TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series SP3002 Series 0.85pF Diode Array RoHS Pb GREEN Description The SP3002 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features • Low capacitance of • Low leakage current of I/O 1 I/O 4 I/O 1 1 6 I/O 4 0.85 pF (TYP) per I/O 0.5μA (MAX) at 5V • ESD protection of • Small packaging options GND VCC NC 2 Gnd 5 VCC ±12kV contact discharge, saves board space ±15kV air discharge, • Lightning Protection, IEC I/O 2 3 4 I/O 3 (IEC 61000-4-2) 61000-4-5, 2nd edition I/O 2 I/O 3 • EFT protection, IEC 4.5A (8/20µs) SC70-6 and SOT23-6 (1.6xμ1D.6FxN0.-56mm) 61000-4-4, 40A • RoHS compliant and (5/50ns) lead-free Functional Block Diagram Applications I/O2 V I/O4 • Computer Peripherals • Network Hardware/Ports CC • Mobile Phones • Test Equipment • PDA’s • Medical Equipment • Digital Cameras Application Example I/O1 GND I/O3 +5V A single 4 channel SP300x-04 D2+ D2+ device can be used to protect Gnd Additional Information D2- D2- four of the data lines in a 6 5 4 HDMI/DVI interface. Two (2) SP300x-04 1 2 3 SP300x-04 devices provide D1+ D1+ Gnd protection for the main data D1- D1- lines. Low voltage ASIC HDMI HDMI Resources Samples or DVI or DVI HDMI/DVI drivers can also be Interface Connector IC protected with the SP300x-04, D0+ D0+ Gnd the +V pins on the SP300x-04 D0- D0- CC can be substituted with a 6 5 4 1S P 3 0 20 x - 0 4 3 suitable bypass capacitor or in Clk+ Clk+ some backdrive applications the Gnd Clk- Clk- +VCC of the SP300x-04 can be floated or NC. Gnd Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t=8/20μs) 4.5 A Storage Temperature Range –55 to °C PP p 150 T Operating Temperature –40 to 125 °C OP Maximum Junction Temperature 150 °C T Storage Temperature –55 to 150 °C STOR Maximum Lead Temperature 260 °C (Soldering 20-40s) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T =25ºC) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I ≤ 1µA 6.0 V RWM R Reverse Leakage Current I V =5V 0.5 µA LEAK R I =1A, t=8/20µs, Fwd 9.5 11.0 V PP p Clamp Voltage1 V C I =2A, t=8/20µs, Fwd 10.6 13.0 V PP p IEC61000-4-2 (Contact) ±12 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.95 1.1 1.25 pF Diode Capacitance1 C I/O-GND Reverse Bias=1.65V 0.7 0.85 1.0 pF Diode Capacitance1 C Reverse Bias=0V 0.5 pF I/O-I/O Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1.50 0 1.40 1.30 B] -5 )Fp 1.20 Insertion Loss [d -10 ( ecnaticapaC O/I 1100....10980000 VCC =V FClCo =a t3.3V V = 5V -15 0.70 CC 0.60 0.50 -210.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency [Hz] I/O DC Bias (V) © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Capacitance vs. Frequency Product Characteristics SC70 & SOT23: Matte Tin 2E-12 Lead Plating μDFN: Pre-Plated Frame 1.8E-12 Lead Material Copper Alloy 1.6E-12 1.4E-12 Lead Coplanarity 0.0004 inches (0.102mm) F] nce [1.2E-12 Substitute Material Silicon pacita 81EE--1132 Body Material Molded Epoxy a C 6E-13 Flammability UL 94 V-0 4E-13 Notes : 2E-13 1. All dimensions are in millimeters 2. Dimensions include solder plating. 0 3. Dimensions are exclusive of mold flash & metal burr. 1.E+06 1.E+07 1.E+08 1.E+09 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Frequency [Hz] 5. Package surface matte finish VDI 11-13. Soldering Parameters Reflow Condition Pb – Free assembly - Temperature Min (T ) 150°C s(min) Pre Heat - Temperature Max (T ) 200°C s(max) - Time (min to max) (t) 60 – 180 secs s Average ramp up rate (Liquidus) Temp 3°C/second max (T) to peak L T to T - Ramp-up Rate 3°C/second max S(max) L - Temperature (T) (Liquidus) 217°C Reflow L - Temperature (t) 60 – 150 seconds L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Package Dimensions — SC70-6 e e Package SC70-6 Pins 6 6 5 4 JEDEC MO-203 E HE Millimeters Inches Min Max Min Max 1 2 3 A 0.80 1.10 0.031 0.043 B A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 D B 0.15 0.30 0.006 0.012 A2A c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 A1 E 1.15 1.35 0.045 0.053 e 0.65 BSC 0.026 BSC C HE 2.00 2.40 0.079 0.094 Solder Pad Layout L 0.26 0.46 0.010 0.018 L Package Dimensions — SOT23-6 Package SOT23-6 Pins 6 JEDEC MO-178 Millimeters Inches Notes Min Max Min Max A 0.900 1.450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 Ref - e1 1.9 Ref 0.0748 Ref - L 0.100 0.600 0.004 0.023 4,5 N 6 6 6 a 0º 10º 0º 10º - Recommended Solder Pad Layout M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - Notes: 1. Dimensioning and tolerances per ANSI 14.5M-1982. M 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. P 7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. R O © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Package Dimensions — μDFN-6 (1.6x1.6x0.5mm) Bottom View Top View Package μDFN-6 (1.6x1.6x0.5mm) D2 D A 0.05 C JEDEC MO-229 L 6 5 4 4 5 6 0.05 C Millimeters Inches Symbol Min Max Min Max E A 0.45 0.55 0.018 0.022 E2 A1 0.00 0.05 0.000 0.002 Pin 1 Index Area 1 2 3 3 2 1 Pin 1 chamfer A3 0.127 Ref 0.005 Ref B 0.10 x 45’ b 0.20 0.30 0.008 0.012 ℮ D 1.50 1.70 0.060 0.067 Side View D2 1.05 1.30 0.042 0.052 0.05 C A1 A3 E 1.50 1.70 0.060 0.067 A E2 0.40 0.65 0.016 0.026 Seating plane e 0.50 Ref 0.020 Ref C L 0.25 0.40 0.010 0.016 b 0.10M CAB 0.05M C Part Numbering System Ordering Information SP3002-04*TG Part Number Package Marking Min. Order Qty. TVS Diode Arrays G= Green (SPA® Diodes) SP3002-04HTG SOT23-6 E*4 3000 T= Tape & Reel SP3002-04JTG SC70-6 E*4 3000 Package Series H = SOT23-6 SP3002-04UTG μDFN-6 E*4 3000 Number of Channels J = SC70-6 (1.6x1.6x0.5mm) -04 = 4 channel U = μDFN-6 Part Marking System E * 4 E*4 Product Series Number of Channels E = SP3002 series Assembly Site (varies) © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3002 Series Embossed Carrier Tape & Reel Specification — SC70-6 Millimetres Inches Symbol Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0± 0.20 1.574±0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t 0.27 Max 0.010 Max Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL ACCESS HOLE DIA1..5 HmOmLE 4.0mm 2.0mm 1.75mm 14.4mm 8mm CL 4.0mm 13mm SOT-23 (8mm POCKET PITCH) GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 180mm 60mm 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 8.4mm USER DIRECTION OF FEED PIN 1 Embossed Carrier Tape & Reel Specification — μDFN-6 (1.6x1.6x0.5mm) D Millimetres Inches P2 t Symbol Min Max Min Max E E 1.65 1.85 0.06 0.07 W F 3.45 3.55 0.14 0.14 D1 1.00 1.25 0.04 0.05 F D 1.50 MIN 0.06 MIN 0 D1 B P0 3.90 4.10 0.15 0.16 P0 10P0 40.0± 0.20 1.57±0.01 A0 W 7.90 8.30 0.31 0.33 0 P2 1.95 2.05 0.08 0.08 K A0 1.78 1.88 0.07 0.07 B0 1.78 1.88 0.07 0.07 K0 0.84 0.94 0.03 0.04 t 0.25 TYP 0.01 TYP COVER TAPE Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17