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  • 型号: STTH2L06A
  • 制造商: STMicroelectronics
  • 库位|库存: xxxx|xxxx
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STTH2L06A产品简介:

ICGOO电子元器件商城为您提供STTH2L06A由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 STTH2L06A价格参考。STMicroelectronicsSTTH2L06A封装/规格:二极管 - 整流器 - 单, 标准 表面贴装 二极管 600V 2A SMA。您可以下载STTH2L06A参考资料、Datasheet数据手册功能说明书,资料中有STTH2L06A 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

DIODE ULTRA FAST 600V 2A SMA整流器 H ULTRAFAST DIODE

产品分类

单二极管/整流器分离式半导体

品牌

STMicroelectronics

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

二极管与整流器,整流器,STMicroelectronics STTH2L06A-

数据手册

点击此处下载产品Datasheet

产品型号

STTH2L06A

不同If时的电压-正向(Vf)

1.3V @ 2A

不同 Vr、F时的电容

-

不同 Vr时的电流-反向漏电流

2µA @ 600V

二极管类型

标准

产品

Ultra Fast Recovery Rectifiers

产品目录页面

点击此处下载产品Datasheet

产品种类

整流器

供应商器件封装

SMA

其它名称

497-3549-1

其它有关文件

http://www.st.com/web/catalog/sense_power/FM64/CL830/SC12/SS1652/PF86750?referrer=70071840

包装

剪切带 (CT)

反向恢复时间(trr)

85ns

反向电压

600 V

反向电流IR

2 uA

商标

STMicroelectronics

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

DO-214AC,SMA

封装/箱体

SMA

工作温度-结

175°C (最大)

工厂包装数量

5000

恢复时间

85 ns

最大工作温度

+ 175 C

最大浪涌电流

35 A

最小工作温度

- 65 C

标准包装

1

正向电压下降

1.3 V

正向连续电流

2 A

热阻

30°C/W Jl

电压-DC反向(Vr)(最大值)

600V

电流-平均整流(Io)

2A

系列

STTH2L06

速度

快速恢复 =< 500 ns,> 200mA(Io)

配置

Single

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PDF Datasheet 数据手册内容提取

STTH2L06 High efficiency ultrafast diode Features A K ■ Very low conduction losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ High junction temperature Description The STTH2L06 is using ST Turbo 2 600 V planar DO-41 Pt doping technology. It is specially suited for STTH2L06 SMPS and base drive transistor circuits. Packaged in axial, SMA and SMB, this device is intended for use in high frequency inverters, free wheeling and polarity protection. SMA SMB STTH2L06A STTH2L06U T able 1. Device summary Symbol Value I 2 A F(AV) V 600 V RRM T 175 °C j V (typ) 0.85 V F t (max) 60 ns rr October 2009 Doc ID10758 Rev 2 1/9 www.st.com 9

Characteristics STTH2L06 1 Characteristics T able 2. Absolute ratings (limiting values) Symbol Parameter Value Unit V Repetitive peak reverse voltage 600 V RRM I Forward rms current 7 A F(RMS) DO-41 T = 90 °C 2 l I Average forward current, δ = 0.5 SMA T = 100 °C 2 A F(AV) l SMB T = 115 °C 2 l DO-41 t = 10 ms 45 I Surge non repetitive forward current p A FSM SMA / SMB sinusoidal 35 T Storage temperature range -65 to + 175 °C stg T Maximum operating junction temperature 175 °C j T able 3. Thermal resistance Symbol Parameter Maximum Unit DO-41 L = 5 mm 35 R Junction to lead SMA 30 °C/W th(j-l) SMB 25 T able 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I (1) Reverse leakage Tj = 25 °C V = V 2 µA R current T= 150 °C R RRM 12 85 j T = 25 °C 1.3 V (2) Forward voltage drop j I = 2 A V F F T = 150 °C 0.85 1.05 j 1. Pulse test: t = 5 ms, δ < 2 % p 2. Pulse test: t = 380 µs, δ < 2 % p To evaluate the maximum conduction losses use the following equation: P = 0.89 x I + 0.08 I 2 F(AV) F (RMS) 2/9 Doc ID10758 Rev 2

STTH2L06 Characteristics T able 5. Dynamic electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I = 1 A, F t Reverse recovery time T = 25 °C dI /dt = 50 A/µs, 60 85 ns rr j F V = 30 V R t Forward recovery time I = 2 A 100 ns fr F T = 25 °C dI /dt = 100 A/µs j F VFP Forward recovery voltage VFR = 1.1 x VFmax 9 V Figure 1. Conduction losses vs average Figure 2. Forward voltage drop vs forward current forward current P(W) IFM(A) 2.5 δ= 0.1 δ= 0.2 δ= 0.5 10 δ= 0.05 9 (maxTimj=u1m50 v°aClues) 2.0 8 δ= 1 7 1.5 6 Tj=150°C (typical values) 5 1.0 4 Tj=25°C 3 (maximum values) T 0.5 2 IF(AV)(A) δ=tp/T tp 1 VFM(V) 0.0 0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 0.00.10.20.30.40.50.60.70.80.91.01.11.21.31.41.51.61.71.81.92.0 F igure 3. Relative variation of thermal Figure 4. Relative variation of thermal impedance junction to case vs impedance junction to case vs pulse duration (SMA - S = 1 cm2) pulse duration (SMB - S = 1 cm2) CU CU Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Single pulse 0.1 Single pulse tp(s) tp(s) 0.0 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Doc ID10758 Rev 2 3/9

Characteristics STTH2L06 F igure 5. Relative variation of thermal Figure 6. Peak reverse recovery current vs impedance junction to case vs dI /dt (typical values) F pulse duration (DO-41) Zth(j-a)/Rth(j-a) IRM(A) 1.0 15.0 VR=400V 0.9 Tj=125°C 12.5 IF=2 x IF(AV) 0.8 0.7 IF=IF(AV) 10.0 0.6 IF=0.5 x IF(AV) 0.5 7.5 0.4 5.0 0.3 0.2 2.5 0.1 Single pulse tp(s) dIF/dt(A/µs) 0.0 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0 50 100 150 200 250 300 350 400 450 500 F igure 7. Reverse recovery time vs dI /dt Figure 8. Reverse recovery charges vs F (typical values) dI /dt (typical values) F trr(ns) Qrr(nC) 500 800 VR=400V VR=400V 450 Tj=125°C 700 Tj=125°C 400 IF=2 x IF(AV) 600 350 300 500 250 IF=2 x IF(AV) 400 IF=IF(AV) 200 IF=IF(AV) IF=0.5 x IF(AV) 300 IF=0.5 x IF(AV) 150 200 100 50 100 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 100 150 200 250 300 350 400 450 500 0 100 200 300 400 500 Figure 9. R elative variations of dynamic Figure 10. Transient peak forward voltage vs parameters vs junction temperature dI /dt (typical values) F VFP(V) 1.4 25 IF=IF(AV) IF=IF(AV) 1.2 VR=400V Tj=125°C Reference:Tj=125°C 20 1.0 0.8 15 QRR 0.6 trr 10 0.4 IRM 5 0.2 Tj(°C) dIF/dt(A/µs) 0.0 0 25 50 75 100 125 0 50 100 150 200 250 4/9 Doc ID10758 Rev 2

STTH2L06 Characteristics F igure 11. Forward recovery time vs dI /dt Figure 12. Junction capacitance vs reverse F (typical values) voltage applied (typical values) tfr(ns) C(pF) 400 100 350 VFR=T1IFj.=1=1 Ix2F(5VA°VFC)max. VOSFCT==j=132M05m°HCVzRMS 300 250 200 10 150 100 50 dIF/dt(A/µs) VR(V) 0 1 0 50 100 150 200 250 1 10 100 1000 F igure 13. Thermal resistance junction to Figure 14. Thermal resistance vs lead lengh ambient vs copper surface under (DO-41) tab (epoxy FR4, Cu= 35 µm) Rth(j-a)(°C/W) Rth(°C/W) 120 120 110 Rth(j-a) 100 100 90 SMA 80 80 SMB 70 60 60 50 Rth(j-l) 40 40 30 20 20 10 SCU(cm²) Llead(mm) 0 0 0 1 2 3 4 5 5 10 15 20 25 Doc ID10758 Rev 2 5/9

Package information STTH2L06 2 Package information ● Epoxy meets UL 94, V0 ● Band indicates cathode ● Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. T able 6. DO-41 (plastic) dimensions Dimensions Ref. Millimeters Inches ØD ØB Min. Max. Min. Max. A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107 C A C C 25.4 1 D 0.71 0.86 0.028 0.034 T able 7. SMA dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 D A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 E c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 A1 E 4.80 5.35 0.189 0.211 C A2 L b E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 6/9 Doc ID10758 Rev 2

STTH2L06 Package information Figure 15. Footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43 T able 8. SMB dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 D A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 E c 0.15 0.40 0.006 0.016 A1 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 C A2 L b E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Figure 16. Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Doc ID10758 Rev 2 7/9

Ordering information STTH2L06 3 Ordering information T able 9. Ordering information Delivery Order code Marking Package Weight Base qty mode STTH2L06 STTH2L06 DO-41 0.34 g 2000 Ammopack STTH2L06RL STTH2L06 DO-41 0.34 g 5000 Tape and reel STTH2L06A L6A SMA 0.068 g 5000 Tape and reel STTH2L06U L6U SMB 0.11 g 2500 Tape and reel 4 Revision history T able 10. Document revision history Date Revision Changes 07-Sep-2004 1 First issue. 30-Sep-2009 2 Updated table 6 package dimensions. 8/9 Doc ID10758 Rev 2

STTH2L06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID10758 Rev 2 9/9

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