TVS Diode Array (SPA ® Diodes) Low Capacitance ESD Protection - SP3003 Series SP3003 Series 0.65pF Diode Array RoHS Pb GREEN Description The SP3003 has ultra low capacitance rail-to-rail diodes with an additional protection diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge and ± 15 kV air discharge without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features • ESD protection of ±8kV • Low leakage current of SP3003-02X/J SP3003-04X/J SP3003-02UTG contact discharge, 0.5μA (MAX) at 5V NC I/O 1 I/O 1 I/O 4 I/O1 1 6 NC ±15kV air discharge, (IEC • Complete line of small GND GND VCC I/O2 2 5 NC 61000-4-2) packaging helps save • EFT protection, board space (SC70, VCC I/O 2 I/O 2 I/O 3 GND 3 4 GND IEC 61000-4-4, 40A SOT553, SOT563, SP3003-04A SP3003-08A (5/50ns) MSOP10, µDFN-6L) I/O 1 NC I/O 1 I/O 8 • Lightning, 2.5A (8/20μs as • AEC-Q101 qualified I/O 2 NC I/O 2 I/O 7 defined in IEC 61000-4-5 • RoHS compliant and lead- VCC GND I/O 3 NC 2nd Edition) free I/O 3 NC I/O 4 I/O 6 • Low capacitance of • Moisture Sensitivity I/O 4 NC GND I/O 5 0.65pF (TYP) per I/O Level(MSL-1) Functional Block Diagram Applications SP3003-04J/XTG SP3003-04ATG • LCD/ PDP TVs • Set Top Boxes 6 5 4 10 9 8 7 6 SP3003-02UTG • DVD Players • Mobile Phones • Desktops • Notebooks • MP3/ PMP • Computer Peripherals • Digital Cameras 1 2 3 1 2 3 4 5 SP3003-02J/XTG SP3003-08ATG 5 4 10 9 8 7 6 Application Example DVI/ HDMI Port *Package is shown as transparent D2+ GND 1 2 3 1 2 3 4 5 D2- Vcc/NC D1+ GND Additional Information D1- IC D0+ GND D0- Vcc/NC CLK+ Datasheet Resources Samples GND CLK- Life Support Note: GND GND Signal GND Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving A single, 4 channel SP3003-04 component can be used to protect four (4) of the data lines in a HDMI/DVI applications unless otherwise expressly indicated. interface so two (2) SP3003-04 components provide protection for all eight (8) TMDS lines. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19

TVS Diode Array (SPA ® Diodes) Low Capacitance ESD Protection - SP3003 Series Absolute Maximum Ratings Symbol Parameter Value Units I Peak Current (t=8/20μs) 2.5 A PP p T Operating Temperature –40 to 125 °C OP T Storage Temperature –55 to 150 °C STOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T =25ºC) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I ≤ 1µA 6 V RWM R Reverse Leakage Current I V=5V 0.5 µA LEAK R I =1A, t=8/20µs, Fwd 10.0 12.0 V Clamp Voltage1 V PP p C I =2A, t=8/20µs, Fwd 11.8 15.0 V PP p IEC61000-4-2 (Contact) ±8 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.7 0.8 0.95 pF Diode Capacitance1 C I/O-GND Reverse Bias=1.65V 0.55 0.65 0.8 pF Diode Capacitance1 C Reverse Bias=0V 0.35 pF I/O-I/O Note: 1. Parameter is guaranteed by design and/or component Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage I/O - GND 1 1.00 0 0.95 -1 0.90 on Loss [dB] ----2543 )Fp( ecnatica 000...887505 VCC = Float Inserti --76 paC O/I 00..7605 VCC = 3.3V V = 5V CC 0.60 -8 -9 0.55 -10 0.50 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency [Hz] I/O DC Bias (V) © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19

TVS Diode Array (SPA ® Diodes) Low Capacitance ESD Protection - SP3003 Series Capacitance vs. Frequency Product Characteristics Matte Tin (SC70-x, MSOP-10) Pre-Plated Frame 1.4E-12 Lead Plating (SOT5x3, µDFN-6) Lead Material Copper Alloy 1.2E-12 Lead Coplanarity 0.0004 inches (0.102mm) 1E-12 Substrate Material Silicon F] e [ Body Material Molded Compound nc 8E-13 UL Recognized compound meeting cita Flammability flammability rating V-0 a p 6E-13 a C 4E-13 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Soldering Parameters Reflow Condition Pb – Free assembly - Temperature Min (T ) 150°C tP s(min) TP CCrriittiiccaall ZZoonnee Pre Heat - Temperature Max (Ts(max)) 200°C e RRaammpp--uupp TTLL ttoo TTPP Average ramp- T uimp era (tme i(nL itqou midauxs)) ( Ttes)mp (TL) to peak 630°C –/ s1e8c0o nsde cmsax rutare TS(mTaxL) tL T to T - Ramp-up Rate 3°C/second max pm RRaammpp--ddoown S(max) L e PPrreehheeaatt - Temperature (T) (Liquidus) 217°C T Reflow L TS(min) - Temperature (tL) 60 – 150 seconds tS Peak Temperature (T) 260+0/-5 °C P 25 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds time to peak temperature Time Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T) 8 minutes Max. P Do not exceed 260°C © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19

TVS Diode Array (SPA ® Diodes) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SC70-5 e e Package SC70-5 6 not 5used 4 Recommended Solder Pad Layout Pins 5 JEDEC MO-203 E HE Millimeters Inches Symbol Min Max Min Max 1 2 3 A 0.80 1.10 0.031 0.043 B A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 D B 0.15 0.30 0.006 0.012 A2 A c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 A1 E 1.15 1.35 0.045 0.053 C e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L L 0.26 0.46 0.010 0.018 Package Dimensions — SC70-6 e e Package SC70-6 Recommended Solder Pad Layout Pins 6 6 5 4 JEDEC MO-203 E HE Millimeters Inches Symbol Min Max Min Max 1 2 3 A 0.80 1.10 0.031 0.043 B A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 D B 0.15 0.30 0.006 0.012 A2 A c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 A1 E 1.15 1.35 0.045 0.053 e 0.65 BSC 0.026 BSC C HE 2.00 2.40 0.079 0.094 L L 0.26 0.46 0.010 0.018 Package Dimensions — SOT553 A Package SOT 553 D L Recommended Pins 5 Solder Pad Layout Millimeters Inches 6 5 4 Symbol (not used) E Min Max Min Max HE 2 3 A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 e c 0.08 0.18 0.003 0.007 c D 1.50 1.70 0.059 0.067 B E 1.10 1.30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19

TVS Diode Array (SPA ® Diodes) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SOT563 A Package SOT 563 D L Pins 6 Recommended Millimeters Inches 6 5 4 E Solder Pad Layout Symbol Min Max Min Max HE 2 3 A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 e c 0.08 0.18 0.003 0.007 c D 1.50 1.70 0.059 0.067 B E 1.10 1.30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package Dimensions — MSOP10 Package MSOP10 JEDEC MO-187 Pins 10 Millimeters Inches Symbol Min Max Min Max A - 1.10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 Recommended Solder Pad E 4.67 5.10 0.184 0.200 Layout Recommanded Solder Pad Layout E1 2.90 3.10 0.114 0.122 e 0.50 BSC 0.020 BSC HE 0.40 0.80 0.016 0.031 Package Dimensions —µDFN-6L Package µDFN-6L Recommended JEDEC MO-229 Solder Pad Layout Pins 6 Millimeters Inches Symbol Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 A3 0.125REF 0.005REF b 0.35 0.45 0.014 0.018 b1 0.15 0.25 0.006 0.010 D 1.55 1.65 0.062 0.065 D2 - - - - E 0.95 1.05 0.038 0.042 E2 - - - - e 0.50REF 0.020REF L 0.33 0.43 0.013 0.017 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19

TVS Diode Array (SPA ® Diodes) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier Tape & Reel Specification — MSOP-10 Millimetres Inches Symbol Min Max Min Max E 1.65 1.85 0.065 0.073 F 5.40 5.60 0.213 0.220 D 1.50 1.60 0.059 0.063 D1 1.50 Min 0.059 Min P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1.574±0.008 W 11.90 12.10 0.469 0.476 P 7.90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 User Feeding Direction B0 3.20 3.40 0.126 0.134 K0 1.20 1.40 0.047 0.055 t 0.30 ± 0.05 0.012± 0.002 Pin 1 Location Embossed Carrier Tape & Reel Specifications — SC70-5 and SC70-6 Millimetres Inches Symbol Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1.574±0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1.12 1.32 0.044 0.052 User Feeding Direction t 0.27 max 0.010 max Pin 1 Location Embossed Carrier Tape & Reel Specifications — SOT553 and SOT563 Millimetres Inches Symbol Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1.574±0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 User Feeding Direction K0 0.64 0.74 0.025 0.029 t 0.22 max 0.009 max Pin 1 Location © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19

TVS Diode Array (SPA ® Diodes) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier Tape & Reel Specification — µDFN-6L Millimetres Inches Symbol Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 40.0±0.20 1.574±0.008 W 7.90 8.30 0.311 0.319 P 3.90 4.10 0.154 0.161 A0 1.15 1.25 0.045 0.049 B0 1.75 1.85 0.069 0.073 K0 0.65 0.75 0.026 0.03 t 0.22 max 0.009 max Pin 1 Location User Feeding Direction Part Marking System Ordering Information Part Number Package Marking Min. Order Qty. SP3003-02JTG SC70-5 F*2 3000 F * * SP3003-02UTG µDFN-6L F*2 3000 SP3003-02XTG SOT553 F*2 3000 F * * Product Series Number of Channels F=SP3003 series (varies) SP3003-04ATG MSOP-10 F*4 4000 Assembly Site SP3003-04JTG SC70-6 F*4 3000 (varies) SP3003-04XTG SOT563 F*4 3000 SP3003-08ATG MSOP-10 F*8 4000 Part Numbering System SP3003 -0x x TG TVS Diode Arrays G= Green (SPA® Diodes) T= Tape & Reel Package Series A = MSOP-10, 4000 quantity Number of Channels J = SC70-5 or SC70-6, 3000 quantity -02 = 2 channel X = SOT553 or SOT563, 5000 quantity (SC70-5, SOT553, µDFN-6L packages) U= µDFN-6L, 3000 quantity -04 = 4 channel (SC70-6, SOT563, MSOP-10 packages) -08 = 8 channel (MSOP-10 packages) Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19