STTH3R06 ® TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER Table 1: Main Product Characteristics I 3 A F(AV) A K V 600 V RRM I (max) 100 µA R T 175°C j V (typ) 1.0 V F t (typ) 35 ns rr FEATURES AND BENEFITS DO-201AD ■ Ultrafast switching STTH3R06 ■ Low forward voltage drop ■ Low thermal resistance ■ Low leakage current (platinium doping) DESCRIPTION The STTH3R06, which is using ST Turbo 2 600V technology, is specially suited for use in switching SMB SMC power supplies, inverters and as a free wheeling STTH3R06U STTH3R06S diode. Table 2: Order Codes Part Number Marking STTH3R06 STTH3R06 STTH3R06RL STTH3R06 STTH3R06U 3R6U STTH3R06S R6S September 2005 REV. 3 1/9

STTH3R06 Table 3: Absolute Ratings (limiting values) Symbol Parameter Value Unit V Repetitive peak reverse voltage 600 V RRM I RMS forward current 10 A F(RMS) I Average forward current DO-201AD Tl = 80°C 3 A F(AV) δ = 0.5 SMB Tl = 55°C SMC Tl = 80°C I Surge non repetitive forward current DO-201AD tp = 10ms 55 A FSM SMB / SMC sinusoidal 45 T Storage temperature range -65 to + 175 °C stg T Maximum operating junction temperature 175 °C j Table 4: Thermal Parameters Symbol Parameter Maximum Unit R Junction to lead DO-201AD L = 10 mm 20 °C/W th(j-l) SMB 25 SMC 20 R Junction to ambient (see fig. 13) DO-201AD L = 10 mm 75 °C/W th(j-a) Table 5: Static Electrical Characteristics Symbol Parameter Test conditions Min. Typ Max. Unit I Reverse leakage current T = 25°C V = V 3 µA R j R RRM T = 150°C 15 100 j V Forward voltage drop T = 25°C I = 3A 1.7 V F j F T = 150°C 1.0 1.25 j 2 To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.09 IF (RMS) Table 6: Dynamic Characteristics Symbol Parameter Test conditions Min. Typ Max. Unit t Reverse recovery T = 25°C I = 0.5A I = 0.25A I = 1A 30 ns rr j F RR R time I = 1A dI /dt = -50 A/µs V =30V 35 F F R t Forward recovery T = 25°C I = 3A dI /dt = 100 A/µs 100 ns fr j F F time V = 1.1 x V FR Fmax V Forward recovery I = 3A dI /dt = 100 A/µs 10 V FP F F voltage 2/9

STTH3R06 Figure 1: Conduction losses versus average Figure 2: Forward voltage drop versus forward current current P(W) IFM(A) 5.0 50 δ= 0.1 δ= 0.2 δ= 0.5 4.5 δ= 0.05 45 Tj=150°C 4.0 δ= 1 40 (maximum values) 3.5 35 3.0 30 Tj=150°C (typical values) 2.5 25 Tj=25°C (maximum values) 2.0 20 1.5 T 15 1.0 10 0.5 IF(AV)(A) δ=tp/T tp 5 VFM(V) 0.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Figure 3: Relative variation of thermal impedance Figure 4: Peak reverse recovery current junction ambient versus pulse duration (epoxy versus dI /dt (typical values) F printed circuit FR4, L = 10mm, S =1cm2) leads CU Zth(j-a)/Rth(j-a) IRM(A) 1.0 13 12 VR=400V 0.9 11 Tj=125°C IF=2 x IF(AV) 0.8 10 0.7 9 IF=IF(AV) 0.6 8 IF=0.5 x IF(AV) SMC 7 0.5 SCu= 1cm2 6 IF=0.25 x IF(AV) 0.4 SMB 5 0.3 SCu= 1cm2 4 DO-201AD 0.2 Single pulse Lleads= 10mm 3 2 0.1 tp(s) 1 dIF/dt(A/µs) 0.0 0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0 50 100 150 200 250 300 350 400 450 500 Figure 5: Reverse recovery time versus dI /dt Figure 6: Reverse recovery charges versus F (typical values) dI /dt (typical values) F trr(ns) Qrr(nC) 160 450 114500 VTjR==142050°CV 400 VTjR==142050°CV 130 350 IF=2 x IF(AV) 120 IF=2 x IF(AV) 110 300 100 90 IF=IF(AV) IF=0.5 x IF(AV) 250 IF=IF(AV) 80 70 200 60 IF=0.5 x IF(AV) 50 150 40 100 30 20 50 10 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 3/9

STTH3R06 Figure 7: Softness factor versus d /dt (typical Figure 8: Relative variations of dynamic IF values) parameters versus junction temperature S factor 3.0 1.0 IF=IF(AV) 0.9 Sfactor 2.5 TVjR==142050°CV 0.8 IRM 0.7 2.0 0.6 QRR 0.5 1.5 0.4 1.0 0.3 0.2 VIFR==I4F0(A0VV) 0.5 0.1 Tj(°C) Reference:Tj=125°C dIF/dt(A/µs) 0.0 0.0 25 50 75 100 125 0 50 100 150 200 250 300 350 400 450 500 Figure 9: Transient peak forward voltage Figure 10: Forward recovery time versus dI /dt F versus dI /dt (typical values) (typical values) F VFP(V) tfr(ns) 20 200 18 ITFj==I1F2(A5V°)C 180 VFR=T1IFj.=1=1 Ix2F(5VA°VFC)max. 16 160 14 140 12 120 10 100 8 80 6 60 4 40 2 dIF/dt(A/µs) 20 dIF/dt(A/µs) 0 0 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 Figure 11: Junction capacitance versus Figure 12: Thermal resistance junction to reverse voltage applied (typical values) ambient versus copper surface under lead (epoxy FR4, e =35µm) (DO-201AD) CU C(pF) Rth(j-a)(°C/W) 100 80 F=1MHz VOSCT=j=3205m°CVRMS 70 60 DO-201AD 50 10 40 30 20 10 VR(V) SCU(cm²) 1 0 1 10 100 1000 0 1 2 3 4 5 6 7 8 9 10 4/9

STTH3R06 Figure 13: Thermal resistance junction to Figure 14: Thermal resistance versus lead ambient versus copper surface under lead length (epoxy FR4, e =35µm) (SMB / SMC) CU Rth(j-a)(°C/W) Rth(°C/W) 110 100 DO-201AD 100 90 90 80 Rth(j-a) 80 70 SMB 70 60 60 SMC 50 50 40 40 Rth(j-l) 30 30 20 20 10 SCU(cm²) 10 Llead(mm) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25 5/9

STTH3R06 Figure 15: SMB Package Mechanical Data DIMENSIONS REF. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 D A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 E c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 A1 E1 4.05 4.60 0.159 0.181 C A2 D 3.30 3.95 0.130 0.156 L b L 0.75 1.60 0.030 0.063 Figure 16: SMB Foot Print Dimensions (in millimeters) 2.3 1.52 2.75 1.52 6/9

STTH3R06 Figure 17: SMC Package Mechanical Data DIMENSIONS REF. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 D A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E E 7.75 8.15 0.305 0.321 A1 E1 6.60 7.15 0.260 0.281 C A2 E2 4.40 4.70 0.173 0.185 L b D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 Figure 18: SMC Foot Print Dimensions (in millimeters) 3.3 2.0 4.2 2.0 7/9

STTH3R06 Figure 19: DO-201AD Package Mechanical Data DIMENSIONS B A B ØC REF. Millimeters Inches Min. Max. Min. Max. note 1 E E note 1 A 9.50 0.374 B 25.40 1.000 C 5.30 0.209 D 1.30 0.051 ØD ØD E 1.25 0.049 1 - The lead diameter ø D is not controlled over zone E note 2 2 - The minimum axial length within which the device NOTES may be placed with its leads bent at right angles is 0.59"(15 mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 7: Ordering Information Delivery Ordering type Marking Package Weight Base qty mode STTH3R06 STTH3R06 DO-201AD 1.12 g 600 Ammopack STTH3R06-RL STTH3R06 DO-201AD 1.12 g 1900 Tape & reel STTH3R06U 3R6U SMB 0.11 g 2500 Tape & reel STTH3R06S R6S SMC 0.243 g 2500 Tape & reel ■ Epoxy meets UL94, V0 ■ Band indicated cathode (DO-201AD) ■ Bending method: see application note AN1471 (DO-201AD) Table 8: Revision History Date Revision Description of Changes March-2003 1 First issue 07-Sep-2004 2 SMB and SMC packages added 14-Oct-2005 3 Changed marking of STTH3R06U from R06U to 3R6U on page 1. Added ECOPACK statement. 8/9

STTH3R06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9

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