SP3220E/EB/EU +3.0V to +5.5V RS-232 Driver/Receiver Pair FEATURES ■ Meets all EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply EN 1 16 SHDN • Interoperable with RS-232 and V.28 at +2.7V C1+ 2 15 VCC ■ Supports High Serial Data Rates: • 120kbps SP3220E V+ 3 14 GND • 250kbps SP3220EB • 1Mbps SP3220EU C1- 4 SP3220 13 T1OUT E/EB/EU ■ 1µA Low Power Shutdown Mode C2+ 5 12 No Connect ■ Footprint Compatible with MAX3221E, ISL3221 ■ 4 x 1.0µF External Charge Pump Capacitors C2- 6 11 T1IN ■ Improved ESD Specifications: +15kV Human Body Model V- 7 10 No Connect +15kV IEC61000-4-2 Air Discharge R1IN 8 9 R1OUT +8kV IEC61000-4-2 Contact Discharge Now Available in Lead Free Packaging DESCRIPTION The SP3220E devices are RS-232 driver/receiver solutions intended for portable or hand-held applications such as palmtop computers, instrumentation and consumer products. These devices incorporate a high-efficiency, charge-pump power supply that allows the SP3220E devices to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.0V. This charge pump requires only 0.1µF capacitors in 3.3V operation. The ESD toler- ance of the these devices are over +/-15kV for both Human Body Model and IEC61000-4-2 Air discharge test methods. All devices have a low-power shutdown mode where the driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1µA. SELECTION TABLE MODEL Power RS-232 RS-232 External Shutdown Data Rate Supplies Drivers Receivers Components SP3220E +3.0V to +5.5V 1 1 4 Capacitors Yes 120kbps SP3220EB +3.0V to +5.5V 1 1 4 Capacitors Yes 250kbps SP3220EU +3.0V to +5.5V 1 1 4 Capacitors Yes 1Mbps Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 1

ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. V .......................................................-0.3V to +6.0V Power Dissipation per package VC+C (NOTE 1).......................................-0.3V to +7.0V 16-pin SSOP (derate 9.69mW/oC above +70oC)...............775mW V- (NOTE 1)........................................+0.3V to -7.0V 16-pin TSSOP (derate 10.5mW/oC above +70oC)..............840mW V+ + |V-| (NOTE 1)...........................................+13V I (DC V or GND current).........................+100mA CC CC Input Voltages TxIN, EN, SHDN...........................-0.3V to Vcc + 0.3V RxIN...................................................................+25V Output Voltages TxOUT.............................................................+13.2V RxOUT, .......................................-0.3V to (V +0.3V) CC Short-Circuit Duration TxOUT....................................................Continuous Storage Temperature......................-65°C to +150°C NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. ELECTRICAL CHARACTERISTICS Unless otherwise noted, the following specifications apply for V = +3.0V to +5.5V with T = T to T . CC AMB MIN MAX Typical values apply at Vcc = +3.3V or +5.0V and T = 25oC, C1 - C4 = 0.1µF. AMB PARAMETER MIN. TYP. MAX. UNITS CONDITIONS DC CHARACTERISTICS Supply Current 0.3 1.0 mA no load, V = 3.3V, CC T = 25oC, TxIN = GND or V AMB CC Shutdown Supply Current 1.0 10 µA SHDN = GND, V = 3.3V, CC T = 25oC, TxIN = Vcc or GND AMB LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold LOW GND 0.8 V TxIN, EN, SHDN, Note 2 Input Logic Threshold HIGH 2.0 V Vcc = 3.3V, Note 2 Input Logic Threshold HIGH 2.4 V Vcc = 5.0V, Note 2 Input Leakage Current +0.01 +1.0 µA TxIN, EN, SHDN, T = +25oC, V = 0V to V AMB IN CC Output Leakage Current +0.05 +10 µA Receivers disabled, V = 0V to V OUT CC Output Voltage LOW 0.4 V I = 1.6mA OUT Output Voltage HIGH V -0.6 V -0.1 V I = -1.0mA CC CC OUT DRIVER OUTPUTS Output Voltage Swing +5.0 +5.4 V Driver output loaded with 3KΩ to GND, T = +25oC AMB NOTE 2: Driver input hysteresis is typically 250mV. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 2

ELECTRICAL CHARACTERISTICS Unless otherwise noted, the following specifications apply for V = +3.0V to +5.5V with T = T to T , CC AMB MIN MAX Typical values apply at V = +3.3V or +5.0V and T = 25°C. CC AMB PARAMETER MIN. TYP. MAX. UNITS CONDITIONS DRIVER OUTPUTS (continued) Output Resistance 300 Ω V = V+ = V- = 0V, T =+2V CC OUT Output Short-Circuit Current +35 +60 mA V = 0V OUT Output Leakage Current +25 µA V = +12V, V = GND to 5.5V, OUT CC Drivers disabled RECEIVER INPUTS Input Voltage Range -15 +15 V Input Threshold LOW 0.6 1.2 V Vcc = 3.3V Input Threshold LOW 0.8 1.5 V Vcc = 5.0V Input Threshold HIGH 1.5 2.4 V Vcc = 3.3V Input Threshold HIGH 1.8 2.4 V Vcc = 5.0V Input Hysteresis 0.3 V Input Resistance 3 5 7 kΩ TIMING CHARACTERISTICS Data Rate SP3220E 120 235 kbps R = 3KΩ, C = 1000pF L L Data Rate SP3220EB 250 kbps R = 3KΩ, C = 1000pF L L Data Rate SP3220EU 1000 kbps R = 3KΩ, C = 250pF L L Receiver Propagation Delay, t 0.15 µs Receiver input to Receiver PHL output, C = 150pF L Receiver Propagation Delay, t 0.15 µs Receiver input to Receiver PLH output, C = 150pF L Receiver Output Enable Time 200 ns Receiver Output Disable Time 200 ns Driver Skew 100 ns | t - t |, T = 25°C PHL PLH AMB Receiver Skew 50 ns | t - t | PHL PLH Transition-Region Slew Rate 30 V/µs Vcc = 3.3V, R = 3kΩ, T = L AMB 25°C, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V (SP3220E and SP3220EB) Transition-Region Slew Rate 90 V/µs Vcc = 3.3V, R = 3kΩ, T = L AMB 25°C, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V (SP3220EU) Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 3

TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise noted, the following performance characteristics apply for V = +3.3V, 250kbps data rate, all CC drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and T = +25°C. AMB 30 6 25 TT12 aatt F1/u1ll6 D Fautlal DRaattae Rate 125Kbps 4 TxOUT+ T1+T2 Loaded with 3k/CLoad ut Icc (mA) 211050 60Kbps20Kbps nsmitter OutpVoltage (V) -202 T1 at 250Kbps a 5 Tr -4 TxOUT- 0 -6 0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000 Load Capacitance (pF) Load Capacitance (pF) Figure 1. Icc vs Load Capacitance for the Figure 2. Transmitter Output Voltage vs Load SP3220EB. Capacitance for the SP3220EB. 6 12 TxOUT+ ut 4 10 Transmitter OutpVoltage (V)--2024 TxOUT- Supply Current (mA) 8642 T1 Loaded with 3K // 1000pf @ 250Kbps -6 0 2.7 3 3.5 4 4.5 5 2.7 3 3.5 4 4.5 5 Supply Voltage (V) Supply Voltage (V) Figure 3. Transmitter Output Voltage vs Supply Figure 4. Supply Current vs Supply Voltage for the Voltage for the SP3220EB. SP3220EB. 25 40 - Slew 1Mbps 20 + Slew 30 V/s) 2Mbps ate (15 mA)20 500Kbps ew r10 Icc ( Sl 10 5 0 0 0 500 1000 2000 3000 4000 5000 0 250 500 1000 2000 3000 4000 Load Capacitance (pF) Load Capacitance (pF) Figure 5. Slew Rate vs Load Capacitance for the Figure 6. Supply Current vs Supply Voltage for the SP3220EB. SP3220EU. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 4

TYPICAL PERFORMANCE CHARACTERISTICS: Continued Unless otherwise noted, the following performance characteristics apply for V = +3.3V, 250kbps data rate, all CC drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and T = +25°C. AMB 6 6 4 2Mbps 1.5Mbps 1Mbps 4 TxOUT+ TransmitterOutput Voltage (V)-202 Transmitter OutputVoltage (V)-202 -4 2Mbps 1.5Mbps 1Mbps -4 TxOUT- -60 250 500 1000 1500 2000 -62.5 2.7 3 3.5 4 4.5 5 Load Capacitance (pF) Supply Voltage (V) Figure 7. Transmitter Output Voltage vs Load Figure 8. Transmitter Output Voltage vs Supply Capacitance for the SP3220EU. Voltage for the SP3220EU. 16 14 mA)12 nt (10 e urr 8 C ply 6 up 4 S T1 Loaded with 3K // 1000pf @1Mbps 2 0 2.7 3 3.5 4 4.5 5 Supply Voltage (V) Figure 9. Supply Current vs Supply Voltage for the SP3220EU. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 5

PIN FUNCTION NAME FUNCTION PIN NUMBER Receiver Enable. Apply Logic LOW for normal operation. EN 1 Apply logic HIGH to disable the receiver outputs (high-Z state) C1+ Positive terminal of the voltage doubler charge-pump capacitor 2 V+ +5.5V output generated by the charge pump 3 C1- Negative terminal of the voltage doubler charge-pump capacitor 4 C2+ Positive terminal of the inverting charge-pump capacitor 5 C2- Negative terminal of the inverting charge-pump capacitor 6 V- -5.5V output generated by the charge pump 7 RIN RS-232 receiver input 8 1 ROUT TTL/CMOS receiver output 9 1 TIN TTL/CMOS driver input 11 1 TOUT RS-232 driver output. 13 1 GND Ground 14 V +3.0V to +5.5V supply voltage 15 CC Shutdown Control Input. Drive HIGH for normal device operation. SHDN Drive LOW to shutdown the drivers (high-Z output) and the on- 16 board power supply N.C. No Connect 10, 12 Table 1. Device Pin Description Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 6

PINOUT EN 1 16 SHDN C1+ 2 15 V CC V+ 3 14 GND C1- 4 SP3220 13 T1OUT E/EB/EU C2+ 5 12 No Connect C2- 6 11 T1IN V- 7 10 No Connect R1IN 8 9 R1OUT Figure 10. Pinout Configurations for the SP3220E/EB/EU Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 7

TYPICAL OPERATING CIRCUITS VCC + 15 C5 0.1µF VCC 2C1+ 3 + V+ + C1 0.1µF *C3 0.1µF 4C1- 5C2+ SP3220 7 V- + E/EB/EU C2 0.1µF C4 0.1µF 6C2- + LOGIC 11 T1IN T1OUT 13 RS-232 INPUTS OUTPUTS LOGIC 9 R1OUT R1IN 8 RS-232 OUTPUTS INPUTS 5kΩ 1 EN SHDN 16 GND 14 *can be returned to either VCC or GND Figure 11. SP3220E/EB/EU Typical Operating Circuit Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 8

DESCRIPTION The SP3220E/EB/EU devices meet the will meet EIA/TIA-562 levels of +/-3.7V with EIA/TIA-232 and ITU-T V.28/V.24 commu- supply voltages as low as 2.7V. nication protocols and can be implemented in battery-powered, portable, or hand-held The SP3220EB driver can guarantee a data applications such as notebook or palmtop rate of 250kbps fully loaded with 3kΩ in computers. The SP3220E/EB/EU devices parallel with 1000pF, ensuring compatibility feature Exar's proprietary on-board charge with PC-to-PC communication software. The pump circuitry that generates ±5.5V for RS- SP3220EU driver can guarantee a data rate 232 voltage levels from a single +3.0V to of 1000kbps fully loaded with 3kΩ in parallel +5.5V power supply. This series is ideal for with 250pF. +3.3V-only systems, mixed +3.3V to +5.5V systems, or +5.0V-only systems that require The slew rate of the SP3220E and true RS-232 performance. The SP3220EB SP3220EB outputs are internally limited to a device has a driver that can operate at a data maximum of 30V/µs in order to meet the EIA rate of 250kbps fully loaded. The SP3220EU standards (EIA RS-232D 2.1.7, Paragraph can operate at 1000kbps; the SP3220E 5). The transition of the loaded output from device can operate at a typical data rate of HIGH to LOW also meet the monotonicity 235kbps when fully loaded. requirements of the standard. The slew rate of the SP3220EU is not limited. This allows The SP3220E/EB/EU is a 1-driver/1- receiver it to transmit at much faster data rates. device ideal for portable or hand-held ap- plications. The SP3220E/EB/EU features a Figure 12 shows a loopback test circuit 1µA shutdown mode that reduces power used to test the RS-232 Driver. Figure consumption and extends battery life in por- 13 shows the test results of the loopback table systems. Its receivers remain active in circuit with the SP3220EB driver active at shutdown mode, allowing external devices 250kbps with RS-232 load in parallel with such as modems to be monitored using only a 1000pF capacitor. Figure 14 shows the 1µA supply current. test results where the SP3220EU driver was active at 1000kbps and loaded with an RS-232 receiver in parallel with 250pF ca- THEORY OF OPERATION pacitors. A solid RS-232 data transmission The SP3220E/EB/EU series is made up of rate of 250kbps provides compatibility with three basic circuit blocks: many designs in personal computer periph- 1. Driver erals and LAN applications. 2. Receiver 3. The Exar proprietary charge pump The SP3220E/EB/EU driver's output stage is turned off (tri-state) when the device is in shutdown mode. When the power is Driver off, the SP3220E/EB/EU device permits The driver is an inverting level transmitter that the outputs to be driven up to +/-12V. The converts TTL or CMOS logic levels to +5.0V driver's inputs do not have pull-up resistors. EIA/TIA-232 levels with an inverted sense Designers should connect unused inputs to relative to the input logic levels. Typically, Vcc or GND. the RS-232 output voltage swing is +5.5V with no load and at least +5V minimum fully In the shutdown mode, the supply current loaded. The driver outputs are protected falls to less than 1µA, where SHDN = LOW. against infinite short-circuits to ground with- When the SP3220E/EB/EU device is shut out degradation in reliability. Driver outputs down, the device's driver output is disabled Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 9

DESCRIPTION (tri-stated) and the charge pump is turned VCC off with V+ pulled down to Vcc and V- pulled + to GND. The time required to exit shutdown C5 0.1µF VCC is typically 100ms. Connect SHDN to Vcc if + C1+ V+ + C1 0.1µF C3 0.1µF the shutdown mode is not used. SHDN has C1- no effect on RxOUT. Note that the driver is C2+ SP3220 V- enabled only when the magnitude of V- ex- C2 +0.1µF E/EB/EU C4 +0.1µF ceeds approximately 3V. C2- LOGIC TxIN TxOUT INPUTS Receiver The receiver converts EIA/TIA-232 levels LOGIC RxOUT RxIN OUTPUTS to TTL or CMOS logic output levels. The 5kΩ EN receiver has an inverting high-impedance *SHDN VCC output. This receiver output (RxOUT) is at GND high-impedance when the enable control (SP3220EU 250pF) EN = HIGH. In the shutdown mode, the (SP3220E/EB 1000pF) receiver can be active or inactive. EN has Figure 12. SP3220E/EB/EU Driver Loopback Test no effect on TxOUT. The truth table logic Circuit of the SP3220E/EB/EU driver and receiver outputs can be found in Table 2. SHDN EN TxOUT RxOUT 0 0 Tri-state Active 0 1 Tri-state Tri-state 1 0 Active Active 1 1 Active Tri-state Table 2. SP3220E/EB/EU Truth Table Logic for Shutdown and Enable Control Figure 13. SP3220EB Loopback Test results at 250kbps Since receiver input is usually from a trans- mission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, an internal 5KΩ pull-down resistor to ground will commit the output of the receiver to a HIGH state. Figure 14. SP3220EU Loopback Test results at 1Mbps Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 10

DESCRIPTION Charge Pump Simultaneous with the transfer of the volt- The charge pump is an Exar-patended age to C , the positive side of capacitor C 3 1 design (U.S. 5,306,954) and uses a unique is switched to V and the negative side is CC approach compared to older less-efficient connected to GND. designs. The charge pump still requires four external capacitors, but uses a four-phase Phase 3 voltage shifting technique to attain sym- — V charge storage — The third phase of DD metrical 5.5V power supplies. The internal the clock is identical to the first phase — the power supply consists of a regulated dual charge transferred in C produces –V in 1 CC charge pump that provides output voltages the negative terminal of C , which is applied 1 of +/-5.5V regardless of the input voltage to the negative side of capacitor C . Since 2 (Vcc) over the +3.0V to +5.5V range. C + is at V , the voltage potential across C 2 CC 2 is 2 times V . CC In most circumstances, decoupling the Phase 4 power supply can be achieved adequately — V transfer — The fourth phase of DD using a 0.1µF bypass capacitor at C5 (refer the clock connects the negative terminal to figures 6 and 7). In applications that are of C to GND, and transfers this positive 2 sensitive to power-supply noise, decouple generated voltage across C to C , the 2 4 Vcc to ground with a capacitor of the same V storage capacitor. This voltage is DD value as charge-pump capacitor C1. Physi- regulated to +5.5V. At this voltage, the in- cally connect bypass capacitor as close to ternal oscillator is disabled. Simultaneous the IC as possible. with the transfer of the voltage to C , the 4 positive side of capacitor C is switched 1 The charge pump operates in a discontinu- to V and the negative side is con- CC ous mode using an internal oscillator. If the nected to GND, allowing the charge output voltages are less than a magnitude pump cycle to begin again. The charge of 5.5V, the charge pump is enabled. If the pump cycle will continue as long as the output voltages exceed a magnitude of 5.5V, operational conditions for the internal the charge pump is disabled. This oscillator oscillator are present. controls the four phases of the voltage shift- ing. A description of each phase follows. Since both V+ and V– are separately gener- ated from V , in a no–load condition V+ CC Phase 1 and V– will be symmetrical. Older charge — V charge storage — During this phase pump approaches that generate V– from SS of the clock cycle, the positive side of capaci- V+ will show a decrease in the magnitude tors C and C are initially charged to V . of V– compared to V+ due to the inherent 1 2 CC C+ is then switched to GND and the charge inefficiencies in the design. l in C – is transferred to C –. Since C + is con- 1 2 2 nected to V , the voltage potential across CC capacitor C is now 2 times V . 2 CC Phase 2 — V transfer — Phase two of the clock SS connects the negative terminal of C to the V 2 SS storage capacitor and the positive terminal of C to GND. This transfers a negative gener- 2 ated voltage to C . This generated voltage is 3 regulated to a minimum voltage of -5.5V. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 11

DESCRIPTION Charge Pump Design Guidelines Voltage potential across any of the capaci- tors will never exceed 2 x VCC. Therefore The charge pump operates with 0.1µF ca- capacitors with working voltages as low as pacitors for 3.3V operation. For other supply 6.3V rating may be used with a 3.0V VCC voltages, see the table for required capacitor supply. The reference terminal of the V+ values. Do not use values smaller than those capacitor may be connected either to VCC listed. Increasing the capacitor values (e.g., or ground, but if connected to ground a by doubling in value) reduces ripple on the minimum 10V working voltage is required. transmitter outputs and may slightly reduce Higher working voltages and/or capacitance power consumption. C2, C3, and C4 may be values may be advised if operating at higher increased without changing C1’s value. VCC or to provide greater stability as the capacitors age. Minimum recommended charge pump Under lightly loaded conditions the intelligent capacitor value pump oscillator maximizes efficiency by Input Voltage Charge pump running only as needed to maintain V+ and Vcc capacitor value for V-. Since interface transceivers often spend SP3220E/EB/EU much of their time at idle this power-efficient innovation can greatly reduce total power 3.0V to 3.6V C1 - C4 = 0.1µF consumption. This improvement is made 3.0V to 5.5V C1 - C4 = 0.22µF possible by the independent phase sequence of the Exar charge-pump design. The charge pump oscillator typically operates at greater than 250kHz allowing the pump to run efficiently with small 0.1μF capacitors. Efficient operation depends on rapidly charg- ing and discharging C1 and C2, therefore capacitors should be mounted close to the IC and have low ESR (equivalent series resistance). Low cost surface mount ceramic capacitors (such as are widely used for power-supply decoupling) are ideal for use on the charge pump. However the charge pumps are de- signed to be able to function properly with a wide range of capacitor styles and values. If polarized capacitors are used the positive and negative terminals should be connected as shown in the Typical Operating Circuit. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 12

DESCRIPTION VCC = +5V +5V C4 + + + – VDD Storage Capacitor C1– C2– – + VSS Storage Capacitor –5V –5V C3 Figure 15. Charge Pump — Phase 1 VCC = +5V C4 + + + – VDD Storage Capacitor C1– C2– – + VSS Storage Capacitor -5.5V C3 Figure 16. Charge Pump — Phase 2 [ T ] +6V a) C2+ GND 1 T GND 2 b) C2- T -6V Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V Figure 17. Charge Pump Waveforms VCC = +5V +5V C4 + + + – VDD Storage Capacitor C1– C2– – + VSS Storage Capacitor –5V –5V C3 Figure 18. Charge Pump — Phase 3 VCC = +5V +5.5V C4 + + + – VDD Storage Capacitor C1– C2– – + VSS Storage Capacitor C3 Figure 19. Charge Pump — Phase 4 Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 13

DESCRIPTION ESD TOLERANCE the system is required to withstand an amount of static electricity when ESD is applied to The SP3220E/EB/EU device incorpo- points and surfaces of the equipment that rates ruggedized ESD cells on all driver are accessible to personnel during normal output and receiver input pins. The ESD usage. The transceiver IC receives most structure is improved over our previous of the ESD current when the ESD source is family for more rugged applications and applied to the connector pins. The test circuit environments sensitive to electro-static for IEC61000-4-2 is shown on Figure 21. discharges and associated transients. The There are two methods within IEC61000-4-2, improved ESD tolerance is at least +15kV the Air Discharge method and the Contact without damage nor latch-up. Discharge method. There are different methods of ESD testing With the Air Discharge Method, an ESD applied: voltage is applied to the equipment under a) MIL-STD-883, Method 3015.7 test (EUT) through air. This simulates an b) IEC61000-4-2 Air-Discharge electrically charged person ready to connect c) IEC61000-4-2 Direct Contact a cable onto the rear of the system only to find an unpleasant zap just before the person The Human Body Model has been the touches the back panel. The high energy generally accepted ESD testing method potential on the person discharges through for semi-conductors. This method is also an arcing path to the rear panel of the system specified in MIL-STD-883, Method 3015.7 before he or she even touches the system. for ESD testing. The premise of this ESD test This energy, whether discharged directly or is to simulate the human body’s potential to through air, is predominantly a function of the store electro-static energy and discharge it discharge current rather than the discharge to an integrated circuit. The simulation is voltage. Variables with an air discharge such performed by using a test model as shown as approach speed of the object carrying the in Figure 20. This method will test the IC’s ESD potential to the system and humidity capability to withstand an ESD transient will tend to change the discharge current. during normal handling such as in manu- For example, the rise time of the discharge facturing areas where the IC's tend to be current varies with the approach speed. handled frequently. The Contact Discharge Method applies the The IEC-61000-4-2, formerly IEC801-2, is ESD current directly to the EUT. This method generally used for testing ESD on equipment was devised to reduce the unpredictability and systems. For system manufacturers, of the ESD arc. The discharge current rise they must guarantee a certain amount of ESD time is constant since the energy is directly protection since the system itself is exposed transferred without the air-gap arc. In situ- to the outside environment and human pres- ations such as hand held systems, the ESD ence. The premise with IEC61000-4-2 is that charge can be directly discharged to the RC RS SW1 SW2 Device DC Power CS Under Source Test Figure 20. ESD Test Circuit for Human Body Model Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 14

DESCRIPTION Contact-Discharge Model RC RS RV SW1 SW2 Device DC Power CS Under Source Test RS andRV add up to 330Ωfor IEC61000-4-2. Figure 21. ESD Test Circuit for IEC61000-4-2 equipment from a person already holding The higher C value and lower R value in S S the equipment. The current is transferred the IEC61000-4-2 model are more stringent on to the keypad or the serial port of the than the Human Body Model. The larger equipment directly and then travels through storage capacitor injects a higher voltage the PCB and finally to the IC. to the test point when SW2 is switched on. The lower current limiting resistor increases The circuit models in Figures 20 and 21 rep- the current charge onto the test point. resent the typical ESD testing circuit used for all three methods. The C is initially charged S with the DC power supply when the first switch (SW1) is on. Now that the capacitor → is charged, the second switch (SW2) is on I while SW1 switches off. The voltage stored 30A in the capacitor is then applied through R , S the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under 15A test receives a duration of voltage. For the Human Body Model, the current 0A limiting resistor (R ) and the source capacitor S (C ) are 1.5kΩ an 100pF, respectively. For S t = 0ns t = 30ns IEC-61000-4-2, the current limiting resistor t → (R ) and the source capacitor (C ) are 330Ω S S an 150pF, respectively. Figure 22. ESD Test Waveform for IEC61000-4-2 DEVICE PIN HUMAN BODY IEC61000-4-2 TESTED MODEL Air Discharge Direct Contact Level Driver Outputs +15kV +15kV +8kV 4 Receiver Inputs +15kV +15kV +8kV 4 Table 3. Transceiver ESD Tolerance Levels Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 15

PACKAGE: 16 PIN SSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 16

PACKAGE: 16 PIN TSSOP Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 17

ORDERING INFORMATION(1) Operating Part Number Temperature Range Lead-Free Package Package Method SP3220EBCA-L/TR 0°C to 70°C SSOP Tape and Reel SP3220EBCY-L/TR 0°C to 70°C TSSOP Tape and Reel SP3220EBCY-L 0°C to 70°C TSSOP Rail SP3220EBEA-L/TR -40°C to 85°C SSOP Tape and Reel SP3220EBEA-L -40°C to 85°C SSOP Rail SP3220EBEY-L/TR -40°C to 85°C TSSOP Tape and Reel SP3220EBEY-L -40°C to 85°C TSSOP Rail SP3220ECA-L/TR 0°C to 70°C SSOP Tape and Reel Yes(2) SP3220ECA-L 0°C to 70°C SSOP Rail SP3220ECY-L/TR 0°C to 70°C TSSOP Tape and Reel SP3220ECY-L 0°C to 70°C TSSOP Rail SP3220EEA-L/TR -40°C to 85°C SSOP Tape and Reel SP3220EEA-L -40°C to 85°C SSOP Rail SP3220EEY-L/TR -40°C to 85°C TSSOP Tape and Reel SP3220EEY-L -40°C to 85°C TSSOP Rail SP3220EUEY-L/TR -40°C to 85°C TSSOP Tape and Reel NOTES: 1. Refer to www.exar.com/SP3220E, www.exar.com/SP3220EB, www.exar.com/SP3220EU for the most up-to-date Ordering Information. 2. Visit www.exar.com for additional information on Environmental Rating. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 18

REVISION HISTORY Date Revision Description 08/30/05 -- Legacy Sipex Datasheet 02/02/11 1.0.0 Convert to Exar Format and update ordering information. 06/03/11 1.0.1 Remove SP3220EUCA-L(/TR) and SP3220EUEA-L(/TR) per PDN 110510-01 10/20/16 1.0.2 Update input voltage range of receiver from +/-25V to +/-15V, update ordering information table, remove WSOIC package information Notice EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reli- ability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Copyright 2012-16 EXAR Corporation Datasheet October 2016 For technical questions please email Exar's Serial Technical Support group at: serialtechsupport@exar.com Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com SP3220E_EB_EU_102_102016 19

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: E xar: SP3220ECY-L SP3220EBEY-L SP3220ECA-L SP3220EBCY-L SP3220EEA-L SP3220EEY-L SP3220EUEY-L/TR SP3220EUCY-L SP3220EUEY-L SP3220EUCY-L/TR SP3220ECA-L/TR SP3220EEA-L/TR SP3220EBEA-L SP3220EBEA-L/TR SP3220EBCA-L SP3220EBCA-L/TR SP3220EBEY-L/TR SP3220EEY-L/TR SP3220EBCY-L/TR SP3220ECY-L/TR