TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series SP3030 Series 0.5pF 20kV Unidirectional Discrete TVS RoHS Pb GREEN Description The SP3030 includes low capacitance rail to rail diodes with an additional Zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±20kV contact discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines such as HDMI, DVI, USB2.0, USB3.0 and eSATA. Features Pinout • ESD protection of ±20kV • Low capacitance of 0.5pF contact discharge, @ V =0V R ±30kV air discharge, • Low leakage current of 1 (IEC61000-4-2) 0.1μA at 5V • EFT protection, • Small SOD882 packaging IEC61000-4-4, 40A helps save board space (t =5/50ns) p • AEC-Q101 qualified • Lightning Protection, (SOD882 package) 2 IEC61000-4-5, 3A (t =8/20µs) p (AEC-Q101 qualified) Applications Functional Block Diagram • Tablets • Digital Cameras 1 • Ultrabook • MP3/ PMP • eReader • Set Top Boxes • Smart Phones • Portable Medical USB3.0 Application Example 2 Life Support Note: USB Port USB Controller Not Intended for Use in Life Support or Life Saving Applications VBU S The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP1003 *Packages are shown as transparent HDMI Application Example D+ D- IC HDMI HDMI Port *Packages are shown as transparent Chipset SSTX+ D2+ SSTX- D2- D1+ SSRX+ D1- SSRX- D0+ D0- CLK+ CLK- Signal Ground IC SP3030(x6) SP3030 (x8) CEC Additional Information SCL SDA HPD PWR SP3002 Datasheet Resources Samples © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units IPP Peak Current (tp=8/20μs) 3.0 A Storage Temperature Range -55 to 150 °C T Operating Temperature -40 to 125 °C Maximum Junction Temperature 150 °C OP T Storage Temperature -55 to 150 °C Maximum Lead Temperature 260 °C STOR (Soldering 20-40s) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 0 3 Electrical Characteristics (TOP=25ºC) 0 3 P Parameter Symbol Test Conditions Min Typ Max Units S Reverse Standoff Voltage V 5 V RWM Reverse Leakage Current I V =5V with 1pin at GND 0.1 0.5 µA LEAK R I =1A, t=8/20µs, Fwd 9.2 V Clamp Voltage1 V PP p C I =2A, t=8/20µs, Fwd 10.0 V PP p IEC61000-4-2 (Contact) ±20 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±30 kV Dynamic Resistance R (V -V )/(I -I ) 0.55 Ω DYN C2 C1 PP2 PP1 Diode Capacitance1 C Reverse Bias=0V, f=1 MHz 0.5 pF I/O-I/O Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Normalized Capacitance vs. Reverse Voltage 0 2.0 -1 1.8 -2 1.6 pF) Attenuation (dB) ----6453 malized Capacitance ( 1110....4208 -7 Nor 0.6 0.4 -8 0.2 -9 -10 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency (MHz) Bias Voltage (V) HDMI 1.4 Eye Diagram USB3.0 Eye Diagram © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series Pulse Waveform Transmission Line Pulsing(TLP) Plot 20 110% 100% 18 90% 16 Percent of IPP 4567800000%%%%% P Current (A) 1118024 30% TL 6 20% 4 10% 0% 2 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0 Time (μs) 0 5 10 15 20 25 TLP Voltage (V) Soldering Parameters Reflow Condition Pb – Free assembly tP TP CCrriittiiccaall ZZoonnee - Temperature Min (Ts(min)) 150°C e RRaammpp--uupp TTLL ttoo TTPP Pre Heat -- TTeimmep e(mraitnu rteo Mmaaxx )( T(ts()max)) 2600 0–° C180 secs rutare TS(mTaxL) tL s pm RRaammpp--ddoown Average ramp up rate (Liquidus) Temp 3°C/second max eT PPrreehheeaatt (TL) to peak TS(min) tS T to T - Ramp-up Rate 3°C/second max S(max) L Reflow -- TTeemmppeerraattuurree ((TtL)) (Liquidus) 26107 –° C1 50 seconds 25 time to peak temperature Time L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) Product Characteristics p Ramp-down Rate 6°C/second max Lead Plating Pre-Plated Frame Time 25°C to peak Temperature (T ) 8 minutes Max. P Lead Material Copper Alloy Do not exceed 260°C Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Part Numbering System Body Material Molded Epoxy SP 3030 –01 E T G Flammability UL 94 V-0 Notes : T(SVPSA ®D Dioidoed eAsr)rays G= Green 12.. ADlilm diemnesinosnios ninsc alured ein s molidlleimr eptlaetrisng. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. T= Tape & Reel 5. Package surface matte finish VDI 11-13. Series Part Marking System Number of Package Channels E: SOD882 X Pin 1 Product ID “T” or “W” © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series Ordering Information Part Number Package Marking Packaging Options P0/P1 Packaging Specifications Min. Order Qty. SP3030-01ETG SOD882 “T” or “W” Tape & Reel - 8mm tape/7” reel 4mm/2mm EIA-481 10,000 Package Dimensions — SOD882 Package SOD882 JEDEC MO-236 Symbol Millimeters Inches Min Typ Max Min Typ Max A 0.90 1.00 1.10 0.037 0.039 0.041 B 0.50 0.60 0.70 0.022 0.024 0.026 C 0.40 0.50 0.60 0.016 0.020 0.024 D 0.45 0.018 E 0.20 0.25 0.35 0.008 0.010 0.012 Recommended Soldering Pad Layout F 0.45 0.50 0.55 0.018 0.020 0.022 Embossed Carrier Tape & Reel Specification — SOD882 P0 P2 Φ2:1.55±0.05 Tape Dimensions T Top E Symbol Millimeters Cover Min Max Tape W A0 F A0 0.65 0.75 3°REF B0 1.10 1.20 B0 K0 0.50 0.60 K0 Φ:0.40±0.05 E 1.65 1.85 P1 F 3.45 3.55 P0 3.90 4.10 W1 S P1 1.90 2.10 R P2 1.95 2.05 K T 1.95 2.05 M N W 7.90 8.10 H Reel Dimensions (Size Ø 178) W Symbol Millimeters Min Max M 177.0 179.0 DeviceOrientationinTape N 59.0 61.0 W 11.0 12.0 W1 8.5 9.5 H 12.5 13.5 S 1.9 2.1 K 10.8 11.2 Pin1 R 0.95 1.05 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17