TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series SP3012 Series 0.5pF Diode Array for USB3.0 RoHS Pb GREEN Description The SP3012 Series integrates either 3, 4 or 6 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust devices can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal lines such as USB3.0, HDMI, USB2.0, and eSATA. Features Pinout *Pins 6, 7, 9, 10 are not internally connected • ESD, IEC 61000-4-2, • Small form factor μDFN 4 5 6 but 6s h o u l d 7b e c o n n8e c t e d t o9 t h e t r1ac0e. ±12kV contact, ±25kV air (JEDEC MO-229) and • EFT, IEC 61000-4-4, 40A SOT23-6 (JEDEC MO- (t =5/50ns) 178AB) packages provide P flow through routing to 5 4 3 2 1 • Lightning, IEC 61000- simplify PCB layout 3 2 1 4-5 2nd edition, 4A SP3012-03UTG SP3012-04UTG (AEC-Q101 Qualified) (t =8/20μs) • AEC-Q101 Qaulified P (μDFN10 and μDFN14) 6 5 4 • Low capacitance of 0.5pF (TYP) per I/O • RoHS compliant and lead- 8 14 free • Low leakage current of 1.5μA (MAX) at 5V Applications 7 1 SP3012-06UTG (AEC-Q101 Qualified) *Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected 1 2 3 • LCD/PDP TVs • Set Top Boxes but should be connected to the opposite pin with the PCB trace. SP3012-04HTG • External Storages • Smartphones Functional Block Diagram • DVD/Blu-ray Players • Ultrabooks/Notebooks • Desktops • Digital Cameras SP3012-03UTG SP3012-06UTG • MP3/PMP • Automotive Electronics PIN 1 PIN 11 Application Example for USB3.0 PIN 8 PIN 4 PIN 12 PIN 13 PIN 9 PIN 5 PIN 14 USB Port USB Controller V BUS GND (PIN 2) PIN 10 SP3012-04UTG SP3012-04HTG SSTX+ SSTX- IC PIN 1 PIN 1 SSRX+ PIN 2 PIN 3 PIN 4 PIN 4 SSRX- PIN 5 PIN 6 GND SP3012-06UTG D+ GND (PIN 3, 8) GND (PIN 2) D- Additional Information Signal GND Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving Datasheet Resources Samples applications unless otherwise expressly indicated. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Absolute Maximum Ratings Symbol Parameter Value Units I Peak Current (t=8/20μs) 4.0 A PP p T Operating Temperature -40 to 125 °C OP T Storage Temperature -55 to 150 °C STOR 2 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of 1 the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 0 3 P Electrical Characteristics (TOP=25ºC) S Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I ≤ 1µA 5.0 V RWM R Reverse Leakage Current I V =5V, Any I/O to GND 1.5 µA LEAK R I =1A, t=8/20µs, Fwd 6.6 7.9 V Clamp Voltage1 V PP p C I =2A, t=8/20µs, Fwd 7.0 8.4 V PP p Dynamic Resistance R (V - V ) / (I - I ) 0.4 Ω DYN C2 C1 PP2 PP1 IEC61000-4-2 (Contact) ±12 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±25 kV Diode Capacitance1 C Reverse Bias=0V, f=1 MHz 0.5 0.65 pF I/O-GND Diode Capacitance1 C Reverse Bias=0V, f=1 MHz 0.3 0.4 pF I/O-/O Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 0 1.0 -3 -6 0.8 B)-9 Capacitance (pF)0.6 Attenuation (d---111852 0.4 -21 -24 0.2 -27 -30 0.0 100 1000 0.0 1.0 2.0 3.0 4.0 5.0 Frequency (MHz) Bias Voltage (V) Clamping Voltage vs. I Transmission Line Pulsing(TLP) Plot PP 15 14 10.0 13 12 8.0 )A11 ( tn10 e 9 6.0 rru 8 C P 7 L mp Voltage (V)24..00 T 6543 Cla 2 0.0 1 1 2 3 4 Current (A) 0 0 1 2 3 4 5 6 7 8 9 10 11 TLP Voltage (V) © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Pulse Waveform Product Characteristics Pre-Plated Frame (µDFN) 110% Lead Plating Matte Tin (SOT23) 100% 90% Lead Material Copper Alloy 80% Lead Coplanarity 0.0004 inches (0.102mm) ent of IPP 567000%%% Substitute Material Silicon erc 40% Body Material Molded Epoxy P 30% 20% Flammability UL 94 V-0 10% 0% Notes : 0.0 5.0 10.0 15.0 20.0 25.0 30.0 1. All dimensions are in millimeters Time (μs) 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Reflow Condition Pb – Free assembly tP TP CCrriittiiccaall ZZoonnee - Temperature Min (Ts(min)) 150°C e RRaammpp--uupp TTLL ttoo TTPP Pre Heat -- TTeimmep e(mraitnu rteo Mmaaxx )( T(ts()max)) 2600 0–° C180 secs rutare TS(mTaxL) tL s pm RRaammpp--ddoown Average ramp up rate (Liquidus) Temp e PPrreehheeaatt 3°C/second max T (TL) to peak TS(min) tS T to T - Ramp-up Rate 3°C/second max S(max) L Reflow -- TTeemmppeerraattuurree ((TtL)) (Liquidus) 26107 –° C1 50 seconds 25 time to peak temperature Time L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. Part Numbering System P Do not exceed 260°C SP 3012 –xx x T G TVS Diode Arrays Ordering Information (SPA® Diodes) G= Green T= Tape & Reel Part Number Package Marking Min. Order Qty. Series Package SP3012-03UTG µDFN-6 V*3 3000 Number of Channels U= µDFN-6 (1.6x1.6mm) SP3012-04UTG µDFN-10 V*4 3000 03 = 3 channel µDFN-10 (2.5x1.0mm) 04 = 4 channel µDFN-14 (3.5x1.35mm) SP3012-06UTG µDFN-14 V*6 3000 06 = 6 channel H= SOT23-6 (3.0x1.75mm) SP3012-04HTG SOT23-6 V*4 3000 Part Marking System V* * Product Series Number of V = SP3012 Channels Assembly Site 3 = 3 channel 4 = 4 channel 6 = 6 channel © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Application Information Signal Integrity of High-Speed Data Interfaces Figure 1: PCB Layout of the SP3012-06UTG for USB 3.0 Adding external ESD protection to a high-speed data port is not trivial for a variety of reasons. J1 1. ESD protection devices will add parasitic capacitance to each data line from line to GND and line to line causing impedance mismatches between the differential pairs. This ultimately affects the signal eye-diagram and whether or not the transceiver can distinguish a “1” from a “0”. U1 2. ESD devices should be placed as close as possible to the port being protected to maximize their effect (i.e. clamping capability) and minimize the effect that PCB trace inductance can have during an ESD transient. Depending on the package size and pinout this could be challenging Figure 2 shows the USB 3.0 eye diagram that resulted and the bigger the package, the larger the land pattern from the PCB layout above with the SP3012-06UTG must be, which adds more parasitic capacitance. soldered on the landing pattern. 3. Stub traces can add another element of discontinuity 500 adversely affecting signal integrity so ESD protection is best employed when it’s “overlaid” on the data lines or when the signals can simply pass underneath the device. Taking all of this into account Littelfuse developed the SP3012 Series which was designed specifically 0 for protection of high-speed data ports such as HDMI 1.3/1.4 and USB 3.0. They present less than 0.5pF from line to GND and only 0.3pF from line to line minimizing impedance mismatch between the differential pairs. Wfrms:500 Furthermore, the SP3012 is rated up to ±12kV (contact -500 Base: 27.0000 ns Scale:33.0 ps/div discharge) which far exceeds the maximum requirement of the IEC 61000-4-2 standard. Figure 2: USB 3.0 Eye Diagram with the SP3012-06UTG There are two options available (4 channel and 6 channel) and both are housed in leadless µDFN packages so the Using a similar layout as above, Figure 3 shows the eye data lines can pass directly underneath the device to diagram that resulted using the SP3012-04UTG to protect reduce discontinuities and maintain signal integrity. the Super-Speed data lines and the SP3003-02UTG to protect the legacy data pair. 500 USB 3.0 Eye Diagram Data Figure 1 shows the layout used for the SP3012-06UTG in a USB 3.0 application. The traces routed toward the top are the two legacy USB 2.0 lines (D+/D-) that run at the slower speed of 480Mbps and therefore are not as critical as the 0 5Gbps Super-Speed traces. Wfrms:850 -500 Base: 27.0000 ns Scale:33.0 ps/div Figure 3: USB 3.0 Eye Diagram with the SP3012-04UTG © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Package Dimensions — μDFN-6 Bottom View Top View Package μDFN-6 (1.6x1.6x0.5mm) D2 D A 0.05 C JEDEC MO-229 L 6 5 4 4 5 6 0.05 C Millimeters Inches Symbol Min Max Min Max E A 0.45 0.55 0.018 0.022 E2 A1 0.00 0.05 0.000 0.002 Pin 1 Index Area 1 2 3 3 2 1 Pin 1 chamfer A3 0.152Ref 0.006 Ref B 0.10 x 45’ b 0.20 0.30 0.008 0.012 ℮ D 1.55 1.65 0.061 0.065 Side View D2 1.05 1.30 0.042 0.052 0.05 C A1 A3 E 1.50 1.70 0.060 0.067 A E2 0.40 0.65 0.016 0.026 Seating plane e 0.50 BSC 0.020BSC C L 0.164 0.316 0.006 0.012 b 0.10M CAB 0.05M C Embossed Carrier Tape & Reel Specification — μDFN-6 D P2 t Millimetres Inches Symbol Min Max Min Max E E 1.65 1.85 0.06 0.07 F 3.45 3.55 0.14 0.14 W D1 1.00 1.25 0.04 0.05 D 1.50 MIN 0.06 MIN P0 3.90 4.10 0.15 0.16 F 10P0 40.0+/- 0.20 1.57+/-0.01 0 D1 B W 7.90 8.30 0.31 0.33 P0 P2 1.95 2.05 0.08 0.08 A0 A0 1.78 1.88 0.07 0.07 B0 1.78 1.88 0.07 0.07 K0 0.84 0.94 0.03 0.04 0 K t 0.25 TYP 0.01 TYP © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Package Dimensions— µDFN-10 (2.5x1.0x0.5mm) Top View Package µDFN-10 (2.5x1.0x0.5mm) Top View D A A JEDEC MO-229 D E Millimeters Inches Symbol E B Min Nom Max Min Nom Max Side View A 0.48 0.515 0.55 0.019 0.020 0.021 0.05 C A1 A3 A1 0.00 -- 0.05 0.000 0.022 Seating A B A3 0.125 Ref 0.005 Ref Plane b1 0.05 C SideC View b b 0.15 0.20 0.25 0.006 0.008 0.012 0.05 C A10.1A03M C AB b1 0.35 0.40 0.45 0.014 0.016 0.018 A 0.05M C D 2.40 2.50 2.60 0.094 0.098 0.102 Seating E 0.90 1.00 1.10 0.035 0.039 0.043 Plane C b b1 BoRt0t.1o2m5 V0.0ie5wC e 0.50 BSC 0.020 BSC L 0.30 0.365 0.43 0.012 0.014 0.016 0.10MLCAB 0.05M C 2xR0.075mm (7x) e Soldering Pad Layout Dimensions Recomended Bottom VSieowldering Pad Layout Inch Millimeter R0.125 PP1 C (0.034) (0.875) Y G 0.008 0.20 Z (C) G (Y1) P 0.020 0.50 L P1 0.039 1.00 X 2xR0.075mm (7x) X1 X 0.008 0.20 e X1 0.016 0.40 Y 0.027 0.675 Recomended Alternative Soldering Pad Layout Soldering Pad Layout Y1 (0.061) (1.55) P1 P1 Z 0.061 1.55 P P Y Y Z (C) G (Y1) Z (C) G (Y1) X X X1 X1 Embossed Carrier Tape & Reel Specification— µDFN-10 P0 Package µDFN-10 (2.5x1.0x0.5mm) PP21 D0 T User Feeding Direction Symbol Millimeters E A0 1.30 +/- 0.10 W B0 2.83 +/- 0.10 D0 Ø 1.50 + 0.10 F D1 B0 5º Max Pin 1 Location D1 Ø 1.00 + 0.25 E 1.75 +/- 0.10 A0 F 3.50 +/- 0.05 5º Max K0 0.65 +/- 0.10 K0 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.254 +/- 0.02 W 8.00 + 0.30 /- 0.10 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Package Dimensions — µDFN-14 (3.5x1.35x0.5mm) Top View µDFN-14 (3.5x1.35x0.5mm) D A JEDEC MO-229 E Millimeters Inches Symbol PIN 1 Index Area 1 2 3 4 Min Nom Max Min Nom Max B Side View A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 Seating A A1 A2 A2 0.203 Ref 0.008 Ref Plane b 0.15 0.20 0.25 0.006 0.008 0.012 C b D 3.40 3.50 3.60 0.134 0.138 0.142 D2 - - - - - - E 1.25 1.35 1.45 0.050 0.054 0.058 Bottom View E1 - - - - - - e 0.500 BSC 0.020 BSC L 0.25 0.30 0.35 0.010 0.012 0.014 Pin 1 Identification Notes: Chamfer 0.10X45º 1. Dimension and tolerancing comform to ASME Y14.5M-1994. 2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily exact. Recomended Soldering Pad Layout Soldering Pad Layout Dimensions Symbol Millimeter InMcheisllimeters Inches Symbol Nom Nom D 3.30 0.1299 E 1.65 0.0571 b 0.30 0.0118 L 0.50 0.0197 e 0.50 typ 0.020 typ s 0.20 0.0078 s1 0.65 0.0256 Embossed Carrier Tape & Reel Specification — µDFN-14 P1 P0 D0 User Feeding Direction Symbol Millimeters P2 E A0 1.58 +/- 0.10 B0 3.73 +/- 0.10 D0 Ø 1.50 + 0.10 F D1 Ø 0.60 +/- 0.05 W E 1.75 +/- 0.10 Pin 1 Location F 5.50 +/- 0.05 K0 0.68 + 0.12/ -0.10 D1 A0 P0 2.00 +/- 0.05 T P1 4.00 +/- 0.10 P2 4.00 +/- 0.10 B0 T 0.28 +0.02/ -0.05 K0 W 12.00 + 0.30 /- 0.10 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Package Dimensions — SOT23-6 Package SOT23 Pins 6 JEDEC MO-178AB Millimeters Inches Notes Min Max Min Max A 0.900 1.450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref - e1 1.9 Ref 0.0748 Ref - L 0.30 0.600 0.012 0.023 4,5 N 6 6 6 Recommended Solder Pad Layout a 0º 8º 0º 8º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - M R 0.950 0.038 - Notes: P 1. Dimensioning and tolerancing Per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. R 4. Foot length L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. O 6. “N” is the number of terminal positions. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL 14.4mm 4.0mm ACCESS HOLE 1.5mm 2.0mm 1.75mm DIA. HOLE 13mm 8mm CL 4.0mm 180mm 60mm GENERAL INFORMATION SOT-23 (8mm POCKET PITCH) 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 8.4mm USER DIRECTION OF FEED PIN 1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. COVER TAPE Revised: 02/23/17