STTH3012 Ultrafast recovery - 1200 V diode Main product characteristics A K I 30 A F(AV) V 1200 V RRM T 175° C j A V (typ) 1.30 V F K t (typ) 57 ns rr DO-247 STTH3012W Features and benefits ■ Ultrafast, soft recovery ■ Very low conduction and switching losses A ■ High frequency and/or high pulsed current operation K ■ High reverse voltage capability TO-220AC STTH3012D ■ High junction temperature Description The high quality design of this diode has Order codes produced a device with low leakage current, regularly reproducible characteristics and intrinsic Part Number Marking ruggedness. These characteristics make it ideal for heavy duty applications that demand long term STTH3012D STTH3012D reliability. STTH3012W STTH3012W Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. March 2006 Rev 1 1/9 www.st.com 9

Characteristics STTH3012 1 Characteristics Table 1. A bsolute ratings (limiting values at 25° C, unless otherwise specified) Symbol Parameter Value Unit V Repetitive peak reverse voltage 1200 V RRM I RMS forward current 50 A F(RMS) I Average forward current, δ = 0.5 T = 105° C 30 A F(AV) c I Repetitive peak forward current t = 5 µs, F = 5 kHz square 300 A FRM p I Surge non repetitive forward current t = 10 ms Sinusoidal 210 A FSM p T Storage temperature range -65 to + 175 °C stg T Maximum operating junction temperature 175 °C j Table 2. T hermal parameters Symbol Parameter Value Unit R Junction to case 0.95 °C/W th(j-c) Table 3. S tatic electrical characteristics Symbol Parameter Test conditions Min. Typ Max. Unit T = 25° C 20 I (1) Reverse leakage current j V = V µA R R RRM T = 125° C 15 150 j T = 25° C 2.1 j T = 125° C I = 25 A 1.25 1.9 j F T = 150° C 1.20 1.8 V (2) Forward voltage drop j V F T = 25° C 2.25 j T = 125° C I = 30 A 1.35 2.05 j F T = 150° C 1.30 1.95 j 1. Pulse test: t = 5 ms, δ < 2 % p 2. Pulse test: t = 380 µs, δ < 2 % p To evaluate the conduction losses use the following equation: P = 1.60 x I + 0.012 I 2 F(AV) F (RMS) 2/9

STTH3012 Characteristics Table 4. D ynamic characteristics Symbol Parameter Test conditions Min. Typ Max. Unit I = 1 A, dI /dt = -50 A/µs, F F 115 V = 30 V, T = 25° C R j t Reverse recovery time ns rr I = 1 A, dI /dt = -100 A/µs, F F 57 80 V = 30 V, T = 25° C R j I = 30 A, dI /dt = -200 A/µs, I Reverse recovery current F F 25 35 A RM V = 600 V, T = 125° C R j I = 30 A, dI /dt = -200 A/µs, S Softness factor F F 1.5 V = 600 V, T = 125° C R j I = 30 A dI /dt = 100 A/µs t Forward recovery time F F 550 ns fr V = 1.5 x V , T = 25° C FR Fmax j I = 30 A, dI /dt = 100 A/µs, F F V Forward recovery voltage 6 V FP T = 25° C j Figure 1. Conduction losses versus Figure 2. Forward voltage drop versus average current forward current P(W) IFM(A) 80 120 70 δ= 0.2 δ= 0.5 110 δ= 0.1 100 60 90 (typTijc=a1l5 v0a°lCues) 50 δ= 0.05 δ= 1 80 70 40 60 Tj= 25°C (maximum values) 50 30 40 Tj=150°C 20 T 30 (maximum values) 20 10 IF(AV)(A) δ=tp/T tp 10 VFM(V) 0 0 0 5 10 15 20 25 30 35 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 3/9

Characteristics STTH3012 Figure 3. R elative variation of thermal Figure 4. Peak reverse recovery current impedance junction to case versus dI /dt (typical values) F versus pulse duration Zth(j-c)/Rth(j-c) IRM(A) 1.0 60 0.9 55 VTjR==162050°CV 50 0.8 0.7 45 IF=2 x IF(AV) 40 0.6 35 IF=IF(AV) 0.5 30 IF=0.5 x IF(AV) 0.4 25 20 0.3 Single pulse 15 0.2 10 0.1 tp(s) 5 dIF/dt(A/µs) 0.0 0 1.E-03 1.E-02 1.E-01 1.E+00 0 50 100 150 200 250 300 350 400 450 500 Figure 5. R everse recovery time versus Figure 6. Reverse recovery charges versus dI /dt (typical values) dI /dt (typical values) F F trr(ns) Qrr(µC) 800 8 VTjR==162050°CV 7 VTjR==162050°CV 700 IF=2 x IF(AV) 6 IF=2 x IF(AV) 600 5 IF=IF(AV) IF=IF(AV) 500 4 IF=0.5 x IF(AV) 3 IF=0.5 x IF(AV) 400 2 300 1 dIF/dt(A/µs) dIF/dt(A/µs) 200 0 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 Figure 7. Softness factor versus dI /dt Figure 8. Relative variations of dynamic F (typical values) parameters versus junction temperature S factor 3.0 2.00 ITVFjR=≤=1262x05I0°FCV(AV) 1.75 Sfactor RefereVInFRc==eI6F:0(TA0Vj=V)125°C 2.5 1.50 1.25 2.0 1.00 trr 1.5 0.75 IRM 0.50 1.0 0.25 QRR Tj(°C) dIF/dt(A/µs) 0.00 0.5 25 50 75 100 125 0 50 100 150 200 250 300 350 400 450 500 4/9

STTH3012 Characteristics Figure 9. T ransient peak forward voltage Figure 10. Forward recovery time versus dI /dt F versus dI /dt (typical values) (typical values) F VFP(V) tfr(ns) 30 1100 IF=IF(AV) IF=IF(AV) Tj=125°C 1000 VFR=T1j.=51 x25V°FCmax. 25 900 20 800 700 15 600 10 500 400 5 dIF/dt(A/µs) 300 dIF/dt(A/µs) 0 200 0 100 200 300 400 500 0 100 200 300 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C 100 VR(V) 10 1 10 100 1000 5/9

Package information STTH3012 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Recommended torque value: 0.80 Nm (DO-247) Maximum torque value: 0.7 Nm (TO-220AC) Maximum torque value: 1.0 Nm (DO-247) T able 5. DO-247 dimensions DIMENSIONS REF. Millimeters Inches Min. Max Min. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 V E 0.40 0.80 0.015 0.031 V Dia F 1.00 1.40 0.039 0.055 F2 2.00 0.078 A F3 2.00 2.40 0.078 0.094 H G 10.90 0.429 L5 H 15.45 15.75 0.608 0.620 L L 19.85 20.15 0.781 0.793 L2 L1 3.70 4.30 0.145 0.169 L4 F2 L1 L2 18.50 0.728 L3 V2 F3 D L3 14.20 14.80 0.559 0.582 L4 34.60 1.362 F G M E L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 3.55 3.65 0.139 0.143 6/9

STTH3012 Package information T able 6. T0-220AC dimensions DIMENSIONS REF. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 H2 A C 1.23 1.32 0.048 0.051 Ø I C D 2.40 2.72 0.094 0.107 L5 L7 E 0.49 0.70 0.019 0.027 L6 F 0.61 0.88 0.024 0.034 L2 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 F1 L9 D H2 10.00 10.40 0.393 0.409 L4 L2 16.40 typ. 0.645 typ. F L4 13.00 14.00 0.511 0.551 M L5 2.65 2.95 0.104 0.116 E L6 15.25 15.75 0.600 0.620 G L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. Diam. I 3.75 3.85 0.147 0.151 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9

Ordering information STTH3012 3 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH3012D STTH3012D TO-220AC 1.86 g 50 Tube STTH3012W STTH3012W DO-247 4.4 g 30 Tube 4 Revision history Date Revision Description of Changes 02-Mar-2006 1 First issue. 8/9

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