STTH3L06 Turbo 2 ultrafast high voltage rectifier Datasheet - production data Description A K This device uses ST Turbo 2 600 V technology, and is particularly suited as boost diode in A A discontinuous or critical mode power factor corrections. KSMB K It is also intended for use as a freewheeling diode SMC in power supplies and other power switching applications. Table 1: Device summary DO-201AD Symbol Value IF(AV) 3 A VRRM 600 V Features IR (max.) 100 µA  Ultrafast switching Tj (max.) 175 °C  Low forward voltage drop VF (typ.) 0.85 V  Low thermal resistance trr (typ.) 60 ns  Low leakage current (platinum doping) Table 2: Order codes Part number Marking STTH3L06 STTH3L06 STTH3L06U 3L6U STTH3L06S S06 April 2016 DocID8322 Rev 4 1/11 This is information on a product in full production. www.st.com

Characteristics STTH3L06 1 Characteristics Table 3: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms current 10 A Average forward current δ = DO-201AD/SMC TI = 100 °C IF(AV) 0.5, square wave SMB TI = 80 °C 3 A IFSM Ssiunrugseo indoanl repetitive forward current, tp = 10 ms DSMO-B2/0S1MACD 7600 AA Tstg Storage temperature range -65 to +175 °C Tj Maximum operating junction temperature +175 °C Table 4: Thermal parameters Symbol Parameter Maximum Unit DO-201AD L = 10 mm 20 Rth(j-l) Junction to lead SMB 25 °C/W SMC 20 Rth(j-a) Junction to ambient DO-201AD L = 10 mm 75 Table 5: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 3 IR Reverse leakage current VR = VRRM µA Tj = 150 °C - 15 100 Tj = 25 °C - 1.3 VF Forward voltage drop IF = 3 A V Tj = 150 °C - 0.85 1.05 To evaluate the conduction losses use the following equation: P = 0.89 x I + 0.055 I 2 F(AV) F (RMS) Table 6: Dynamic characteristics Symbol Parameters Test conditions Min. Typ. Max. Unit trr Rreecvoevresrey time Tj = 25 °C IVFR = = 1 3 A0; Vd IF/dt = -50 A/μs; - 60 85 ns tfr Freocrowvaerrdy time IAF/ μ=s 3; VAF; Rd =IF /1d.t1 = x 1 V0F0m ax - 100 Forward Tj = 25 °C VFP recovery IF = 3 A; dlF/dt = 100 A/µs - 7.5 V voltage 2/11 DocID8322 Rev 4

STTH3L06 Characteristics 1.1 Characteristics (curves) Figure 1: Conduction losses versus average Figure 2: Forward voltage drop versus forward current current IFM(A) 1.E+02 P(W) 4.5 4.0 δ=0.05 δ=0.1 δ=0.2 δ=0.5 δ=1 (MaTxijm=u1m50v°aClues) 3.5 1.E+01 Tj=150°C 3.0 (Typicalvalues) 2.5 1.E+00 2.0 Tj=25°C (Maximumvalues) 1.5 1.0 T 1.E-01 0.5 IF(AV)(A) δ=tp/T tp 0.0 VFM(V) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1.E-02 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Figure 3: Relative variation of thermal impedance Figure 4: Peak reverse recovery current versus junction ambient versus pulse duration dIF/dt (typical values) (epoxy printed circuit FR4, eCU = 35 µm) IRM(A) 20 1.0 Zth(j-a)/Rth(j-a) 18 TVjR==142050°CV 0.9 LDleOad-s2=0110AmDm 16 IF=2xIF(AV) 0.8 14 IF=IF(AV) 0.7 0.6 12 IF=0.5xIF(AV) 0.5 10 0.4 8 IF=0.25xIF(AV) 0.3 6 0.2 0.1 Singlepulse tP(s) 4 2 0.0 dIF/dt(A/µs) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0 0 50 100 150 200 250 300 350 400 450 500 Figure 5: Reverse recovery time versus dIF/dt Figure 6: Reverse recovery charges versus dIF/ dt (typical values) (typical values) 700 tRR(ns) 500 QRR(nC) 600 TVjR==142050°CV 450 TVjR==142050°CV IF=2xIF(AV) 400 500 350 IF=IF(AV) 400 IF=2xIF(AV) 300 IF=0.5xIF(AV) IF=IF(AV) 250 300 IF=0.5xIF(AV) 200 200 150 100 100 50 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 DocID8322 Rev 4 3/11

Characteristics STTH3L06 Figure 7: Softness factor versus dIF/dt (typical Figure 8: Relative variations of dynamic values) parameters versus junction temperature Sfactor 2.0 1.8 VIRF==4IF0(A0V)V Tj=125°C 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 dIF/dt(A/µs) 0.0 0 20 40 60 80 100 120 140 160 180 200 Figure 9: Transient peak forward voltage versus Figure 10: Forward recovery time versus dIF/dt dIF/dt (typical values) (typical values) VFP(V) tfr(ns) 10 200 9 TjIF==1I2F(5AV°)C 180 IVFF=RI=F(1A.V1)xVFmax. 8 160 Tj=125°C 7 140 6 120 5 100 4 80 3 60 2 40 1 dIF/dt(A/µs) 20 dlF/dt(A/µs) 0 0 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 Figure 11: Thermal resistance junction to ambient Figure 12: Thermal resistance versus lead length versus copper surface under lead (epoxy FR4, eCU = 35 μm) (SMB / SMC) Rth(j-a)(C°/W) Rth(°C/W) 100 100 90 90 DO-201AD 80 SMB 80 Rth(j-a) 70 70 60 60 SMC 50 50 40 40 Rth(j-l) 30 30 20 20 10 SCu(cm²) 10 Lleads(mm) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25 4/11 DocID8322 Rev 4

STTH3L06 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.  Epoxy meets UL94, V0  Band indicated cathode (DO-201AD)  Bending method: see application note AN1471 (DO-201AD) 2.1 DO-201AD package information Figure 13: DO-201AD package outline Table 7: DO-201AD package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 9.5 0.3740 B 25.4 1.000 C 5.3 0.2087 D 1.3 0.0512 E 1.25 0.0492 DocID8322 Rev 4 5/11

Package information STTH3L06 2.2 SMC package information Figure 14: SMC package outline Table 8: SMC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 E2 4.40 4.70 0.1732 0.1850 L 0.75 1.50 0.0295 0.0591 6/11 DocID8322 Rev 4

STTH3L06 Package information Figure 15: SMC recommended footprint 1.54 5.11 1.54 (0.061) (0.201) (0.061) 3.14 (0.124) 8.19 (0.323) millimeters (inches) DocID8322 Rev 4 7/11

Package information STTH3L06 2.3 SMB package information Figure 16: SMB package outline Table 9: SMB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 8/11 DocID8322 Rev 4

STTH3L06 Package information Figure 17: SMB recommended footprint 1.62 2.60 1.62 0.064 (0.102) 0.064 2.18 (0.086) 5.84 (0.230) millimeters (inches) DocID8322 Rev 4 9/11

Ordering information STTH3L06 3 Ordering information Table 10: Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH3L06 STTH3L06 600 Ammopack DO-201AD 1.12 g STTH3L06-RL STTH3L06 1900 Tape and reel STTH3L06U 3L6U SMB 0.11 g 2500 Tape and reel STTH3L06S S06 SMC 0.243 g 2500 Tape and reel 4 Revision history Table 11: Document revision history Date Revision Changes October-2001 1 First issue 07-Sep-2004 2 SMB, SMC and DPAK packages added. Changed marking of STTH3L06U from 3L06U to 3L6U. 14-Oct-2005 3 Added ECOPACK statement. Removed DPAK package information. 29-Apr-2016 4 Minor text changes 10/11 DocID8322 Rev 4

STTH3L06 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID8322 Rev 4 11/11

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