TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SRV05 Series SRV05 Series 6V 10A Diode Array RoHS Pb GREEN Description The SRV05 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb surge current per IEC61000-4-5 (t =8/20µs) without P performance degradation and a minimum ±20kV ESD per IEC61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins. Features • E SD, IEC61000-4-2, • L ow capacitance of 2pF ±20kV contact, ±30kV air (TYP) per I/O • EFT, IEC61000-4-4, 40A • Low leakage current of Pinout (5/50ns) 0.5μA (MAX) at 5V • L ightning, IEC61000-4-5, • S mall SOT23-6 (JEDEC 10A (8/20μs) MO-178) packaging I/O 1 I/O 4 Applications GND V CC • LCD/PDP TVs • Firewire • Monitors • Set Top Boxes I/O 2 I/O 3 • Notebooks • Flat Panel Displays • 10/100/1000 Ethernet • Portable Medical Functional Block Diagram 10/100 Ethernet Differential Protection RJ45 ApplicaTtXi +on Examples Unused 6 5 4 10/100 UTTXnXu -+sed work EtPhHerYnetTX - USB DualR RPTTort ProtecStR12i3Vo0n5-4HTG6V54BUS DVD -B+US RXUP +oSrBt wisted-Pair Net ConUtSrRoXB l+ler CT CT VBUSSRV05-4HTG GND URnXu -sed To T Unused 75 75 75VBUS75 VRCXC - VCRCT VDB +US USB 1 2 3 GND RT D - Port CT CT GND Additional Information 10/100/1000 Ethernet Protection RJ45 Unused TX + Unused 10/100/1000 TTXX -+ work Datasheet Resources Samples EtPhHerYnetTX - 123 654 RX + wisted-Pair Net RX + SRV05-4HTG URnXu -sed To T Unused 75 75 75 75 RX - VCC Life Support Note: VCC Not Intended for Use in Life Support or Life Saving Applications GND The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SRV05 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t=8/20μs)1 10 A Storage Temperature Range –55 to 150 °C PP p Maximum Junction Temperature 150 °C P Peak Pulse Power (t=8/20μs) 150 W PK p Maximum Lead Temperature 260 °C T Operating Temperature –40 to 125 °C OP (Soldering 20-40s) T Storage Temperature –55 to 150 °C STOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1Non-repetitive pulse per waveform on page 3 Electrical Characteristics (T =25ºC) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I ≤ 1µA 6.0 V RWM R Reverse Voltage Drop V I = 1mA 8.0 V R R Reverse Leakage Current I V =5V 0.1 0.5 µA LEAK R I =1A, t=8/20µs, I/O to GND2 8.8 10.0 V PP p Clamp Voltage1 V I =5A, t=8/20µs, I/O to GND2 11.5 13.0 V C PP p I =8A, t=8/20µs, I/O to GND2 13.2 15.0 V PP p Dynamic Resistance R (V - V ) / (I - I ) 0.7 Ω DYN C2 C1 PP2 PP1 IEC61000-4-2 (Contact) ±20 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±30 kV Reverse Bias=0V 2.4 3.0 pF Diode Capacitance1 C I/O-GND Reverse Bias=1.65V 2.0 pF Diode Capacitance1 C Reverse Bias=0V 1.2 pF I/O-I/O Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Repetitive pulse per waveform on page 3. Clamping Voltage vs. I Product Characteristics PP 20.0 Lead Plating Matte Tin 18.0 Lead Material Copper Alloy 16.0 V)C 14.0 Lead Coplanarity 0.0004 inches (0.102mm) ge ( 12.0 Substitute Material Silicon a olt 10.0 p V 8.0 Body Material Molded Epoxy m Cla 6.0 Flammability UL 94 V-0 4.0 Notes : 2.0 1. All dimensions are in millimeters 0.0 2. Dimensions include solder plating. 1 2 3 4 5 6 7 8 9 10 3. Dimensions are exclusive of mold flash & metal burr. Peak Pulse Current-I (A) PP 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SRV05 Series Capacitance vs. Reverse Bias Pulse Waveform 3.0 110% 100% 2.5 90% VCC=Float 80% Capacitance (pF)112...050 VCC =3.3V VCC =5V Percent of IPP 45670000%%%% 30% 0.5 20% 10% 0.0 0% 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 DC Bias (V) Time (μs) Soldering Parameters Reflow Condition Pb – Free assembly tP TP CCrriittiiccaall ZZoonnee - Temperature Min (Ts(min)) 150°C e RRaammpp--uupp TTLL ttoo TTPP Pre Heat -- TTeimmep e(mraitnu rteo Mmaaxx )( T(ts()max)) 2600 0–° C180 secs rutare TS(mTaxL) tL s pm RRaammpp--ddoown Average ramp up rate (Liquidus) Temp e PPrreehheeaatt 3°C/second max T (TL) to peak TS(min) tS T to T - Ramp-up Rate 3°C/second max S(max) L Reflow -- TTeemmppeerraattuurree ((TtL)) (Liquidus) 26107 –° C1 50 seconds 25 time to peak temperature Time L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C Part Numbering System Part Marking System L*4 SRV05 – 4 H T G L*4 Product Series Number of Channels LL == SSRV05 G= Green Assembly Site T= Tape & Reel ((VVaarriieess)) Series Package Ordering Information Number of H: SOT23-6 Channels Part Number Package Marking Min. Order Qty. SRV05-4HTG SOT23-6 L*4 3000 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SRV05 Series Package Dimensions — SOT23-6 Package SOT23-6 Pins 6 JEDEC MO-178 Millimeters Inches Notes Min Max Min Max A 0.900 1.450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref - e1 1.9 Ref 0.0748 Ref - L 0.100 0.600 0.004 0.023 4,5 N 6 6 6 Recommended Solder Pad Layout a 0º 10º 0º 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - M R 0.950 0.038 - Notes: 1. Dimensioning and tolerances per ANSI 14.5M-1982. 2. Package conforms to EIAJ SC-74 (1992). P 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. R 6. “N” is the number of terminal positions. 7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. O Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL ACCESS HOLE DIA1..5 HmOmLE 4.0mm 2.0mm 1.75mm 14.4mm 8mm CL 4.0mm 13mm SOT-23 (8mm POCKET PITCH) GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 180mm 60mm 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 8.4mm USER DIRECTION OF FEED PIN 1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 COVER TAPE