF(AV) 12 250 10 200 8 150 6 4 100 2 dIF/dt(A/µs) 50 dIF/dt(A/µs) 0 0 0 100 200 300 400 500 0 100 200 300 400 500 Figure 7. Reverse recovery charges versus Figure 8. Softness factor versus dI /dt (typical F dI /dt (typical values) values) F Qrr(nC) S factor 2000 4.0 1800 VTjR==162050°CV IVFR≤=26x0I0FV(AV) 3.5 Tj=125°C 1600 IF=2 x IF(AV) 1400 3.0 1200 IF=IF(AV) 2.5 1000 IF=0.5 x IF(AV) 2.0 800 600 1.5 400 1.0 200 dIF/dt(A/µs) dIF/dt(A/µs) 0 0.5 0 100 200 300 400 500 0 100 200 300 400 500 Figure 9. Relative variations of dynamic Figure 10. Transient peak forward voltage parameters versus junction temperature versus dI /dt (typical values) F VFP(V) 2.25 50 2.00 RefereVInFRc==eI6F:0(TA0Vj=V)125°C 45 ITFj==I1F2(A5V°)C 1.75 40 Sfactor 1.50 35 1.25 30 1.00 25 0.75 trr 20 IRM 15 0.50 0.25 QRR Tj(°C) 10 5 0.00 dIF/dt(A/µs) 25 50 75 100 125 0 0 50 100 150 200 250 300 4/13 DocID12154 Rev 3

STTH512 Characteristics Figure 11. Forward recovery time versus Figure 12. Junction capacitance versus reverse dI /dt (typical values) voltage applied (typical values) F tfr(ns) C(pF) 700 100 IF=IF(AV) F=1MHz VFR=1.5 xVFmax. VOSC=30mVRMS Tj=125°C Tj=25°C 600 500 10 400 300 dIF/dt(A/µs) VR(V) 200 1 0 50 100 150 200 250 300 350 400 450 500 1 10 100 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (cid:53) (cid:11)(cid:131)(cid:38)(cid:18)(cid:58)(cid:12)(cid:3) (cid:87)(cid:75)(cid:11)(cid:77)(cid:16)(cid:68)(cid:12) (cid:20)(cid:19)(cid:19) (cid:28)(cid:19) (cid:40)(cid:83)(cid:82)(cid:91)(cid:92)(cid:3)(cid:83)(cid:85)(cid:76)(cid:81)(cid:87)(cid:72)(cid:71)(cid:3)(cid:69)(cid:82)(cid:68)(cid:85)(cid:71)(cid:3)(cid:41)(cid:53)(cid:23)(cid:15)(cid:3)(cid:70)(cid:82)(cid:83)(cid:83)(cid:72)(cid:85)(cid:3)(cid:87)(cid:75)(cid:76)(cid:70)(cid:78)(cid:81)(cid:72)(cid:86)(cid:86)(cid:3)(cid:32)(cid:3)(cid:22)(cid:24)(cid:3)(cid:151)(cid:80) (cid:39)(cid:51)(cid:36)(cid:46) (cid:27)(cid:19) (cid:26)(cid:19) (cid:25)(cid:19) (cid:24)(cid:19) (cid:23)(cid:19) (cid:22)(cid:19) (cid:21)(cid:19) (cid:20)(cid:19) (cid:54) (cid:11)(cid:70)(cid:80)(cid:240)(cid:12) (cid:38)(cid:56) (cid:19) (cid:19) (cid:24) (cid:20)(cid:19) (cid:20)(cid:24) (cid:21)(cid:19) (cid:21)(cid:24) (cid:22)(cid:19) (cid:22)(cid:24) (cid:23)(cid:19) DocID12154 Rev 3 5/13 13

Package information STTH512 2 Package information  Epoxy meets UL94, V0  Cooling method: by conduction (C)  Recommended torque values: 0.55 N·m for TO-220AC and TO-220FPAC  Maximum torque value: 0.7 N·m for TO-220AC and TO-220FPAC In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 TO-220AC package information Figure 14. TO-220AC package outline H2 A Ø I C L5 L7 L6 L2 D F1 L9 L4 F M E G 6/13 DocID12154 Rev 3

STTH512 Package information Table 6. TO-220AC package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.60 typ. 0.102 typ. Diam. I 3.75 3.85 0.147 0.151 DocID12154 Rev 3 7/13 13

Package information STTH512 2.2 TO-220FPAC package information Figure 15. TO-220FPAC package outline A H B Dia L6 L2 L7 L3 D F1 L4 F E G1 G 8/13 DocID12154 Rev 3

STTH512 Package information Table 7. TO-220FPAC package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 B 2.50 2.70 0.098 0.106 D 2.50 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1.00 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.40 2.70 0.094 0.106 H 10.00 10.40 0.393 0.409 L2 16.00 Typ. 0.630 Typ. L3 28.60 30.60 1.126 1.205 L4 9.80 10.60 0.386 0.417 L6 15.90 16.40 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 DocID12154 Rev 3 9/13 13

Package information STTH512 2.3 DPAK package information Figure 16. DPAK package outline (cid:40) (cid:36) (cid:69)(cid:23) (cid:70)(cid:21) (cid:55)(cid:75)(cid:72)(cid:85)(cid:80)(cid:68)(cid:79)(cid:3)(cid:83)(cid:68)(cid:71) (cid:40)(cid:20) (cid:47)(cid:21) (cid:39)(cid:20) (cid:39) (cid:43) (cid:53) (cid:47)(cid:23) (cid:36)(cid:20) (cid:69) (cid:53) (cid:72) (cid:72)(cid:20) (cid:70) (cid:36)(cid:21) (cid:47)(cid:20) (cid:47) (cid:57)(cid:21) (cid:42)(cid:68)(cid:88)(cid:74)(cid:72) (cid:19)(cid:17)(cid:21)(cid:24) (cid:83)(cid:79)(cid:68)(cid:81)(cid:72) Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 10/13 DocID12154 Rev 3

STTH512 Package information Table 8. DPAK package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.214 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.264 E1 4.32 5.50 0.170 0.216 e 2.28 0.090 e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.00 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° 8° Figure 17. Footprint (dimensions in mm) (cid:25)(cid:17)(cid:26) (cid:22)(cid:17)(cid:19) (cid:22)(cid:17)(cid:19) (cid:36) (cid:23)(cid:17)(cid:24)(cid:26)(cid:21) (cid:25)(cid:17)(cid:26) (cid:37) (cid:20)(cid:17)(cid:25) (cid:55)(cid:75)(cid:72)(cid:3)(cid:71)(cid:72)(cid:89)(cid:76)(cid:70)(cid:72)(cid:3)(cid:80)(cid:88)(cid:86)(cid:87)(cid:3)(cid:69)(cid:72)(cid:3)(cid:83)(cid:82)(cid:86)(cid:76)(cid:87)(cid:76)(cid:82)(cid:81)(cid:72)(cid:71)(cid:3)(cid:90)(cid:76)(cid:87)(cid:75)(cid:76)(cid:81) (cid:19)(cid:17)(cid:19)(cid:24) (cid:36)(cid:37) DocID12154 Rev 3 11/13 13

Ordering information STTH512 3 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode STTH512D STTH512D TO-220AC 1.86 g 50 Tube STTH512FP STTH512FP TO-220FPAC 1.9 g 50 Tube STTH512B-TR STTH512B DPAK 0.32 g 2500 Tape and reel 4 Revision history Table 10. Document revision history Date Revision Changes 02-Mar-2006 1 First issue. Updated DPAK package information and reformatted to current 26-Nov-2014 2 standard. Updated DPAK package information and reformatted to current 24-Feb-2016 3 standard. 12/13 DocID12154 Rev 3

STTH512 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID12154 Rev 3 13/13 13

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