TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3001 Series SP3001 Series 0.65pF Diode Array RoHS Pb GREEN Description The SP3001 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Features Pinout • Low capacitance of • Small SC70 ( JEDEC MO- 0.65pF (TYP) per I/O 203) package saves board I/O 1 I/O 4 • ESD protection of ±8kV space contact discharge, ±15kV • Lightning Protection, IEC GND V air discharge, 61000-4-5, 2nd edition CC (IEC 61000-4-2) 2.5A (8/20µs) • EFT protection, IEC • RoHS compliant and I/O 2 I/O 3 61000-4-4, lead-free 40A (5/50ns) • Low leakage current of 0.5μA (MAX) at 5V Functional Block Diagram I/O2 VCC I/O4 Applications • Computer Peripherals • Network Hardware/Ports • Mobile Phones • Test Equipment • PDA’s • Medical Equipment • Digital Cameras I/O1 GND I/O3 Application Example Additional Information +5V A single 4 channel SP300x-04 D2+ D2+ device can be used to protect Gnd D2- D2- four of the data lines in a 6 5 4 HDMI/DVI interface. Two (2) SP300x-04 Resources Samples 1 2 3 SP300x-04 devices provide D1+ D1+ Gnd protection for the main data D1- D1- lines. Low voltage ASIC HDMI HDMI or DVI or DVI HDMI/DVI drivers can also be Interface Connector IC protected with the SP300x-04, D0+ D0+ Gnd the +V pins on the SP300x-04 D0- D0- CC can be substituted with a 6 5 4 1S P 3 0 20 x - 0 4 3 suitable bypass capacitor or in Clk+ Clk+ some backdrive applications the Gnd Clk- Clk- +VCC of the SP300x-04 can be Life Support Note: floated or NC. Gnd Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3001 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t=8/20μs) 2.5 A Storage Temperature Range –55 to °C PP p 150 T Operating Temperature –40 to 125 °C OP Maximum Junction Temperature 150 °C T Storage Temperature –55 to 150 °C STOR Maximum Lead Temperature 260 °C (Soldering 20-40s) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T =25ºC) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V I ≤ 1µA 6 V RWM R Reverse Leakage Current I V =5V 0.5 µA LEAK R I =1A, t=8/20µs, Fwd 9.5 11.0 V PP p Clamp Voltage1 V C I =2A, t=8/20µs, Fwd 10.6 13.0 V PP p IEC61000-4-2 (Contact) ±8 kV ESD Withstand Voltage1 V ESD IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.7 0.8 0.9 pF Diode Capacitance1 C I/O-GND Reverse Bias=1.65V 0.55 0.65 0.75 pF Diode Capacitance1 C Reverse Bias=0V 0.35 pF I/O-I/O Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1 1.00 0 0.95 -1 0.90 -2 B] )F 0.85 Insertion Loss [d -----76543 p( ecnatciapaC O/I 0000....87760505 VCC = 3.3V VCC = Float VCC = 5V -8 0.60 -9 0.55 -10 0.50 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency [Hz] I/O DC Bias (V) © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3001 Series Capacitance vs. Frequency Product Characteristics 1.4E-12 Lead Plating Matte Tin 1.2E-12 Lead Material Copper Alloy 1E-12 Lead Coplanarity 0.0004 inches (0.102mm) F] nce [ 8E-13 Substitute Material Silicon a pacit 6E-13 Body Material Molded Epoxy a C 4E-13 Flammability UL 94 V-0 2E-13 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 0 1.E+06 1.E+07 1.E+08 1.E+09 3. Dimensions are exclusive of mold flash & metal burr. Frequency [Hz] 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Reflow Condition Pb – Free assembly - Temperature Min (T ) 150°C s(min) Pre Heat - Temperature Max (T ) 200°C s(max) - Time (min to max) (t) 60 – 180 secs s Average ramp up rate (Liquidus) Temp 3°C/second max (T) to peak L T to T - Ramp-up Rate 3°C/second max S(max) L - Temperature (T) (Liquidus) 217°C Reflow L - Temperature (t) 60 – 150 seconds L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) P Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3001 Series Package Dimensions — SC70-6 e e Package SC70-6 Pins 6 6 5 4 JEDEC MO-203 E HE Millimeters Inches Min Max Min Max 1 2 3 A 0.80 1.10 0.031 0.043 B A1 0.00 0.10 0.000 0.004 D A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 A2A c 0.08 0.25 0.003 0.010 A1 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 C e 0.65 BSC 0.026 BSC Solder Pad Layout HE 2.00 2.40 0.079 0.094 L L 0.26 0.46 0.010 0.018 Part Marking System Part Numbering System D* 4 SP3001-04JTG TVS Diode Arrays D*4 Product Series Number of Channels (SPA® Diodes) G= Green D = SP3001 series T= Tape & Reel Assembly Site (varies) Series Package J = SC70-6 Number of Channels -04 = 4 channel Ordering Information Part Number Package Marking Min. Order Qty. SP3001-04JTG SC70-6 D*4 3000 Embossed Carrier Tape & Reel Specification — SC70-6 Millimetres Inches Symbol Min Max Min Max E 1.65 1.85 0.064 0.072 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.062 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.153 0.161 10P0 40.0± 0.20 1.574±0.007 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17