STTH2R02 Datasheet 200 V - 2 A ultrafast recovery diode Features • Very low conduction losses • Negligible switching losses • Low forward voltage drop • High junction temperature • ECOPACK®2 compliant Applications • Switching diode • LED Lighting • Auxiliary power supply • Flyback diode Description The STTH2R02 uses ST's patented 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in SMA, SMB, the STTH2R02 is optimized for use low voltage, high frequency inverters, free wheeling and polarity protection Product status STTH2R02 Product summary Symbol Value IF(AV) 2 A VRRM 200 V T j(max.) 175 °C VF(typ.) 0.7 V trr(typ.) 15 ns DS4744 - Rev 3 - December 2018 www.st.com For further information contact your local STMicroelectronics sales office.

STTH2R02 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V SMA TL = 90 °C IF(AV) Average forward current δ = 0.5, square wave 2 A SMB TL = 90 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature +175 °C Table 2. Thermal resistance parameter Symbol Parameter Max. value Unit Rth(j-l) Junction to lead SMA / SMB 30 °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 3 IR(1) Reverse leakage current VR = VRRM µA Tj = 125 °C - 2 20 Tj = 25 °C IF = 6 A - 1.20 Tj = 25 °C - 0.89 1.00 VF(2) Forward voltage drop V Tj = 100 °C IF = 2 A - 0.76 0.85 Tj = 150 °C - 0.70 0.80 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.68 x I + 0.06 x I 2 F(AV) F (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS4744 - Rev 3 page 2/13

STTH2R02 Characteristics Table 4. Dynamic characteristics (T = 25 °C unless otherwise specified) j Symbol Parameters Test conditions Min. Typ. Max. Unit IF = 1 A, dIF/dt = -50 A/μs, VR = 30 V - 23 30 trr Reverse recovery time ns IF = 1 A, dIF/dt = -100 A/μs, VR = 30 V - 15 20 IRM Reverse recovery current IF = 2 A, dIF/dt = -200 A/μs, VR = 160 V, Tj = 125 °C - 3 4 A tfr Forward recovery time IF = 2 A, dIF/dt = 100 A/μs, VFR = 1.1 VF(max.) - 40 ns VFP Forward recovery voltage IF = 2 A, dIF/dt = 100 A/μs - 2.0 V DS4744 - Rev 3 page 3/13

STTH2R02 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Forward voltage drop versus forward current Figure 1. Peak current versus duty cycle (typical values) IM(A) 100 TT IF(A) IIMM 50 80 δd==ttpp//TT ttpp 40 60 PP == 55WW 30 40 PP == 22WW 20 Tj=150°C PP == 11WW 20 10 Tj=25°C δ VF(V) 0 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.5 1.0 1.5 2.0 2.5 Figure 3. Forward voltage drop versus forward current Figure 4. Relative variation of thermal impedance junction (maximum values) to lead versus pulse duration (SMA) IFM(A) Zth(j-a)/Rth(j-a) 50 1.0 SMA 0.9 Scu=1cm² 40 0.8 0.7 30 0.6 0.5 20 Tj=150°C 0.4 0.3 Tj=25°C 10 0.2 Single pulse VFM(V) 0.1 tP(s) 0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 DS4744 - Rev 3 page 4/13

STTH2R02 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction Figure 6. Junction capacitance versus reverse voltage to lead versus pulse duration (SMB) applied (typical values) Zth(j-a)/Rth(j-a) C(pF) 1.0 100 SMB F=1MHz 0.9 Scu=1cm² Vosc=30mVRMS Tj=25°C 0.8 0.7 0.6 0.5 10 0.4 0.3 0.2 0.1 Single pulse tP(s) VR(V) 0.0 1 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1 10 100 1000 Figure 7. Reverse recovery charges versus dI /dt (typical Figure 8. Reverse recovery time versus dI /dt (typical F F values) values) QRR(nC) tRR(ns) 60 60 50 VIFR== 126 A0V 50 VIFR==126A0V 40 40 30 Tj=125°C 30 Tj=125°C 20 20 10 10 Tj=25°C Tj=25°C dIF/dt(A/µs) dIF/dt(A/µs) 0 0 10 100 1000 10 100 1000 Figure 9. Peak reverse recovery current versus dIF/dt Figure 10. Relative variations of dynamic parameters (typical values) versus junction temperature IRM(A) QRR;IRM[Tj]/QRR;IRM[Tj=125°C] 6 1.4 VIFR== 126A0V 1.2 VIFR== 126A0V 5 1.0 4 0.8 IRM 3 Tj=125°C 0.6 QRR 2 0.4 1 Tj=25°C 0.2 dIF/dt(A/µs) 0.0 Tj(°C) 0 25 50 75 100 125 150 10 100 1000 DS4744 - Rev 3 page 5/13

STTH2R02 Characteristics (curves) Figure 11. Thermal resistance junction to ambient versus Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (typical values) copper surface under each lead (typical values) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 200 200 Epoxy printed circuit board FR4,copper thickness:35 µm SMA EpoxyprintedcircuitboardFR4,copperthickness:35µm SMB 150 150 100 100 50 50 S(Cu)(cm²) S(Cu)(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DS4744 - Rev 3 page 6/13

STTH2R02 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMA package information • Epoxy meets UL94, V0 • Cooling method : by conduction (C) Figure 13. SMA package outline E1 D E A1 C A2 L b Table 5. SMA package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 DS4744 - Rev 3 page 7/13

STTH2R02 SMA package information Figure 14. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS4744 - Rev 3 page 8/13

STTH2R02 SMB package information 2.2 SMB package information • Epoxy meets UL94, V0 • Lead-free package Figure 15. SMB package outline E1 D E A1 C A2 L b DS4744 - Rev 3 page 9/13

STTH2R02 SMB package information Table 6. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 Figure 16. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS4744 - Rev 3 page 10/13

STTH2R02 Ordering information 3 Ordering information Table 7. Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH2R02A R2A SMA 0.068 g 5000 Tape and reel STTH2R02U R2U SMB 0.107 g 2500 Tape and reel DS4744 - Rev 3 page 11/13

STTH2R02 Revision history Table 8. Document revision history Date Revision Changes 03-May-2006 1 First issue. 13-Oct-2006 2 Maximum Tj set to 175° C for all packages in Table 1. 11-Dec-2018 3 Removed DO-15 package information. DS4744 - Rev 3 page 12/13

STTH2R02 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS4744 - Rev 3 page 13/13

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