TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP03-6 Series SP03-6 Series 6V 150A Diode Array RoHS Pb GREEN Description This new broadband protection component from Littelfuse provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information. Agency Approvals Features Agency Agency File Number • RoHS compliant • UL Recognized • SOIC-8 surface mount compound meeting E128662 package (JEDEC MS-012) flammability rating V-0 • Low insertion loss, log- • Lightning, 150A (8/20 as linear capacitance defined in IEC 61000-4-5 2nd edition) Pinout • Combined longitudinal and metallic protection • Low clamping voltage 1 8 • Clamping speed of nanoseconds 2 7 3 6 Applications 4 5 • T1/E1 Line cards • 10/100/1000 BaseT • T3/E3 and DS3 Interfaces Ethernet SOIC-8 (Top View) • STS-1 Interfaces Functional Block Diagram Application Example Pin 1 and 8 Line in Line out TeleLink (0461 1.25) SP03-6 TIP 1 8 Pin 2, 3, 6, and 7 2 7 to chipset (Ethernet PHY, 3 6 T3/E3 PHY, etc.) 4 5 Line in Line out Pin 4 and 5 RING This schematic shows a high-speed data interface Additional Information protection solution. The SP03-6 provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events. Its surge rating is compatible with the intra-building surge requirements of Telcordia’s GR-1089-CORE, and the Basic Level Datasheet Resources Samples Recommendations of ITU K.20 and .21. This component protects against both positive and negative induced surge events. The TeleLink fuse provides overcurrent protection Life Support Note: for the long term 50/60 Hz power fault events. Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/05/18

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP03-6 Series Absolute Maximum Ratings Parameter Rating Units Peak Pulse Current (8/20µs) 150 A Peak Pulse Power (8/20µs) 2800 W IEC 61000-4-2, Contact Discharge, (Level 4) 30 kV IEC 61000-4-2, Air Discharge, (Level 4) 30 kV IEC 61000-4-5, 2nd Edition (8/20) 100 A Telcordia GR 1089 (Intra-Building) (2/10µs) 150 A ITU K.20 (5/310µs) 40 A CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T = 25°C) OP Parameter Symbol Test Conditions Min Typ Max Units Reverse Stand-Off Voltage V - - - 6 V RWM Reverse Breakdown Voltage V I= 1mA 6.8 - - V BR T Reverse Leakage Current I V = 6V, T= 25°C - - 25 µA R RWM Clamping Voltage, Line-Ground V I = 50A, t=8/20 µs - - 15 V C PP p Clamping Voltage, Line-Ground V I = 100A, t=8/20 µs - - 20 V C PP p Between I/O Pins and Ground C (Line-Ground) - 16 25 pF j V =0V, f= 1MHz Junction Capacitance R Between I/O Pins C (Line-Line) - 8 12 pF j V =0V, f= 1MHz R Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time Figure 2: Current Derating Curve 1000 120 )I%P100 )A( tn100 ( tnerruC 80 erruC esluP kaeP 10 detaR fo egatnecreP 246000 1 0 1 10 100 1000 0 20 40 60 80 100 120 140 160 Pulse decay time (µs) Ambient Temperature (C) © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/05/18

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP03-6 Series Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 25 100 Line-to-Line 20 %) 80 e (V) ntage of I(PP 60 mping Voltag 1150 Line-to-Ground Perce 40 V ClaC 20 5 0 0 0 20 40 60 80 100 0 5 10 15 20 25 30 35 40 Time, µs IP Peak Impulse Current (A) Figure 5: Capacitance vs. Reverse Voltage Figure 6: Forward Voltage vs. Forward Current 20 7 18 Line-to-Ground 6 16 Ground-to-Line )Fp 14 )V( e 5 ( ecnaticapa 11028 Line-to-Line gatloV draw 34 C 6 ro 2 F 4 1 2 0 0 0 1 2 3 4 5 6 7 0 10 20 30 40 50 60 70 80 90 100 Reverse Voltage (V) Forward Current (A) Soldering Parameters Reflow Condition Pb – Free assembly tP TP CCrriittiiccaall ZZoonnee - Temperature Min (Ts(min)) 150°C e RRaammpp--uupp TTLL ttoo TTPP Pre Heat -- TTeimmep e(mraitnu rteo Mmaaxx )( T(ts()max)) 2600 0–° C180 secs rutare TS(mTaxL) tL s pm RRaammpp--ddoown Average ramp up rate (Liquidus) Temp e PPrreehheeaatt 3°C/second max T (TL) to peak TS(min) tS T to T - Ramp-up Rate 3°C/second max S(max) L Reflow -- TTeemmppeerraattuurree ((tTL)) (Liquidus) 26107 –° C1 50 seconds 25 time to peak temperature Time L Peak Temperature (T ) 260+0/-5 °C P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/05/18

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP03-6 Series Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package SOIC Pins 8 JEDEC MS-012 Millimetres Inches LF Min Max Min Max A 1.35 1.75 0.053 0.069 o A1 0.10 0.25 0.004 0.010 Recommended A2 1.25 1.65 0.049 0.065 Soldering Pad Outline B 0.31 0.51 0.012 0.020 (Reference Only) c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 1.27 BSC 0.050 BSC L 0.40 1.27 0.016 0.050 Embossed Carrier Tape & Reel Specification — SOIC Package User Feeding Direction Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.95 2.05 0.077 0.081 Pin 1 Location D 1.5 1.6 0.059 0.063 D1 1.50 Min 0.059 Min P0 3.9 4.1 0.154 0.161 10P0 40.0 ± 0.20 1.574 ± 0.008 Part Numbering System W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 SP 03 - 6 B T G A0 6.3 6.5 0.248 0.256 TVS Diode Arrays G= Green B0 5.1 5.3 0.2 0.209 (SPA® Diodes) K0 2 2.2 0.079 0.087 T= Tape & Reel t 0.30 ± 0.05 0.012 ± 0.002 Series Package B - SOIC Working Product Characteristics Voltage Part Marking System Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.003 inches (0.08 mm) LF SP03-6 Substrate Material Silicon XXXXXXXX First Line: Part number Body Material Molded Second Line: Date code UL Recognized compound meeting Flammability flammability rating V-0 Ordering Information Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. Part Number Package Marking Min. Order Qty. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. SP03-6BTG SOIC Tape & Reel SP03-6 2500 5. Package surface matte finish VDI 11-13. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/05/18