TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series SP3003 Series 0.65pF Diode Array RoHS Pb GREEN Description The SP3003 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features • ESD protection of ±8kV • Low leakage current of SP3003-02X/J SP3003-04X/J SP3003-02UTG (AEC-Q101 qualified) contact discharge, 0.5μA (MAX) at 5V NC I/O 1 I/O 1 I/O 4 ±15kV air discharge, (IEC • Complete line of small GND GND VCC 61000-4-2) packaging helps save • EFT protection, board space (SC70, VCC I/O 2 I/O 2 I/O 3 IEC 61000-4-4, 40A SOT553, SOT563, (5/50ns) MSOP10, µDFN-6L) SP3003-04A SP3003-08A • Lightning Protection, IEC • AEC-Q101 qualified I/O 1 NC I/O 1 I/O 8 61000-4-5, 2nd edition (µDFN package) I/O 2 NC I/O 2 I/O 7 2.5A (8/20µs) • RoHS compliant and lead- VCC GND I/O 3 NC I/O 3 NC I/O 4 I/O 6 • Low capacitance of free I/O 4 NC GND I/O 5 0.65pF (TYP) per I/O Applications Functional Block Diagram • LCD/ PDP TVs • Set Top Boxes SP3003-04J/XTG SP3003-04ATG 6 5 4 10 9 8 7 6 SP3003-02UTG • DVD Players • Mobile Phones • Desktops • Notebooks • MP3/ PMP • Computer Peripherals • Digital Cameras 1 2 3 1 2 3 4 5 Application Example SP3003-02J/XTG SP3003-08ATG 5 4 10 9 8 7 6 DVI/ HDMI Port *Package is shown as transparent D2+ GND D2- Vcc/NC D1+ GND 1 2 3 1 2 3 4 5 D1- IC D0+ Additional Information GND D0- Vcc/NC CLK+ GND CLK- Resources Samples GND GND Signal GND A single, 4 channel SP3003-04 device can be used to Life Support Note: protect four (4) of the data lines in a HDMI/DVI interface Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving so two (2) SP3003-04 devices provide protection for all applications unless otherwise expressly indicated. eight (8) TMDS lines. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t=8/20μs) 2.5 A Storage Temperature Range –55 to 150 °C PP p Maximum Junction Temperature 150 °C T Operating Temperature –40 to 125 °C OP Maximum Lead Temperature 260 °C TSTOR Storage Temperature –55 to 150 °C (Soldering 20-40s) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T =25ºC) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I ≤ 1µA 6 V RWM R Reverse Leakage Current I V =5V 0.5 µA LEAK R I =1A, t=8/20µs, Fwd 10.0 12.0 V PP p Clamp Voltage1 V C I =2A, t=8/20µs, Fwd 11.8 15.0 V PP p IEC61000-4-2 (Contact) ±8 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.7 0.8 0.95 pF Diode Capacitance1 C I/O-GND Reverse Bias=1.65V 0.55 0.65 0.8 pF Diode Capacitance1 C Reverse Bias=0V 0.35 pF I/O-I/O Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1 1.00 0 0.95 -1 0.90 on Loss [dB] ----2543 )Fp( ecnatica 000...887505 VCC = Float Inserti --76 paC O/I 00..7605 VCC = 3.3V V = 5V CC 0.60 -8 -9 0.55 -10 0.50 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency [Hz] I/O DC Bias (V) © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Capacitance vs. Frequency Product Characteristics Matte Tin (SC70-x, MSOP-10) Pre-Plated 1.4E-12 Lead Plating Frame (SOT5x3, µDFN-6) 1.2E-12 Lead Material Copper Alloy 1E-12 Lead Coplanarity 0.0004 inches (0.102mm) F] nce [ 8E-13 Substitute Silicon cita Material a ap 6E-13 Body Material Molded Epoxy C 4E-13 Flammability UL 94 V-0 Notes : 2E-13 1. All dimensions are in millimeters 2. Dimensions include solder plating. 0 3. Dimensions are exclusive of mold flash & metal burr. 1.E+06 1.E+07 1.E+08 1.E+09 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Frequency [Hz] 5. Package surface matte finish VDI 11-13. Soldering Parameters Reflow Condition Pb – Free assembly - Temperature Min (T ) 150°C s(min) Pre Heat - Temperature Max (T ) 200°C s(max) - Time (min to max) (t) 60 – 180 secs s Average ramp up rate (Liquidus) Temp 3°C/second max (T) to peak L T to T - Ramp-up Rate 3°C/second max S(max) L - Temperature (T) (Liquidus) 217°C Reflow L - Temperature (t) 60 – 150 seconds L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SC70-5 e e Package SC70-5 6 not 5used 4 Recommended Solder Pad Layout Pins 5 JEDEC MO-203 E HE Millimeters Inches 1 2 3 Min Max Min Max B A 0.80 1.10 0.031 0.043 D A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 A2A B 0.15 0.30 0.006 0.012 A1 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 C E 1.15 1.35 0.045 0.053 L e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SC70-6 e e Package SC70-6 6 5 4 Recommended Solder Pad Layout Pins 6 JEDEC MO-203 E HE Millimeters Inches 1 2 3 Min Max Min Max A 0.80 1.10 0.031 0.043 B A1 0.00 0.10 0.000 0.004 D A2 0.70 1.00 0.028 0.039 A2A B 0.15 0.30 0.006 0.012 A1 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 C E 1.15 1.35 0.045 0.053 L e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SOT553 A Package SOT 553 D L Recommended Pins 5 Solder Pad Layout 6 5 4 Millimeters Inches (not used) E HE Min Max Min Max 2 3 A 0.50 0.60 0.020 0.024 e B 0.17 0.27 0.007 0.011 c c 0.08 0.18 0.003 0.007 B D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SOT563 A Package SOT 563 D L Pins 6 Recommended 6 5 4 Millimeters Inches E Solder Pad Layout HE Min Max Min Max 2 3 A 0.50 0.60 0.020 0.024 e B 0.17 0.27 0.007 0.011 c c 0.08 0.18 0.003 0.007 B D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package Dimensions — MSOP10 Package MSOP10 JEDEC MO-187 Pins 10 Millimeters Inches Min Max Min Max A - 1.10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 Recommended Solder Pad Recommanded Solder Pad Layout Layout D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 e 0.50 BSC 0.020 BSC HE 0.40 0.80 0.016 0.031 Package Dimensions —µDFN-6L Package µDFN-6L Recommended JEDEC MO-229 Solder Pad Layout Pins 6 Millimeters Inches Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 A3 0.125REF 0.005REF b 0.35 0.45 0.014 0.018 b1 0.15 0.25 0.006 0.010 D 1.55 1.65 0.062 0.065 D2 - - - - E 0.95 1.05 0.038 0.042 E2 - - - - e 0.50REF 0.020REF L 0.33 0.43 0.013 0.017 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier Tape & Reel Specification — MSOP-10 Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 5.40 5.60 0.213 0.220 D 1.50 1.60 0.059 0.063 D1 1.50 Min 0.059 Min P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1.574±0.008 W 11.90 12.10 0.469 0.476 P 7.90 8.10 0.311 0.319 User Feeding Direction A0 5.20 5.40 0.205 0.213 B0 3.20 3.40 0.126 0.134 K0 1.20 1.40 0.047 0.055 Pin 1 Location t 0.30 ± 0.05 0.012± 0.002 Embossed Carrier Tape & Reel Specifications — SC70-5 and SC70-6 Millimetres Inches Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1.574±0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 User Feeding Direction B0 2.24 2.44 0.088 0.960 Pin 1 Location K0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max Embossed Carrier Tape & Reel Specifications — SOT553 and SOT563 Millimetres Inches Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1.574±0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 User Feeding Direction A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 Pin 1 Location K0 0.64 0.74 0.025 0.029 t 0.22 max 0.009 max © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier Tape & Reel Specification — µDFN-6L Millimetres Inches Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 40.0±0.20 1.574±0.008 W 7.90 8.30 0.311 0.319 P0 3.90 4.10 0.154 0.161 A0 1.15 1.25 0.045 0.049 B0 1.75 1.85 0.069 0.073 K0 0.65 0.75 0.026 0.03 t 0.22 max 0.009 max Part Marking System Ordering Information Part Number Package Marking Min. Order Qty. SP3003-02JTG SC70-5 F*2 3000 F * * SP3003-02UTG µDFN-6L FH2 3000 F * * Product Series Number of Channels F=SP3003 series (varies) SP3003-02XTG SOT553 F*2 3000 Assembly Site (varies) SP3003-04ATG MSOP-10 F*4 4000 SP3003-04JTG SC70-6 F*4 3000 SP3003-04XTG SOT563 F*4 3000 SP3003-08ATG MSOP-10 F*8 4000 Part Numbering System SP3003-0x xTG TVS Diode Arrays G= Green (SPA® Diodes) T= Tape & Reel Package Series A = MSOP-10, 4000 quantity Number of Channels J = SC70-5 or SC70-6, 3000 quantity -02 = 2 channel X = SOT553 or SOT563, 5000 quantity (SC70-5, SOT553, µDFN-6L packages) U= µDFN-6L, 3000 quantity -04 = 4 channel (SC70-6, SOT563, MSOP-10 packages) -08 = 8 channel (MSOP-10 packages) Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17