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STPS20L45CFP产品简介:
ICGOO电子元器件商城为您提供STPS20L45CFP由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 STPS20L45CFP价格参考¥7.17-¥7.51。STMicroelectronicsSTPS20L45CFP封装/规格:二极管 - 整流器 - 阵列, Diode Array 1 对共阴极 肖特基 45V 10A 通孔 TO-220-3 整包。您可以下载STPS20L45CFP参考资料、Datasheet数据手册功能说明书,资料中有STPS20L45CFP 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | DIODE SCHOTTKY 45V 10A TO220FP肖特基二极管与整流器 Lo drop Pwr Schottky rectifier |
产品分类 | 二极管,整流器 - 阵列分离式半导体 |
品牌 | STMicroelectronics |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 二极管与整流器,肖特基二极管与整流器,STMicroelectronics STPS20L45CFP- |
数据手册 | |
产品型号 | STPS20L45CFP |
不同If时的电压-正向(Vf) | 550mV @ 10A |
不同 Vr时的电流-反向漏电流 | 200µA @ 45V |
二极管类型 | |
二极管配置 | 1 对共阴极 |
产品 | Schottky Rectifiers |
产品种类 | 肖特基二极管与整流器 |
供应商器件封装 | TO-220FP |
其它名称 | 497-12635-5 |
其它有关文件 | http://www.st.com/web/catalog/sense_power/FM64/CL1571/SC541/SS1617/PF64868?referrer=70071840 |
包装 | 管件 |
反向恢复时间(trr) | - |
商标 | STMicroelectronics |
安装类型 | 通孔 |
安装风格 | Through Hole |
封装 | Tube |
封装/外壳 | TO-220-3 整包 |
封装/箱体 | TO-220-3 FP |
峰值反向电压 | 45 V |
工作温度范围 | + 150 C |
工厂包装数量 | 50 |
技术 | Silicon |
最大反向漏泄电流 | 200 uA |
最大工作温度 | + 150 C |
最大浪涌电流 | 180 A |
最小工作温度 | - 65 C |
标准包装 | 50 |
正向电压下降 | 0.73 V |
正向连续电流 | 20 A |
热阻 | 3.5°C/W Jc |
电压-DC反向(Vr)(最大值) | 45V |
电流-平均整流(Io)(每二极管) | 10A |
系列 | STPS20L45C |
速度 | 快速恢复 =< 500 ns,> 200mA(Io) |
配置 | Dual Common Cathode |
STPS20L45C Low drop power Schottky rectifier Datasheet - production data Description A1 K A2 Dual center tap Schottky rectifiers designed for high frequency switched mode power supplies K and DC to DC converters. These devices are intended for use in low voltage, high frequency inverters, free-wheeling A2 and polarity protection applications. A2 K K A1 A1 Table 1: Device summary TO-220AB TO-220FPAB Symbol Value IF(AV) 2 x 10 A K K VRRM 45 V VF (typ.) 0.44 V A2 A2 Tj (max.) 150 °C A1 A1 D²PAK Features Low forward voltage drop meaning very small conduction losses Low switching losses allowing high frequency operation Insulated package: TO-220FPAB Insulating voltage = 2000 V sine RMS Avalanche capability specified ECOPACK®2 compliant component for D²PAK on demand October 2016 DocID8001 Rev 5 1/15 This is information on a product in full production. www.st.com
Characteristics STPS20L45C 1 Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 30 A TO-220AB / TC = 135 °C Per diode 10 Average forward D²PAK TC = 130 °C Per device 20 IF(AV) current A δ = 0.5, square wave TC = 115 °C Per diode 10 TO-220FPAB TC = 100 °C Per device 20 IFSM Surge non repetitive forward current tspi n=u 1so0i dmasl 180 A PARM Repetitive peak avalanche power tTpj == 1102 5µ s°C, 285 W Tstg Storage temperature range -65 to +150 °C Tj Maximum operating junction temperature (1) 150 Notes: (1)(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Parameter Max. value Unit Per diode 4.5 TO-220FPAB Total 3.5 Rth(j-c) Junction to case TO-220AB Per diode 2.2 D²PAK Total 1.3 °C/W TO-220FPAB 2.5 Rth(c) Coupling TO-220AB 0.3 D²PAK When the diodes 1 and 2 are used simultaneously: ΔT = P x R (per diode) + P x R j (diode1) (diode1) th(j-c) (diode2) th(c) 2/15 DocID8001 Rev 5
STPS20L45C Characteristics Table 4: Static electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit Tj = 25 °C - 0.2 IR(1) Reverse leakage current VR = VRRM mA Tj = 125 °C - 65 130 Tj = 25 °C - 0.55 IF = 10 A Tj = 125 °C 0.44 0.5 VF(1) Forward voltage drop V Tj = 25 °C - 0.73 IF = 20 A Tj = 125 °C - 0.62 0.72 Notes: (1)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.28 x I + 0.022 x I 2 F(AV) F (RMS) DocID8001 Rev 5 3/15
Characteristics STPS20L45C 1.1 Characteristics (curves) Figure 1: Average forward power dissipation Figure 2: Average forward current versus ambient versus average forward current (per diode) temperature (δ = 0.5, per diode) IF(AV)(A) PF(AV)(W) 12 8 11 Rth(j-a)=Rth(j-c) TO-220AB 7 δ=0.1 δ=0.2 δ=0.5 10 δ=0.05 9 TO-220FPAB 6 8 7 Rth(j-a)=15°C/W 5 δ=1 6 4 5 4 3 3 T 2 T 2 1 1 δ=tp/T tp Tamb(°C) IF(AV)(A) δ=tp/T tp 0 0 0 25 50 75 100 125 150 0 2 4 6 8 10 12 14 Figure 3: Normalized avalanche power deratings Figure 4: Reverse leakage current versus reverse versus pulse duration (Tj = 125 °C) voltage applied (typical values, per diode) PARM(tp) 2E+2 IR(mA) 1 PARM(10µs) 1E+2 Tj=150°C 1E+1 Tj=125°C 0.1 Tj=75°C 1E+0 0.01 1E-1 Tj=25°C 1E-2 t(µs) p 0.001 VR(V) 1 10 100 1000 1E-3 0 5 10 15 20 25 30 35 40 45 Figure 5: Relative variation of thermal impedance Figure 6: Relative variation of thermal impedance junction to case versus pulse duration junction to case versus pulse duration (TO-220AB, D²PAK) (TO-220FPAB) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.8 0.8 0.6 δ=0.5 0.6 δ=0.5 0.4 δ=0.2 0.4 δ=0.2 δ=0.1 T T δ=0.1 0.2 0.2 Singlepulse tp(s) δ=tp/T tp Singlepulse tp(s) δ=tp/T tp 0.0 0.0 1E-3 1E-2 1E-1 1E+0 1E-3 1E-2 1E-1 1E+0 1E+1 4/15 DocID8001 Rev 5
STPS20L45C Characteristics Figure 7: Junction capacitance versus reverse Figure 8: Forward voltage drop versus forward voltage applied (typical values, per diode) current (maximum values, per diode) C(pF) 2000 F=1MHz V =30mV OSC RMS 1000 Tj=25°C VR(V) 100 1 2 5 10 20 50 Figure 9: Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) 80 70 60 50 40 30 20 EpoxyprintedboardFR4,eCU=35µm 10 SCu(cm²) 0 0 5 10 15 20 25 30 35 40 DocID8001 Rev 5 5/15
Package information STPS20L45C 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N·m for TO-220AB Maximum torque value: 0.7 N·m for TO-220AB 6/15 DocID8001 Rev 5
STPS20L45C Package information 2.1 TO-220AB package information Figure 10: TO-220AB package outline DocID8001 Rev 5 7/15
Package information STPS20L45C Table 5: TO-220AB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.240 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 D1 1.27 typ. 0.050 typ. E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 8/15 DocID8001 Rev 5
STPS20L45C Package information 2.2 TO-220FPAB package information Figure 11: TO-220FPAB package outline DocID8001 Rev 5 9/15
Package information STPS20L45C Table 6: TO-220FPAB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.028 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.2 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.394 0.409 L2 16 typ. 0.63 typ. L3 28.60 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9 9.3 0.354 0.366 Dia 3 3.2 0.118 0.126 10/15 DocID8001 Rev 5
STPS20L45C Package information 2.3 D²PAK package information Figure 12: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID8001 Rev 5 11/15
Package information STPS20L45C Table 7: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. 0.015 V2 0° 8° 0° 8° 12/15 DocID8001 Rev 5
STPS20L45C Package information Figure 13: D²PAK recommended footprint (dimensions in mm) DocID8001 Rev 5 13/15
Ordering information STPS20L45C 3 Ordering information Table 8: Ordering information Order code Marking Package Weight Base qty. Delivery mode STPS20L45CT STPS20L45CT TO-220AB 1.95 g 50 Tube STPS20L45CFP STPS20L45CFP TO-220FPAB 1.7 g 50 Tube STPS20L45CG-TR STPS20L45CG D²PAK 1.38 g 1000 Tape and reel 4 Revision history Table 9: Document revision history Date Revision Changes Jul-2003 3C Last release. 22-Mar-2007 4 Removed ISOWATT and TO-247 packages. Updated cover page. Updated Section 3: "Characteristics" and Section 3.1: 06-Oct-2016 5 "Characteristics (curves)" and Section 5: "Ordering information" and Section 4.4: "D²PAK package information". 14/15 DocID8001 Rev 5
STPS20L45C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID8001 Rev 5 15/15
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