SN74LVC3G07 www.ti.com SCES365K–AUGUST2001–REVISEDNOVEMBER2013 Triple Buffer/Driver With Open-drain Outputs CheckforSamples:SN74LVC3G07 FEATURES DESCRIPTION 1 • AvailableintheTexasInstruments NanoFree™ This triple buffer/driver is designed for 1.65-V to 5.5-V 2 V operation. Package CC • Supports5-VV Operation NanoFree™ package technology is a major CC breakthrough in IC packaging concepts, using the die • Maxt of3.7nsat3.3V pd asthepackage. • LowPowerConsumption,10-μAMaxI CC The output of the SN74LVC3G07 is open drain and • ±24-mAOutputDriveat3.3V can be connected to other open-drain outputs to • InputandOpen-DrainOutputAccepts implement active-low wired-OR or active-high wired- Voltagesupto5.5V ANDfunctions.Themaximumsinkcurrentis32mA. • TypicalV (OutputGroundBounce) <0.8Vat OLP This device is fully specified for partial-power-down VCC=3.3V,TA=25°C applications using Ioff. The Ioff circuitry disables the • TypicalV (OutputV Undershoot) >2Vat outputs, preventing damaging current backflow OHV OH V =3.3V,T =25°C throughthedevicewhenitispowereddown. CC A • I SupportsLiveInsertion,Partial-Power- off DownModeandBackDriveProtection • Latch-UpPerformanceExceeds100mAPer JESD78,ClassII • ESDProtectionExceedsJESD22 – 2000-VHuman-BodyModel(A114-A) – 200-VMachineModel(A115-A) – 1000-VCharged-DeviceModel(C101) DCT PACKAGE DCU PACKAGE YZP PACKAGE (TOP VIEW) (TOP VIEW) (BOTTOM VIEW) 1A 1 8 VCC 1A 1 8 VCC GN2AD 3456 23YA 3Y 2 7 1Y 3Y 27 1Y 3Y 2 7 1Y 2A 3 6 3A 1A 18 VCC GND 4 5 2Y 2A 3 6 3A GND 4 5 2Y See mechanical drawings for dimensions. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. NanoFreeisatrademarkofTexasInstruments. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2001–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74LVC3G07 SCES365K–AUGUST2001–REVISEDNOVEMBER2013 www.ti.com FunctionTable (EachBuffer/Driver) INPUT OUTPUT A Y H H L L LOGIC DIAGRAM (POSITIVE LOGIC) 1 7 1A 1Y 3 5 2A 2Y 6 2 3A 3Y Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 6.5 V CC V Inputvoltagerange(2) –0.5 6.5 V I V Voltagerangeappliedtoanyoutputinthehigh-impedanceorpower-offstate(2) –0.5 6.5 V O V Voltagerangeappliedtoanyoutputinthehighorlowstate(2) (3) –0.5 6.5 V O I Inputclampcurrent V <0 –50 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent ±50 mA O ContinuouscurrentthroughV orGND ±100 mA CC DCTpackage 220 θ Packagethermalimpedance(4) DCUpackage 227 °C/W JA YZPpackage 102 T Storagetemperaturerange –65 150 °C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputnegative-voltageandoutputvoltageratingsmaybeexceedediftheinputandoutputclamp-currentratingsareobserved. (3) ThevalueofV isprovidedintherecommendedoperatingconditionstable. CC (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. 2 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC3G07

SN74LVC3G07 www.ti.com SCES365K–AUGUST2001–REVISEDNOVEMBER2013 Recommended Operating Conditions(1) MIN MAX UNIT Operating 1.65 5.5 VCC Supplyvoltage V Dataretentiononly 1.5 VCC=1.65Vto1.95V 0.65×VCC VCC=2.3Vto2.7V 1.7 VIH High-levelinputvoltage V VCC=3Vto3.6V 2 VCC=4.5Vto5.5V 0.7×VCC VCC=1.65Vto1.95V 0.35×VCC VCC=2.3Vto2.7V 0.7 VIL Low-levelinputvoltage V VCC=3Vto3.6V 0.8 VCC=4.5Vto5.5V 0.3×VCC VI Inputvoltage 0 5.5 V VO Outputvoltage 0 5.5 V VCC=1.65V 4 VCC=2.3V 8 IOL Low-leveloutputcurrent 16 mA VCC=3V 24 VCC=4.5V 32 VCC=1.8V±0.15V,2.5V±0.2V 20 Δt/Δv Inputtransitionriseorfallrate VCC=3.3V±0.3V 10 ns/V VCC=5V±0.5V 5 TA Operatingfree-airtemperature –40 125 °C (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) –40°Cto85°C –40°Cto125°C PARAMETER TESTCONDITIONS VCC MIN TYP(1) MAX MIN TYP(1) MAX UNIT 1.65Vto5.5 IOL=100μA V 0.1 0.1 IOL=4mA 1.65V 0.45 0.45 VOL IOL=8mA 2.3V 0.3 0.3 V IOL=16mA 0.4 0.4 3V IOL=24mA 0.55 0.75 IOL=32mA 4.5V 0.55 0.75 II Ainputs VI=5.5VorGND 0to5.5V ±5 ±5 μA Ioff VIorVO=5.5V 0 ±10 ±10 μA 1.65Vto5.5 ICC VI=5.5VorGND, IO=0 V 10 10 μA ΔICC OneinputatVCC–0.6V, OtherinputsatVCCorGND 3Vto5.5V 500 500 μA CI VI=VCCorGND 3.3V 3.5 3.5 pF (1) AlltypicalvaluesareatV =3.3V,T =25°C. CC A Switching Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure1) SN74LVC3G07 –40°Cto85°C FROM TO PARAMETER (INPUT) (OUTPUT) VCC=1.8V VCC=2.5V VCC=3.3V VCC=5V UNIT ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX tpd A Y 1.5 7.8 1 4.3 1.1 3.7 1 2.9 ns Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74LVC3G07

SN74LVC3G07 SCES365K–AUGUST2001–REVISEDNOVEMBER2013 www.ti.com Switching Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure1) SN74LVC3G07 –40°Cto125°C FROM TO PARAMETER (INPUT) (OUTPUT) VCC=1.8V VCC=2.5V VCC=3.3V VCC=5V UNIT ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX tpd A Y 1.5 8.3 1 4.8 1.1 4.2 1 3.4 ns Operating Characteristics T =25°C A V =1.8V V =2.5V V =3.3V V =5V CC CC CC CC PARAMETER TESTCONDITIONS UNIT TYP TYP TYP TYP C Powerdissipationcapacitance f=10MHz 3 3 4 5 pF pd 4 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC3G07

SN74LVC3G07 www.ti.com SCES365K–AUGUST2001–REVISEDNOVEMBER2013 Parameter Measurement Information (Open Drain) VLOAD From Output RL S1 Open TEST S1 Under Test GND tPZL (see Notes E and F) VLOAD CL (see Note A) RL tPLZ (see Notes E and G) VLOAD tPHZ/tPZH VLOAD LOAD CIRCUIT INPUT VCC VI tr/tf VM VLOAD CL RL VD 1.8 V ± 0.15 V VCC ≤ 2 ns VCC/2 2 × VCC 30 pF 1 kW 0.15 V 2.5 V ± 0.2 V VCC ≤ 2 ns VCC/2 2 × VCC 30 pF 500 W 0.15 V 3.3 V ± 0.3 V 3 V ≤ 2.5 ns 1.5 V 6 V 50 pF 500 W 0.3 V 5 V ± 0.5 V VCC ≤ 2.5 ns VCC/2 2 × VCC 50 pF 500 W 0.3 V VI Timing Input VM 0 V tw tsu th VI Input VM VM Data Input VM VM VI 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUP AND HOLD TIMES VI Output VI Input VM VM Control VM VM 0 V 0 V tPLH tPHL Output tPZL tPLZ VOH Waveform 1 VLOAD/2 Output VM VM VOL (Ss1e ea tN VoLteO ABD) VM VOL + VD VOL tPHL tPLH tPZH tPHZ Output Output VM VM VOH WS1a vaet fVoLrOmA D2 VM VLOAD/2 − VDVLOAD/2 VOL (see Note B) ≈0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES INVERTING AND NONINVERTING OUTPUTS LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 W . D. The outputs are measured one at a time, with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at VM. G. tPLZ is measured at VOL + VD . H. All parameters and waveforms are not applicable to all devices. Figure1. LoadCircuitandVoltageWaveforms Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74LVC3G07

SN74LVC3G07 SCES365K–AUGUST2001–REVISEDNOVEMBER2013 www.ti.com REVISION HISTORY ChangesfromRevisionJ(Feburary2007)toRevisionK Page • Updateddocumentformatting. ............................................................................................................................................. 1 • Updatedoperatingtemperaturerange.................................................................................................................................. 3 6 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC3G07

PACKAGE OPTION ADDENDUM www.ti.com 15-Jun-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74LVC3G07DCT3 ACTIVE SM8 DCT 8 3000 Pb-Free SNBI Level-1-260C-UNLIM -40 to 85 C07 (RoHS) Z SN74LVC3G07DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C07 & no Sb/Br) (R, Z) SN74LVC3G07DCTRG4 ACTIVE SM8 DCT 8 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C07 & no Sb/Br) (R, Z) SN74LVC3G07DCUR ACTIVE VSSOP DCU 8 3000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C07J, C07Q, C07R) & no Sb/Br) SN74LVC3G07DCURG4 ACTIVE VSSOP DCU 8 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C07R & no Sb/Br) SN74LVC3G07DCUT ACTIVE VSSOP DCU 8 250 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C07Q, C07R) & no Sb/Br) SN74LVC3G07DCUTG4 ACTIVE VSSOP DCU 8 250 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C07R & no Sb/Br) SN74LVC3G07YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 CVN & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 15-Jun-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC3G07 : •Automotive: SN74LVC3G07-Q1 •Enhanced Product: SN74LVC3G07-EP NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 9-May-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74LVC3G07DCT3 SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3 SN74LVC3G07DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3 SN74LVC3G07DCUR VSSOP DCU 8 3000 178.0 9.5 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC3G07DCUR VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC3G07DCURG4 VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC3G07DCUT VSSOP DCU 8 250 178.0 9.5 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC3G07DCUTG4 VSSOP DCU 8 250 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC3G07YZPR DSBGA YZP 8 3000 178.0 9.2 1.02 2.02 0.63 4.0 8.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 9-May-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74LVC3G07DCT3 SM8 DCT 8 3000 182.0 182.0 20.0 SN74LVC3G07DCTR SM8 DCT 8 3000 182.0 182.0 20.0 SN74LVC3G07DCUR VSSOP DCU 8 3000 202.0 201.0 28.0 SN74LVC3G07DCUR VSSOP DCU 8 3000 202.0 201.0 28.0 SN74LVC3G07DCURG4 VSSOP DCU 8 3000 202.0 201.0 28.0 SN74LVC3G07DCUT VSSOP DCU 8 250 202.0 201.0 28.0 SN74LVC3G07DCUTG4 VSSOP DCU 8 250 202.0 201.0 28.0 SN74LVC3G07YZPR DSBGA YZP 8 3000 220.0 220.0 35.0 PackMaterials-Page2

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MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,65 0,13 M 0,15 8 5 0,15 NOM 2,90 4,25 ÇÇÇÇÇ 2,70 3,75 ÇÇÇÇÇ ÇÇÇÇÇ Gage Plane ÇÇÇÇÇ PIN 1 INDEX AREA 0,25 1 4 0°– 8° 3,15 0,60 2,75 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 4188781/C 09/02 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion D. Falls within JEDEC MO-187 variation DA. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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PACKAGE OUTLINE YZP0008 DSBGA - 0.5 mm max height SCALE 8.000 DIE SIZE BALL GRID ARRAY B E A BALL A1 CORNER D C 0.5 MAX SEATING PLANE 0.19 0.05 C 0.15 BALL TYP 0.5 TYP D C SYMM 1.5 D: Max = 1.919 mm, Min =1 .858 mm TYP B E: Max = 0.918 mm, Min =0 .857 mm 0.5 TYP A 0.25 8X 1 2 0.21 0.015 C A B SYMM 4223082/A 07/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT YZP0008 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.23) 1 2 A (0.5) TYP B SYMM C D SYMM LAND PATTERN EXAMPLE SCALE:40X SOLDER MASK 0.05 MAX 0.05 MIN ( 0.23) OPENING SOLDER MASK OPENING ( 0.23) METAL METAL UNDER SOLDER MASK NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4223082/A 07/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). www.ti.com

EXAMPLE STENCIL DESIGN YZP0008 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.25) (R0.05) TYP 1 2 A (0.5) TYP B SYMM C METAL TYP D SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4223082/A 07/2016 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

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