STPS2H100 Datasheet 100 V, 2 A power Schottky rectifier Features • Negligible switching losses • High junction temperature capability • Low leakage current • Good trade-off between leakage current and forward voltage drop • Avalanche capability specified • ECOPACK2 component Applications • Switching diode • Battery charger • SMPS • DC / DC converter • Telecom power • LED lighting Description This Schottky rectifier is designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMA, SMA Flat, SMB, SMB Flat and SMA Flat Notch, the STPS2H100 Product status link is ideal for use in lighting and telecom power applications. STPS2H100 Product summary Symbol Value IF(AV) 2 A VRRM 100 V Tj (max.) 175 °C VF (max.) 0.65 V DS1452 - Rev 10 - October 2019 www.st.com For further information contact your local STMicroelectronics sales office.

STPS2H100 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V SMA Tl = 130 °C, δ = 0.5 SMB Tl = 135 °C, δ = 0.5 IF(AV) Average forward current 2 A SMA Flat, SMA Flat Notch Tl = 145 °C, δ = 0.5 SMB Flat Tl = 150 °C, δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 173 W Tstg Storage temperature range -65 to +175 °C Tj Maximum operating junction temperature(1) 175 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Parameter Max. value Unit SMA 30 SMA Flat, SMA Flat Notch 20 Rth(j-l) Junction to lead °C/W SMB 25 SMB Flat 15 For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 1.00 µA IR(1) Reverse leakage current VR = VRRM Tj = 125 °C - 0.40 1.00 mA Tj = 25 °C - 0.79 IF = 2 A Tj = 125 °C - 0.60 0.65 VF(2) Forward voltage drop V Tj = 25 °C - 0.88 IF = 4 A Tj = 125 °C - 0.69 0.74 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.56 x I + 0.045 x I 2 F(AV) F (RMS) DS1452 - Rev 10 page 2/19

STPS2H100 Characteristics (curves) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient average forward current temperature (δ = 0.5, SMA / SMB) PF(AV)(W) IF(AV)(A) 1.7 2.2 1.6 δ= 0.1 δ= 0.2 δ= 0.5 Rth(j-a)=Rth(j-I) 1.5 δ= 0.05 2.0 SMB 1.4 1.8 1.3 SMA 1.2 1.6 SMA 11..01 δ= 1 1.4 RS(tCh(Uj-)a=)=11.50c0m°C2/W 0.9 1.2 000...678 01..80 SRS(MtCh(UBj-)a=)=1.850c°mC2/W 0.5 0.6 0.4 T T 0.3 0.4 00..12 IF(AV)(A) δ=tp/T tp 0.2 δ=tp/T tp Tamb(°C) 0.0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 175 Figure 3. Average forward current versus ambient Figure 4. Average forward current versus ambient temperature (δ = 0.5, SMB Flat) temperature (δ = 0.5, SMA Flat, SMA Flat Notch) IF(AV)(A) IF(AV)(A) 2.2 2.2 2.0 Rth(j-a)=Rth(j-l) 2.0 Rth(j-a)=Rth(j-l) 1.8 1.8 1.6 1.6 SMA Flat 1.4 1.4 SMA Flat Notch 1.2 SMBflat 1.2 1.0 1.0 0.8 Rth(j-a)= 40 °C/W 0.8 0.6 T SCU= 2.5 cm2 0.6 T 0.4 0.4 0.2 δ=tp/T tp Tamb(°C) 0.2 δ=tp/T tp Tamb(°C) 0.0 0.0 0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175 DS1452 - Rev 10 page 3/19

STPS2H100 Characteristics (curves) Figure 6. Relative variation of thermal impedance junction Figure 5. Normalized avalanche power derating versus to ambient versus pulse duration (SMA) junction temperature (T = 125 °C) j PARM(tp) Zth(j-a)/Rth(j-a) P (10 µs) 1.0 1 ARM SMA 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 tp(µs) 0.1 Single pulse tp(s) 0.001 0.0 1 10 100 1000 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction to lead versus pulse duration (SMA Flat, SMA Flat Notch) to ambient versus pulse duration (SMB) Zth(j-l)/Rth(j-l) Zth(j-a)/Rth(j-a) 1.0 1.0 SMA Flat SMB 0.9 SMA Flat Notch 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.1 tp(s) 0.1 Single pulse tp(s) 0.0 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 9. Relative variation of thermal impedance junction Figure 10. Reverse leakage current versus reverse to lead versus pulse duration (SMB Flat) voltage applied (typical values) Zth(j-l)/Rth(j-l) IR(µA) 1.0 1.E+04 SMBflat 0.9 0.8 1.E+03 Tj= 150°C 0.7 Tj= 125°C 1.E+02 0.6 Tj= 100°C 0.5 1.E+01 Tj= 75 °C 0.4 1.E+00 Tj= 50 °C 0.3 0.2 Tj= 25 °C 1.E-01 0.1 Single pulse tp(s) VR(V) 0.0 1.E-02 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 0 20 40 60 80 100 DS1452 - Rev 10 page 4/19

STPS2H100 Characteristics (curves) Figure 11. Junction capacitance versus reverse voltage Figure 12. Forward voltage drop versus forward current applied (typical values) (low level) C(pF) IF(A) 100 2.0 F=1MHz 1.8 VOSCT=j=3205m°VCRMS 1.6 ((MMaaxxTTiimmjj==uu11mm2255 vv°°aaCClluueess)) 1.4 1.2 1.0 ((TTyyppTTiijjcc==aa11ll22vv55aa°°llCCuueess)) 0.8 0.6 (MaxiTmj=u2m5 °vCalues) 0.4 0.2 VR(V) VF(V) 10 0.0 1 10 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 Figure 13. Forward voltage drop versus forward current Figure 14. Thermal resistance junction to ambient versus (high level) copper surface under each lead (SMA) IF(A) Rth(j-a)(°C/W) 100 200 Epoxy printed circuit board FR4,copper thickness:35 µm SMA ((MMaaxxTTiimmjj==uu11mm2255 vv°°aaCClluueess)) 150 ((TTyyppTTiijjcc==aa11ll22vv55aa°°llCCuueess)) 10 100 (MaxiTmj=u2m5 °vCalues) 50 VF(V) S(Cu)(cm²) 1 0 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA Flat Figure 16. Thermal resistance junction to ambient versus Notch) copper surface under each lead (SMB) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 200 200 Epoxy printed circuit board FR4,copper thickness:35 µm EpoxyprintedcircuitboardFR4,copperthickness:35µm SMB SMA Flat SMA Flat Notch 150 150 100 100 50 50 S(Cu)(cm²) S(Cu)(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DS1452 - Rev 10 page 5/19

STPS2H100 Characteristics (curves) Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat) R (°C/W) th(j-a) 200 Epoxy printed circuit board FR4, eCu= 35 µm SMB-Flat 150 100 50 SCu(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DS1452 - Rev 10 page 6/19

STPS2H100 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMA Flat package information • Epoxy meets UL94, V0 • Lead-free package Figure 18. SMA Flat package outline A c D L 2x L1 2x E E1 L L2 2x b 2x Table 4. SMA Flat package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.95 0.088 0.117 E 4.80 5.60 0.188 0.221 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 L1 0.50 0.020 L2 0.50 0.020 DS1452 - Rev 10 page 7/19

STPS2H100 SMA Flat package information Figure 19. SMA Flat recommended footprint in mm (inches) 5.52 (0.217) 1.52 (0.060) 1.20 3.12 1.20 (0.047) (0.123) (0.047) millimeter s (inches) DS1452 - Rev 10 page 8/19

STPS2H100 SMA Flat Notch package information 2.2 SMA Flat Notch package information • Epoxy meets UL94, V0 • Cooling method: by conduction (C) • Band indicates cathode Figure 20. SMA Flat Notch package outline Table 5. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A1 0.90 1.10 0.035 0.044 A1 0.05 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° DS1452 - Rev 10 page 9/19

STPS2H100 SMA Flat Notch package information Figure 21. SMA Flat Notch recommended footprint in mm (inches) 1.20 3.12 1.20 (0.047) (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS1452 - Rev 10 page 10/19

STPS2H100 SMA package information 2.3 SMA package information • Epoxy meets UL94, V0 • Lead-free package Figure 22. SMA package outline E1 D E A1 C A2 L b Table 6. SMA package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.097 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 DS1452 - Rev 10 page 11/19

STPS2H100 SMA package information Figure 23. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) DS1452 - Rev 10 page 12/19

STPS2H100 SMB package information 2.4 SMB package information • Epoxy meets UL94, V0 • Lead-free package Figure 24. SMB package outline E1 D E A1 C A2 L b Table 7. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 DS1452 - Rev 10 page 13/19

STPS2H100 SMB package information Figure 25. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS1452 - Rev 10 page 14/19

STPS2H100 SMB Flat package information 2.5 SMB Flat package information • Epoxy meets UL94, V0 • Lead-free package Figure 26. SMB Flat package outline A c D L 2x L1 2x E E1 L2 2x b Table 8. SMB Flat mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 L1 0.40 0.016 L2 0.60 0.024 DS1452 - Rev 10 page 15/19

STPS2H100 SMB Flat package information Figure 27. Footprint recommendations, dimensions in mm (inches) 1.20 3.44 1.20 (0.047) (0.136) (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS1452 - Rev 10 page 16/19

STPS2H100 Ordering Information 3 Ordering Information Table 9. Ordering information Order code Marking Package Weight Base qty. Delivery mode STPS2H100A S21 SMA 0.068 g 5000 Tape and reel STPS2H100AF F21 SMA Flat 0.035 g 10 000 Tape and reel STPS2H100AFN A21 SMA Flat Notch 0.039 g 10 000 Tape and reel STPS2H100U G21 SMB 0.107 g 2500 Tape and reel STPS2H100UF FG21 SMB Flat 0.050 g 5000 Tape and reel DS1452 - Rev 10 page 17/19

STPS2H100 Revision history Table 10. Document revision history Date Version Changes Jul-2003 4A Last update. SMA package dimensions update. Reference A1 max. changed from 2.70 Aug-2004 5 (0.106 inches) to 2.03 mm (0.080 inches). Reformatted to current standards. Added ECOPACK statement. Added 08-Feb-2007 6 SMBflat package. 15-Feb-2010 7 Updated weight for SMBflat in Table 9. 24-Jun-2013 8 Added SMAflat package Removed figure 6. Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise 17-May-2018 9 specified) and Section Description. Minor text changes to improve readability. 08-Oct-2019 10 Added Section 2.2 SMA Flat Notch package information. DS1452 - Rev 10 page 18/19

STPS2H100 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS1452 - Rev 10 page 19/19