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  • 型号: STTH1512G
  • 制造商: STMicroelectronics
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STTH1512G产品简介:

ICGOO电子元器件商城为您提供STTH1512G由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 STTH1512G价格参考。STMicroelectronicsSTTH1512G封装/规格:二极管 - 整流器 - 单, 标准 表面贴装 二极管 1200V 15A D2PAK。您可以下载STTH1512G参考资料、Datasheet数据手册功能说明书,资料中有STTH1512G 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

DIODE ULTRA FAST 1200V 15A D2PAK整流器 ULTRAFAST DIODE

产品分类

单二极管/整流器分离式半导体

品牌

STMicroelectronics

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

二极管与整流器,整流器,STMicroelectronics STTH1512G-

数据手册

点击此处下载产品Datasheet

产品型号

STTH1512G

不同If时的电压-正向(Vf)

2.1V @ 15A

不同 Vr、F时的电容

-

不同 Vr时的电流-反向漏电流

15µA @ 1200V

二极管类型

标准

产品

Ultra Fast Recovery Rectifiers

产品目录页面

点击此处下载产品Datasheet

产品种类

整流器

供应商器件封装

D2PAK

其它名称

497-6095-5

其它有关文件

http://www.st.com/web/catalog/sense_power/FM64/CL830/SC8/PF129974?referrer=70071840

包装

管件

反向恢复时间(trr)

105ns

反向电压

1200 V

反向电流IR

15 uA

商标

STMicroelectronics

安装类型

表面贴装

安装风格

SMD/SMT

封装

Tube

封装/外壳

TO-263-3,D²Pak(2 引线+接片),TO-263AB

封装/箱体

D2-PAK

工作温度-结

175°C (最大)

工厂包装数量

1000

恢复时间

53 ns

最大工作温度

+ 175 C

最大浪涌电流

150 A

最小工作温度

- 65 C

标准包装

50

正向电压下降

2.1 V

正向连续电流

15 A

热阻

1.3°C/W Jc

电压-DC反向(Vr)(最大值)

1200V(1.2kV)

电流-平均整流(Io)

15A

系列

STTH1512

速度

快速恢复 =< 500 ns,> 200mA(Io)

配置

Single

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PDF Datasheet 数据手册内容提取

STTH1512 1200 V ultrafast recovery diode Features A K ■ Ultrafast, soft recovery ■ Very low conduction and switching losses K ■ High frequency and/or high pulsed current A A operation K K ■ High reverse voltage capability DOP3I DO247 ■ High junction temperature STTH1512PI STTH1512W ■ Insulated package: DOP3I – Electrical insulation = 2500 V rms – Capacitance = 12 pF K A Description A A A K The high quality design of this diode has D2PAK TO-220AC produced a device with low leakage current, STTH1512G STTH1512D regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal T able 1. Device summary for heavy duty applications that demand long term reliability. Symbol Value Such demanding applications include industrial I 15 A F(AV) power supplies, motor control, and similar V 1200 V mission-critical systems that require rectification RRM and freewheeling. These diodes also fit into T 175 °C j auxiliary functions such as snubber, bootstrap, V (typ) 1.20 V and demagnetization applications. F t (typ) 53 ns The improved performance in low leakage rr current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. April 2010 Doc ID 12157 Rev 2 1/11 www.st.com 11

Characteristics STTH1512 1 Characteristics T able 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit V Repetitive peak reverse voltage 1200 V RRM I Forward rms current TO-220AC / DO247 / DOP3I / D2PAK 50 A F(RMS) TO-220AC / D2PAK / I Average forward current, DO247 Tc = 130 °C 15 A F(AV) δ = 0.5 DOP3I T = 105 °C c Repetitive peak forward I t = 5 µs, F = 5 kHz square 200 A FRM current p Surge non repetitive I t = 10 ms Sinusoidal 200 A FSM forward current p T Storage temperature range -65 to + 175 °C stg T Maximum operating junction temperature 175 °C j T able 3. Thermal parameters Symbol Parameter Value Unit TO-220AC / D2PAK / DO247 1.3 °C/W R Junction to case th(j-c) DOP3I 2 °C/W T able 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I (1) Reverse leakage Tj = 25 °C V = V 15 µA R current T = 125 °C R RRM 10 100 j T = 25 °C 2.10 j V (2) Forward voltage drop T = 125 °C I = 15 A 1.25 1.90 V F j F T = 150 °C 1.20 1.80 j 1. Pulse test: t = 5 ms, δ < 2 % p 2. Pulse test: t = 380 µs, δ < 2 % p To evaluate the conduction losses use the following equation: P = 1.4 x I + 0.027 I 2 F(AV) F (RMS) 2/11 Doc ID 12157 Rev 2

STTH1512 Characteristics Table 5. D ynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I = 1 A, dI /dt = -50 A/µs, F F 105 V = 30 V, T = 25 °C R j t Reverse recovery time ns rr I = 1 A, dI /dt = -100 A/µs, F F 53 75 V = 30 V, T = 25 °C R j I = 15 A, dI /dt = -200 A/µs, I Reverse recovery current F F 20 28 A RM V = 600 V, T = 125 °C R j I = 15 A, dI /dt = -200 A/µs, S Softness factor F F 1.5 V = 600 V, T = 125 °C R j I = 15 A dI /dt = 50 A/µs t Forward recovery time F F 600 ns fr V = 1.5 x V , T = 25 °C FR Fmax j I = 15 A, dI /dt = 50 A/µs, V Forward recovery voltage F F 5.5 V FP T = 25 °C j Figure 1. Conduction losses versus Figure 2. Forward voltage drop versus average current forward current P(W) IFM(A) 35 150 δ= 0.1 δ= 0.2 δ= 0.5 140 30 δ= 0.05 112300 Tj=150°C (typical values) 110 25 δ= 1 100 90 20 80 70 15 60 10 T 4500 (maxTimj=u1m50 v°aClues) (maxiTmj=u2m5 °vCalues) 30 5 20 IF(AV)(A) δ=tp/T tp 10 VFM(V) 0 0 0 2 4 6 8 10 12 14 16 18 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Figure 3. Relative variation of thermal Figure 4. Peak reverse recovery current impedance junction to case versus dI /dt (typical values) F versus pulse duration Zth(j-c)/Rth(j-c) IRM(A) 1.0 50 VR=600V 0.9 45 Tj=125°C 0.8 40 0.7 35 IF=2 x IF(AV) 0.6 30 IF=IF(AV) 0.5 25 IF=0.5 x IF(AV) 0.4 20 0.3 Single pulse 15 0.2 10 0.1 tp(s) 5 dIF/dt(A/µs) 0.0 0 1.E-03 1.E-02 1.E-01 1.E+00 0 50 100 150 200 250 300 350 400 450 500 Doc ID 12157 Rev 2 3/11

Characteristics STTH1512 Figure 5. R everse recovery time versus Figure 6. Reverse recovery charges versus dI /dt (typical values) dI /dt (typical values) F F trr(ns) Qrr(µC) 600 5.5 550 VTjR==162050°CV 5.0 VTjR==162050°CV 4.5 500 IF=2 x IF(AV) 4.0 IF=2 x IF(AV) 450 3.5 400 IF=IF(AV) IF=0.5 x IF(AV) 3.0 IF=IF(AV) 350 2.5 300 2.0 IF=0.5 x IF(AV) 250 1.5 200 1.0 150 dIF/dt(A/µs) 0.5 dIF/dt(A/µs) 100 0.0 0 50 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 Figure 7. S oftness factor versus Figure 8. Relative variations of dynamic dI /dt (typical values) parameters versus junction F temperature S factor 3.0 ITVFjR=≤=1262x05I0°FCV(AV) 22..0205 RefereVInFRc==eI6F:0(TA0Vj=V)125°C 2.5 1.75 Sfactor 1.50 2.0 1.25 1.00 1.5 0.75 trr IRM 0.50 1.0 0.25 QRR Tj(°C) dIF/dt(A/µs) 0.00 0.5 25 50 75 100 125 0 50 100 150 200 250 300 350 400 450 500 Figure 9. T ransient peak forward voltage Figure 10. Forward recovery time versus dI /dt F versus dI /dt (typical values) (typical values) F VFP(V) tfr(ns) 40 800 35 ITFj==I1F2(A5V°)C 700 VFR=T1IFj.=5=1 Ix2F(5VA°VFC)max. 30 600 25 500 20 400 15 300 10 200 5 100 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 100 200 300 400 500 0 100 200 300 400 500 4/11 Doc ID 12157 Rev 2

STTH1512 Characteristics F igure 11. Junction capacitance versus Figure 12. Thermal resistance junction to reverse voltage applied ambient versus copper surface (typical values) under each lead C(pF) Rth(j-a)(°C/W) 1000 80 F=1MHz Epoxy printed circuit board FR4, VOSCT=j=3205m°CVRMS 70 copper thickness = 35 µm 60 50 100 40 30 20 VR(V) 10 S (cm²) 10 CU 1 10 100 1000 00 5 10 15 20 25 30 35 40 Doc ID 12157 Rev 2 5/11

Package information STTH1512 2 Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.4 to 0.6 N·m (TO-220AC) ● Recommended torque value: 0.80 N·m (DOP3I) ● Maximum torque value: 1.0 N·m (DOP3I) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. T able 6. DOP3 dimensions Dimensions Ref. Millimeters Inches E A Min. Max. Min. Max. E1 R c A 4.40 4.60 0.173 0.181 ØP b 1.20 1.40 0.047 0.055 c 1.45 1.55 0.057 0.061 c1 0.50 0.70 0.020 0.028 G Y D D 12.15 13.10 0.474 0.516 E 15.10 15.50 0.594 0.610 E1 7.55 7.75 0.297 0.305 e 10.80 11.30 0.425 0.445 L G 20.4 21.10 0.815 0.831 L 14.35 15.60 0.565 0.614 b c1 P 4.08 4.17 0.161 0.164 Q e Q 2.70 2.90 0.106 0.114 R 4.60 typ. 0.181 typ. Y 15.80 16.50 0.622 0.650 6/11 Doc ID 12157 Rev 2

STTH1512 Package information T able 7. DO247 dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 V D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 V Dia F 1.00 1.40 0.039 0.055 F2 2.00 0.078 A H F3 2.00 2.40 0.078 0.094 G 10.90 0.429 L5 H 15.45 15.75 0.608 0.620 L L 19.85 20.15 0.781 0.793 L2 L4 L1 3.70 4.30 0.145 0.169 F2 L1 L2 18.50 0.728 L3 V2 F3 D L3 14.20 14.80 0.559 0.582 L4 34.60 1.362 F M E G L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 3.55 3.65 0.139 0.143 Doc ID 12157 Rev 2 7/11

Package information STTH1512 T able 8. D2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A A1 2.49 2.69 0.098 0.106 E L2 C2 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 D B2 1.14 1.70 0.045 0.067 L C 0.45 0.60 0.017 0.024 L3 A1 C2 1.23 1.36 0.048 0.054 B2 C R D 8.95 9.35 0.352 0.368 B E 10.00 10.40 0.393 0.409 G G 4.88 5.28 0.192 0.208 A2 L 15.00 15.85 0.590 0.624 M * L2 1.27 1.40 0.050 0.055 V2 L3 1.40 1.75 0.055 0.069 * FLAT ZONE NO LESS THAN 2mm M 2.40 3.20 0.094 0.126 R 0.40 typ. 0.016 typ. V2 0° 8° 0° 8° Figure 13. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 3.70 8.90 8/11 Doc ID 12157 Rev 2

STTH1512 Package information T able 9. TO-220AC dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 H2 A C 1.23 1.32 0.048 0.051 Ø I C D 2.40 2.72 0.094 0.107 L5 L7 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 L6 F1 1.14 1.70 0.044 0.066 L2 G 4.95 5.15 0.194 0.202 F1 L9 D H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 F L4 13.00 14.00 0.511 0.551 M L5 2.65 2.95 0.104 0.116 E L6 15.25 15.75 0.600 0.620 G L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. Diam. I 3.75 3.85 0.147 0.151 Doc ID 12157 Rev 2 9/11

Ordering information STTH1512 3 Ordering information T able 10. Ordering information Order code Marking Package Weight Base qty Delivery mode STTH1512D STTH1512D TO-220AC 1.86g 50 Tube STTH1512PI STTH1512PI DOP3I 4.46 g 30 Tube STTH1512W STTH1512W DO-247 4.4 g 30 Tube STTH1512G STTH1512G D2PAK 1.48 g 50 Tube STTH1512G-TR STTH1512G D2PAK 1.48 g 1000 Tape and reel 4 Revision history T able 11. Document revision history Date Revision Changes 02-Mar-2006 1 Initial release. Updated I in Table2 from 150 A to 200 A. Updated ECOPACK 19-Apr-2010 2 FSM statement. 10/11 Doc ID 12157 Rev 2

STTH1512 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 12157 Rev 2 11/11

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