ICGOO在线商城 > 射频/IF 和 RFID > RF 放大器 > SST12LN01-QU6E
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SST12LN01-QU6E产品简介:
ICGOO电子元器件商城为您提供SST12LN01-QU6E由Microchip设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 SST12LN01-QU6E价格参考。MicrochipSST12LN01-QU6E封装/规格:RF 放大器, 射频放大器 IC 802.11b/g 2.4GHz ~ 2.5GHz 6-UQFN(3x1.6)。您可以下载SST12LN01-QU6E参考资料、Datasheet数据手册功能说明书,资料中有SST12LN01-QU6E 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | IC RF PWR AMP WLAN LNA 6-QFN射频放大器 WLAN 2.4 GHz LNA |
产品分类 | |
品牌 | Microchip Technology |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | RF集成电路,射频放大器,Microchip Technology SST12LN01-QU6E- |
数据手册 | |
P1dB | - |
产品型号 | SST12LN01-QU6E |
RF类型 | 802.11b/g |
产品种类 | 射频放大器 |
供应商器件封装 | 6-UQFN(3x1.6) |
其它名称 | SST12LN01-QU6EDKR |
功率增益类型 | 14 dB |
包装 | Digi-Reel® |
商标 | Microchip Technology |
噪声系数 | 1.55 dB |
增益 | 14dB |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | 6-UFQFN 裸露焊盘 |
封装/箱体 | UQFN-6 |
工作电源电压 | 3.3 V |
工作频率 | 2.4 GHz |
工厂包装数量 | 3000 |
技术类型 | Variable Gain Amplifiers |
最大工作温度 | + 85 C |
最小工作温度 | - 40 C |
标准包装 | 1 |
测试频率 | 2.4GHz ~ 2.5GHz |
电压-电源 | 3.3V |
电流-电源 | 11mA |
电源电流 | 11 mA |
类型 | Low Noise Amplifier |
输出截获点 | 3 dBm |
通道数量 | 1 Channel |
频率 | 2.4GHz ~ 2.5GHz |
频率范围 | 2.4 GHz to 2.5 GHz |
SST12LN01 2.4-2.5 GHz WLAN Low-Noise Amplifier Features 1.0 PRODUCT DESCRIPTION • Gain: SST12LN01 is a cost effective Low-Noise Amplifier – Typically 13.5 dB gain across 2.4–2.5 GHz (LNA) which requires no external RF-matching compo- (cid:129) Noise Figure: nents. This device is based on the GaAs pHEMT tech- nology, and complies with 802.11 b/g applications. – Typically 1.5 dB across 2.4–2.5 GHz (cid:129) P1dB: SST12LN01 provides high-performance, low-noise, and moderate-gain operation within the 2.4–2.5 GHz – Typically -5dBm with V 3.3V DD frequency band. Across this frequency band, the LNA (cid:129) Low-Current Consumption typically provides 13.5 dB gain and 1.5 dB noise figure. – 10 mA across 2.4–2.5 GHz This LNA cell is designed with a self DC-biasing (cid:129) 50 Input/Output Matched scheme, which maintains low DC current consumption, (cid:129) Packages available nominally at 10 mA, during operation. Optimum perfor- – 6-contact UQFN – 3 mm x 1.6 mm mance is achieved with only a single power supply, and (cid:129) All non-Pb (lead-free) devices are RoHS no external bias resistors or networks are required. The compliant input and output ports are single-ended 50 matched. RF ports are also DC isolated requiring no DC blocking Applications capacitors or matching components. SST12LN01 is offered in a 6-contact UQFN package. (cid:129) WLAN See Figure 3-1 for pin assignments and Table 4-1 for (cid:129) Bluetooth pin descriptions. (cid:129) Wireless Network 2015 Microchip Technology Inc. DS70005150A-page 1
SST12LN01 2.0 FUNCTIONAL BLOCKS FIGURE 2-1: FUNCTIONAL BLOCK DIAGRAM 3.0 PIN ASSIGNMENTS FIGURE 3-1: PIN ASSIGNMENTS FOR 16-CONTACT UQFN Top View (contacts facing down) VDD 6 NC 1 RFIN 2 RF and DC GND 5 RFOUT 0 4 NC 3 NC 1329 6-uqfn P1.0 4.0 PIN DESCRIPTIONS TABLE 4-1: PIN DESCRIPTION Symbol Pin No. Pin Name Type1 Function GND 0 Ground NC 1 No Connection Unconnected pin RFIN 2 I 2.4G RF input NC 3 No Connection Unconnected pin NC 4 No Connection Unconnected pin RFOUT 5 O 2.4G RF output VDD 6 Power Supply PWR 1. I=Input, O=Output DS70005150A-page 2 2015 Microchip Technology Inc.
SST12LN01 5.0 ELECTRICAL SPECIFICATIONS The AC and DC specifications for the power amplifier interface signals. Refer to Table 5-2 for the DC voltage and current specifications. Refer to Figure 6-1 for the RF performance. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maxi- mum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and func- tional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Input power to pin 2 (P ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 dBm IN Average output power (P )1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 dBm OUT Supply Voltage at pin 6 (V ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +4.6V DD DC supply current (I ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 mA DD Operating Temperature (T ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC A Storage Temperature (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC STG Maximum Junction Temperature (T ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC J Surface Mount Solder Reflow Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds 1. Never measure with CW source. Pulsed single-tone source with <50% duty cycle is recommended. Exceeding the maximum rating of average output power could cause permanent damage to the device. TABLE 5-1: OPERATING RANGE Range Ambient Temp V DD Extended -20°C to +85°C 2.4–3.6V TABLE 5-2: DC ELECTRICAL CHARACTERISTICS Symbol Parameter Min. Typ Max. Unit V Supply Voltage at pin 6 3.3 V DD I Supply Current 2.4–2.5 GHz 10 mA DD TABLE 5-3: AC ELECTRICAL CHARACTERISTICS FOR CONFIGURATION, V =3.3V DD Symbol Parameter Min. Typ Max. Unit F Frequency range 2400 2500 MHz L-U G Small signal gain, 2.4–2.5 GHz 13.5 dB NF Noise Figure, 2.4–2.5 GHz 1.5 dB IP1dB Input 1 dB compression point -5 dBm 2015 Microchip Technology Inc. DS70005150A-page 3
SST12LN01 6.0 TYPICAL PERFORMANCE CHARACTERISTICS Test Conditions: V = 3.3V, T = 25°C, unless otherwise specified DD A FIGURE 6-1: S-PARAMETERS DS70005150A-page 4 2015 Microchip Technology Inc.
SST12LN01 FIGURE 6-2: NOISE FIGURE VERSUS FREQUENCY FIGURE 6-3: FREQUENCY RESPONSE OF GAIN (S21) FOR THREE TEMPERATURES 20.00 Temp: 25 degree Temp: 80 degree 15.00 Temp-: -10 degree 10.00 B d n, ai 5.00 G 0.00 -5.00 -10.00 1 2 3 4 Frequency, GHz 1329 F7.0 2015 Microchip Technology Inc. DS70005150A-page 5
SST12LN01 FIGURE 6-4: GAIN VERSUS OUTPUT POWER FIGURE 6-5: TYPICAL APPLICATION CIRCUIT VDD 0.1 µF 6 1 50Ω DC Block DC Block 50Ω RFIN 2 5 RFOUT 4 3 1329 app_circuit-1.2 DS70005150A-page 6 2015 Microchip Technology Inc.
SST12LN01 7.0 PACKAGING DIAGRAMS 6-Lead Ultra Thin Quad Flatpack No-Leads (QU6E/F) - 3x1.6 mm Body [UQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-14001A Sheet 1 of 1 2015 Microchip Technology Inc. DS70005150A-page 7
SST12LN01 TABLE 7-1: REVISION HISTORY Revision Description Date 00 (cid:129) Initial release of data sheet Sep 2006 01 (cid:129) Updated “Features” on page1 Sep 2007 02 (cid:129) Revised Product Description on page 1 Jun 2008 (cid:129) Change Suitable Gain to 14 dB globally (cid:129) Changed low-noise figure 1.55 dB globally (cid:129) Changes low-current consumption to 10-12 mA (cid:129) Edited Table 2, DC Electrical Characteristics and Table 3, AC Electrical Characteristics on page (cid:129) Replaced Figures 6-1 through 6-5, pages 5 through 8 (cid:129) Edited Figure 6-5, page 8 (cid:129) Added Figure 6-3 on page 8 03 (cid:129) Updated Contact Information Feb 2009 04 (cid:129) Updated document status from “Preliminary Specifications” to “Data Dec 2009 Sheet” 05 (cid:129) Revised IIPE values in Features on page 1 and Table5-3 on page3 Nov 2010 (cid:129) Changed definition of “F” environmental attribute in “Packaging Dia- grams” on page7 A (cid:129) Applied new document format Jan 2015 (cid:129) Released document under letter revision system (cid:129) Updated Spec number from S71329 to DS70005143 (cid:129) Updated “Features” on page1, “Electrical Specifications” on page3, and “Product Identification System” on page10 DS70005150A-page 8 2015 Microchip Technology Inc.
SST12LN01 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at Users of Microchip products can receive assistance www.microchip.com. This web site is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the web site contains the following informa- tion: • Field Application Engineer (FAE) • Technical Support • Product Support – Data sheets and errata, appli- cation notes and sample programs, design Customers should contact their distributor, representa- resources, user’s guides and hardware support tive or Field Application Engineer (FAE) for support. documents, latest software releases and archived Local sales offices are also available to help custom- software ers. A listing of sales offices and locations is included in • General Technical Support – Frequently Asked the back of this document. Questions (FAQ), technical support requests, Technical support is available through the web site online discussion groups, Microchip consultant at: http://microchip.com/support program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Micro- chip sales offices, distributors and factory repre- sentatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a spec- ified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Cus- tomer Change Notification” and follow the registration instructions. 2015 Microchip Technology Inc. DS70005150A-page 9
SST12LN01 8.0 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. XXX Valid Combinations: SST12LN01-QU6E Device Package SST12LN01-QU6E-K SST12LN01-QU6F SST12LN01-QU6F-K Device: SST12LN01 =2.4-2.5 GHz Low-Noise Amplifier Package: QU6E/QU6F1 =UQFN (3mm x 1.6mm), 0.6 max thickness, 6-contact Evaluation Kit K =Evaluation Kit Flag 1. Suffix E/F = Matte Tin finish DS70005150A-page 10 2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, ensure that your application meets with your specifications. LANCheck, MediaLB, MOST, MOST logo, MPLAB, MICROCHIP MAKES NO REPRESENTATIONS OR OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, WARRANTIES OF ANY KIND WHETHER EXPRESS OR SST, SST Logo, SuperFlash and UNI/O are registered IMPLIED, WRITTEN OR ORAL, STATUTORY OR trademarks of Microchip Technology Incorporated in the OTHERWISE, RELATED TO THE INFORMATION, U.S.A. and other countries. INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR The Embedded Control Solutions Company and mTouch are FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated arising from this information and its use. Use of Microchip in the U.S.A. devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, the buyer’s risk, and the buyer agrees to defend, indemnify and CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit hold harmless Microchip from any and all damages, claims, Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, suits, or expenses resulting from such use. No licenses are KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, conveyed, implicitly or otherwise, under any Microchip MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code intellectual property rights. Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-014-1 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2015 Microchip Technology Inc. DS70005150A-page 11
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