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STTH2L06A产品简介:
ICGOO电子元器件商城为您提供STTH2L06A由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 STTH2L06A价格参考。STMicroelectronicsSTTH2L06A封装/规格:二极管 - 整流器 - 单, 标准 表面贴装 二极管 600V 2A SMA。您可以下载STTH2L06A参考资料、Datasheet数据手册功能说明书,资料中有STTH2L06A 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | DIODE ULTRA FAST 600V 2A SMA整流器 H ULTRAFAST DIODE |
产品分类 | 单二极管/整流器分离式半导体 |
品牌 | STMicroelectronics |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 二极管与整流器,整流器,STMicroelectronics STTH2L06A- |
数据手册 | |
产品型号 | STTH2L06A |
不同If时的电压-正向(Vf) | 1.3V @ 2A |
不同 Vr、F时的电容 | - |
不同 Vr时的电流-反向漏电流 | 2µA @ 600V |
二极管类型 | 标准 |
产品 | Ultra Fast Recovery Rectifiers |
产品目录页面 | |
产品种类 | 整流器 |
供应商器件封装 | SMA |
其它名称 | 497-3549-1 |
其它有关文件 | http://www.st.com/web/catalog/sense_power/FM64/CL830/SC12/SS1652/PF86750?referrer=70071840 |
包装 | 剪切带 (CT) |
反向恢复时间(trr) | 85ns |
反向电压 | 600 V |
反向电流IR | 2 uA |
商标 | STMicroelectronics |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | DO-214AC,SMA |
封装/箱体 | SMA |
工作温度-结 | 175°C (最大) |
工厂包装数量 | 5000 |
恢复时间 | 85 ns |
最大工作温度 | + 175 C |
最大浪涌电流 | 35 A |
最小工作温度 | - 65 C |
标准包装 | 1 |
正向电压下降 | 1.3 V |
正向连续电流 | 2 A |
热阻 | 30°C/W Jl |
电压-DC反向(Vr)(最大值) | 600V |
电流-平均整流(Io) | 2A |
系列 | STTH2L06 |
速度 | 快速恢复 =< 500 ns,> 200mA(Io) |
配置 | Single |
STTH2L06 High efficiency ultrafast diode Features A K ■ Very low conduction losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ High junction temperature Description The STTH2L06 is using ST Turbo 2 600 V planar DO-41 Pt doping technology. It is specially suited for STTH2L06 SMPS and base drive transistor circuits. Packaged in axial, SMA and SMB, this device is intended for use in high frequency inverters, free wheeling and polarity protection. SMA SMB STTH2L06A STTH2L06U T able 1. Device summary Symbol Value I 2 A F(AV) V 600 V RRM T 175 °C j V (typ) 0.85 V F t (max) 60 ns rr October 2009 Doc ID10758 Rev 2 1/9 www.st.com 9
Characteristics STTH2L06 1 Characteristics T able 2. Absolute ratings (limiting values) Symbol Parameter Value Unit V Repetitive peak reverse voltage 600 V RRM I Forward rms current 7 A F(RMS) DO-41 T = 90 °C 2 l I Average forward current, δ = 0.5 SMA T = 100 °C 2 A F(AV) l SMB T = 115 °C 2 l DO-41 t = 10 ms 45 I Surge non repetitive forward current p A FSM SMA / SMB sinusoidal 35 T Storage temperature range -65 to + 175 °C stg T Maximum operating junction temperature 175 °C j T able 3. Thermal resistance Symbol Parameter Maximum Unit DO-41 L = 5 mm 35 R Junction to lead SMA 30 °C/W th(j-l) SMB 25 T able 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I (1) Reverse leakage Tj = 25 °C V = V 2 µA R current T= 150 °C R RRM 12 85 j T = 25 °C 1.3 V (2) Forward voltage drop j I = 2 A V F F T = 150 °C 0.85 1.05 j 1. Pulse test: t = 5 ms, δ < 2 % p 2. Pulse test: t = 380 µs, δ < 2 % p To evaluate the maximum conduction losses use the following equation: P = 0.89 x I + 0.08 I 2 F(AV) F (RMS) 2/9 Doc ID10758 Rev 2
STTH2L06 Characteristics T able 5. Dynamic electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I = 1 A, F t Reverse recovery time T = 25 °C dI /dt = 50 A/µs, 60 85 ns rr j F V = 30 V R t Forward recovery time I = 2 A 100 ns fr F T = 25 °C dI /dt = 100 A/µs j F VFP Forward recovery voltage VFR = 1.1 x VFmax 9 V Figure 1. Conduction losses vs average Figure 2. Forward voltage drop vs forward current forward current P(W) IFM(A) 2.5 δ= 0.1 δ= 0.2 δ= 0.5 10 δ= 0.05 9 (maxTimj=u1m50 v°aClues) 2.0 8 δ= 1 7 1.5 6 Tj=150°C (typical values) 5 1.0 4 Tj=25°C 3 (maximum values) T 0.5 2 IF(AV)(A) δ=tp/T tp 1 VFM(V) 0.0 0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 0.00.10.20.30.40.50.60.70.80.91.01.11.21.31.41.51.61.71.81.92.0 F igure 3. Relative variation of thermal Figure 4. Relative variation of thermal impedance junction to case vs impedance junction to case vs pulse duration (SMA - S = 1 cm2) pulse duration (SMB - S = 1 cm2) CU CU Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Single pulse 0.1 Single pulse tp(s) tp(s) 0.0 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Doc ID10758 Rev 2 3/9
Characteristics STTH2L06 F igure 5. Relative variation of thermal Figure 6. Peak reverse recovery current vs impedance junction to case vs dI /dt (typical values) F pulse duration (DO-41) Zth(j-a)/Rth(j-a) IRM(A) 1.0 15.0 VR=400V 0.9 Tj=125°C 12.5 IF=2 x IF(AV) 0.8 0.7 IF=IF(AV) 10.0 0.6 IF=0.5 x IF(AV) 0.5 7.5 0.4 5.0 0.3 0.2 2.5 0.1 Single pulse tp(s) dIF/dt(A/µs) 0.0 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0 50 100 150 200 250 300 350 400 450 500 F igure 7. Reverse recovery time vs dI /dt Figure 8. Reverse recovery charges vs F (typical values) dI /dt (typical values) F trr(ns) Qrr(nC) 500 800 VR=400V VR=400V 450 Tj=125°C 700 Tj=125°C 400 IF=2 x IF(AV) 600 350 300 500 250 IF=2 x IF(AV) 400 IF=IF(AV) 200 IF=IF(AV) IF=0.5 x IF(AV) 300 IF=0.5 x IF(AV) 150 200 100 50 100 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 100 150 200 250 300 350 400 450 500 0 100 200 300 400 500 Figure 9. R elative variations of dynamic Figure 10. Transient peak forward voltage vs parameters vs junction temperature dI /dt (typical values) F VFP(V) 1.4 25 IF=IF(AV) IF=IF(AV) 1.2 VR=400V Tj=125°C Reference:Tj=125°C 20 1.0 0.8 15 QRR 0.6 trr 10 0.4 IRM 5 0.2 Tj(°C) dIF/dt(A/µs) 0.0 0 25 50 75 100 125 0 50 100 150 200 250 4/9 Doc ID10758 Rev 2
STTH2L06 Characteristics F igure 11. Forward recovery time vs dI /dt Figure 12. Junction capacitance vs reverse F (typical values) voltage applied (typical values) tfr(ns) C(pF) 400 100 350 VFR=T1IFj.=1=1 Ix2F(5VA°VFC)max. VOSFCT==j=132M05m°HCVzRMS 300 250 200 10 150 100 50 dIF/dt(A/µs) VR(V) 0 1 0 50 100 150 200 250 1 10 100 1000 F igure 13. Thermal resistance junction to Figure 14. Thermal resistance vs lead lengh ambient vs copper surface under (DO-41) tab (epoxy FR4, Cu= 35 µm) Rth(j-a)(°C/W) Rth(°C/W) 120 120 110 Rth(j-a) 100 100 90 SMA 80 80 SMB 70 60 60 50 Rth(j-l) 40 40 30 20 20 10 SCU(cm²) Llead(mm) 0 0 0 1 2 3 4 5 5 10 15 20 25 Doc ID10758 Rev 2 5/9
Package information STTH2L06 2 Package information ● Epoxy meets UL 94, V0 ● Band indicates cathode ● Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. T able 6. DO-41 (plastic) dimensions Dimensions Ref. Millimeters Inches ØD ØB Min. Max. Min. Max. A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107 C A C C 25.4 1 D 0.71 0.86 0.028 0.034 T able 7. SMA dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 D A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 E c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 A1 E 4.80 5.35 0.189 0.211 C A2 L b E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 6/9 Doc ID10758 Rev 2
STTH2L06 Package information Figure 15. Footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43 T able 8. SMB dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 D A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 E c 0.15 0.40 0.006 0.016 A1 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 C A2 L b E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Figure 16. Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Doc ID10758 Rev 2 7/9
Ordering information STTH2L06 3 Ordering information T able 9. Ordering information Delivery Order code Marking Package Weight Base qty mode STTH2L06 STTH2L06 DO-41 0.34 g 2000 Ammopack STTH2L06RL STTH2L06 DO-41 0.34 g 5000 Tape and reel STTH2L06A L6A SMA 0.068 g 5000 Tape and reel STTH2L06U L6U SMB 0.11 g 2500 Tape and reel 4 Revision history T able 10. Document revision history Date Revision Changes 07-Sep-2004 1 First issue. 30-Sep-2009 2 Updated table 6 package dimensions. 8/9 Doc ID10758 Rev 2
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