STPS3150 Power Schottky rectifier Datasheet - production data Description A 150 V Power Schottky rectifier are suited for switch mode power supplies on up to 24 V rails and high frequency converters. DO-201AD Packaged in Axial, SMB, and low-profile SMB, K this device is intended for use in consumer and computer applications like TV, STB, PC and DVD A A where low drop forward voltage is required to reduce power dissipation. K K SMB SMBflat Table 1. Device summary Symbol Value I 3 A F(AV) Features V 150 V RRM • Negligible switching losses T (max) 175 °C j • Low forward voltage drop for higher efficiency V (typ) 0.63 V F and extended battery life • Low thermal resistance • ECOPACK®2 compliant component August 2016 Doc ID 9474 Rev 6 1/9 This is information on a product in full production. www.st.com

Characteristics STPS3150 1 Characteristics Table 2. Absolute Ratings (limiting values at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 150 V SMB T = 130 °C L Average forward current, IF(AV) δ= 0.5 square wave DO-201AD TL = 140 °C 3 A SMB flat T = 150 °C L SMB 80 Surge non repetitive IFSM forward current DO-201AD tp = 10 ms sinusoidal 100 A SMB flat 80 P (1) Repetitive peak avalanche power T = 125 °C, t = 10 µs 210 W ARM j p T Storage temperature range -65 to + 175 °C stg T Operating junction temperature(2) 175 °C j 1. For pulse time duration deratings, please refer to Figure3. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics Application notes AN1768, “Admissible avalanche power of Schottky diodes” and AN2025, “Converter improvement using Schottky rectifier avalanche specification”. 2. d----dP---T--t--o-j---t<R-----t--h----(-1--j--–-----a----)- condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Parameter Value Unit SMB flat 10 R Junction to lead SMB 20 °C/W th(j-l) Lead length = 10 mm DO-201AD 15 Table 4. Static electrical characteristics Symbol Parameter Tests conditions Min. Typ Max. Unit I (1) Reverse leakage Tj = 25 °C V = V 0.4 2.0 µA R current T = 125 °C R RRM 0.6 2.0 mA j T = 25 °C 0.78 0.82 j I = 3 A F T = 125 °C 0.63 0.67 V (2) Forward voltage drop j V F T = 25 °C 0.85 0.89 j I = 6 A F T = 125 °C 0.70 0.75 j 1. t = 5 ms, δ < 2% p 2. t = 380 µs, δ < 2% p To evaluate the conduction losses use the following equation: P = 0.59 x I + 0.027 I 2 F(AV) F (RMS) 2/9 Doc ID 9474 Rev 6

STPS3150 Characteristics Figure 1. A v erage forward power dissipation Figure 2. Average forward current versus versus average forward current ambient temperature (δ=0.5) PF(AV)(W) IF(AV)(A) 2.5 (cid:2)= 0.05 (cid:2)= 0.1 (cid:2)= 0.2 (cid:2)= 0.(cid:3) (cid:2)=1 3.5 Rth(j-a)=Rth(j-l) 3.0 2.0 SMB-Flat 2.5 DO-201AD 1.5 2.0 SMB 1.5 1.0 T 1.0 T 0.5 0.5 IF(AV)(A) (cid:2)=tp/T tp (cid:2)=tp/T tp Tamb(°C) 0.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 175 Figure 3. No r malized avalanche power derating Figure 4. Relative variation of thermal versus pulse duration impedance junction to ambient versus pulse duration (DO-201AD) PARM(tp) 1.0Zth(j-a)/Rth(j-a) 1 PARM(10 µs) DO-201AD 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 T 0.2 Single pulse 0.001 tp(µs) 0.1 tp(s) (cid:2)=tp/T tp 0.0 1 10 100 1000 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 5 . Relative variation of thermal Figure 6. Relative variation of thermal impedance junction to ambient versus pulse impedance junction to lead versus pulse duration (SMB) duration (SMBflat) Zth(j-a)/Rth(j-a) Zth(j-l)/Rth(j-l) 1.0 1.0 SMB SMBflat 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 T T 0.2 0.2 Single pulse Single pulse 0.1 tp(s) (cid:2)=tp/T tp 0.1 tp(s) (cid:2)=tp/T tp 0.0 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Doc ID 9474 Rev 6 3/9 9

Characteristics STPS3150 Figure 7. Reverse leakage current versus Figure 8. Junction capacitance versus reverse reverse voltage applied (typical values) voltage applied (typical values) IR(µA) C(pF) 1.E+04 1000 F = 1MHZ Tj= 150 °C VOSC= 30 mVRMS 1.E+03 Tj= 25 °C Tj= 125 °C 1.E+02 Tj= 100 °C 1.E+01 Tj= 75 °C 100 Tj= 50 °C 1.E+00 Tj= 25 °C 1.E-01 VR(V) VR(V) 1.E-02 10 0 25 50 75 100 125 150 1 10 100 1000 Figure 9. Fo r ward voltage drop versus forward Figure 10. Thermal resistance junction to current ambient versus copper surface under each lead (typical values) R (°C/W) 100 IF(A) 200 th(j-a) (maTxjim= u1m25 v a°Clues) 180 epoxy printed boardFR4copper thickness = 35 µm SMB 160 Tj= 125 °C (typical values) 140 Tj= 25 °C (maximum values) 120 10 100 80 60 40 20 VF(V) 0 SCu(cm²) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 11 . Thermal resistance junction to Figure 12. Thermal resistance versus lead ambient versus copper surface under each lead length (typical values) R (°C/W) 200 th(j-a) 90Rth(°C/W) 180 epoxy printed boardFR4copper thickness = 35 µm SMBflat DO-201AD 80 Rth(j-a) 160 70 140 60 120 50 100 40 80 60 30 Rth(j-l) 40 20 20 SCu(cm²) 10 Lleads(mm) 0 0 5 10 15 20 25 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 4/9 Doc ID 9474 Rev 6

STPS3150 Package information 2 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 13. SMB dimensions (definitions) E1 D E A1 C A2 L b Table 5. SMB dimensions (values) Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 14. SMB footprint (dimensions in mm) 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.23) Doc ID 9474 Rev 6 5/9 9

Package information STPS3150 Figure 15. SMBflat dimensions (definitions) A c D L 2x L2 2x E E1 L L1 2x b Table 6. SMBflat dimensions (values) Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 c(1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 L1 0.40 0.016 L2 0.60 0.024 1. Applies to plated leads Figure 16. SMB Flat footprint 5.84 (0.230) 2.07 (0.082) 1.20 3.44 1.20 (0.047) (0.136) (0.047) millimeters (inches) 6/9 Doc ID 9474 Rev 6

STPS3150 Package information Figure 17. DO-201AD dimensions (definitions) B A B E E Note 1 Note 1 ØD Note 2 ØC Table 7. DO-201AD dimensions (values) Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 9.50 0.374 B 25.40 1.000 C 5.30 0.209 D(1) 1.30 0.051 E 1.25 0.049 Note 2(2) 15 0.59 1. The lead diameter D is not controlled over zone E 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”) Doc ID 9474 Rev 6 7/9 9

Ordering information STPS3150 3 Ordering information Table 8. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS3150U G315 SMB 107 mg 2500 Tape and reel STPS3150UF FG315 SMB flat 50 mg 5000 Tape and reel STPS3150 STPS3150 DO-201AD 1.12 g 600 Ammopack STPS3150RL STPS3150 DO-201AD 1.12 g 1900 Tape and reel 4 Revision history Table 9. Document revision history Date Revision Changes May-2003 2A Last update. Reformatted to current standard. Added ECOPACK statement. 31-May-2006 3 Updated SMB footprint in Figure 12. Changed nF to pF in Figure 8. 08-Feb-2007 4 Added SMB flat and SMB flat e package. 20-Jul-2011 5 Updated Table 2. 11-Aug-2016 6 Updated Table2 and all curves. 8/9 Doc ID 9474 Rev 6

STPS3150 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved Doc ID 9474 Rev 6 9/9 9

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