TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series SP1001 Series - 8pF 15kV Unidirectional TVS Array RoHS Pb GREEN Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high- speed signal pins. Features Pinout • Low capacitance of 8pF 0.5 to 0.1μA (MAX) at 5V (TYP) per I/O • Small package saves *SP1001-02 *SP1001-04 *SP1001-05 SP1001-02 • ESD protection of ±15kV board space (SC70-3) (SC70-5) (SC70-6) (SOT 553) 1 1 5 1 6 NC 5 contact discharge, ±30kV • Lightning protection, IEC air discharge, (Level 4, 61000-4-5, 2nd edition 2A 3 2 2 5 2 IEC 61000-4-2) (8/20µs) 2 3 4 3 4 NC 4 • EFT protection, IEC • AEC-Q101 qualified 61000-4-4, 40A (SC70-x packages) SP1001-04 SP1001-05 SP1001-05 (5/50ns) • RoHS compliant and lead- (SOT 553) (SOT 563) (SOT 963) • Low leakage current of free 1 5 1 6 1 6 2 2 5 2 5 Applications 3 4 3 4 3 4 • Computer Peripherals • LCD/PDP TVs *Note: AEC-Q101 qualified • Mobile Phones • Set Top Boxes • Digital Cameras • DVD Players Functional Block Diagram • Desktops/Notebooks • MP3/PMP SP1001-02 SP1001-02 1 2 5 4 Application Example Input LCD module Controller D1 3 2 D2 O D3 u ts D4 SP1001-04 SP1001-05 id 5 4 6 5 4 e W o r ld SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Signal Shield Ground Ground 1 2 3 1 2 3 Additional Information Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Datasheet Resources Samples © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units Parameter Rating Units I Peak Current (t=8/20μs) 2 A Storage Temperature Range –55 to 150 °C PP p TOP Operating Temperature –40 to 125 °C Maximum Junction Temperature 150 °C T Storage Temperature –55 to 150 °C STOR Maximum Lead Temperature (Soldering 260 °C 20s-40s) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T = 25°C) OP Parameter Symbol Test Conditions Min Typ Max Units Forward Voltage Drop V I=10mA 0.7 0.9 1.2 V F F Reverse Voltage Drop V I =1mA 6.0 8.5 V R R Reverse Standoff Voltage V I ≤1µA 5.5 V RWM R Reverse Leakage Current I V =5V 0.1 µA LEAK R I =1A, t=8/20µs, Fwd 8.0 11.0 V Clamp Voltage1 V PP p C I =2A, t=8/20µs, Fwd 9.7 13.0 V PP p Dynamic Resistance R (V - V ) / (I - I ) 1.7 Ω DYN C2 C1 PP2 PP1 IEC61000-4-2 (Contact) ±15 kV ESD Withstand Voltage1,2 V ESD IEC61000-4-2 (Air) ±30 kV Reverse Bias=0V 12 pF Diode Capacitance1 C Reverse Bias=2.5V 8 pF D Reverse Bias=5V 7 pF Notes: 1 Parameter is guaranteed by device characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Capacitance vs. Reverse Bias Design Consideration Because of the fast rise-time of the ESD transient, 14 placement of ESD devices is a key design consideration. 12 To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD 10 transient as possible. Install the ESD suppressors directly pF) behind the connector so that they are the first board-level ce ( 8 circuit component encountered by the ESD transient. They n acita 6 are connected from signal/data line to ground. p a C 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 DC Bias (V) © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Soldering Parameters Reflow Condition Pb – Free assembly tP TP CCrriittiiccaall ZZoonnee - Temperature Min (Ts(min)) 150°C e RRaammpp--uupp TTLL ttoo TTPP Pre Heat -- TTeimmep e(mraitnu rteo Mmaaxx )( T(ts()max)) 2600 0–° C180 secs rutare TS(mTaxL) tL s pm RRaammpp--ddoown Average ramp up rate (Liquidus) Temp e PPrreehheeaatt 3°C/second max T (TL) to peak TS(min) tS T to T - Ramp-up Rate 3°C/second max S(max) L Reflow -- TTeemmppeerraattuurree ((TtL)) (Liquidus) 26107 –° C1 50 seconds 25 time to peak temperature Time L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes max. P Do not exceed 260°C Part Numbering System Product Characteristics SP1001- 0**TG Matte Tin (SC70-x) Pre-Plated Frame Lead Plating (SOT5x3, SOT963) TVS Diode Arrays (SPA® Diodes) G= Green Lead Material Copper Alloy T= Tape & Reel Package Lead Coplanarity 0.0004 inches (0.102mm) Series J = SC70-3, SC70-5 or SC70-6 Number of Channels X = SOT553 or SOT563 Substitute Silicon 02 = 2 Channel V = SOT963 Material 04 = 4 Channel 05 = 5 Channel Body Material Molded Epoxy Flammability UL 94 V-0 Part Marking System Notes : 1. All dimensions are in millimeters A* * 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. A** Product Series Number of Channels 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. A = SP1001 series (varies) 5. Package surface matte finish VDI 11-13. Assembly Site (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP1001-02JTG SC70-3 A*2 3000 SP1001-02XTG SOT553 A*2 3000 SP1001-04JTG SC70-5 A*4 3000 SP1001-04XTG SOT553 A*4 3000 SP1001-05JTG SC70-6 A*5 3000 SP1001-05VTG SOT963 A*5 8000 SP1001-05XTG SOT563 A*5 3000 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Package Dimensions — SC70 Package SC70-3 SC70-3 Pins 3 B Solder Pad Layout JEDEC MO-203 3 Millimeters Inches E HE Min Max Min Max A 0.80 1.10 0.031 0.043 1 2 e e A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 D B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 A2A D 1.85 2.25 0.073 0.089 A1 E 1.15 1.35 0.045 0.053 e 0.66 BSC 0.026 BSC C HE 2.00 2.40 0.079 0.094 L L 0.26 0.46 0.010 0.018 e e SC70-5 Package SC70-5 6 5 4 Solder Pad Layout Pins 5 not used JEDEC MO-203 E HE Millimeters Inches Min Max Min Max 1 2 3 A 0.80 1.10 0.031 0.043 B A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 D B 0.15 0.30 0.006 0.012 A2 A c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 A1 E 1.15 1.35 0.045 0.053 e 0.65 BSC 0.026 BSC C HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 L B B SC70-6 Package SC70-6 6 5 4 Solder Pad Layout Pins 6 JEDEC MO-203 E HE Millimeters Inches Min Max Min Max 1 2 3 A 0.80 1.10 0.031 0.043 B A1 0.00 0.10 0.000 0.004 D A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 A2A c 0.08 0.25 0.003 0.010 A1 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 C e 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L L 0.26 0.46 0.010 0.018 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Package Dimensions — SOT553 and SOT563 A Package SOT 553 D L Pins 5 SOT 553 Millimeters Inches 6 (not 5used) 4 E HE Solder Pad Layout Min Max Min Max 2 3 A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 e c c 0.08 0.18 0.003 0.007 B D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 A Package SOT 563 D L SOT 563 Pins 6 6 5 4 Solder Pad Layout Millimeters Inches E HE Min Max Min Max 2 3 A 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 e c c 0.08 0.18 0.003 0.007 B D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package Dimensions — SOT963 Package SOT 963 Pins 6 Millimeters Inches Min Nom Max Min Nom Max A 0.44 0.48 0.50 0.0173 0.0189 0.0197 B 0.10 0.15 0.20 0.004 0.006 0.008 c 0.05 0.10 0.15 0.002 0.004 0.006 D 0.95 1.00 1.05 0.037 0.039 0.041 E 0.75 0.80 0.85 0.029 0.031 0.033 E1 0.95 1.00 1.05 0.037 0.039 0.041 e 0.35 BSC 0.014 BSC L 0.05 0.10 0.15 0.002 0.004 0.006 L1 0.125 0.15 0.175 0.005 0.006 0.007 ø 3 º 5 º 7 º 3 º 5 º 7 º Recommanded Solder Pad Layout © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification — SC70-3 Dimensions Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 ± 0.20 1.574 ± 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 0.098 A1 1.00 Ref 0.039 Ref B0 2.30 2.50 0.090 0.098 B1 1.90 Ref 0.074 K0 1.10 1.30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Dimensions Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 ± 0.20 1.574 ± 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification — SOT553 and SOT563 Dimensions Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.1 0.154 0.161 10P0 40.0 ± 0.20 1.574 ± 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t 0.22 max .009 max Embossed Carrier Tape & Reel Specification – SOT963 PO D P2 /o t Dimensions Millimetres Inches Symbol E Min Max Min Max E 1.65 1.85 0.065 0.073 W F 3.45 3.55 0.136 0.140 D1 0.45 0.55 0.018 0.022 F D 1.50 min 0.059 min P0 3.90 4.10 0.154 0.161 o/D1 O 10P0 40.0 ± 0.20 1.575 ± 0.008 P B P 1.95 2.05 0.077 0.081 AO P2 1.95 2.05 0.077 0.081 W 7.90 8.20 0.311 0.323 A0 1.11 1.21 0.044 0.048 B0 1.11 1.21 0.044 0.048 K0 0.58 0.68 0.023 0.027 O K t 0.22 max 0.009 max Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17