STPS3L40 Power Schottky rectifier Datasheet - production data Description A Schottky rectifier suited for switched mode power supplies and high frequency DC to DC K converters. Packaged in SMC, and SMBflat, this device is intended for use in DC/DC chargers. SMC STPS3L40S Table 1. Device summary I 3 A F(AV) A V 40 V RRM T (max) 150 °C j K V (max) 0.44 V SMBflat F STPS3L40UF Features  Negligible switching losses  Low thermal resistance  Low forward voltage drop  Avalanche capability specified May 2013 DocID7128 Rev 4 1/9 This is information on a product in full production. www.st.com

Characteristics STPS3L40 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit V Repetitive peak reverse voltage 40 V RRM Average forward SMC TL = 120 °C  = 0.5 I 3 A F(AV) current SMBflat T = 130 °C  = 0.5 L I Surge non repetitive forward current t = 10 ms sinusoidal 75 A FSM p P Repetitive peak avalanche power t = 1 µs Tj = 25 °C 1300 W ARM p T Storage temperature range -65 to + 175 °C stg T Operating junction temperature (1) 150 °C j 1. d----P-----t--o----t------------1-------------- condition to avoid thermal runaway for a diode on its own heatsink dTj Rthj–a Table 3. Thermal resistance Symbol Parameter Value Unit SMC 18 R Junction to lead °C/W th(j-l) SMBflat 10 Table 4. Static electrical characteristics Symbol Parameter Test conditions Typ. Max. Unit T = 25 °C 100 µA I (1) Reverse leakage current j V = V R R RRM T = 125 °C 16 40 mA j T = 25 °C 0.5 j I = 3 A F T = 125 °C 0.40 0.44 V (1) Forward voltage drop j V F T = 25 °C 0.62 j I = 6 A F T = 125 °C 0.52 0.58 j 1. Pulse test: t = 380 µs,  < 2% p To evaluate the conduction losses use the following equation: P = 0.30 x I + 0.047 I 2 F(AV) F (RMS) 2/9 DocID7128 Rev 4

STPS3L40 Characteristics Figure 1. Average forward power dissipation Figure 2. Average forward current versus versus average forward current ambient temperature ( = 0.5) - SMC PF(AV)(W) IF(AV)(A) 2.0 3.5 δ= 0.1 δ= 0.2 δ= 0.5 Rth(j-a)=Rth(j-l) SMC δ= 0.05 3.0 1.6 δ= 1 2.5 1.2 Rth(j-a)=75°C/W 2.0 1.5 0.8 1.0 T T 0.4 0.5 IF(AV)(A) δ=tp/T tp δ=tp/T tp Tamb(°C) 0.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 150 Figure 3. Average forward current versus Figure 4. Non repetitive surge peak forward ambient temperature ( = 0.5) SMBflat current versus overload duration (maximum values) SMC IF(AV)(A) IM(A) 3.5 14 Rth(j-a)=Rth(j-l) SMC 3.0 12 SMB flat 2.5 10 Rth(j-a)=75°C/W Ta=25°C 2.0 8 1.5 6 Ta=75°C 1.0 4 T Ta=125°C IM 0.5 2 δ=tp/T tp Tamb(°C) δ=t0.5 t(s) 0.0 0 0 25 50 75 100 125 150 1.E-03 1.E-02 1.E-01 1.E+00 Figure 5. Non repetitive surge peak forward Figure 6. Normalized avalanche power derating current versus overload duration (maximum versus pulse duration values) SMBflat IM(A) PARM(tp) 45 SMB flat PARM(1µs) 40 (non exposed pad) 1 35 30 0.1 25 TL=25°C 20 TL=75°C 15 0.01 10 TL=125°C IM 5 δ=t0.5 t(s) 0.001 tp(µs) 0 0.01 0.1 1 10 100 1000 1.E-03 1.E-02 1.E-01 1.E+00 DocID7128 Rev 4 3/9 9

Characteristics STPS3L40 Figure 7. Normalized avalanche power derating Figure 8. Relative variation of thermal versus junction temperature impedance junction to ambient versus pulse duration - SMC Zth(j-c)/Rth(j-c) PARM(Tj) 1.0 PARM(25°C) 1.2 0.9 SMC 0.8 1 0.7 0.8 0.6 0.6 0.5 0.4 0.4 0.3 T 0.2 0.2 0 Tj(°C) 0.1 Single pulse tp(s) δ=tp/T tp 25 50 75 100 125 150 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 9. Relative variation of thermal Figure 10. Reverse leakage current versus impedance junction to lead versus pulse reverse voltage applied (typical values) duration - SMBflat Zth(j-l)/Rth(j-l) IR(mA) 1.0 1.E+02 SMB flat 0.9 0.8 1.E+01 Tj=125°C 0.7 Tj=100°C 0.6 1.E+00 0.5 0.4 1.E-01 0.3 Tj=25°C 0.2 1.E-02 Single pulse 0.1 tp(s) VR(V) 0.0 1.E-03 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 0 5 10 15 20 25 30 35 40 Figure 11. Junction capacitance versus reverse Figure 12. Forward voltage drop versus forward voltage applied (typical values) current C(pF) IFM(A) 1000 100.00 F=1MHz VOSC=30mVRMS Tj=25°C 10.00 ((MMaaxxTTiimmjj==11uu22mm55 vv°°aaCClluueess)) 100 1.00 ((TTyyTTppiijj==ccaa11ll2255vvaa°°llCCuueess)) 0.10 (MaxiTmj=u2m5 °vCalues) VR(V) VFM(V) 10 0.01 1 10 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 4/9 DocID7128 Rev 4

STPS3L40 Characteristics Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, copper thickness = 35µm) Rth(j-a)(°C/W) 110 100 90 SMC 80 70 60 50 SMB flat 40 30 20 10 SCU(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DocID7128 Rev 4 5/9 9

Package information STPS3L40 2 Package information  Epoxy meets UL94,V0  Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMC package dimensions Dimensions Ref Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 D A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 E c 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 A1 E 7.75 8.15 0.305 0.321 C A2 E2 L b E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.40 0.030 0.063 Figure 14. SMC footprint dimensions in mm (inches) 1.54 5.11 1.54 (0.061) (0.201) (0.061) 3.14 (0.124) 8.19 (0.322) 6/9 DocID7128 Rev 4

STPS3L40 Package information Table 6. SMBflat dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A c A 0.90 1.10 0.035 0.043 D b(1) 1.95 2.20 0.077 0.087 L c(1) 0.15 0.40 0.006 0.016 L2 D 3.30 3.95 0.130 0.156 E E1 E 5.10 5.60 0.200 0.220 L E1 4.05 4.60 0.189 0.181 L1 b L 0.75 1.50 0.029 0.059 L1 0.40 0.016 L2 0.60 0.024 1. Applies to plated leads Figure 15. SMBflat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 1.20 DocID7128 Rev 4 7/9 9

Ordering information STPS3L40 3 Ordering information Table 7. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS3L40S S3L4 SMC 0.24 g 2500 Tape and reel STPS3L40UF FS3L4 SMBflat 0.05 g 5000 Tape and reel 4 Revision history Table 8. Document revision history Date Revision Description of changes Jul-2003 2A Last update. Reformatted to current standard. Added ECOPACK statement. Added 08-Feb-2007 3 SMBflat package. Updated SMC package information. Updated ECOPACK statement. 20-May-2013 4 Corrected Y axis labels of Figure12. 8/9 DocID7128 Rev 4

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