STTH208 Datasheet 2 A, 800 V ultrafast recovery diode K A Features • Low forward voltage drop • High reliability A • High surge current capability A • Soft switching for reduced EMI disturbances • Planar technology K • ECOPACK compliant K Applications DO-15 SMB • Switching diode • Power swiching applications Description The STTH208, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. Product status STTH208 Product summary Symbol Value IF(AV) 2 A VRRM 800 V T j(max.) 175 °C VF(typ.) 0.89 V trr(max.) 75 ns DS3068 - Rev 2 - April 2020 www.st.com For further information contact your local STMicroelectronics sales office.

STTH208 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 800 V VRMS RMS voltage 560 V DO-15 TL = 60 °C IF(AV) Average forward current δ = 0.5, square wave 2 A SMB TL = 100 °C DO-15 45 A IFSM Surge non repetitive forward current tp = 8.3 ms sinusoidal SMB 35 Tstg Storage temperature range -50 to +175 °C Tj Maximum operating junction temperature +175 °C Table 2. Thermal resistance parameter Symbol Parameter Max. value Unit Junction to lead SMB 25 Rth(j-l) Junction to lead 40 °C/W Lead length = 10 mm on infinite heatsink DO-15 Rth(j-a) Junction to ambient 110 For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 5 µA IR(1) Reverse leakage current VR = 800 V Tj = 125 °C - 5 50 µA Tj = 25 °C - 1.65 VF(2) Forward voltage drop IF = 2 A V Tj = 150 °C - 0.89 1.25 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.5 x I + 0.10 x I 2 F(AV) F (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS3068 - Rev 2 page 2/10

STTH208 Characteristics Table 4. Dynamic characteristics (T = 25 °C unless otherwise stated) j Symbol Parameters Test conditions Min. Typ. Max. Unit trr Reverse recovery time IF = 0.5 A, Irr = 0.25 A, IF = 1 A - - 75 ns tfr Forward recovery time - - 200 ns IF = 2 A, dIF/dt = 50 A/μs, VFR = 1.1 x VF(max.) VFP Forward recovery voltage - - 9 V DS3068 - Rev 2 page 3/10

STTH208 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus Figure 2. Forward voltage drop versus forward current average forward current IFM(A) P(W) 100.0 3.5 3.0 δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5 (maxTimj=u1m50 v°Calues) 2.5 10.0 δ= 1 2.0 Tj=150°C (typical values) 1.5 1.0 Tj=25°C (maximum values) 1.0 T 0.5 IF(AV)(A) δ=tp/T tp 0.1 VFM(V) 0.0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Figure 3. Relative variation of thermal impedance junction Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration (DO-15) to lead versus pulse duration (SMB) Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 0.9 DO-15 0.9 SMB L = 10mm S = 1 cm² 0.8 leads 0.8 0.7 0.7 0.6 δ= 0.5 0.6 δ= 0.5 0.5 0.5 0.4 0.4 0.3 δ= 0.2 0.3 δ= 0.2 T T 0.2 δ= 0.1 0.2 δ= 0.1 0.1 Single pulse tp(s) δ= tp/T tp 0.1 Single pulse tp(s) δ= tp/T tp 0.0 0.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 5. Thermal resistance junction to ambient versus Figure 6. Thermal resistance junction to ambient versus copper surface under each lead (typical values) lead length, DO-15 200 Rth(j-a)(°C/W) 120Rth(j-a)(°C/W) DO-15 SMB 100 150 80 100 60 50 Epoxy printed board FR4, eCu = 35 µm 40 20 SCu(cm²) 0 Lleads(mm) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DS3068 - Rev 2 page 4/10

STTH208 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB package information • Epoxy meets UL94, V0 • Lead-free package Figure 7. SMB package outline E1 D E A1 C A2 L b DS3068 - Rev 2 page 5/10

STTH208 SMB package information Table 5. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 Figure 8. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS3068 - Rev 2 page 6/10

STTH208 DO-15 package information 2.2 DO-15 package information • Epoxy meets UL 94, V0 Figure 9. DO-15 package outline C A C ØD ØB Table 6. DO-15 package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 6.05 - 6.75 0.238 - 0.266 B 2.95 - 3.53 0.116 - 0.139 C 26.00 - 31.00 1.024 - 1.220 D 0.71 - 0.88 0.028 - 0.0035 DS3068 - Rev 2 page 7/10

STTH208 Ordering information 3 Ordering information Table 7. Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH208U U08 SMB 0.107 g 2500 Tape and reel STTH208 STTH208 DO-15 0.400 g 6000 Tape and reel DS3068 - Rev 2 page 8/10

STTH208 Revision history Table 8. Document revision history Date Revision Changes 2003 1 First issue. 01-Apr-2020 2 Updated Figure 4 and Figure 3. Minor text changes. DS3068 - Rev 2 page 9/10

STTH208 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS3068 - Rev 2 page 10/10

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