TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series SP3010 Series 0.45pF Diode Array RoHS Pb GREEN Description The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features • ESD, IEC 61000-4-2, • Low leakage current of 6 7 8 9 10 ±8kV contact, ±15kV air 0.1μA (TYP) at 5V • EFT, IEC 61000-4-4, 40A • Small form factor (5/50ns) μDFN( JEDEC MO-229) • Lightning, IEC 61000- package saves board 4-5 2nd edition, 3A space 5 4 3 2 1 (t =8/20μs) • RoHS compliant and P *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. • Low capacitance of lead-free 0.45pF (TYP) per I/O Functional Block Diagram Applications • LCD/PDP TVs • Set Top Boxes • DVD Players • Mobile Phones • Desktops • Notebooks PPiinn 11 • MP3/PMP • Digital Cameras PPiinn 22 GGNNDD ((PPiinnss 33,,88)) PPiinn 44 PPiinn 55 Application Example HDMI HDMI Port Chipset D2+ Additional Information Ground D2- SP3010-04 D1+ Ground d D1- orl W Datasheet Resources Samples de D0+ si Ground ut D0- O SP3010-04 CLK+ Ground CLK- * Package is shown as transparent Case Life Support Note: Ground Signal Ground Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series Absolute Maximum Ratings Symbol Parameter Value Units I Peak Current (t=8/20μs) 3.0 A PP p T Operating Temperature –40 to 125 °C OP T Storage Temperature –55 to 150 °C STOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T =25ºC) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I ≤ 1µA 6.0 V RWM R Reverse Leakage Current I V =5V, Any I/O to GND 0.1 0.5 µA LEAK R I =1A, t=8/20µs, Fwd 10.8 V Clamp Voltage1 V PP p C I =2A, t=8/20µs, Fwd 12.3 V PP p Dynamic Resistance R (V - V ) / (I - I ) 1.5 Ω DYN C2 C1 PP2 PP1 IEC61000-4-2 (Contact) ±8 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±15 kV Diode Capacitance1 C Reverse Bias=0V 0.45 pF I/O-GND Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 0.6 0 0.5 -5 acitance (pF)00..34 nuation (dB)--1150 O Cap0.2 Atte-20 I/ 0.1 -25 0.0 -30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 100 1000 10000 I/O Bias Voltage (V) Frequency (MHz) Clamping Voltage vs. I Pulse Waveform PP 16.0 110% 100% 14.0 90% V)C12.0 80% Voltage ( 108..00 nt of IPP 567000%%% Clamp 6.0 Perce 3400%% 4.0 20% 2.0 10% 0% 0.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 1.0 1.5 2.0 2.5 3.0 Time (μs) Peak Pulse Current-I (A) PP © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series Soldering Parameters Reflow Condition Pb – Free assembly tP TP CCrriittiiccaall ZZoonnee - Temperature Min (Ts(min)) 150°C e RRaammpp--uupp TTLL ttoo TTPP Pre Heat -- TTeimmep e(mraitnu rteo Mmaaxx )( T(ts()max)) 2600 0–° C180 secs rutare TS(mTaxL) tL s pm RRaammpp--ddoown Average ramp up rate (Liquidus) Temp e PPrreehheeaatt 3°C/second max T (TL) to peak TS(min) tS T to T - Ramp-up Rate 3°C/second max S(max) L Reflow -- TTeemmppeerraattuurree ((TtL)) (Liquidus) 26107 –° C1 50 seconds 25 time to peak temperature Time L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C Part Numbering System Product Characteristics SP 3010 04 U T G Lead Plating Pre-Plated Frame TVS Diode Arrays Lead Material Copper Alloy (SPA® Diodes) G= Green Lead Coplanarity 0.0004 inches (0.102mm) T= Tape & Reel Series Substitute Material Silicon Package Number of Channels µDFN-10 (2.5x1.0mm) Body Material Molded Epoxy -04 = 4 Channel Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Q* 4 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Product Series Number of Q = SP3010 Channels Assembly Site Ordering Information Part Number Package Marking Min. Order Qty. SP3010-04UTG µDFN-10 Q*4 3000 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series Embossed Carrier Tape & Reel Specification — µDFN-10 P0 P1 D0 T User Feeding Direction Package µDFN-10 (2.5x1.0x0.5mm) P2 Symbol Millimeters E A0 1.30 ± 0.10 B0 2.83 ± 0.10 W D0 Ø 1.50 + 0.10 D1 Ø 1.00 + 0.25 F E 1.75 ± 0.10 Top View D1 B0 5º Max Pin 1 Location F 3.50 ± 0.05 D A K0 0.65 ± 0.10 P0 4.00 ± 0.10 A0 P1 4.00 ± 0.10 E P2 2.00 ± 0.05 5º Max T 0.254 ± 0.02 0 B W 8.00 + 0.30 /- 0.10 K Side View Package Dimensions — µDFN-10 (2.5x1.0x0.5mm) 0.05 C A1 A3 A Seating Plane Package b1 µDFN0-1.005 (2C.5x1.0x0.5mm) C JEDEC b MO-229 Top View Millimeters Inches A Symbol 0.10M CAB D Min Nom Max Min Nom Max 0.05M C A 0.48 0.515 0.55 0.019 0.020 0.021 A1 0.00 -- 0.05 0.000 0.022 E A3 Bottom View0.125 Ref 0.005 Ref b R0.102.155 0.20 0.25 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.018 B D 2.40 2.50 2.60 0.094 0.098 0.102 Side View LE 0.90 1.00 1.10 0.035 0.039 0.043 0.05 C A1 A3 e 2xR0.075m0.m50 ( 7BxS)C 0.020 BSC L e 0.30 0.365 0.43 0.012 0.014 0.016 A Seating Plane b1 0.05 C Recomended Soldering Pad Layout Dimensions C b Soldering Pad Layout Inch Millimeter P1 0.10M C AB P C (0.034) (0.875) G 0.008 0.20 0.05M C Y P 0.020 0.50 Z (C) G (Y1) P1 0.039 1.00 X 0.008 0.20 Bottom View X1 0.016 0.40 X R0.125 X1 Y 0.027 0.675 Y1 (0.061) (1.55) Alternative Z 0.061 1.55 L Soldering Pad Layout 2xR0.075mm (7x) P1 e P Y Recomended Z (C) G (Y1) Soldering Pad Layout P1 X P X1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own Yapplications. Littelfuse products are not designed for, and may not be used in, all applications. Read comZpl(eCt)e DGisclaimer Notice at www.l(Yit1te)lfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 X X1