SN74LVC2G86 www.ti.com SCES360I–AUGUST2001–REVISEDDECEMBER2013 Dual 2-Input Exclusive-OR Gate CheckforSamples:SN74LVC2G86 FEATURES DESCRIPTION 1 • AvailableintheTexasInstruments NanoFree™ This dual 2-input exclusive-OR gate is designed for 2 1.65-Vto5.5-VV operation. Package CC • Supports5-VV Operation The SN74LVC2G86 performs the Boolean function Y CC =A ⊕ BorY=AB+ABinpositivelogic. • InputsAcceptVoltagesto5.5V • Maxt of4.7nsat3.3V NanoFree™ package technology is a major pd breakthrough in IC packaging concepts, using the die • LowPowerConsumption,10-μAMaxI CC asthepackage. • ±24-mAOutputDriveat3.3V A common application is as a true/complement • TypicalV (OutputGroundBounce) OLP element. If the input is low, the other input is <0.8VatV =3.3V,T =25°C CC A reproduced in true form at the output. If the input is • TypicalV (OutputV Undershoot) high, the signal on the other input is reproduced OHV OH >2VatV =3.3V,T =25°C invertedattheoutput. CC A • IoffSupportsLiveInsertion,Partial-Power- This device is fully specified for partial-power-down DownModeandBackDriveProtection applications using I . The I circuitry disables the off off • Latch-UpPerformanceExceeds100mAPer outputs, preventing damaging current backflow throughthedevicewhenitispowereddown. JESD78,ClassII • ESDProtectionExceedsJESD22 – 2000-VHuman-BodyModel(A114-A) – 200-VMachineModel(A115-A) – 1000-VCharged-DeviceModel(C101) DCT PACKAGE DCU PACKAGE YZP PACKAGE (TOP VIEW) (TOP VIEW) (BOTTOM VIEW) 1A 1 8 VCC 1A 1 8 VCC GN2DY 3456 22AB 1B 2 7 1Y 1B 27 1Y 1B 2 7 1Y 2Y 3 6 2B 1A 18 VCC GND 4 5 2A 2Y 3 6 2B GND 4 5 2A See mechanical drawings for dimensions. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. NanoFreeisatrademarkofTexasInstruments. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2001–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

SN74LVC2G86 SCES360I–AUGUST2001–REVISEDDECEMBER2013 www.ti.com Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. FunctionTable (EachGate) INPUTS OUTPUT A B Y L L L L H H H L H H H L EXCLUSIVE-OR LOGIC An exclusive-OR gate has many applications, some of which can be represented better by alternative logic symbols. EXCLUSIVE OR = 1 These are five equivalent exclusive-OR symbols valid for an SN74LVC2G86 gate in positive logic; negation may be shown at any two ports. LOGIC-IDENTITY ELEMENT EVEN-PARITY ELEMENT ODD-PARITY ELEMENT = 2k 2k + 1 The output is active (low) if The output is active (low) if The output is active (high) if all inputs stand at the same an even number of inputs an odd number of inputs logic level (i.e., A = B). (i.e., 0 or 2) are active. (i.e., only 1 of the 2) are active. 2 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC2G86

SN74LVC2G86 www.ti.com SCES360I–AUGUST2001–REVISEDDECEMBER2013 Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange –0.5 6.5 V CC V Inputvoltagerange(2) –0.5 6.5 V I V Voltagerangeappliedtoanyoutputinthehigh-impedanceorpower-offstate(2) –0.5 6.5 V O V Voltagerangeappliedtoanyoutputinthehighorlowstate(2) (3) –0.5 V +0.5 V O CC I Inputclampcurrent V <0 –50 mA IK I I Outputclampcurrent V <0 –50 mA OK O I Continuousoutputcurrent ±50 mA O ContinuouscurrentthroughV orGND ±100 mA CC DCTpackage 220 θ Packagethermalimpedance(4) DCUpackage 227 °C/W JA YZPpackage 102 T Storagetemperaturerange –65 150 °C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Theinputnegative-voltageandoutputvoltageratingsmaybeexceedediftheinputandoutputclamp-currentratingsareobserved. (3) ThevalueofV isprovidedintherecommendedoperatingconditionstable. CC (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SN74LVC2G86

SN74LVC2G86 SCES360I–AUGUST2001–REVISEDDECEMBER2013 www.ti.com Recommended Operating Conditions(1) MIN MAX UNIT Operating 1.65 5.5 V Supplyvoltage V CC Dataretentiononly 1.5 V =1.65Vto1.95V 0.65×V CC CC V =2.3Vto2.7V 1.7 CC V High-levelinputvoltage V IH V =3Vto3.6V 2 CC V =4.5Vto5.5V 0.7×V CC CC V =1.65Vto1.95V 0.35×V CC CC V =2.3Vto2.7V 0.7 CC V Low-levelinputvoltage V IL V =3Vto3.6V 0.8 CC V =4.5Vto5.5V 0.3×V CC CC V Inputvoltage 0 5.5 V I V Outputvoltage 0 V V O CC V =1.65V –4 CC V =2.3V –8 CC I High-leveloutputcurrent –16 mA OH V =3V CC –24 V =4.5V –32 CC V =1.65V 4 CC V =2.3V 8 CC I Low-leveloutputcurrent 16 mA OL V =3V CC 24 V =4.5V 32 CC V =1.8V±0.15V,2.5V±0.2V 20 CC Δt/Δv Inputtransitionriseorfallrate V =3.3V±0.3V 10 ns/V CC V =5V±0.5V 5 CC T Operatingfree-airtemperature –40 125 °C A (1) AllunusedinputsofthedevicemustbeheldatV orGNDtoensureproperdeviceoperation.RefertotheTIapplicationreport, CC ImplicationsofSloworFloatingCMOSInputs,literaturenumberSCBA004. 4 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC2G86

SN74LVC2G86 www.ti.com SCES360I–AUGUST2001–REVISEDDECEMBER2013 Electrical Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted) –40°Cto85°C –40°Cto125°C PARAMETER TESTCONDITIONS VCC MIN TYP(1) MAX MIN TYP(1) MAX UNIT 1.65Vto5.5 IOH=–100µA V VCC–0.1 VCC–0.1 IOH=–4mA 1.65V 1.2 1.2 VOH IOH=–8mA 2.3V 1.9 1.9 V IOH=–16mA 2.4 2.4 3V IOH=–24mA 2.3 2.3 IOH=–32mA 4.5V 3.8 3.8 1.65Vto5.5 IOL=100µA V 0.1 0.1 IOL=4mA 1.65V 0.45 0.45 VOL IOL=8mA 2.3V 0.3 0.3 V IOL=16mA 0.4 0.4 3V IOL=24mA 0.55 0.55 IOL=32mA 4.5V 0.55 0.55 II AorBinputs VI=5.5VorGND 0to5.5V ±5 ±5 µA Ioff VIorVO=5.5V 0 ±10 ±10 µA 1.65Vto5.5 ICC VI=VCCorGND, IO=0 V 10 10 µA Oneinputat Otherinputsat ΔICC VCC–0.6V, VCCorGND 3Vto5.5V 500 500 µA Ci VI=VCCorGND 3.3V 5 pF (1) AlltypicalvaluesareatV =3.3V,T =25°C. CC A Switching Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure1) SN74LVC2G86 –40°Cto85°C FROM TO PARAMETER (INPUT) (OUTPUT) VCC=1.8V VCC=2.5V VCC=3.3V VCC=5V UNIT ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX tpd AorB Y 4.1 9.9 2 5.7 1.6 4.7 1.4 3.6 ns Switching Characteristics overrecommendedoperatingfree-airtemperaturerange(unlessotherwisenoted)(seeFigure1) SN74LVC2G86 –40°Cto125°C FROM TO PARAMETER (INPUT) (OUTPUT) VCC=1.8V VCC=2.5V VCC=3.3V VCC=5V UNIT ±0.15V ±0.2V ±0.3V ±0.5V MIN MAX MIN MAX MIN MAX MIN MAX tpd AorB Y 4.1 11.0 2 6.7 1.6 5.6 1.4 4.2 ns Operating Characteristics T =25°C A VCC=1.8V VCC=2.5V VCC=3.3V VCC=5V PARAMETER TESTCONDITIONS UNIT TYP TYP TYP TYP Cpd Powerdissipationcapacitance f=10MHz 20 20 20 22 pF Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SN74LVC2G86

SN74LVC2G86 SCES360I–AUGUST2001–REVISEDDECEMBER2013 www.ti.com Parameter Measurement Information V LOAD R S1 Open From Output L TEST S1 Under Test GND t /t Open C PLH PHL (see NoteA)L RL tPLZ/tPZL VLOAD t /t GND PHZ PZH LOAD CIRCUIT INPUTS V V V C R V CC V t/t M LOAD L L D I r f 1.8 V±0.15 V V £2 ns V /2 2 ×V 30 pF 1 kW 0.15 V CC CC CC 2.5 V±0.2 V V £2 ns V /2 2 ×V 30 pF 500W 0.15 V CC CC CC 3.3 V±0.3 V 3 V £2.5 ns 1.5 V 6 V 50 pF 500W 0.3 V 5 V±0.5 V V £2.5 ns V /2 2 ×V 50 pF 500W 0.3 V CC CC CC V I Timing Input V M 0 V t W VI tsu th V Input V V I M M Data Input V V M M 0 V 0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUPAND HOLD TIMES Input VM VM VI COounttpruotl VM VM VI 0 V 0 V t t t t PLH PHL PZL PLZ V Output V /2 Output VM VM OH WSav1e afot rVm 1 VM V + V LOAD VOL (see NoteL OBAD) OL D VOL t t PHL PLH t t PZH PHZ Output VM VM VOH WSa1v eaOfto uGrtmpNu D2t VM VOH–VD VOH VOL (see Note B) »0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PROPAGATION DELAYTIMES ENABLEAND DISABLE TIMES INVERTINGAND NONINVERTING OUTPUTS LOW-AND HIGH-LEVELENABLING NOTES: A. C includes probe and jig capacitance. L B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR£10 MHz, Z = 50W. O D. The outputs are measured one at a time, with one transition per measurement. E. t and t are the same as t . PLZ PHZ dis F. t and t are the same as t . PZL PZH en G.t and t are the same as t . PLH PHL pd H. All parameters and waveforms are not applicable to all devices. Figure1. LoadCircuitandVoltageWaveforms 6 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:SN74LVC2G86

SN74LVC2G86 www.ti.com SCES360I–AUGUST2001–REVISEDDECEMBER2013 REVISION HISTORY ChangesfromRevisionH(Feburary2007)toRevisionI Page • UpdateddocumenttonewTIdatasheetformat. ................................................................................................................. 1 • RemovedOrderingInformationtable.................................................................................................................................... 1 • AddedESDwarning. ............................................................................................................................................................ 2 • Updatedoperatingtemperaturerange.................................................................................................................................. 4 Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SN74LVC2G86

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) SN74LVC2G86DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C86 & no Sb/Br) (R, Z) SN74LVC2G86DCUR ACTIVE VSSOP DCU 8 3000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C86Q, C86R) & no Sb/Br) SN74LVC2G86DCURG4 ACTIVE VSSOP DCU 8 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 125 C86R & no Sb/Br) SN74LVC2G86DCUT ACTIVE VSSOP DCU 8 250 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (C86Q, C86R) & no Sb/Br) SN74LVC2G86YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 85 CHN & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) SN74LVC2G86DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3 SN74LVC2G86DCUR VSSOP DCU 8 3000 178.0 9.5 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC2G86DCUR VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC2G86DCURG4 VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC2G86DCUT VSSOP DCU 8 250 178.0 9.5 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC2G86YZPR DSBGA YZP 8 3000 178.0 9.2 1.02 2.02 0.63 4.0 8.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) SN74LVC2G86DCTR SM8 DCT 8 3000 182.0 182.0 20.0 SN74LVC2G86DCUR VSSOP DCU 8 3000 202.0 201.0 28.0 SN74LVC2G86DCUR VSSOP DCU 8 3000 202.0 201.0 28.0 SN74LVC2G86DCURG4 VSSOP DCU 8 3000 202.0 201.0 28.0 SN74LVC2G86DCUT VSSOP DCU 8 250 202.0 201.0 28.0 SN74LVC2G86YZPR DSBGA YZP 8 3000 220.0 220.0 35.0 PackMaterials-Page2

None

None

MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,65 0,13 M 0,15 8 5 0,15 NOM 2,90 4,25 ÇÇÇÇÇ 2,70 3,75 ÇÇÇÇÇ ÇÇÇÇÇ Gage Plane ÇÇÇÇÇ PIN 1 INDEX AREA 0,25 1 4 0°– 8° 3,15 0,60 2,75 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 4188781/C 09/02 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion D. Falls within JEDEC MO-187 variation DA. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

None

PACKAGE OUTLINE YZP0008 DSBGA - 0.5 mm max height SCALE 8.000 DIE SIZE BALL GRID ARRAY B E A BALL A1 CORNER D C 0.5 MAX SEATING PLANE 0.19 0.05 C 0.15 BALL TYP 0.5 TYP D C SYMM 1.5 D: Max = 1.919 mm, Min =1 .858 mm TYP B E: Max = 0.918 mm, Min =0 .857 mm 0.5 TYP A 0.25 8X 1 2 0.21 0.015 C A B SYMM 4223082/A 07/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT YZP0008 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.23) 1 2 A (0.5) TYP B SYMM C D SYMM LAND PATTERN EXAMPLE SCALE:40X SOLDER MASK 0.05 MAX 0.05 MIN ( 0.23) OPENING SOLDER MASK OPENING ( 0.23) METAL METAL UNDER SOLDER MASK NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4223082/A 07/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). www.ti.com

EXAMPLE STENCIL DESIGN YZP0008 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.25) (R0.05) TYP 1 2 A (0.5) TYP B SYMM C METAL TYP D SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4223082/A 07/2016 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

IMPORTANTNOTICEANDDISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated