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  • 型号: STP24N60M2
  • 制造商: STMicroelectronics
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STP24N60M2产品简介:

ICGOO电子元器件商城为您提供STP24N60M2由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 STP24N60M2价格参考¥17.63-¥17.63。STMicroelectronicsSTP24N60M2封装/规格:晶体管 - FET,MOSFET - 单, 通孔 N 沟道 600V 18A(Tc) 150W(Tc) TO-220。您可以下载STP24N60M2参考资料、Datasheet数据手册功能说明书,资料中有STP24N60M2 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

MOSFET N-CH 600V 18A TO-220MOSFET N-Ch 600V 0.168 Ohm 18A Mdmesh II Plus

产品分类

FET - 单分离式半导体

FET功能

标准

FET类型

MOSFET N 通道,金属氧化物

Id-ContinuousDrainCurrent

18 A

Id-连续漏极电流

18 A

品牌

STMicroelectronics

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,MOSFET,STMicroelectronics STP24N60M2MDmesh™ II Plus

数据手册

点击此处下载产品Datasheet

产品型号

STP24N60M2

Pd-PowerDissipation

150 W

Pd-功率耗散

150 W

Qg-GateCharge

29 nC

Qg-栅极电荷

29 nC

RdsOn-Drain-SourceResistance

168 mOhms

RdsOn-漏源导通电阻

168 mOhms

Vds-Drain-SourceBreakdownVoltage

600 V

Vds-漏源极击穿电压

600 V

Vgsth-Gate-SourceThresholdVoltage

3 V

Vgsth-栅源极阈值电压

3 V

上升时间

9 ns

下降时间

61 ns

不同Id时的Vgs(th)(最大值)

4V @ 250µA

不同Vds时的输入电容(Ciss)

1060pF @ 100V

不同Vgs时的栅极电荷(Qg)

29nC @ 10V

不同 Id、Vgs时的 RdsOn(最大值)

190 毫欧 @ 9A,10V

产品种类

MOSFET

供应商器件封装

TO-220

其它名称

497-13556-5

其它有关文件

http://www.st.com/web/catalog/sense_power/FM100/CL824/SC1167/PF255399?referrer=70071840

典型关闭延迟时间

15 ns

功率-最大值

150W

包装

管件

商标

STMicroelectronics

安装类型

通孔

安装风格

Through Hole

封装

Tube

封装/外壳

TO-220-3

封装/箱体

TO-220-3

工厂包装数量

50

晶体管极性

N-Channel

最大工作温度

+ 150 C

最小工作温度

- 55 C

标准包装

50

漏源极电压(Vdss)

600V

特色产品

http://www.digikey.cn/product-highlights/zh/mdmesh-ii-plus-low-qg-power-mosfets/52036

电流-连续漏极(Id)(25°C时)

18A (Tc)

系列

STP24N60M2

配置

Single

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PDF Datasheet 数据手册内容提取

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 N-channel 600 V, 0.168 Ω typ., 18 A MDmesh II Plus™ low Q g 2 2 Power MOSFET in D PAK, I PAK, TO-220 and TO-247 packages − Datasheet production data Features TAB TAB Order codes V @ T R max I 2 DS Jmax DS(on) D 3 1 STB24N60M2 D2PAK 123 STI24N60M2 I2PAK 650 V 0.19 Ω 18 A STP24N60M2 TAB STW24N60M2 • Extremely low gate charge 3 3 • Lower R x area vs previous generation 2 2 DS(on) 1 1 TO-220 TO-247 • Low gate input resistance • 100% avalanche tested Figure 1. Internal schematic diagram • Zener-protected D(2, TAB) Applications • Switching applications Description G(1) These devices are N-channel Power MOSFETs developed using a new generation of MDmesh™ technology: MDmesh II Plus™ low Q . These g revolutionary Power MOSFETs associate a vertical structure to the company's strip layout to S(3) yield one of the world's lowest on-resistance and gate charge. They are therefore suitable for the AM01476v1 most demanding high efficiency converters. Table 1. Device s ummary Order codes Marking Package Packaging STB24N60M2 D2PAK Tape and reel STI24N60M2 I2PAK 24N60M2 STP24N60M2 TO-220 Tube STW24N60M2 TO-247 February 2014 DocID023964 Rev 5 1/21 This is information on a product in full production. www.st.com 21

Contents STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V Gate-source voltage ± 25 V GS I Drain current (continuous) at T = 25 °C 18 A D C I Drain current (continuous) at T = 100 °C 12 A D C I (1) Drain current (pulsed) 72 A DM P Total dissipation at T = 25 °C 150 W TOT C dv/dt (2) Peak diode recovery voltage slope 15 V/ns dv/dt(3) MOSFET dv/dt ruggedness 50 V/ns T Storage temperature stg - 55 to 150 °C T Max. operating junction temperature j 1. Pulse width limited by safe operating area. 2. I ≤ 18 A, di/dt ≤ 400 A/μs; V < V , V =400 V. SD DSpeak (BR)DSS DD 3. V ≤ 480 V DS Table 3. Thermal data Value Symbol Parameter Unit D2PAK I2PAK TO-220 TO-247 R Thermal resistance junction-case max 0.83 °C/W thj-case R Thermal resistance junction-pcb max(1) 30 °C/W thj-pcb R Thermal resistance junction-ambient max 62.5 50 °C/W thj-amb 1. When mounted on 1 inch² FR-4, 2 Oz copper board Table 4. Avalanche characteristics Symbol Parameter Value Unit Avalanche current, repetitive or not I 3.5 A AR repetitive (pulse width limited by T ) jmax Single pulse avalanche energy (starting E 180 mJ AS T=25°C, I = I ; V =50) j D AR DD DocID023964 Rev 5 3/21

Electrical characteristics STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 2 Electrical characteristics (T = 25 °C unless otherwise specified) C Table 5. On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit Drain-source V I = 1 mA, V = 0 600 V (BR)DSS breakdown voltage D GS Zero gate voltage VDS = 600 V 1 μA I DSS drain current (VGS = 0) VDS = 600 V, TC=125 °C 100 μA Gate-body leakage I V = ± 25 V ±10 μA GSS current (V = 0) GS DS V Gate threshold voltage V = V , I = 250 μA 2 3 4 V GS(th) DS GS D Static drain-source R V = 10 V, I = 9 A 0.168 0.19 Ω DS(on) on-resistance GS D Table 6. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C Input capacitance - 1060 - pF iss Coss Output capacitance VDS = 100 V, f = 1 MHz, - 55 - pF V = 0 C Reverse transfer GS pF rss - 2.2 - capacitance Equivalent output C (1) V = 0 to 480 V, V = 0 - 258 - pF oss eq. capacitance DS GS Intrinsic gate R f = 1 MHz, I = 0 - 7 - Ω G resistance D Q Total gate charge - 29 - nC g V = 480 V, I = 18 A, DD D Q Gate-source charge V = 10 V - 6 - nC gs GS (see Figure17) Q Gate-drain charge - 12 - nC gd 1. C is defined as a constant equivalent capacitance giving the same charging time as C when V oss eq. oss DS increases from 0 to 80% V DSS Table 7. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t Turn-on delay time - 14 - ns d(on) V = 300 V, I = 9 A, t Rise time DD D - 9 - ns r R = 4.7 Ω, V = 10 V G GS t Turn-off delay time - 60 - ns d(off) (see Figure16 and 21) t Fall time - 15 - ns f 4/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Electrical characteristics Table 8. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I Source-drain current - 18 A SD I (1) Source-drain current (pulsed) - 72 A SDM V (2) Forward on voltage I = 18 A, V = 0 - 1.6 V SD SD GS t Reverse recovery time - 332 ns rr I = 18 A, di/dt = 100 A/μs Q Reverse recovery charge SD - 4 μC rr V = 60 V (see Figure18) DD I Reverse recovery current - 24 A RRM t Reverse recovery time - 450 ns rr I = 18 A, di/dt = 100 A/μs SD Q Reverse recovery charge V = 60 V, T = 150 °C - 5.5 μC rr DD j (see Figure18) I Reverse recovery current - 25 A RRM 1. Pulse width limited by safe operating area. 2. Pulsed: pulse duration = 300 μs, duty cycle 1.5% DocID023964 Rev 5 5/21

Electrical characteristics STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 2.1 Electrical characteristics (curves) Figure 2. Safe operating area for D2PAK, I2PAK Figure 3. Thermal impedance D2PAK, I2PAK and and TO-220 TO-220 ID AM15495v1 (A) 10 Operatimiotne id n btyh ism aarx eaR iDsS(on) 11100m0µsµss Li 1 Tj=150°C Tc=25°C 10ms Single pulse 0.1 0.1 1 10 100 VDS(V) Figure 4. Safe operating area for TO-247 Figure 5. Thermal impedance for TO-247 ID AM15461v1 (A) 10 Operatimiotne id n btyh ism aarx eaR iDsS(on) 11100m0µsµss Li 1 Tj=150°C Tc=25°C 10ms Single pulse 0.1 0.1 1 10 100 VDS(V) Figure 6. Output characteristics Figure 7. Transfer characteristics AM15470v1 AM15469v1 ID ID (A) VGS= 8, 9, 10 V (A) VGS= 7 V VDS= 17 V 40 40 35 35 30 30 25 VGS= 6 V 25 20 20 15 15 10 VGS= 5 V 10 5 5 VGS= 4 V 0 0 0 5 10 15 20 VDS(V) 0 2 4 6 8 10 VGS(V) 6/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Electrical characteristics Figure 8. Gate charge vs gate-source voltage Figure 9. Static drain-source on-resistance VGS AMV1D54S71v1 RDS(Ω(on)) AM15465v1 (V) 12 VDS VDD=480 V (6V0)0 VGS=10V ID=18 A 0.176 10 500 0.172 8 400 6 300 0.168 4 200 0.164 2 100 0 0 0.160 0 5 10 15 20 25 30 Qg(nC) 0 4 8 12 16 ID(A) Figure 10. Capacitance variations Figure 11. Output capacitance stored energy C AM15665v1 Eoss AM15472v1 (pF) (µJ) 8 1000 Ciss 7 6 5 100 4 Coss 3 10 2 Crss 1 1 0 0.1 1 10 100 VDS(V) 0 100 200 300 400 500 600 VDS(V) Figure 12. Normalized gate threshold voltage vs Figure 13. Normalized on-resistance vs temperature temperature VGS(th) AM15473v1 RDS(on) AM15464v1 (norm) (norm) ID = 250 µA 1.1 2.3 ID = 9 A 2.1 VGS = 10 V 1.0 1.9 1.7 0.9 1.5 1.3 0.8 1.1 0.9 0.7 0.7 0.6 0.5 -50 -25 0 25 50 75 100 TJ(°C) -50 -25 0 25 50 75 100 TJ(°C) DocID023964 Rev 5 7/21

Electrical characteristics STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Figure 14. Source-drain diode forward Figure 15. Normalized V vs temperature (BR)DSS characteristics VSD AM15468v1 V(BR)DSS AM15466v1 (V) (norm) 1.11 1.4 1.09 ID = 1mA 1.2 TJ=-50°C 1.07 1 1.05 0.8 1.03 1.01 0.6 TJ=150°C TJ=25°C 0.99 0.4 0.97 0.2 0.95 0 0.93 0 2 4 6 8 10 12 14 16 ISD(A) -50 -25 0 25 50 75 100 TJ(°C) 8/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Test circuits 3 Test circuits Figure 16. Switching times test circuit for Figure 17. Gate charge test circuit resistive load VDD 12V 47kΩ 1kΩ 100nF RL 2μ20F0 3μ.F3 VDD IG=CONST VD Vi=20V=VGMAX 100Ω D.U.T. VGS 2200 RG D.U.T. μF 2.7kΩ VG PW 47kΩ 1kΩ PW AM01468v1 AM01469v1 Figure 18. Test circuit for inductive load Figure 19. Unclamped inductive load test circuit switching and diode recovery times L A A A D FAST L=100μH VD G D.U.T. DIODE 2200 3.3 μF μF VDD S B 3.3 1000 B B μF μF 25Ω D VDD ID G RG S Vi D.U.T. Pw AM01470v1 AM01471v1 Figure 20. Unclamped inductive waveform Figure 21. Switching time waveform (cid:57)(cid:11)(cid:37)(cid:53)(cid:12)(cid:39)(cid:54)(cid:54) ton toff (cid:57)(cid:39) tdon tr tdoff tf 90% 90% (cid:44)(cid:39)(cid:48) 10% (cid:44)(cid:39) 0 10% VDS (cid:57)(cid:39)(cid:39) (cid:57)(cid:39)(cid:39) 90% VGS (cid:36)(cid:48)(cid:19)(cid:20)(cid:23)(cid:26)(cid:21)(cid:89)(cid:20) 0 10% AM01473v1 DocID023964 Rev 5 9/21

Package mechanical data STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 22. D²PAK (TO-263) drawing 0079457_T 10/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Package mechanical data Table 9. D²PAK (TO-263) mechanical data mm Dim. Min. Typ. Max. A 4.40 4.60 A1 0.03 0.23 b 0.70 0.93 b2 1.14 1.70 c 0.45 0.60 c2 1.23 1.36 D 8.95 9.35 D1 7.50 E 10 10.40 E1 8.50 e 2.54 e1 4.88 5.28 H 15 15.85 J1 2.49 2.69 L 2.29 2.79 L1 1.27 1.40 L2 1.30 1.75 R 0.4 V2 0° 8° DocID023964 Rev 5 11/21

Package mechanical data STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Figure 23. D²PAK footprint(a) 16.90 12.20 5.08 1.60 3.50 9.75 Footprint Figure 24. I²PAK (TO-262) drawing 0004982_Rev_H a. All dimension are in millimeters 12/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Package mechanical data Table 10. I²PAK (TO-262) mechanical data mm. DIM. min. typ max. A 4.40 4.60 A1 2.40 2.72 b 0.61 0.88 b1 1.14 1.70 c 0.49 0.70 c2 1.23 1.32 D 8.95 9.35 e 2.40 2.70 e1 4.95 5.15 E 10 10.40 L 13 14 L1 3.50 3.93 L2 1.27 1.40 DocID023964 Rev 5 13/21

Package mechanical data STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Figure 25. TO-220 type A drawing (cid:19)(cid:19)(cid:20)(cid:24)(cid:28)(cid:27)(cid:27)(cid:66)(cid:87)(cid:92)(cid:83)(cid:72)(cid:36)(cid:66)(cid:53)(cid:72)(cid:89)(cid:66)(cid:55) 14/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Package mechanical data Table 11. TO-220 type A mechanical data mm Dim. Min. Typ. Max. A 4.40 4.60 b 0.61 0.88 b1 1.14 1.70 c 0.48 0.70 D 15.25 15.75 D1 1.27 E 10 10.40 e 2.40 2.70 e1 4.95 5.15 F 1.23 1.32 H1 6.20 6.60 J1 2.40 2.72 L 13 14 L1 3.50 3.93 L20 16.40 L30 28.90 ∅ P 3.75 3.85 Q 2.65 2.95 DocID023964 Rev 5 15/21

Package mechanical data STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Figure 26. TO-247 drawing 0075325_G 16/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Package mechanical data Table 12. TO-247 mechanical data mm. Dim. Min. Typ. Max. A 4.85 5.15 A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c 0.40 0.80 D 19.85 20.15 E 15.45 15.75 e 5.30 5.45 5.60 L 14.20 14.80 L1 3.70 4.30 L2 18.50 ∅P 3.55 3.65 ∅R 4.50 5.50 S 5.30 5.50 5.70 DocID023964 Rev 5 17/21

Packaging mechanical data STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 5 Packaging mechanical data Figure 27. Tape 10 pitches cumulative tolerance on tape +/- 0.2 mm Top cover P0 D P2 T tape E F K0 W B1 B0 For machine ref. only A0 P1 D1 including draft and radii concentric around B0 User direction of feed R Bending radius User direction of feed AM08852v1 18/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Packaging mechanical data Figure 28. Reel T REEL DIMENSIONS 40mm min. Access hole At sl ot location B D C N A Full radius Tape slot G measured at hub in core for tape start 25 mm min. width AM08851v2 Table 13. D²PAK (TO-263) tape and reel mechanical data Tape Reel mm mm Dim. Dim. Min. Max. Min. Max. A0 10.5 10.7 A 330 B0 15.7 15.9 B 1.5 D 1.5 1.6 C 12.8 13.2 D1 1.59 1.61 D 20.2 E 1.65 1.85 G 24.4 26.4 F 11.4 11.6 N 100 K0 4.8 5.0 T 30.4 P0 3.9 4.1 P1 11.9 12.1 Base qty 1000 P2 1.9 2.1 Bulk qty 1000 R 50 T 0.25 0.35 W 23.7 24.3 DocID023964 Rev 5 19/21

Revision history STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 6 Revision history Table 14. Document revision history Date Revision Changes 10-Dec-2012 1 First release. Added MOSFET dv/dt ruggedness in Table2: Absolute maximum 20-Dec-2012 2 ratings. 14-Jan-2013 3 Modified: Figure16 , 17, 18 and 17 – Minor text changes 28-May-2013 4 – Updated: Table7 – Updated: Table11 and Figure25 – Minor text changes 28-Feb-2014 5 – Modified: title of Figure15. – Modified: Figure16, 17, 18 and 19 20/21 DocID023964 Rev 5

STB24N60M2, STI24N60M2, STP24N60M2, STW24N60M2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2014 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com DocID023964 Rev 5 21/21

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: S TMicroelectronics: STP24N60M2 STW24N60M2 STB24N60M2 STI24N60M2