TVS Diode Arrays (SPA ® Diodes) Lightning Surge Protection - SP4065 SP4065 Series 3.3V 20A Diode Array RoHS Pb GREEN Description The SP4065 integrates low capacitance diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb up to 20A per IEC 61000-4-5, 2nd Edition (tp=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC 61000-4-2 International Standard. Their low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features • ESD, IEC 61000-4-2, • Low leakage current of I/O 1 I/O 8 ±30kV contact, ±30kV air 1µA (MAX) at 3.3V I/O 2 I/O 7 • EFT, IEC 61000-4-4, 40A • AEC-Q101 qualified I/O 6 (5/50ns) • Halogen free, Lead-free I/O 3 • Lightning, IEC 61000-4-5, and RoHS compliant I/O 5 I/O 4 2nd Edition 20A (8/20µs) • Moisture Sensitivity Level NC GND • Low capacitance of 4.4pF (MSL - Level 1) (TYP) per I/O Functional Block Diagram Applications • LCD/LED TVs • Notebooks I/O 8 I/O 7 I/O 6 I/O 5 • Desktops • 1Gb Ethernet • Game Consoles • Network Hardware • Set Top Boxes • Small Cells Application Example LVDS Interface LVDS Controller I/O 1 I/O 2 I/O 3 I/O 4 GND CLK+ CLK- A0+ Additional Information A0- Outside World A1+ A1- A2+ A2- Datasheet Resources Samples Signal Shield GND SP4065-08ATG Life Support Note: Shield GND Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16

TVS Diode Arrays (SPA ® Diodes) Lightning Surge Protection - SP4065 Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t=8/20μs) 20.0 A Storage Temperature Range -55 to 150 °C PP p Maximum Junction Temperature 150 °C P Peak Pulse Power (t=8/20µs) 300 W PK p Maximum Lead Temperature 260 °C T Operating Temperature -40 to 125 ºC OP (Soldering 20-40s) T Storage Temperature -55 to 150 °C STOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T =25ºC) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V 3.3 V RWM Snap Back Voltage V I =50mA 2.8 V SB SB Reverse Leakage Current I V =3.3V, I/O to GND 0.5 1.0 µA LEAK R I =1A, t=8/20µs, Fwd 5.5 V PP p I =5A, t=8/20µs, Fwd 7.0 V Clamp Voltage1 V PP p C I =10A, t=8/20µs, Fwd 9.0 V PP p I =20A, t=8/20µs, Fwd 13.5 V PP p Dynamic Resistance R (V - V ) / (I - I ) 0.4 Ω DYN C2 C1 PP2 PP1 IEC61000-4-2 (Contact) ±30 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±30 kV Diode Capacitance1 C Reverse Bias=0V 4.4 5.0 pF I/O-GND Diode Capacitance1 C Reverse Bias=0V 2.2 pF I/O-I/O Note: 1. Parameter is guaranteed by design and/or device characterization. Clamping Voltage vs. I Capacitance vs. Bias PP 14.0 5.0 12.0 4.0 V)C10.0 pF) Clamp Voltage ( 68..00 Capacitance ( 23..00 4.0 1.0 2.0 0.0 0.0 1.0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 17.0 19.0 21.0 0 0.5 1 1.5 2 2.5 3 Peak Pulse Current-IPP (A) Bias Voltage (V) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16

TVS Diode Arrays (SPA ® Diodes) Lightning Surge Protection - SP4065 8/20µs Pulse Waveform Product Characteristics 110% Lead Plating Pre-Plated Frame 100% Lead Material Copper Alloy 90% 80% Lead Coplanarity 0.0004 inches (0.102mm) of IPP 70% Substrate material Silicon nt 60% e erc 50% Body Material Molded Epoxy, rated UL 94 V-0 P 40% 30% 20% Notes : 1. All dimensions are in millimeters 10% 2. Dimensions include solder plating. 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 3. Dimensions are exclusive of mold flash & metal burr. Time (μs) 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters tP Reflow Condition Pb – Free assembly TP CCrriittiiccaall ZZoonnee e RRaammpp--uupp TTLL ttoo TTPP Pre Heat --- TTTeeimmmepp ee(mrraaittnuu rrteeo MMmaainxx ) ( (T(Ttss(m()mina)x))) 1625000 0–°° CC1 80 secs rutarepm TS(mTaxL) tL RRaammpp--ddoown s e PPrreehheeaatt T Atov epreaagke ramp up rate (Liquidus) Temp (TL) 3°C/second max TS(min) tS T to T - Ramp-up Rate 3°C/second max S(max) L 25 - Temperature (T) (Liquidus) 217°C time to peak temperature Time Reflow L - Temperature (t) 60 – 150 seconds L Peak Temperature (T) 260+0/-5 °C Part Numbering System P Time within 5°C of actual peak 20 – 40 seconds SP 4065 -08ATG Temperature (t) p G= Green Ramp-down Rate 6°C/second max TVS Diode Arrays (SPA® Diodes) T= Tape & Reel Time 25°C to peak Temperature (T) 8 minutes Max. P Do not exceed 260°C Package Series A = MSOP10 Number of Channels Ordering Information Part Marking System Part Number Package Marking Min. Order Qty. LF SP4065-08ATG MSOP-10 AAH8 4000 YYWWD YYWW = Date code Product Series AA*8 Number of AA= SP4065 Channels Assembly Site © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16

TVS Diode Arrays (SPA ® Diodes) Lightning Surge Protection - SP4065 Package Dimensions — MSOP-10 2.00 D [0.0787] 0.50 Package MSOP 10 [0.0197] Pins 10 JEDEC MO-187 Millimeters Inches E1 E 5.28[0.2079]3.20[0.1260] 1.04[0.0409]4.24[0.1669] DAIM M-in M1.1a0x M-in 0M.0a4x3 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 0.32 [0.0126] c 0.08 0.23 0.003 0.009 Solder Pad Layout D 2.90 3.10 0.114 0.122 1 2 A E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 C e 0.50 BSC 0.020 BSC L 0.40 0.80 0.016 0.032 B e A1 L Embossed Carrier Tape & Reel Specification — MSOP-10 Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 e 0.5 0.02 F 5.40 5.60 0.213 0.220 D 1.50 1.60 0.059 0.063 D1 1.50 Min 0.059 Min P0 3.90 4.10 0.154 0.161 W 11.70 12.30 0.460 0.484 P 7.90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 B0 3.20 3.50 0.126 0.138 K0 1.20 1.50 0.047 0.059 t 0.30 +/- 0.05 0.012+/- 0.002 Pin 1 Location User Feeding Direction © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/29/16