TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Series SP3031 Series 0.8pF 10kV Unidirectional Discrete TVS RoHS Pb GREEN Description The SP3031 is a single channel low capacitance diode that provides protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust diode can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8 kV contact discharge and ±15 kV air discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines. Features Pinout • RoHS compliant, lead-free • Low capacitance of 0.8pF and halogen-free @ V =0V R • ESD protection of ±10kV • Low leakage current of contact discharge, 1μA at 5V 1 ±15kV air discharge, (IEC 61000-4-2) • EFT, IEC 61000-4-4, 40A (5/50ns) • Lightning protection, IEC 61000-4-5, 2nd Edition: 8/20 Surge, 5A Surge 2 Applications • USB 2.0, Ethernet • Smart Phones Functional Block Diagram • MHL/MIPI/MDDI • External Storage • HDMI, Display Port, • Ultrabooks, Notebooks 1 eSATA • Tablets, eReaders • Set Top Boxes, Game Consoles USB2.0 Application Example USB2.0 Port USB Controller 2 V BUS D+ D- Additional Information SP1003 IC SP3031 (x2) Datasheet Resources Samples *Package is shown as transparent Life Support Note: Signal GND Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/24/18

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t=8/20μs) 5.0 A Maximum Junction Temperature 150 °C PP p Maximum Lead Temperature 260 °C T Operating Temperature –40 to 125 °C OP (Soldering 20-40s) T Storage Temperature –55 to 150 °C STOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1 3 Electrical Characteristics (T =25ºC) 0 OP 3 P Parameter Symbol Test Conditions Min Typ Max Units S Reverse Standoff Voltage V 5.0 V RWM Reverse Breakdown Voltage V 1 =1mA 6.0 V BR R Reverse Leakage Current I V =5V with 1pin at GND 1 µA LEAK R I =1A, t=8/20µs, Fwd 6.9 V Clamp Voltage1 V PP p C I =2A, t=8/20µs, Fwd 7.5 V PP p Dynamic Resistance R (V -V )/(I -I ) 0.6 Ω DYN C2 C1 PP2 PP1 IEC 61000-4-2 (Contact) ±10 kV ESD Withstand Voltage1 V ESD IEC 61000-4-2 (Air) ±15 kV Diode Capacitance1 C Reverse Bias=0V 0.8 pF I/O-I/O Note: 1. Parameter is guaranteed by design and/or component characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Reverse Voltage 1.2 0 -5 1.0 uation (dB) --1105 ance (pF) 00..68 Atten --2250 Capacit 0.4 0.2 -30 -35 0.0 0.0 1.0 2.0 3.0 4.0 5.0 10 100 1000 Frequency (MHz) DC Bias (V) 8/20µs Waveform 110% 100% 90% 80% of IPP 6700%% ent 50% erc 40% P 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/24/18

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Series Product Characteristics Ordering Information Lead Plating Pre-Plated Frame or Matte Tin Part Number Package Marking Min. Order Qty. Lead Material Copper Alloy SP3031-01ETG SOD882 •f 10000 Substitute Material Silicon Body Material Molded Epoxy UL Recognized epoxy meeting Flammability flammability rating V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Reflow Condition Pb – Free assembly tP TP CCrriittiiccaall ZZoonnee - Temperature Min (Ts(min)) 150°C e RRaammpp--uupp TTLL ttoo TTPP Pre Heat -- TTeimmep e(mraitnu rteo Mmaaxx )( T(ts()max)) 2600 0–° C180 secs rutare TS(mTaxL) tL s pm RRaammpp--ddoown Average ramp up rate (Liquidus) Temp e PPrreehheeaatt 3°C/second max T (TL) to peak TS(min) tS T to T - Ramp-up Rate 3°C/second max S(max) L Reflow -- TTeemmppeerraattuurree ((TtL)) (Liquidus) 26107 –° C1 50 seconds 25 time to peak temperature Time L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C Part Numbering System Part Marking System SP 3031 –01 E T G SOD882 TVS Diode Arrays G= Green (SPA® Diodes) f T= Tape & Reel Series Pin 1 Indicator Product ID Number of Package Channels E: SOD882 © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/24/18

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Series Package Dimensions — SOD882 Package SOD882 JEDEC MO-236 Symbol Millimeters Inches Min Typ Max Min Typ Max A 0.90 1.00 1.10 0.035 0.039 0.043 B 0.50 0.60 0.70 0.020 0.024 0.028 C 0.40 0.50 0.60 0.016 0.020 0.024 D 0.45 0.018 E 0.20 0.25 0.35 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 Recommanded Soldering Pad Layout Embossed Carrier Tape & Reel Specification — SOD882 Symbol Millimeters A0 0.70±0.045 B0 1.10±0.045 K0 0.65±0.045 F 3.50±0.05 P1 2.00±0.10 W 8.00 + 0.30 -0.10 Notes : 1. All dimensions are in millimeters Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 01/24/18